Detailed Description
Please refer to fig. 1 to 5. Fig. 1 is a schematic perspective view of a computer device according to a first embodiment of the invention. Fig. 2 is a partially exploded schematic view of fig. 1. Fig. 3 is a partially exploded view of fig. 2. Fig. 4 is a partially exploded view of fig. 3. Fig. 5 is a side view schematic of fig. 1.
The computer device 10 of the present embodiment includes a housing 100, a central processing unit 200, a display card 300 and a fan housing 400. In addition, the computer device 10 may further include a circuit substrate 500.
The housing 100 includes a bottom plate 110, a front plate 120, a rear plate 130, and a cover 140. The front plate 120 and the rear plate 130 are respectively connected to opposite sides of the bottom plate 110. The cover 140 includes a top plate 141, a left side plate 143, and a right side plate 142. The left side plate 143 and the right side plate 142 are respectively connected to opposite sides of the top plate 141, and the left side plate 143 and the right side plate 142 are respectively mounted on opposite sides of the bottom plate 110, so that the bottom plate 110, the front plate 120, the rear plate 130, the top plate 141, the left side plate 143 and the right side plate 142 together form a hollow cuboid housing. In addition, the bottom plate 110, the top plate 141, the left side plate 143 and the right side plate 142 of the present embodiment have a plurality of ventilation openings 111, 1411, 1421, 1431, and the ventilation openings 111, 1411, 1421, 1431 are in communication with the outside of the casing 100. The rear plate 130 of the present embodiment has two adjacent mounting ports 131a, 131b, and the two adjacent mounting ports 131a, 131b communicate with the outside of the casing 100.
In the present embodiment, the casing 100 is a hollow cuboid, but is not limited thereto. In other embodiments, the housing may also be a hollow ellipsoid, a hollow polygonal cylinder, or a hollow cylinder.
In the present embodiment, only the bottom plate 110, the top plate 141, the left side plate 143, and the right side plate 142 have a plurality of ventilation openings 111, 1411, 1421, 1431, but not limited thereto. In other embodiments, the bottom plate, the top plate, the left side plate, the right side plate, the front plate, and the rear plate may all have a plurality of ventilation openings.
Both the CPU assembly 200 and the display card assembly 300 are disposed in the housing 100. That is, the bottom plate 110, the front plate 120, the rear plate 130, the top plate 141, the left side plate 143 and the right side plate 142 are respectively located at different sides of the central processing unit 200 and the display card unit 300, and jointly encapsulate the central processing unit 200 and the display card unit 300. In addition, the display card assembly 300 is closer to the right side plate 142 than the central processing assembly 200, and one sides of the central processing assembly 200 and the display card assembly 300 are respectively mounted at two adjacent mounting openings 131a and 131b.
As shown in fig. 3 and 4, the cpu 200 includes a housing 210, a cpu 220, and a first fan 230. The casing 210 has a first air inlet 211 and a first air outlet 212. The cpu 220 and the fan are disposed in the housing 210, and the fan is used for guiding the heat dissipation airflow to flow in from the first air inlet 211, and then flow out from the first air outlet 212 after passing through the cpu 220.
The card assembly 300 is disposed in the casing 100 and electrically connected to the cpu assembly 200, for example, through the circuit board 500. The display card assembly 300 at least partially covers the first air inlet 211 of the central processing assembly 200. In addition, the central processing unit 200 and the display card unit 300 are both rectangular, and the central processing unit 200 is parallel to and spaced from the display card unit 300.
The display card assembly 300 has a second air inlet 310 and a second air outlet 320 in communication. The second air inlet 310 of the card assembly 300 is shown adjacent to the right side plate 142 and communicates with the vents 1421 located in the right side plate 142. The second air outlet 320 of the display card assembly 300 communicates with the outside through the mounting port 131b of the cabinet 100.
In addition, the display card assembly 300 has a bottom surface 330 at least including a circuit board, wherein a first side surface of the bottom surface 330 faces the first air inlet 211 of the central processing unit 200, and a second side surface provided with a Graphics Processing Unit (GPU) faces the right side plate 142. The card assembly 300 may further have a second fan 340, where the second fan 340 is used for guiding the heat dissipation airflow to flow in from the second air inlet 310, and then flow out from the second air outlet 320 after passing through an image processor (GPU) disposed on the second side of the bottom 330.
The first air outlet 212 of the central processing assembly 200 is adjacent to the top plate 141 and communicates with the vents 1411 located in the top plate 141.
In the embodiment, the display card assembly 300 completely covers the first air inlet 211 of the central processing assembly 200, but is not limited thereto. In other embodiments, the display card assembly may also cover the first air inlet portion of the central processing assembly.
As shown in fig. 3 to 5, the wind scooper 400 has two wind inlets 410 and 420 and a wind outlet 430 that are connected. At least a portion of the air guide cover 400 is stopped between the display card assembly 300 and the first air inlet 211 of the cpu 220, so as to prevent waste heat generated by the display card assembly 300 from being sucked into the cpu 200 by the first fan 230 through the first air inlet 211. The two air inlets 410 and 420 of the air guiding cover 400 are respectively adjacent to the bottom plate 110 and the left side plate 143 and respectively communicated with the air vents 111 positioned on the bottom plate 110 and the air vents 1431 positioned on the left side plate 143. The air guiding outlet 430 is adjacent to and communicates with the first air inlet 211 of the central processing unit 200.
In the present embodiment, the air inlets 410 and 420 of the air guiding cover 400 and the second air inlet 310 of the display card assembly 300 are adjacent to the right side plate 142 of the casing 100, but not limited thereto. In other embodiments, the air inlet of the air guiding cover and the second air inlet of the display card assembly may be adjacent to other different sides of the casing.
In this embodiment, the air guide cover 400 is made of a material with low thermal conductivity, such as plastic, polymer or iron, so as to improve the heat insulation capability of the air guide cover 400.
In this embodiment, the computer device 10 may further include a power supply 600, and the power supply 600 may be disposed near the front board 120 and the top board 141, or near the bottom board 110 and the back board 130. The power supply 600 has a third air inlet 610 and a third air outlet 620 in communication. The third air outlet 620 is adjacent to the top plate 141 and adjacent to the vent 1411 located in the top plate 141.
In the present embodiment, the number of the air inlets 410 and 420 is two, but not limited thereto. In other embodiments, the number of air guiding inlets may be single, three or four.
According to the computer device of the embodiment, the air guide cover is arranged, so that the air guide cover is stopped between the bottom surface of the display card assembly and the first air inlet of the central processing assembly, and waste heat generated by the display card assembly can be prevented from being sucked into the central processing assembly.
In addition, the air inlet of the air guide cover and the second air inlet of the display card assembly are adjacent to different sides of the casing, such as the bottom plate and the right side plate, so that the heat dissipation air flow flowing through the central processing assembly and the heat dissipation air flow flowing through the display card assembly are independent and are not influenced, and the central processing assembly and the display card assembly can dissipate heat through external relatively cold heat dissipation air flows.
In addition, the two air inlets are respectively adjacent to and communicated with the air vents positioned on the bottom plate and the air vents positioned on the left side plate, so that the outside cold air can be led into the first air inlet of the central processing assembly in multiple ways. Therefore, the air inflow of the first air inlet of the central processing assembly can be increased, so that the running temperature of the central processing assembly can be reduced through more heat dissipation air flows.