CN113745143B - Automatic inserting mechanism for arranging silicon wafers - Google Patents
Automatic inserting mechanism for arranging silicon wafers Download PDFInfo
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- CN113745143B CN113745143B CN202111296724.1A CN202111296724A CN113745143B CN 113745143 B CN113745143 B CN 113745143B CN 202111296724 A CN202111296724 A CN 202111296724A CN 113745143 B CN113745143 B CN 113745143B
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- 235000012431 wafers Nutrition 0.000 title abstract description 145
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 126
- 229910052710 silicon Inorganic materials 0.000 title abstract description 126
- 239000010703 silicon Substances 0.000 title abstract description 126
- 230000007246 mechanism Effects 0.000 title abstract description 11
- 239000000463 material Substances 0.000 abstract description 46
- 210000001503 joint Anatomy 0.000 abstract description 32
- 230000000694 effects Effects 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 5
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 13
- 238000007599 discharging Methods 0.000 description 11
- 238000003032 molecular docking Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 210000005056 cell body Anatomy 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An inserting piece mechanism for automatically arranging silicon wafers comprises a groove body; a blanking unit and a butt joint unit are arranged in the tank body; the blanking unit comprises a turning plate assembly and a clamping assembly, wherein the turning plate assembly is used for supporting and fixing a material seat, so that the silicon wafer which is not degummed is hung upside down and suspended in the clamping assembly; the clamping assembly is used for guiding the degummed silicon wafer and enabling the silicon wafer to be automatically regulated in the clamping assembly to be vertically arranged; the butt joint unit comprises a driving piece and a flexible belt, wherein the driving piece drives the flexible belt to butt joint all the silicon wafers loosened from the clamping assembly and to orderly the silicon wafers continuously so as to finish the division and the insertion. The inserting mechanism can quickly carry, arrange and shape the degummed silicon wafer automatically and stably place the silicon wafer in the wafer cavity of the blanking frame; and the silicon wafers can be accurately conveyed to the butt joint position before slicing under the original regular state, the auxiliary operation of personnel is not needed, the uniformity of the regular effect is good, and the butt joint speed is high and stable.
Description
Technical Field
The invention belongs to the technical field of silicon wafer inserting, and particularly relates to an inserting mechanism for automatically arranging silicon wafers.
Background
In the manufacturing process of the photovoltaic silicon wafer, the cleaning of the silicon wafer insert is a key link of the whole silicon wafer manufacturing process, and plays an important role, wherein the silicon wafer insert is an important ring for improving the cleaning efficiency of the silicon wafer. The existing inserting pieces need manual operation to horizontally stack the silicon wafers into the inserting piece grooves, then the inserting pieces are inserted and separated, the silicon wafers stacked and arranged are easy to be laminated when the inserting pieces are inserted, once the lamination occurs, a machine automatically alarms, the inserting pieces need to be suspended to pick out the laminated silicon wafers, and then the inserting and separating of the silicon wafers are continued.
Disclosure of Invention
Aiming at the technical problems of unstable separation cleaning and poor film inserting effect in the existing cleaning process, the invention provides a film inserting mechanism for automatically arranging silicon wafers, which can automatically arrange the silicon wafers and automatically separate and insert the silicon wafers, and has good separation quality and high efficiency.
In order to solve the technical problems, the invention adopts the technical scheme that:
the utility model provides an automatic inserted sheet mechanism of regular silicon chip, includes:
a trough body;
a blanking unit and a butt joint unit are arranged in the tank body;
the blanking unit comprises a turning plate assembly and a clamping assembly, wherein the turning plate assembly is used for supporting and fixing a material seat, so that the silicon wafer which is not degummed is hung upside down and suspended in the clamping assembly; the clamping assembly is used for guiding the degummed silicon wafer and enabling the silicon wafer to be automatically regulated in the clamping assembly to be vertically arranged;
the butt joint unit comprises a driving piece and a flexible belt, the driving piece drives the flexible belt to butt joint all the silicon wafers loosened from the clamping assembly and to regulate the silicon wafers continuously, and the blanking unit and the silicon wafers are driven to move forwards together;
the clamping assembly comprises a supporting rod for supporting the bottom surface of the silicon wafer, a side roller for clamping the vertical surface of the silicon wafer and a supporting rod for supporting the side roller and adjusting the position of the side roller;
each support rod is at least provided with two groups of inclined block groups capable of adjusting the angle of the side roller;
one end of each support rod, which is far away from the slicing roller, is provided with a guide knob;
the guide knob is pushed to synchronously drive the support rod to rotate so as to enable the inclined block group to rotate for a certain angle, and the side roller rotates to a vertical surface position from an inclined surface position with an outward opening.
Further, the side rollers are rotated by an angle not exceeding 45 °.
Further, the side rollers rotate at an angle of 20-30 °.
Furthermore, the sloping block group comprises two sloping blocks which are tightly attached to be adjacently arranged, the surfaces of the sloping blocks, which are contacted with the side rollers, are arranged in a staggered manner, and one end, far away from the side rollers, of the sloping blocks is fixedly sleeved on the supporting rod.
Furthermore, a transmission part and a push rod are arranged at one end of the groove body, which is far away from the slicing roller;
the transmission piece is fixedly arranged on the groove body;
one end of the push rod is connected with the transmission piece, and the other end of the push rod is connected with the guide knob;
the transmission piece is used for controlling the push rod to push or pull the guide knob.
Further, a wafer cavity for regulating the silicon wafer is defined by the side roller and the support rod;
the side roller is arranged on the outer side of the supporting rod along the width direction of the sheet cavity;
the side rollers are of a sheet batten structure;
and an elastic guide sleeve is sleeved on the outer wall of the side roller.
Further, the unloading unit still includes:
the feeding frame is a frame body with an upper hollow structure and a lower hollow structure, and is stacked with the blanking frame with a groove body structure with an opening at the upper end;
the turning plate assembly is arranged in the feeding frame and can rotate oppositely from a vertically upward position to a horizontal position along the length axial direction of the feeding frame so as to jack the side wall surface of the material seat;
the clamping assembly is arranged in the blanking frame, and an inclined plane facing outwards from the opening along the length direction of the blanking frame is adjusted to be a vertical plane.
Further, the flap assembly includes:
the connecting rods and the supporting plates are symmetrically arranged along the length direction of the feeding frame;
an elastic piece capable of automatically resetting is arranged at the end part of each connecting rod, and the elastic piece is sleeved on the connecting rod;
the elastic piece is pressed by the material seat to rotate in opposite directions, and can be driven to rotate backwards after the material seat is moved away.
Furthermore, each group of the support plates which are parallel and arranged in a gap is connected with the connecting rod through a connecting plate;
one end of the connecting plate is fixedly connected with the support plate, and the other end of the connecting plate is hinged with the connecting rod;
and the connecting plate is connected by one end of the elastic piece.
Furthermore, supporting pieces for supporting the connecting plates when the connecting plates are horizontally arranged are arranged on one sides, close to the connecting plates, of the two ends of the feeding frame;
the upper end surface of the supporting piece is contacted with the lower end surface of the connecting plate;
one end of the supporting piece is fixedly arranged on the feeding frame, and the other end of the supporting piece is suspended and fixedly arranged below the connecting plate.
Furthermore, one side of the support plate, which is far away from the connecting rod, is a stepped surface, and the width of the upper end surface in the stepped surface is smaller than that of the lower end surface.
Furthermore, the support plate is provided with a continuous bow-shaped bending section formed by a plurality of grooves arranged at intervals, and the openings of the grooves are arranged towards one side close to the material seat; the groove is of a square structure or an arc structure.
Further, the support rod is suspended at the bottom of the blanking frame;
two ends of the supporting rod are fixedly arranged at the end part of the blanking frame, and the middle of the supporting rod is fixed by a supporting block arranged in the blanking frame;
the support rod is fixed on the upright post at the bottom of the blanking frame;
the end part of the supporting rod is also provided with a supporting seat for fixing the supporting rod.
Furthermore, a baffle plate for preventing the silicon wafer from inclining is arranged at one end part of the support rod, which is far away from the slicing roller, and the baffle plate is vertically and vertically placed on the fixed end face at the end part of the support rod.
Furthermore, the end parts of the two sides of the feeding frame and the blanking frame are respectively provided with a primary and secondary alignment block and a hook column; at least one group of boss structures are arranged in the butt joint surface of each primary and secondary alignment block, and the boss structures are inverted V-shaped, inverted U-shaped or inverted W-shaped; and the direction of the boss structure in at least one group of the primary and secondary alignment blocks is different from the direction of the boss structure in all other primary and secondary alignment blocks.
Further, the driving pieces are symmetrically and fixedly arranged on the side wall surface of the groove body and are arranged close to one end of the slicing roller;
the flexible belts are enclosed into a rectangular structure and horizontally surround the inner wall of the tank body, and are respectively arranged at two sides of the blanking unit symmetrically;
the edges of the flexible belts at two sides, which are close to one side of the silicon wafer, are driven by the corresponding driving pieces to move towards one side of the blanking unit along the width direction of the groove body so as to clamp the vertical surface of the silicon wafer.
Furthermore, each side of the blanking unit is at least provided with two groups of flexible belts which are arranged side by side up and down, and the flexible belts synchronously and synchronously rotate towards the direction close to the slicing roller.
Furthermore, each driving piece is also provided with guide assemblies on two sides, each guide assembly comprises a slide rail perpendicular to the length direction of the groove body and a slide block matched with the slide rail, one end of the slide rail is fixedly arranged on the side surface of the groove body, and the other end of the slide rail is fixedly arranged on a vertical plate fixedly clamped on the blanking unit.
Further, the single-crystal stepping device comprises a stepping unit, wherein the stepping single crystal comprises a propulsion cylinder and a track;
the track is arranged at the bottom of the tank body;
the pushing cylinder can push the blanking unit to move to the initial position of the butt joint unit, and then push the butt joint unit to drive all the silicon wafers after butt joint to move towards the slicing roller on the track until slicing is completed.
The sheet inserting mechanism designed by the invention comprises the blanking unit and the butt joint unit, can quickly and automatically bear, regulate and shape the degummed silicon wafers, can stably and accurately gather in the sheet cavities in the blanking frame for placement, does not need personnel to perform auxiliary operation, and has good regulation consistency and high speed. The silicon wafer can be stably conveyed to the butt joint position of the silicon wafer, so that the blanking frame is used as a cartridge clip to carry out split feeding on the silicon wafer, automatic butt joint matching is achieved, butt joint is accurate, and a foundation is laid for subsequent continuous inserting.
Drawings
FIG. 1 is a perspective view of a sheet inserting mechanism for automatically arranging silicon wafers according to an embodiment of the present invention;
FIG. 2 is a perspective view of a blanking unit according to an embodiment of the present invention;
FIG. 3 is a schematic view of a matching structure of the material loading frame and the flap assembly according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a plate according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a plate according to another embodiment of the present invention;
FIG. 6 is a schematic view of a mating structure of the blanking frame and the clamping assembly according to an embodiment of the present invention;
FIG. 7 is an angle of rotation of the side rollers relative to the elevation of the wafer in accordance with one embodiment of the present invention;
FIG. 8 is a schematic structural diagram of an inverted V-shaped primary-secondary alignment block according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of an inverted U-shaped primary-secondary alignment block according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of an inverted W-shaped primary-secondary alignment block according to an embodiment of the present invention;
fig. 11 is a perspective view of a docking unit and a stepping unit according to an embodiment of the present invention.
In the figure:
10. blanking unit 11, flap component 111 and connecting rod
112. Support plate 113, elastic piece 114 and connecting plate
115. Support member 12, clamping assembly 121 and support rod
122. Side roller 123, support rod 124 and guide knob
125. Inclined block group 126, supporting block 127 and supporting seat
128. Baffle 13, material loading frame 14, unloading frame
15. A piece cavity 16, a primary and secondary alignment block 17 and a hook column
18. Transmission piece 19, push rod 20 and butt joint unit
21. Driving piece 22, flexible belt 23 and guide assembly
30. Stepping unit 31, propulsion cylinder 32, rail
40. A trough body 50, a material seat 60 and a slicing roller.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
The embodiment provides an inserting mechanism for automatically regulating silicon wafers, which comprises a groove body 40, and a blanking unit 10, a butting unit 20 and a stepping unit 30 are arranged in the groove body 40 as shown in fig. 1. The blanking unit 10 comprises a turning plate assembly 11 and a clamping assembly 12, wherein the turning plate assembly 11 is used for supporting and fixing the material seat 50, so that the silicon wafer which is not degummed is hung upside down and suspended in the clamping assembly 12; the clamping assembly 12 is used for guiding the degummed silicon wafer and enabling the silicon wafer to be automatically regulated and vertically arranged in the clamping assembly 12 and can be expanded outwards to loosen the silicon wafer. The butt joint unit 20 comprises a driving piece 21 and a flexible belt 22, wherein the driving piece 21 drives the flexible belt 22 to approach towards the silicon wafers along the width direction of the groove body 40 so as to butt joint all the silicon wafers loosened from the clamping assembly 12, and continue to regulate all the silicon wafers, and drive the blanking unit 10 and all the silicon wafers to move forwards together to finish the transplanting. The stepping unit 30 comprises a propelling cylinder 31 and a rail 32, the rail 32 is arranged at the bottom of the tank body 40 and is positioned below the blanking unit 10, the propelling cylinder 31 can push the blanking unit 10 to move to the initial position of the docking unit 20, and then the docking unit 20 is pushed to drive all the silicon wafers after docking to move towards the slicing roller 60 on the rail 32 until slicing is completed. Therefore, automatic arrangement and blanking of the silicon wafers among the sub-sheets are completed, the degummed silicon wafers are automatically loaded, arranged and shaped quickly, and the degummed silicon wafers are stably placed in the blanking unit 10; and the silicon wafers can be accurately conveyed to the butt joint positions of the butt joint units 20 before slicing under the original regular state, the auxiliary operation of personnel is not needed, the uniformity of the regular effect is good, and the butt joint speed is high and stable.
As shown in fig. 2, the blanking unit further includes a feeding frame 13 and a blanking frame 14, wherein the feeding frame 13 is a frame body with an upper hollow structure and a lower hollow structure, and is stacked with the blanking frame 14 with a groove body structure with an upper end opening. The flap assembly 11 is disposed in the feeding frame 13, and can rotate 90 ° from the vertical upward position to the horizontal position along the length axis of the feeding frame 13 to lift the sidewall surface of the material seat 50. The clamping assembly 12 is arranged in the blanking frame 14 to form a wafer cavity 15 for placing a silicon wafer; the clamping assembly 12 is adjusted from the inclined position of the opening facing outwards to a vertical surface along the length direction of the blanking frame 14, so that the width of the wafer cavity 15 is reduced, and the silicon wafers are uniformly and vertically placed in the wafer cavity 15.
As shown in fig. 3, the flap assembly 11 includes a connecting rod 111 and a support plate 112 symmetrically arranged along the length direction of the feeding frame 13; an elastic member 113 capable of automatically resetting is arranged at the end part of each connecting rod 111, and the elastic member 113 is sleeved on the connecting rods 111; the elastic member 113 is pressed by the material seat 50 downwards to drive the support plate 112 to turn from the initial vertical upward position to the horizontal transverse position; and can bring the support plate 112 back to the initial upright position after the material seat 50 is removed, so that the silicon wafer falls into the wafer cavity 15 in the clamping assembly 12. That is, the elastic member 113 can drive the support plate 112 to rotate to approach or depart from the material seat 50, so as to adjust the width between the adjacent support plates 112, and the material seat 50 is jacked to make the silicon wafer suspended in the material loading frame 13 above the wafer cavity 15; or the material placing seat 50 is loosened, so that the silicon wafers separated from the material placing seat 50, namely the degummed silicon wafers, can land downwards from the material loading frame 13 into the wafer cavities 15 of the material unloading frame 14. The structure of the plate turning component 11 accurately enables the material seat 50 to be jacked and fixed when the material seat 50 drops downwards, so that the silicon wafers are stably suspended above the clamping component 12, not only can all the silicon wafers be completely immersed in water, but also the washing of the water circulation around can accelerate the cleaning effect of the whole silicon wafers.
Each group of parallel support plates 112 arranged in a clearance manner is connected with the connecting rod 111 through connecting plates 114, each support plate 112 needs two connecting plates 114 to be connected with the connecting rod 111, one end of each connecting plate 114 is fixedly connected with the support plate 112, and the other end of each connecting plate 114 is hinged with the annular structure of the connecting rod 111; one end of the elastic member 113 is fixed to the side wall surface of the upper frame 13, and the other end is fixed to the bottom surface of the link plate 114. The connecting rod 111 and the support plate 112 which are arranged in parallel with each other along the length direction of the feeding frame 13 are beneficial to immersing the bearing material frame carrying the silicon wafer into water liquid for soaking, so that the periphery of the silicon wafer is filled with the water liquid in a vacant space, and the water liquid can overflow from each gap in time when the silicon wafer bearing material frame rises, thereby ensuring that the silicon wafer is not cracked or washed away.
The elastic member 113 is penetrated by the connecting rod 111, and preferably, the elastic member 113 is a common spring, and one end of the elastic member is fixed on the upper surface of the feeding frame 13, and the other end is fixed on the side wall surface of the connecting plate 114. The elastic member 113 is controlled by external force to rotate along the axial direction of the connecting rod 111, and further drives the support plate 112 to perform reciprocating rotation movement through the control connecting plate 114.
A supporting piece 115 for supporting the connecting plate 114 when the connecting plate 114 is horizontally arranged is arranged on one side of each of two ends of the feeding frame 13 close to the connecting plate 114, the supporting piece 115 is arranged in parallel to the connecting rod 111 and is perpendicular to the connecting plate 114, and the supporting piece 115 is a triangular line bracket; the horizontally arranged frame beam is the upper end surface of the support 115, and is directly contacted with the lower end surface of the connecting plate 114, so as to play a role in supporting and fixing, and further improve the stability and safety of the support plate 112 when jacking the material seat 50. The vertical side beams of the supporting member 115 are fixed to the inner side walls of the loading frame 13, and the inclined support beams are used for reinforcing the overall strength of the supporting member 115, so that one end of the supporting member 115 which is arranged in a suspended manner is positioned below the connecting plate 114.
The side of the support plate 112 away from the connecting rod 111 is a stepped surface, and the width of the upper end surface of the stepped surface is smaller than that of the lower end surface of the stepped surface, so as to be matched with the side surface of the material seat 50. The support plate 112 has a continuous arcuate curved section formed by a plurality of spaced grooves with the openings of the grooves facing toward one side of the material seat 50. The arrangement of the groove is convenient for avoiding a mechanical arm, and the interference between the mechanical arm for grabbing the material seat 50 and the support plate 112 is avoided, so that the material seat 50 is safely and stably discharged or taken. The transverse width and the longitudinal width of the groove are matched with the size of the hand grip of the manipulator. The groove is of a square structure, and as shown in fig. 4, the groove of the structure is simple in structure and convenient to process. Or an arc structure, as shown in fig. 5, the grooves of this structure can reduce the stress concentration of the support plate 112, improve the structural strength thereof, and simultaneously reduce the resistance to water overflow. Of course, in any kind of structure, the step surfaces of the two side support plates 112 contact with the two side wall surfaces in the length direction of the material seat 50 during the top fixing, so that the material seat 50 is stably supported and fixed, and the silicon wafer is uniformly suspended in the wafer cavity 15.
In order to ensure the gripping stability of the material seat 50, the matching position of the manipulator and the material seat 50 is in the middle of the length of the material seat 50, and correspondingly, the arched bending section is located in the middle of the support plate 112, that is, all the grooves are symmetrically arranged relative to the middle of the length of the support plate 112. Meanwhile, in order not to influence the rotation of the bow-shaped bending section where the groove is located, the connecting plate 114 is arranged close to the end of the connecting rod 111, so that the connecting rod 111 is easy to fix, the stability of the overall work of the plate turning assembly 11 is ensured, the production cost of the structure of the plate turning assembly can be reduced, and the flexibility and the precision of the work of the plate turning assembly 11 are improved.
In the work, the manipulator is used for aligning the feeding frame 13 and the discharging frame 14 in advance and fixing the feeding frame and the discharging frame in the groove body 40; when the silicon wafer after the wire cutting is adhered to the material seat 50, the manipulator grasps the upper end surface of the material seat 50 and clamps the two side surfaces thereof, moves up to the upper part of the feeding frame 13 in the groove body 40 from the slicing machine, the length of the material seat 50 and the length of the feeding frame 13 are coaxially arranged, the manipulator is controlled to start feeding from the bow-shaped bending section with the groove position, and the material seat 50 is slowly controlled to fall down. After the silicon wafer enters the feeding frame 13, the elastic member 113 is pressed by the material seat 50 moving downwards, so that the support plate 112 is forced to slowly rotate in opposite directions from the initial vertical upward position until the silicon wafer is converted into a horizontal position and is erected on the support member 115, at this time, the step surface of the support plate 112 supports the side wall surface of the material seat 50, so that the material seat 50 is erected and fixed in the cavity formed by the alignment support plate 112, and correspondingly, the silicon wafer is suspended and hung upside down in the wafer cavity 15. After the silicon wafer is separated from the material seat, the mechanical arm enters the arc-shaped bending section again to grasp the material seat 50, the material seat 50 is driven to be far away from the silicon wafer, and at the moment, the support plate 112 is forced by the elastic piece 113 to return back to the initial position from the horizontal position and upwards vertically.
As shown in fig. 6, the clamping assembly 12 includes a supporting rod 121 for supporting the bottom surface of the silicon wafer and fixedly disposed at the bottom of the blanking frame 14, side rollers 122 for clamping the vertical surface of the silicon wafer and symmetrically disposed at two sides of the wafer cavity 15, and a supporting rod 123 for supporting the side rollers 122 and driving the side rollers 122 to move left and right along the width direction of the blanking frame 14. Wherein, one end of each support rod 123 far away from the slicing roller 60 is provided with a guiding knob 124, the guiding knob 124 can control the rotation of the support rod 123, that is, two guiding knobs 124 are pushed to synchronously drive the corresponding support rods 123 to rotate oppositely or reversely, so as to drive the two side rollers 122 to repeatedly rotate and move between the inclined plane position where the initial opening is arranged outwards and the vertical plane position where the initial opening is arranged vertically, so as to tighten the width between the side rollers 122 to clamp the silicon wafer or enlarge the width between the side rollers 122 to loosen the transition connection between the silicon wafer and the docking unit 20. The clamping assembly 12 is not only simple in structure and easy to operate, but also can adjust the angle of the side roller 122 accurately, stably and controllably, and can make the degummed silicon wafer centralized and stably arranged vertically in the wafer cavity 15. Before the silicon wafers are inserted, the width of the clamping component 12 is adjusted to release the silicon wafers to be delivered to the docking unit 20 for orderly standing, so that all the silicon wafers are moved to one end of the separating roller 60 for separating and inserting.
Further, all the side rollers 122 and the support rods 121 enclose the sheet cavity 15, and the side rollers are of a sheet-shaped lath structure; an elastic guide sleeve is sleeved on the outer wall of the side roller 122, and the degummed silicon wafer is guided into the wafer cavity 15 by the elastic inner wall of the side roller 122 along the height direction of the wafer cavity 15 and is clamped and fixed by the side roller 122 and the support rod 121.
Wherein, the rotation angle α of the side rollers 122 is not more than 45 °, and is limited by the internal space of the blanking frame 14, preferably, the rotation angle α of the side rollers 122 is 20 to 30 °, as shown in fig. 7, because, if the angle α of the side rollers 122 is less than 20 °, the width between the side rollers 122 is too narrow, the space provided for blanking of the material seat 50 is limited, the avoidance is not in place, and the blanking of the material seat 50 is directly affected; if the angle α of the side rollers 122 is greater than 30 °, the distance between the side rollers 122 is widened, and due to the influence of the space width of the blanking frame 14, the side rollers interfere with the side wall surface of the length of the blanking frame 14, which is not favorable for the normalization of the silicon wafer.
Furthermore, each support rod 123 is at least provided with two inclined block groups 125 capable of adjusting the angle of the side roller 122, each inclined block group comprises two inclined blocks which are tightly attached and adjacently arranged, the contact surfaces of the two inclined blocks and the side roller 122 are in a staggered structure so as to adjust the inclined or vertical position of the side roller 122, and one ends of the inclined blocks, which are far away from the side roller 122, are fixedly sleeved on the support rods 123. The purpose of the skew block arrangement in the staggered arrangement is to ensure that the side roller 122 can rotate from the initial position of the inclined surface and be stabilized at the regular position of the vertical arrangement, so that more accurate corner rotation can be obtained, the control is easy, the corner angle is controllable, the overall structure is simple, and the implementation is easy.
Further, the supporting rod 121 is fixed to the bottom of the blanking frame 14 in a suspended manner, and both ends of the supporting rod are fixed to the end face of the blanking frame 14, and the middle of the supporting rod is supported and fixed by a supporting block 126 arranged on the blanking frame 14. In order to ensure that the overall blanking unit 10 is matched with the tank 40 in height, the support rod 121 is spaced from the bottom of the blanking frame 14, so that the circulation capacity of water liquid in the blanking frame 14 can be increased, and the cleaning effect of the silicon wafer can be improved.
The supporting rod 123 is fixed on the upright column at the bottom of the blanking frame 14; and a supporting seat 127 for fixing the supporting rod 123 is further provided at the end of the supporting rod 123, and the supporting seat 127 is obliquely provided on the ground of the blanking frame 14 for indirectly fixing the side roller 122.
Further, a baffle 128 for preventing the silicon wafer from inclining is arranged at the end of the wafer cavity 15 far away from the wafer separating roller 60, so as to prevent the silicon wafer from falling during the arranging process. Since the silicon wafer is discharged from the end close to the slicing roller 60 to wait for the insertion of the silicon wafer, the baffle 128 is disposed at the end far from the slicing roller 60.
In order to further improve the matching accuracy of the feeding frame 13 and the discharging frame 14 and prevent the silicon wafer from being discharged and dislocated due to sliding in the discharging process, the two side ends of the feeding frame 13 and the discharging frame 14 are respectively provided with a primary and secondary alignment block 16, that is, four sets of primary and secondary alignment blocks 16 are respectively provided at the end of the feeding frame 13 and the two sides of the end of the discharging frame 14, and at least one set of boss structures for position alignment is provided in the butt joint surface of each primary and secondary alignment block 16, as shown in fig. 8-10. Preferably, the boss structure is an inverted V-shape, and the end face structure is shown in FIG. 8; or the boss structure is in an inverted U shape, and the end face structure is shown in figure 9; or the boss structure is in an inverted W shape, and the end face structure is shown in figure 10. Of course, the boss structure can be of other structure types, and the protection scope of the present application is also included in the present application. In actual matching, the directions of the boss structures of at least one group of the primary and secondary alignment blocks 16 are different from the directions of the boss structures of other groups of the primary and secondary alignment blocks 16, as shown in fig. 6, in one end of the blanking frame 14 close to the slicing roller 60, the boss structures of the two primary and secondary alignment blocks 16 are both arranged perpendicular to the length direction of the blanking frame 14; correspondingly, in one end of the blanking frame 14 far away from the slicing roller 60, boss structures in the two primary and secondary alignment blocks 16 are arranged in parallel to the length direction of the blanking frame 14; the arrangement of the structure can improve the matching precision of the primary and secondary alignment blocks 16. In addition, in order to facilitate the mechanical claw to lift the feeding frame 13 and the discharging frame 14 to move conveniently, hook columns 17 are further arranged at the end parts of the two sides of the mechanical claw to be hook points.
In order to ensure the accuracy of the rotational displacement of the side roller 122, a transmission member 18 and a push rod 19 matched with the transmission member 18 are arranged at one end of the groove body 40 far away from the slicing roller 60, as shown in fig. 11, the transmission member 18 is fixedly arranged on the groove body 40, the transmission member 18 is a driving structure in vertical sliding fit, such as a sliding plate and a slideway, and the sliding plate vertically reciprocates on the slideway, so that the push rods 19 arranged at two sides of the slideway are driven to respectively perform pushing or pulling actions towards one side close to or far away from the slicing roller 60; the number of the push rods 19 is the same as that of the guide knobs 124, wherein one end of each push rod 19 is connected with the vertical plates arranged on the two sides of the slide way, and the other end of each push rod 19 is connected with the guide knobs 124. The transmission member 18 forms a driving source to drive the push rod 19 to push or pull the guide knob 124, so that the guide knob 124 rotates toward the side close to the silicon wafer or away from the silicon wafer.
The transmission part 18 controls the push rod 19 to move towards one end close to the blanking frame 14 and enables the push rod 19 to push the guide knob 124, so that the guide knob 124 rotates to drive the side rollers 122 to slowly rotate oppositely from the initial obliquely outward position, silicon wafers after clamping, pushing and degumming can vertically slide downwards along the inner wall surfaces of the side rollers 122 and land on the support rods 121 until the inner walls of the side rollers 122 are supported by the staggered inclined block groups 125 to be vertically arranged and completely contact with the vertical surfaces of the silicon wafers, the silicon wafers gradually fall onto the support rods 121 under the influence of self gravity in the process of regularization, and the side rollers 122 gradually contract inwards to completely clamp the silicon wafers, so that the silicon wafers are supported and fixed, are completely and stably fixed in the wafer cavities 15, and the regularization is completed.
As shown in fig. 11, the driving members 21 in the docking unit 20 are symmetrically and fixedly disposed on the side wall surface of the tank 40 and near one end of the slicing roller 60; the flexible belt 22 is surrounded in a rectangular structure horizontally surrounding the inner wall of the groove body 40 and is arranged symmetrically on two sides of the blanking frame 14. In this embodiment, the driving member 21 is a telescopic cylinder, but may be of other driving structures as long as the driving of the flexible belt 22 is completed; meanwhile, the flexible belt 22 is a belt, is convenient for driving by a telescopic cylinder, is not easy to collide with the silicon wafer when being in contact with the silicon wafer, and does not introduce other impurities into the silicon wafer. The edges of the flexible belts 22 at two sides close to one side of the silicon wafer are driven by the corresponding driving pieces 21 to move towards one side of the blanking frame 14 along the width direction of the groove body 40 so as to clamp the vertical surface of the silicon wafer and complete the transition butt joint work with the silicon wafer blanked from the wafer cavity 15.
At least two groups of flexible belts 22 which are arranged side by side up and down are arranged in the space between the two sides of the blanking frame 14 and the groove body 40, and the flexible belts 22 synchronously rotate towards the direction close to the slicing roller 60 in the same direction after the silicon wafers are butted.
Further, in order to guarantee the stability of telescopic cylinder, still be equipped with direction subassembly 23 in the both sides of each driving piece 21, direction subassembly 23 include perpendicular to cell body 40 length direction's slide rail and with slide rail complex slider, slide rail one end sets firmly on the length direction's of cell body 40 side, the other end sets firmly on the riser of clamping unloading frame 14.
Meanwhile, the driving member 21 can slide along the length direction of the slot body 40 to control the flexible belt 22, the discharging frame 14 and the silicon wafer inside the discharging frame to move towards one end close to the slicing roller 60, so that the technical problem that the silicon wafer is regularly exchanged and the problem that the silicon wafer is regularly influenced due to the overlong length of the slot body 40 can be solved.
The propulsion cylinder 31 drives the discharging frame 14 with the structured silicon wafers to move towards one side close to the slicing roller 60 along the length direction of the rail 32 until the discharging frame moves to the initial position of the butt joint unit 20 and is static; the transmission member 18 controls the push rod 19 to retract, so that the pulling guide knob 124 rotates back to back, the support rod 123 is driven to drive the side roller 122 to simultaneously tilt back to back and forth through the inclined block group 125, and the silicon wafer is loosened; synchronously, the driving pieces 21 on the two sides drive the flexible belts 22 to be close to the silicon wafers until the flexible belts 22 are contacted with the vertical surfaces of all the silicon wafers so as to clamp the silicon wafers, thereby completing the butt joint work of the silicon wafers, keeping the silicon wafers in a regular state, accurately conveying the silicon wafers to the butt joint positions of the butt joint units 20 before slicing, and ensuring good consistency of the regular effect; during the wafer transferring process, the propulsion cylinder 31, the driving piece 21 and the transmission piece 18 synchronously move towards one side of the wafer separating roller 60 together with the blanking frame 14 loaded with the silicon wafers so as to complete the wafer-by-wafer insertion and separation of the silicon wafers.
The inserting piece mechanism designed by the invention comprises the blanking unit and the butt joint unit, can quickly and automatically arrange the degummed silicon wafers so as to shape the silicon wafers, stably and accurately gather the silicon wafers in the wafer cavities in the blanking frame for placement, does not need personnel to assist in operation, and is good in arrangement consistency and high in speed. Still can make the silicon chip deliver to the butt joint position department of burst steadily to make the unloading frame carry out burst pay-off as the cartridge clip to the silicon chip, automatic butt joint cooperation, and the butt joint is accurate, improve regular efficiency, shorten the production process, promote silicon chip inserted sheet quality, practice thrift manufacturing cost, establish the basis for follow-up continuation inserted sheet.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (19)
1. The utility model provides an automatic inserted sheet mechanism of regular silicon chip which characterized in that includes:
a trough body;
a blanking unit and a butt joint unit are arranged in the tank body;
the blanking unit comprises a turning plate assembly and a clamping assembly, wherein the turning plate assembly is used for supporting and fixing a material seat, so that the silicon wafer which is not degummed is hung upside down and suspended in the clamping assembly; the clamping assembly is used for guiding the degummed silicon wafer and enabling the silicon wafer to be automatically regulated in the clamping assembly to be vertically arranged;
the butt joint unit comprises a driving piece and a flexible belt, the driving piece drives the flexible belt to butt joint all the silicon wafers loosened from the clamping assembly and to regulate the silicon wafers continuously, and the blanking unit and the silicon wafers are driven to move forwards together;
the clamping assembly comprises a supporting rod for supporting the bottom surface of the silicon wafer, a side roller for clamping the vertical surface of the silicon wafer and a supporting rod for supporting the side roller and adjusting the position of the side roller;
each support rod is at least provided with two groups of inclined block groups capable of adjusting the angle of the side roller;
one end of each support rod, which is far away from the slicing roller, is provided with a guide knob;
the guide knob is pushed to synchronously drive the support rod to rotate so as to enable the inclined block group to rotate for a certain angle, and the side roller rotates to a vertical surface position from an inclined surface position with an outward opening.
2. The wafer inserting mechanism for automatically regulating the silicon wafers as claimed in claim 1, wherein the rotation angle of the side rollers is not more than 45 °.
3. The wafer inserting mechanism for automatically regulating the silicon wafers as claimed in claim 2, wherein the rotation angle of the side rollers is 20-30 °.
4. The inserting sheet mechanism for automatically regulating the silicon wafers according to any one of claims 1 to 3, wherein the inclined block set comprises two inclined blocks closely attached to each other, the surfaces of the inclined blocks contacting the side rollers are arranged in a staggered manner, and one end of each inclined block, which is far away from the side rollers, is fixedly sleeved on the supporting rod.
5. The inserting mechanism for automatically arranging silicon wafers as claimed in claim 1,
a transmission part and a push rod are arranged at one end of the groove body, which is far away from the slicing roller;
the transmission piece is fixedly arranged on the groove body;
one end of the push rod is connected with the transmission piece, and the other end of the push rod is connected with the guide knob;
the transmission piece is used for controlling the push rod to push or pull the guide knob.
6. The wafer inserting mechanism for automatically organizing silicon wafers as claimed in claim 5, wherein the side rollers and the support rods enclose a wafer cavity for organizing the silicon wafers;
the side roller is arranged on the outer side of the supporting rod along the width direction of the sheet cavity;
the side rollers are of a sheet batten structure;
and an elastic guide sleeve is sleeved on the outer wall of the side roller.
7. The inserting sheet mechanism for automatically regulating silicon wafers according to any one of claims 1-3 and 5-6, wherein the blanking unit further comprises:
the feeding frame is a frame body with an upper hollow structure and a lower hollow structure, and is stacked with the blanking frame with a groove body structure with an opening at the upper end;
the turning plate assembly is arranged in the feeding frame and can rotate oppositely from a vertically upward position to a horizontal position along the length axial direction of the feeding frame so as to jack the side wall surface of the material seat;
the clamping assembly is arranged in the blanking frame, and an inclined plane facing outwards from the opening along the length direction of the blanking frame is adjusted to be a vertical plane.
8. The wafer inserting mechanism for automatically arranging silicon wafers as claimed in claim 7, wherein the flap assembly comprises:
the connecting rods and the supporting plates are symmetrically arranged along the length direction of the feeding frame;
an elastic piece capable of automatically resetting is arranged at the end part of each connecting rod, and the elastic piece is sleeved on the connecting rod;
the elastic piece is pressed by the material seat to rotate in opposite directions, and can be driven to rotate backwards after the material seat is moved away.
9. The wafer inserting mechanism for automatically organizing silicon wafers as claimed in claim 8, wherein each group of the support plates arranged in parallel and at intervals is connected with the connecting rod through a connecting plate;
one end of the connecting plate is fixedly connected with the support plate, and the other end of the connecting plate is hinged with the connecting rod;
and the connecting plate is connected by one end of the elastic piece.
10. The wafer inserting mechanism for automatically organizing silicon wafers as claimed in claim 9, wherein a supporting member for supporting the connecting plate when the connecting plate is horizontally arranged is arranged at each of two ends of the feeding frame close to one side of the connecting plate;
the upper end surface of the supporting piece is contacted with the lower end surface of the connecting plate;
one end of the supporting piece is fixedly arranged on the feeding frame, and the other end of the supporting piece is suspended and fixedly arranged below the connecting plate.
11. An inserting sheet mechanism for automatically regulating silicon wafers according to any one of claims 8 to 10, wherein the side of the support plate away from the connecting rod is a stepped surface, and the width of the upper end surface of the stepped surface is smaller than that of the lower end surface of the stepped surface.
12. The wafer inserting mechanism according to claim 11, wherein the support plate has a continuous arcuate curved section formed by a plurality of spaced grooves, the openings of the grooves are disposed toward a side adjacent to the susceptor; the groove is of a square structure or an arc structure.
13. The inserting mechanism for automatically rectifying silicon wafers as claimed in any one of claims 8 to 10 and 12, wherein the supporting rod is suspended at the bottom of the blanking frame;
two ends of the supporting rod are fixedly arranged at the end part of the blanking frame, and the middle of the supporting rod is fixed by a supporting block arranged in the blanking frame;
the support rod is fixed on the upright post at the bottom of the blanking frame;
the end part of the supporting rod is also provided with a supporting seat for fixing the supporting rod.
14. The insert mechanism for automatically organizing silicon wafers as claimed in claim 13, wherein a baffle for preventing the silicon wafers from tilting is disposed at one end of the supporting rod away from the slicing roller, and the baffle is vertically disposed on the fixed end surface of the end of the supporting rod.
15. An inserting sheet mechanism for automatically regulating silicon wafers according to any one of claims 8-10, 12 and 14, wherein the two side ends of the feeding frame and the discharging frame are provided with a primary and secondary alignment block and a hook column; at least one group of boss structures are arranged in the butt joint surface of each primary and secondary alignment block, and the boss structures are inverted V-shaped, inverted U-shaped or inverted W-shaped; and the direction of the boss structure in at least one group of the primary and secondary alignment blocks is different from the direction of the boss structure in all other primary and secondary alignment blocks.
16. An inserting sheet mechanism for automatically regulating silicon wafers as claimed in any one of claims 1 to 3, 5 to 6, 8 to 10, 12 and 14, wherein the driving members are symmetrically and fixedly arranged on the side wall surface of the bath body and are arranged near one end of the slicing roller;
the flexible belts are enclosed into a rectangular structure and horizontally surround the inner wall of the tank body, and are respectively arranged at two sides of the blanking unit symmetrically;
the edges of the flexible belts at two sides, which are close to one side of the silicon wafer, are driven by the corresponding driving pieces to move towards one side of the blanking unit along the width direction of the groove body so as to clamp the vertical surface of the silicon wafer.
17. The wafer inserting mechanism for automatically organizing silicon wafers as claimed in claim 16, wherein at least two sets of flexible belts are disposed side by side on each side of the blanking unit, and the flexible belts rotate synchronously and in the same direction towards the slicing roller.
18. The wafer inserting mechanism according to claim 17, wherein a guiding assembly is further disposed on each of the two sides of the driving member, the guiding assembly includes a sliding rail perpendicular to the length direction of the bath and a sliding block engaged with the sliding rail, one end of the sliding rail is fixed on the side of the bath, and the other end of the sliding rail is fixed on a vertical plate for clamping the feeding unit.
19. A wafer inserting mechanism for automatically regulating silicon wafers according to any one of claims 1-3, 5-6, 8-10, 12, 14 and 17-18, which is characterized by further comprising a stepping unit, wherein the stepping unit comprises a propelling cylinder and a track;
the track is arranged at the bottom of the tank body;
the pushing cylinder can push the blanking unit to move to the initial position of the butt joint unit, and then push the butt joint unit to drive all the silicon wafers after butt joint to move towards the slicing roller on the track until slicing is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111296724.1A CN113745143B (en) | 2021-11-04 | 2021-11-04 | Automatic inserting mechanism for arranging silicon wafers |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111296724.1A CN113745143B (en) | 2021-11-04 | 2021-11-04 | Automatic inserting mechanism for arranging silicon wafers |
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| CN113745143B true CN113745143B (en) | 2022-01-28 |
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| CN206370413U (en) * | 2016-11-12 | 2017-08-01 | 杭州弘晟智能科技有限公司 | A kind of full-automatic plug-in sheet machine |
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| CN111430505A (en) * | 2020-04-17 | 2020-07-17 | 天津环博科技有限责任公司 | A vertical feeding and inserting machine |
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| CN113394150A (en) * | 2021-07-01 | 2021-09-14 | 杭州中为光电技术有限公司 | Silicon chip conveying and dispersing device |
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2021
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| CN206370413U (en) * | 2016-11-12 | 2017-08-01 | 杭州弘晟智能科技有限公司 | A kind of full-automatic plug-in sheet machine |
| CN207398079U (en) * | 2017-09-26 | 2018-05-22 | 天津环鑫科技发展有限公司 | Automatic circular silicon chip inserting machine |
| CN208307817U (en) * | 2018-05-30 | 2019-01-01 | 天津环博科技有限责任公司 | A kind of silicon wafer basket turnover device |
| CN111430505A (en) * | 2020-04-17 | 2020-07-17 | 天津环博科技有限责任公司 | A vertical feeding and inserting machine |
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