CN113727582A - Server room and passive immersion heat dissipation system thereof - Google Patents
Server room and passive immersion heat dissipation system thereof Download PDFInfo
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- CN113727582A CN113727582A CN202110963102.3A CN202110963102A CN113727582A CN 113727582 A CN113727582 A CN 113727582A CN 202110963102 A CN202110963102 A CN 202110963102A CN 113727582 A CN113727582 A CN 113727582A
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- cooling
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- cooling liquid
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- 238000007654 immersion Methods 0.000 title claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 title claims description 49
- 238000001816 cooling Methods 0.000 claims abstract description 98
- 239000000110 cooling liquid Substances 0.000 claims abstract description 61
- 239000012530 fluid Substances 0.000 claims abstract description 21
- 238000005192 partition Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002480 mineral oil Substances 0.000 claims description 3
- 235000010446 mineral oil Nutrition 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000002826 coolant Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012809 cooling fluid Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种服务器机房及其无源浸没散热系统，无源浸没散热系统包括冷却柜，所述冷却柜内设有用以供服务器浸没的冷却液和设于所述冷却液中的导流单元，所述导流单元中设有与所述冷却液进行热交换、以实现所述冷却液在所述冷却柜中循环对流的流体。上述无源浸没散热系统，在满足服务器散热需求的基础上，无需动力泵，这样可以进一步降低能耗，使散热系统所在的机房PUE(评价能源效率的指标，一般大于1)很容易达到1.1以下；同时该系统取消了动力泵及相关管路、CDU及相关管路的使用，可以简化机房管路部署，大大降低机房建设成本并提升机房空间的利用率。
The invention discloses a server room and a passive immersion cooling system. The passive immersion cooling system includes a cooling cabinet, and the cooling cabinet is provided with cooling liquid for immersion of the server and a diversion arranged in the cooling liquid. The flow guiding unit is provided with a fluid for heat exchange with the cooling liquid, so as to realize the circulation and convection of the cooling liquid in the cooling cabinet. The above passive immersion cooling system, on the basis of meeting the cooling requirements of the server, does not require a power pump, which can further reduce energy consumption and make the PUE (an index for evaluating energy efficiency, generally greater than 1) of the computer room where the cooling system is located can easily reach below 1.1 At the same time, the system cancels the use of power pump and related pipelines, CDU and related pipelines, which can simplify the deployment of the equipment room pipeline, greatly reduce the equipment room construction cost and improve the utilization rate of the equipment room space.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a passive immersion heat dissipation system. The invention also relates to a server room with the passive immersion heat dissipation system.
Background
At present, in order to solve the problem that the PUE (index for evaluating energy efficiency, generally greater than 1) of the server room is high, a liquid cooling machine room is generally adopted. In an active immersion heat dissipation system in the prior art, an insulated cooling liquid is used as a medium, a server and the like are completely immersed in the medium, the medium is circulated by a power pump, and the CDU (cold water distribution unit) is connected with a water inlet pipeline and a return pipeline to distribute and exchange the cooling liquid and the cooling liquid which flows back after cooling the server. However, the system usually has the disadvantages of complex system pipeline layout, insufficient space utilization of the machine room and the like.
Therefore, how to avoid the complex layout of the pipelines of the active immersion heat dissipation system and the insufficient utilization rate of the machine room space is a technical problem to be solved by the technical personnel in the field.
Disclosure of Invention
The invention aims to provide a passive immersion heat dissipation system which can simplify the arrangement of machine room pipelines, improve the utilization rate of machine room space and further reduce energy consumption. Another object of the present invention is to provide a server room including the above passive immersion heat dissipation system.
In order to achieve the above object, the present invention provides a passive immersion heat dissipation system, which includes a cooling cabinet, a cooling liquid for immersing a server and a diversion unit disposed in the cooling liquid are disposed in the cooling cabinet, and a fluid for exchanging heat with the cooling liquid to achieve circulation and convection of the cooling liquid in the cooling cabinet is disposed in the diversion unit.
Optionally, the flow guide unit comprises an inlet, an outlet, and a cooling coil connected to the inlet and the outlet.
Optionally, the cooling coil comprises a plurality of sections of pipes connected in series.
Optionally, the cooling coil is an integrally formed metal tube.
Optionally, a waterproof sheet is arranged at the joint of any two adjacent pipelines.
Optionally, a preset space for accommodating a server is provided between the diversion unit and the bottom of the cooling cabinet.
Optionally, the flow guide unit is arranged on at least one side surface of the cooling cabinet.
Optionally, the cooling system further comprises a partition plate arranged between the flow guide unit and the server, and preset distances are respectively arranged between the partition plate and the upper liquid level of the cooling liquid and between the partition plate and the lower liquid level of the cooling liquid.
Optionally, the cooling fluid is at least one of a mineral oil and a fluorinated liquid.
The invention also provides a server room which comprises a server and a passive immersion heat dissipation system for heat dissipation of the server.
Compared with the background art, the passive immersion heat dissipation system provided by the embodiment of the invention comprises a cooling cabinet, wherein the cooling cabinet is internally provided with cooling liquid and a flow guide unit, the cooling liquid is used for immersing a server, the flow guide unit is arranged in the cooling liquid, and further, the flow guide unit is internally provided with fluid which is used for performing heat exchange with the cooling liquid so as to realize circulating convection of the cooling liquid in the cooling cabinet, so that the heat dissipation requirement of the server in the cooling cabinet can be met.
Specifically speaking, because the coolant has the characteristic of expending with heat and contracting with cold, the coolant in the cooling cabinet is expanded rapidly after being heated in certain region where the server is located, can form local low density, like this under the effect of buoyancy, local coolant very fast can rise to the top region of cooling cabinet, and in the same way, after local coolant in the cooling cabinet meets the low-temperature fluid in the water conservancy diversion unit and takes place the heat exchange with it, density increase after local coolant cools off fast, because of the effect of gravity, these local high-density coolant can flow to the bottom region of cooling cabinet fast. Therefore, the server is completely immersed in the cooling liquid, after the server starts to work, the CPU, the GPU, the memory, the HDD and the like in the server are used as heating sources, the cooling liquid near the heating sources is heated, the heated cooling liquid can quickly flow to the top of the cooling cabinet, and the low-temperature cooling liquid around the heating sources can be quickly supplemented to take away the heat of the heating sources, so that the heat dissipation requirement of the server in the cooling cabinet can be met; meanwhile, due to the heat exchange effect of the fluid in the flow guide unit, the circulating convection of the cooling liquid in the cooling cabinet can be ensured, and further, the server soaked in the cooling liquid can work in a low-temperature environment and reliably and continuously work for a long time.
Compared with the traditional arrangement mode which needs a power pump, a CDU (cold water distribution unit) and related pipelines thereof, the passive immersion heat dissipation system provided by the embodiment of the invention does not need the power pump on the basis of meeting the heat dissipation requirement of a server, so that the energy consumption can be further reduced, and the PUE (index for evaluating energy efficiency, generally more than 1) of a machine room where the heat dissipation system is located can easily reach below 1.1; on the other hand, the system cancels a power pump and related pipelines, a CDU and related pipelines, can simplify the arrangement of the pipelines of the machine room, greatly reduces the construction cost of the machine room and improves the utilization rate of the space of the machine room.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a passive immersion heat dissipation system according to an embodiment of the present invention;
FIG. 2 is a side view of the single cooling cabinet of FIG. 1;
FIG. 3 is a top plan view of the single cooling cabinet of FIG. 1;
FIG. 4 is a schematic view of the natural convection of the coolant in FIG. 2;
FIG. 5 is a schematic structural view of a first cooling cabinet;
FIG. 6 is a schematic structural view of a second cooling cabinet;
fig. 7 is a schematic structural diagram of a third cooling cabinet.
Wherein:
1-a cooling cabinet, 11-cooling liquid, 12-a flow guide unit, 121-an inlet, 122-an outlet, 123-a cooling coil and 13-a clapboard;
2-branch water inlet pipeline;
3-branch return line;
4-main water inlet pipeline;
5-a main return line;
6-server.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a passive immersion heat dissipation system, which can simplify the arrangement of machine room pipelines, improve the utilization rate of machine room space and further reduce energy consumption. Another core of the invention is to provide a server room comprising the passive immersion heat dissipation system.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
It should be noted that the following directional terms such as "upper end, lower end, left side, right side" and the like are defined based on the drawings of the specification.
Referring to fig. 1 to 7, fig. 1 is a schematic structural diagram of a passive immersion heat dissipation system according to an embodiment of the present invention; FIG. 2 is a side view of the single cooling cabinet of FIG. 1; FIG. 3 is a top plan view of the single cooling cabinet of FIG. 1; FIG. 4 is a schematic view of the natural convection of the coolant in FIG. 2; FIG. 5 is a schematic structural view of a first cooling cabinet; FIG. 6 is a schematic structural view of a second cooling cabinet; fig. 7 is a schematic structural diagram of a third cooling cabinet.
The passive immersion heat dissipation system provided by the embodiment of the invention comprises a cooling cabinet 1, wherein cooling liquid 11 and a flow guide unit 12 are arranged in the cooling cabinet 1, the cooling liquid 11 is used for immersing the server 6, and the flow guide unit 12 is arranged in the cooling liquid 11. The guide unit 12 may be disposed above or to the side of the server 6.
Further, the diversion unit 12 is provided with a fluid for exchanging heat with the cooling liquid 11 to realize the circulation convection of the cooling liquid 11 in the cooling cabinet 1, so that the heat dissipation requirement of the servers 6 in the cooling cabinet 1 can be met.
It should be noted that the fluid in the diversion unit 12 is a cryogenic fluid, which has a temperature in the range of 15 ° to 40 °, and generally, the temperature of the fluid is set to about 15 ° in hot summer and about 40 ° in cold winter. The low-temperature fluid may be low-temperature water, which may be pre-disposed in the diversion unit 12, or may be exchanged in time during use to ensure that the diversion unit 12 maintains a stable low-temperature state, and of course, in such a state, the diversion unit 12 needs to be connected to an external cold water source.
In this way, because the cooling liquid 11 has the characteristics of expansion with heat and contraction with cold, the cooling liquid 11 in the cooling cabinet 1 rapidly expands after being heated in a certain area where the server 6 is located, and can form a local low density, so under the action of buoyancy, the local cooling liquid 11 can rapidly rise to the top area of the cooling cabinet 1, and similarly, after the local cooling liquid 11 in the cooling cabinet 1 meets the low-temperature fluid in the diversion unit 12 and exchanges heat with the low-temperature fluid, the density of the local cooling liquid 11 is rapidly increased after being cooled, and due to the action of gravity, the local high-density cooling liquid 11 can rapidly flow to the bottom area of the cooling cabinet 1.
On the basis, the server 6 is completely immersed in the cooling liquid 11, after the server 6 starts to work, a CPU, a GPU, a memory, an HDD and the like in the server are used as heating sources, the cooling liquid 11 near the heating sources is heated, the heated cooling liquid 11 can quickly flow to the top of the cooling cabinet 1, and at the moment, the low-temperature cooling liquid 11 around the heating sources can be quickly supplemented to take away the heat of the heating sources, so that the heat dissipation requirement of the server 6 in the cooling cabinet 1 can be met; meanwhile, due to the heat exchange effect of the fluid in the diversion unit 12, the circulating convection of the cooling liquid 11 in the cooling cabinet 1 can be ensured, and further, the server 6 soaked in the cooling liquid 11 can work in a low-temperature environment and reliably and continuously work for a long time.
Compared with the traditional arrangement mode which needs a power pump, a CDU (cold water distribution unit) and related pipelines thereof, the passive immersion heat dissipation system provided by the embodiment of the invention does not need the power pump on the basis of meeting the heat dissipation requirement of the server 6, so that the energy consumption can be further reduced, and the PUE (index for evaluating energy efficiency, generally more than 1) of a machine room where the heat dissipation system is located can easily reach below 1.1; on the other hand, the system cancels a power pump and related pipelines, a CDU and related pipelines, can simplify the arrangement of the pipelines of the machine room, greatly reduces the construction cost of the machine room and improves the utilization rate of the space of the machine room.
In order to further improve the heat dissipation effect, the cooling liquid 11 is selected from the cooling liquid 11 having excellent expansion/contraction characteristics under heat/cold conditions. For example, the cooling fluid 11 may be at least one of insulating synthetic oil, fluorinated fluid and mineral oil, which have the characteristics of low density, good fluidity and large volume expansion coefficient.
Specifically, the flow guide unit 12 specifically includes an inlet 121, an outlet 122, and a cooling coil 123, and the cooling coil 123 is connected to the inlet 121 and the outlet 122. The guide unit 12 may be connected to an external cold water source through an inlet 121 thereof, and an outlet 122 of the guide unit 12 may be connected to an external return tank. Of course, the diversion unit 12 may also be configured as a cooling coil 123 having an inlet 121 and an outlet 122, and after the diversion unit 12 is filled with the cryogenic fluid, the inlet 121 and the outlet 122 may be closed and placed in the cooling fluid 11 for independent use.
More specifically, the cooling coil 123 may be configured to include multiple sections of helically-shaped, sequentially-connected tubing. When the pipeline is made of metal materials, such as copper pipes, any two adjacent copper pipes are welded.
Of course, the number of the pipes may be adjusted according to the requirement of heat dissipation, and is not particularly limited herein.
In order to ensure the sealing performance of the cooling coil 123, a waterproof sheet is arranged at the joint of any two adjacent pipelines. Specifically, when the pipeline is a copper pipe, the waterproof sheet is a waterproof aluminum sheet, that is, the joint of any two adjacent copper pipes is welded with the waterproof aluminum sheet, and the waterproof aluminum sheet can prevent the joint of two adjacent copper pipes from leaking, so that the sealing performance of the cooling coil 123 can be ensured.
To facilitate the exchange of cryogenic fluid by the diversion unit 12, the inlet 121 and the outlet 122 of the diversion unit 12 are disposed on the same side, for example, the inlet 121 is disposed at the end of the right end pipe of the cooling coil 123, the outlet 122 is connected to the end of the left end pipe of the cooling coil 123 through a pipe, and the pipe connected to the outlet 122 penetrates through the cavity in the center of the entire cooling coil 123.
Of course, the cooling coil 123 may be an integrally formed metal tube, such as a copper tube or an aluminum tube, according to actual requirements.
As an embodiment, a predetermined space for accommodating the server 6 is provided between the diversion unit 12 and the bottom of the cooling cabinet 1, that is, the diversion unit 12 is disposed above the server 6.
In this way, the server 6 is located below the deflector unit 12, with the inlet 121 and outlet 122 of the deflector unit 12 extending through the top of the cooling cabinet 1. After the server 6 is operated, when the heated cooling liquid 11 flows to the top area, it will quickly diffuse around the cooling coil 123, the low-temperature fluid in the cooling coil 123 will quickly cool these high-temperature cooling liquids 11, the low-temperature fluid absorbing heat is heated, and the high-temperature cooling liquid 11 will quickly become the low-temperature cooling liquid 11, and then will quickly flow to the bottom area of the cooling cabinet 1, the cooling liquid 11 at the bottom of the cooling cabinet 1 will quickly diffuse to the whole bottom of the cooling cabinet 1, and these low-temperature cooling liquids 11 will quickly supplement the space after flowing away because of being heated by the heat source of the server 6.
As another specific embodiment, the diversion unit 12 is disposed on at least one side of the cooling cabinet 1, that is, the diversion unit 12 is disposed on one or more sides of the cooling cabinet 1.
In the present embodiment, the cooling cabinet 1 and the server 6 are both rectangular parallelepiped structures as a whole, and the cooling cabinet 1 and the server 6 each include four side surfaces as a whole. In this way, one or more sides of the server 6 are provided with deflector units 12.
In this embodiment, the number of the diversion units 12 may be adjusted as needed, for example, one diversion unit 12 may be provided, one side surface of the cooling cabinet 1 is correspondingly provided with the diversion unit 12, the inlet 121 and the outlet 122 of the diversion unit 12 penetrate through the side surface of the cooling cabinet 1, the cooling coil 123 of the diversion unit 12 is disposed on the inner side of the side surface, and the diversion unit 12 is disposed on one side of the server 6; of course, two diversion units 12 may be provided, two diversion units 12 are respectively provided corresponding to two opposite side surfaces of the cooling cabinet 1, the two diversion units 12 are respectively provided at the left and right sides of the server 6, and the number of the servers 6 between the two diversion units 12 may also be increased to two.
In order to further improve the heat dissipation effect, when the guide unit 12 is located at the side of the server 6, a partition 13 is further included between the server 6 and the guide unit 12, the partition 13 has a preset distance from the upper liquid surface of the coolant 11, and the partition 13 has a preset distance from the lower liquid surface of the coolant 11.
Therefore, the cooling liquid 11 heated by the heat source of the server 6 continuously floats upwards, the cooling liquid 11 cooled by the low-temperature fluid in the diversion unit 12 continuously sinks and continuously circulates, meanwhile, under the action of the partition plate 13, the cooling liquid 11 cooled by the low-temperature fluid in the diversion unit 12 needs to flow to the bottom of the cooling cabinet 1 through the opening below the partition plate 13, and in order to supplement the sinking cooling liquid 11, the cooling liquid 11 positioned at the top of the cooling cabinet 1 needs to flow to the area nearby the diversion unit 12 through the opening above the partition plate 13, so that a natural circulation convection channel is easier to form, meanwhile, the existence of heat dissipation dead corners in the cooling cabinet 1 can be reduced, and the server 6 can be kept to work in a low-temperature environment and reliably and continuously works for a long time. The heat dissipation dead space is a region where almost no coolant 11 flows in the cooling cabinet 1.
It should be noted that the number of the cooling cabinets 1 may be multiple, the passive immersion heat dissipation system further includes a main water inlet pipeline 4 and a main return pipeline 5, an inlet 121 of the diversion unit 12 in any cooling cabinet 1 is connected to the main water inlet pipeline 4 through the branch water inlet pipeline 2, and an outlet 122 of the diversion unit 12 in any cooling cabinet 1 is connected to the main return pipeline 5 through the branch return pipeline 3.
The cooling capacity of the passive immersion heat dissipation system can be up to more than 30 KW/cabinet, the heat dissipation requirements of most of the cabinets of the servers 6 can be met, meanwhile, a completely unpowered pump is adopted, the flow guide unit 12 is integrated into the cooling cabinet 1, a cooling passage is formed by natural convection of the cooling liquid 11, and the passive immersion heat dissipation system is an environment-friendly and efficient immersion heat dissipation scheme.
The server room provided by the invention comprises a server 6 and a passive immersion heat dissipation system for heat dissipation of the server 6, which is described in the above specific embodiment; other parts of the server room can be referred to the prior art and are not expanded herein.
It is noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The server room and the passive immersion heat dissipation system thereof provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are provided only to help understand the concepts of the present invention and the core concepts thereof. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. The passive immersion heat dissipation system is characterized by comprising a cooling cabinet (1), wherein a cooling liquid (11) for immersing a server (6) and a flow guide unit (12) arranged in the cooling liquid (11) are arranged in the cooling cabinet (1), and a fluid which exchanges heat with the cooling liquid (11) to realize circulating convection of the cooling liquid (11) in the cooling cabinet (1) is arranged in the flow guide unit (12).
2. A passive immersion heat dissipation system as defined in claim 1, wherein the flow directing unit (12) comprises an inlet (121), an outlet (122), and a cooling coil (123) connected to the inlet (121) and the outlet (122).
3. The passive immersion heat dissipation system of claim 2, wherein the cooling coil (123) comprises a plurality of helically-shaped, sequentially-connected lengths of pipe.
4. The passive immersion heat dissipation system of claim 2, wherein the cooling coil (123) is an integrally formed metal tube.
5. A passive immersion heat removal system as claimed in claim 3, wherein a waterproof sheet is provided at the junction of any two adjacent pipes.
6. A passive immersion heat dissipation system according to any of claims 1-5, characterized in that there is a predetermined space between the deflector unit (12) and the bottom of the cooling cabinet (1) to accommodate a server (6).
7. A passive immersion heat dissipation system according to any of claims 1-5, characterized in that the deflector unit (12) is provided at least one side of the cooling cabinet (1).
8. The passive immersion heat dissipation system of claim 7, further comprising a partition (13) disposed between the flow guide unit (12) and the server (6), wherein a preset distance is provided between the partition (13) and the upper liquid level of the cooling liquid (11), and between the partition (13) and the lower liquid level of the cooling liquid (11).
9. The passive immersion heat dissipation system of claim 7, wherein the cooling liquid (11) is at least one of a mineral oil and a fluorinated liquid.
10. A server room comprising servers (6), further comprising a passive immersion heat dissipation system as claimed in any one of claims 1-9 for dissipating heat from the servers (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110963102.3A CN113727582A (en) | 2021-08-20 | 2021-08-20 | Server room and passive immersion heat dissipation system thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110963102.3A CN113727582A (en) | 2021-08-20 | 2021-08-20 | Server room and passive immersion heat dissipation system thereof |
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| CN113727582A true CN113727582A (en) | 2021-11-30 |
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| CN202110963102.3A Pending CN113727582A (en) | 2021-08-20 | 2021-08-20 | Server room and passive immersion heat dissipation system thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111615291A (en) * | 2019-02-25 | 2020-09-01 | 鸿富锦精密电子(天津)有限公司 | Immersion cooling device |
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| US20180070477A1 (en) * | 2015-03-30 | 2018-03-08 | Exascaler Inc. | Electronic-device cooling system |
| CN109757061A (en) * | 2017-11-03 | 2019-05-14 | 阿里巴巴集团控股有限公司 | Cooling machine cabinet and cooling system |
| CN209314194U (en) * | 2018-10-12 | 2019-08-27 | 北京丰联奥睿科技有限公司 | A kind of cooling system of liquid dipping machine cabinet |
| CN110730602A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
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2021
- 2021-08-20 CN CN202110963102.3A patent/CN113727582A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180070477A1 (en) * | 2015-03-30 | 2018-03-08 | Exascaler Inc. | Electronic-device cooling system |
| CN109757061A (en) * | 2017-11-03 | 2019-05-14 | 阿里巴巴集团控股有限公司 | Cooling machine cabinet and cooling system |
| CN209314194U (en) * | 2018-10-12 | 2019-08-27 | 北京丰联奥睿科技有限公司 | A kind of cooling system of liquid dipping machine cabinet |
| CN110730602A (en) * | 2019-11-15 | 2020-01-24 | 北京丰联奥睿科技有限公司 | Liquid immersion type server cabinet and cooling system thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111615291A (en) * | 2019-02-25 | 2020-09-01 | 鸿富锦精密电子(天津)有限公司 | Immersion cooling device |
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