CN113725108A - Drift positioning measurement method and device for large-board fan-out type packaged chip - Google Patents
Drift positioning measurement method and device for large-board fan-out type packaged chip Download PDFInfo
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Abstract
本发明涉及大板扇出型封装芯片的漂移定位测量方法，包括以下：构建误差补偿模型，包括，获取激光干涉仪采集的第一数据，根据第一数据得到运动平台的直线度以及垂直度相关信息，根据第一数据计算进而建立所述误差补偿模型；漂移定位测量，包括，获取机器视觉系统采集的第二数据，第二数据包括芯片的图像信息，获取所述运动平台的X、Y、Z轴搭载的光栅尺采集的第三数据，第三数据用于反馈所述运动平台的实时位置信息，根据所述图像信息结合所述第三数据得到所述芯片的误差信息，根据所述误差信息，结合建立的所述误差补偿模型，对所述芯片进行误差补偿。本发明能够使大板扇出型封装芯片的定位精度能达到微米级，能满足芯片封装定位的要求。
The invention relates to a drift positioning measurement method of a large-board fan-out packaged chip, comprising the following steps: constructing an error compensation model, including acquiring first data collected by a laser interferometer, and obtaining straightness and verticality correlation of a motion platform according to the first data information, and then establish the error compensation model according to the first data calculation; drift positioning measurement, including obtaining the second data collected by the machine vision system, the second data includes the image information of the chip, and obtaining the X, Y, The third data collected by the grating ruler mounted on the Z axis is used to feed back the real-time position information of the motion platform, and the error information of the chip is obtained according to the image information combined with the third data. The information is combined with the established error compensation model to perform error compensation on the chip. The invention can make the positioning accuracy of the large-board fan-out package chip reach the micrometer level, and can meet the requirements of chip package positioning.
Description
Technical Field
The invention relates to the field of intelligent detection of ceramic tiles, in particular to a method and a device for measuring drift positioning of a large-board fan-out type packaged chip.
Background
In the packaging process of the chip, the steps of temporary bonding, wafer reconstruction, plastic packaging to rewiring and bump manufacturing are generally required. Due to the problem of chip drift, subsequent punching and wiring processes of chip packaging, which need accurate position information of the chip, are affected, and finally the yield of the chip packaging is affected.
Today's advanced packaging technologies are mainly divided into fan-in type packages and fan-out type packages, and in recent years, large-sized panel-level fan-out type packages have appeared with further development of fan-out type packages. The large-board fan-out type packaging substrate is generally 600mm x 600mm in size, the number of chips to be packaged placed on the substrate is very large, and meanwhile, the positioning precision is required to be in a micron level. In the packaging process of the large-board fan-out packaging chip, due to the difference of the thermal expansion coefficients between the plastic packaging frame and the epoxy resin, the chip can have the problems of drifting and the like caused by factors such as mismatch between heterogeneous materials and the like.
For the understanding of the drift problem, as shown in fig. 1, the solid line is the theoretical position of the chip in the drawing, and the dotted line is the actual position of the chip after the drift occurs, wherein the deflection angle is θ, the x coordinate is shifted by a distance of d1, and the y axis is shifted by a distance of d 2.
Disclosure of Invention
The invention aims to solve at least one of the defects of the prior art and provides a method and a device for measuring the drift positioning of a large-board fan-out type packaged chip.
In order to achieve the purpose, the invention adopts the following technical scheme:
specifically, a method for measuring the drift positioning of a large-board fan-out type packaged chip is provided, which comprises the following steps:
constructing an error compensation model, including,
acquiring first data acquired by a laser interferometer, acquiring relevant information of straightness and verticality of a moving platform according to the first data,
calculating according to the first data to further establish the error compensation model;
the drift location measurements, including,
acquiring second data collected by a machine vision system, wherein the second data comprises image information of a large plate fan-out type packaging chip,
acquiring third data acquired by a grating ruler carried by an X, Y, Z shaft of the motion platform, wherein the third data is used for feeding back real-time position information of the motion platform,
combining the image information with the third data to obtain error information of the chip, wherein the error information comprises the offset of the actual position of the chip from the central position of the chip at the theoretical position and the deflection angle of the chip,
and according to the error information, combining the established error compensation model to perform error compensation on the chip.
Further, the information related to the straightness and the perpendicularity of the motion platform is obtained specifically in the following way,
keeping the Y axis and the Z axis of the motion platform still, recording data measured by the laser interferometer once at intervals of a first threshold distance by moving the X axis of the motion platform, repeatedly measuring for multiple times in an effective stroke by controlling the motion platform, recording the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer, and similarly, measuring the positioning precision and the straightness of the Y axis, wherein the perpendicularity of the motion platform measured by the laser interferometer is measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as a reference axis of perpendicularity measurement, measuring the straightness of the second axis under the condition of keeping the measurement reference of the first axis unchanged, and solving the horizontal perpendicularity of the X, Y axis of the motion platform as theta by fitting the straight line.
Further, the calculating and then establishing the error compensation model according to the first data specifically includes the following steps,
the positioning error model created by the positioning error generated by the moving platform is as follows,
the laser interferometer is used for carrying out equal interval measurement on 11 measurement target points, a positioning error model is established according to the positioning error of the motion platform as the following formula,
δx＝a1x+b1 (13)
δy＝a2y2+b2y+c2 (14)
in the formula ofxFor X-axis positioning error, δyFor Y-axis positioning error, x is displacement of the motion stage, a1、a2、b1、b2、c2Are all constants;
an error model is obtained of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the X, Y axis straightness error curve,
ε＝a3x5+b3x4+c3x3+d3x2+e3x+f3 (15)
establishing a motion platform positioning error model by the motion platform straightness accuracy and the positioning accuracy as follows:
Δx＝δx+εx (16)
Δy＝δy+εy (17)
wherein ΔxPositioning error, Δ, for the x-axisyPositioning error for the y-axis;
the actual coordinates of the motion platform are:
xactual(xideal+Δx)+(yideal+Δy)sinθ (18)
yactual＝(yideal+Δy)cosθ(19)。
further, the manner of acquiring the second data specifically includes the following,
controlling an industrial camera of a machine vision system to move to an initial position;
controlling the industrial camera to circularly acquire images through the planned path until the images are completely acquired;
the following rules are to be followed in planning the path,
a plurality of image acquisition areas are preset for the industrial camera, so that the images of all chips can be completely acquired, and the acquired images have overlapped parts when the industrial camera is positioned in the adjacent image acquisition areas.
Further, the obtaining of the error information of the chip according to the image information and the third data specifically includes the following steps,
carrying out image preprocessing on the acquired image so as to reduce the noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of an incomplete chip;
reading the position of the original image corresponding to the pixel level edge of each contour by combining the third data, respectively obtaining the gray values of a limited number of pixel points at the position of the original image along the left and right sides of the gradient direction, performing cubic polynomial fitting by using the gray values of the limited number of pixel points, and regarding the inflection point of the fitted curve as a sub-pixel edge point;
correspondingly classifying the obtained sub-pixel edge points according to each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
and performing linear fitting on the sub-pixel edge point set corresponding to each chip to obtain error information of each chip.
Further, the first threshold distance is specifically 5 mm.
The invention also provides a drift positioning and measuring device of the large-board fan-out type packaging chip, which comprises,
an error compensation model building block comprising,
the motion platform data acquisition unit is used for acquiring first data acquired by the laser interferometer, acquiring relevant information of straightness and verticality of the motion platform according to the first data,
the model establishing unit is used for calculating according to the first data so as to establish the error compensation model;
the drift positioning measurement module comprises a drift positioning measurement module,
a chip data acquisition unit for acquiring second data acquired by the machine vision system, wherein the second data comprises image information of the large board fan-out type packaging chip,
a moving platform position data obtaining unit, configured to obtain third data collected by a grating ruler carried by an X, Y, Z axis of the moving platform, where the third data is used to feed back real-time position information of the moving platform,
an error information calculation unit for obtaining error information of the chip according to the image information and the third data, wherein the error information comprises the offset of the chip at the actual position and the center position at the theoretical position and the deflection angle of the chip,
and the error compensation unit is used for carrying out error compensation on the chip according to the error information and by combining the established error compensation model.
The invention also proposes a computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 6.
The invention has the beneficial effects that:
the method combines the advantages of software measurement and mechanical compensation, measures the straightness accuracy, the positioning accuracy and the verticality of the moving platform in advance by using the laser interferometer, establishes an error compensation model, and reduces the accumulated error generated in the process of acquiring images by the camera. In the image positioning process, the sub-pixel edge of the outline of each chip is positioned by a sub-pixel edge detection algorithm, so that the positioning precision reaches the sub-pixel level. Meanwhile, accumulated errors can be effectively reduced through error compensation of the motion platform. The positioning precision of the large-board fan-out packaging chip positioning system with two advantages can reach the micron level, and the requirement of chip packaging positioning can be met.
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The foregoing and other features of the present disclosure will become more apparent from the detailed description of the embodiments shown in conjunction with the drawings in which like reference characters designate the same or similar elements throughout the several views, and it is apparent that the drawings in the following description are merely some examples of the present disclosure and that other drawings may be derived therefrom by those skilled in the art without the benefit of any inventive faculty, and in which:
FIG. 1 is a schematic diagram showing an error principle of a drift positioning measurement method of a large-board fan-out type packaged chip according to the present invention;
FIG. 2 is a flow chart showing the operation of the method for measuring the drift location of a large-board fan-out package chip according to the present invention;
FIG. 3 shows a path of an image acquired by an industrial camera according to the method for measuring the drift positioning of a large-board fan-out package chip of the present invention;
FIG. 4 is a schematic structural diagram of the motion platform of the present invention;
FIG. 5 is a schematic diagram showing X-axis positioning accuracy of the method for measuring drift positioning of a large-board fan-out package chip according to the present invention;
FIG. 6 is a schematic diagram showing Y-axis positioning accuracy of the method for measuring drift positioning of a large-board fan-out package chip according to the present invention;
FIG. 7 is a schematic diagram of perpendicularity measurement performed by a laser interferometer of the drift positioning measurement method for a large-board fan-out type packaged chip according to the present invention;
FIG. 8 is a schematic diagram of a camera coordinate system and a machine tool coordinate system of the method for measuring the drift location of a fan-out package chip of a large board according to the present invention;
fig. 9 shows the chip coordinates in the large board coordinate system of the method for measuring the drift location of the large board fan-out type packaged chip according to the present invention.
Detailed Description
The conception, the specific structure and the technical effects of the present invention will be clearly and completely described in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the schemes and the effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The same reference numbers will be used throughout the drawings to refer to the same or like parts.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, embodiment 1, the present invention provides a method for measuring drift positioning of a large board fan-out type packaged chip, including the following steps:
constructing an error compensation model, including,
acquiring first data acquired by a laser interferometer, acquiring relevant information of straightness and verticality of a moving platform according to the first data,
calculating according to the first data to further establish the error compensation model;
the drift location measurements, including,
acquiring second data collected by a machine vision system, wherein the second data comprises image information of a large plate fan-out type packaging chip,
acquiring third data acquired by a grating ruler carried by an X, Y, Z shaft of the motion platform, wherein the third data is used for feeding back real-time position information of the motion platform,
combining the image information with the third data to obtain error information of the chip, wherein the error information comprises the offset of the actual position of the chip from the central position of the chip at the theoretical position and the deflection angle of the chip,
and according to the error information, combining the established error compensation model to perform error compensation on the chip.
In the aspect of hardware, referring to fig. 4, the motion platform is mainly a marble platform and mainly comprises a movable X, Y and Z three-axis loaded high-precision grating ruler.
The machine vision system mainly comprises a camera, a light source and a computer control end.
The invention adopts a single industrial camera to carry out image acquisition and positioning measurement on the large-board fan-out packaging chip. The camera in the image capturing system shown in fig. 4 is installed on the Z-axis of the motion platform, and the camera is focused by moving the Z-axis, and the X-axis and Y-axis of the motion platform move the camera to a proper position. In order to ensure that an image with high single-pixel precision is acquired, the field of view of the acquired image is usually very small, and the large-size image needs to be acquired by moving the X-axis and Y-axis mobile cameras of the mobile motion platform for multiple times.
As a preferred embodiment of the present invention, the information related to the straightness and the perpendicularity of the moving platform is specifically obtained by,
keeping the Y axis and the Z axis of the motion platform still, recording data measured by the laser interferometer once at intervals of a first threshold distance by moving the X axis of the motion platform, repeatedly measuring for multiple times in an effective stroke by controlling the motion platform, recording the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer, and similarly, measuring the positioning precision and the straightness of the Y axis, wherein the perpendicularity of the motion platform measured by the laser interferometer is measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as a reference axis of perpendicularity measurement, measuring the straightness of the second axis under the condition of keeping the measurement reference of the first axis unchanged, and solving the horizontal perpendicularity of the X, Y axis of the motion platform as theta by fitting the straight line.
As shown in fig. 7, 5529A — a dynamic calibrator (laser interferometer) measures perpendicularity of a moving platform by measuring straightness of a first axis of the moving platform and fitting a straight line as a reference axis for perpendicularity measurement, measuring straightness of a second axis under the condition that a measurement reference of the first axis is kept unchanged, and finding out that the horizontal perpendicularity of an X, Y axis of the moving platform is θ by fitting the straight line.
Before chip positioning measurement, the motion error measurement of the motion platform needs to be carried out, and an error model is established for position compensation of subsequent chip positioning. The invention uses a high-precision laser interferometer to measure the error of the motion platform. The specific measurement method is as follows: and the Y axis and the Z axis of the motion platform are kept still, the data measured by the laser interferometer are recorded once every 5mm by moving the X axis of the motion platform, and the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer are recorded by controlling the motion platform to repeatedly measure for multiple times in an effective stroke. And similarly, measuring the positioning progress and the straightness of the Y axis and the verticality of the X axis and the Y axis. And establishing a motion error model of the motion platform by using the measured positioning precision and perpendicularity of the X axis and the Y axis of the motion platform and the straightness of the X axis and the Y axis. The error between the theoretical position and the actual position of the moving platform moving from any one position to another position can be calculated through an error model.
As a preferred embodiment of the present invention, the calculating and then establishing the error compensation model according to the first data specifically includes the following,
the positioning error model created by the positioning error generated by the moving platform is as follows,
the measuring travel of the X axis and the Y axis is determined to be 500mm according to the size of a panel to be measured, and 11 measuring target points are taken for equal-interval measurement in an experiment according to relevant regulations of national standard GB/T17421.2 _ 2000. The results of repeated measurements using a laser interferometer are shown in FIGS. 5 and 6: the laser interferometer is used for carrying out equal interval measurement on 11 measurement target points, a positioning error model is established according to the positioning error of the motion platform as the following formula,
δx＝a1x+b1 (13)
δy＝a2y2+b2y+c2 (14)
in the formula ofxFor X-axis positioning error, δyFor Y-axis positioning error, x is displacement of the motion stage, a1、a2、b1、b2、c2Are all constants;
an error model is obtained of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the X, Y axis straightness error curve,
ε＝a3x5+b3x4+c3x3+d3x2+e3x+f3 (15)
establishing a motion platform positioning error model by the motion platform straightness accuracy and the positioning accuracy as follows:
Δx＝δx+εx (16)
Δy＝δy+εy (17)
wherein epsilonxFor X-axis positioning error caused by Y-axis straightness, X-axis positioning error epsilon caused by Y-axis straightness can be obtained by substituting displacement of Y-axis into formula (15)x。εyThe same can be obtained.
Wherein ΔxPositioning error, Δ, for the x-axisyPositioning error for the y-axis;
the actual coordinates of the motion platform are:
xactual＝(xideal+Δx)+(yideal+Δy)sinθ (18)
yactual＝(yideal+Δy)cosθ(19)。
as a preferred embodiment of the present invention, the second data acquisition mode specifically includes the following,
controlling an industrial camera of a machine vision system to move to an initial position;
controlling the industrial camera to circularly acquire images through the planned path until the images are completely acquired;
the following rules are to be followed in planning the path,
a plurality of image acquisition areas are preset for the industrial camera, so that the images of all chips can be completely acquired, and the acquired images have overlapped parts when the industrial camera is positioned in the adjacent image acquisition areas.
As a preferred embodiment of the present invention, the obtaining of the error information of the chip according to the image information and the third data specifically includes the following steps,
carrying out image preprocessing on the acquired image so as to reduce the noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of an incomplete chip;
reading the position of the original image corresponding to the pixel level edge of each contour by combining the third data, respectively obtaining the gray values of a limited number of pixel points at the position of the original image along the left and right sides of the gradient direction, performing cubic polynomial fitting by using the gray values of the limited number of pixel points, and regarding the inflection point of the fitted curve as a sub-pixel edge point;
correspondingly classifying the obtained sub-pixel edge points according to each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
and performing linear fitting on the sub-pixel edge point set corresponding to each chip to obtain error information of each chip.
Specifically, the method comprises the following processes of fitting the sub-pixel edge by adopting a least square method, wherein a straight line edge mathematical model is as follows:
y＝ax+b (6)
collecting points (x) of one chip straight line edge1，y1)，(x2，y2)......(xn，yn) And (i is 1, 2, …, n) is substituted into the formula (7) to obtain the sum of squares of residuals of the actual edge and the fitted edge Q.
The above equation is derived for a, b, the derivative is made zero, and the parameters a and b of the edge are found by the least residual sum of squares.
Four edges of the chip are fitted to obtain four edge straight lines of the chip, and the intersection point A (x) of the four straight lines is obtaineda，ya)、B(xb，yb)、C(xc，yc)、D(xd，yd). The center position (x) of the chip0，y0) Is composed of
Wherein lwidthIs the width of the image, /)heightIs the height of the image.
Solving the minimum included angle theta between the four edge straight lines and two coordinate axes of the image coordinate system1、θ2、θ3、θ4. The chip is offset by an angle of
As a preferred embodiment of the present invention, the first threshold distance is specifically 5 mm.
In particular, when the method provided by the invention is applied,
camera calibration, as shown in FIG. 8, P0(x0，y0) As the coordinates of the center of the chip in the image coordinate system u-v, P1(x1，y1) The coordinates of the center point of the camera under the world coordinate system X-Y. The v axis of the image coordinate system and the world coordinate axis Y cannot be guaranteed to be absolutely parallel in the installation process of the camera, and meanwhile, the physical size represented by a single pixel needs to be known in the process of converting the coordinates on the image coordinate system into the world coordinate system, so that the camera needs to be calibrated.
This document uses a high precision markov instrument amplifier and a flat crystal to assist in measuring camera drift angle. The flat crystal placing position is parallel to the Y axis of the moving platform, due to the interference of the straightness of the Y axis, if the difference between the reading of the starting point measurement data and the reading of the end point on the amplifier of the Mark instrument observed by the Y axis in the moving process is less than 3um, the flat crystal placing is parallel to the Y axis, the camera collects 10 groups of images of the flat crystal edge, the flat crystal edge is solved by utilizing sub-pixel edge detection, and the deflection angle phi between the flat crystal edge and the v axis of the camera coordinate system is obtained1、φ2…φ10. Then the horizontal deflection angle phi of the camera0Comprises the following steps:
the single pixel accuracy of the image is measured and calibrated using a standard calibration plate. Put standard correction plate at random on measuring platform, control camera and gather the same circular port on 10 different putting position's the correction plate, extract the profile of 10 circular ports, through the sub-pixel edge detection to try to get the sub-pixel edge of circular port. And finally, calculating the radius ri of the circular hole by means of ellipse fitting, wherein the physical size delta d represented by a single camera pixel is as follows:
in the formula ractualTo correct for the actual size of the circular holes in the plate.
Thus, the camera obtained from the equations (11), (12) and (15-20) is at the point (x)ideal，yideal) On the chip actual position (x)actual_1，yactual_1) Comprises the following steps:
[xactual_1 yactual_1 1]＝[xactual yactual 1]
chip off angle thetaactualComprises the following steps:
θactual＝θ0-φ0 (24)
as shown in FIG. 9, the small black rectangles are chips to be detected on the substrate, and the black dots A (x)a，ya)、B(xb，yb)、C(xc，yc) Is the center of a reference point on the substrate, and phi is the included angle between the coordinate system of the large plate and the coordinate system of the motion platform. Dot (X)2，Y2) Is composed ofThe actual position of the motion platform in the motion platform coordinate system, and the position of the chip on the chip processing drawing is based on the coordinate in the large plate coordinate system, so the coordinate of the chip needs to be converted from the machine tool coordinate system to the large plate coordinate system.
The actual positions of the chip under the large-board coordinate system are as follows:
the invention provides a drift positioning and measuring device of a large-board fan-out type packaged chip, which comprises,
an error compensation model building block comprising,
the motion platform data acquisition unit is used for acquiring first data acquired by the laser interferometer, acquiring relevant information of straightness and verticality of the motion platform according to the first data,
the model establishing unit is used for calculating according to the first data so as to establish the error compensation model;
the drift positioning measurement module comprises a drift positioning measurement module,
a chip data acquisition unit for acquiring second data acquired by the machine vision system, wherein the second data comprises image information of the large board fan-out type packaging chip,
a moving platform position data obtaining unit, configured to obtain third data collected by a grating ruler carried by an X, Y, Z axis of the moving platform, where the third data is used to feed back real-time position information of the moving platform,
an error information calculation unit for obtaining error information of the chip according to the image information and the third data, wherein the error information comprises the offset of the chip at the actual position and the center position at the theoretical position and the deflection angle of the chip,
and the error compensation unit is used for carrying out error compensation on the chip according to the error information and by combining the established error compensation model.
The invention also proposes a computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 6.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium and can implement the steps of the above-described method embodiments when the computer program is executed by a processor. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain other components which may be suitably increased or decreased as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media which may not include electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.
While the present invention has been described in considerable detail and with particular reference to a few illustrative embodiments thereof, it is not intended to be limited to any such details or embodiments or any particular embodiments, but it is to be construed as effectively covering the intended scope of the invention by providing a broad, potential interpretation of such claims in view of the prior art with reference to the appended claims. Furthermore, the foregoing describes the invention in terms of embodiments foreseen by the inventor for which an enabling description was available, notwithstanding that insubstantial modifications of the invention, not presently foreseen, may nonetheless represent equivalent modifications thereto.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and the present invention shall fall within the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means. The invention is capable of other modifications and variations in its technical solution and/or its implementation, within the scope of protection of the invention.
Claims (8)
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