CN113724987A - Inductor manufacturing method and inductor - Google Patents
Inductor manufacturing method and inductor Download PDFInfo
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- CN113724987A CN113724987A CN202110989406.7A CN202110989406A CN113724987A CN 113724987 A CN113724987 A CN 113724987A CN 202110989406 A CN202110989406 A CN 202110989406A CN 113724987 A CN113724987 A CN 113724987A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 238000004804 winding Methods 0.000 claims abstract description 27
- 238000009713 electroplating Methods 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000696 magnetic material Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000000748 compression moulding Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 241001391944 Commicarpus scandens Species 0.000 description 4
- 239000006247 magnetic powder Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
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- 238000004512 die casting Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 238000007906 compression Methods 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention relates to the technical field of soft magnetic product manufacturing, and particularly discloses an inductor manufacturing method and an inductor, wherein the inductor manufacturing method comprises the following steps: s101, manufacturing an integrated magnetic core body; s102, bending and attaching pins of a magnetic core body to the surface of the magnetic core body; and S103, electroplating and fixing the pins on the electrodes in an electroplating mode. Bend and laminate extremely through the pin with the magnetic core body surface to adopt the mode of electroplating to fix pin and electrode, increased the area of contact of pin and electrode, contact resistance is less, and DCR is less, is difficult for opening a circuit, and electroplates the back and has formed the protective layer in the outside of winding and electrode, has completely cut off the contact of winding and electrode with external environment, is difficult to become invalid. The inductor manufactured by the manufacturing method of the inductor has the advantages of small contact resistance, small DCR (direct current resistance), difficulty in disconnection, difficulty in failure and high reliability, and the protective layers are formed outside the winding and the electrodes.
Description
Technical Field
The invention relates to the technical field of soft magnetic product manufacturing, in particular to an inductor manufacturing method and an inductor.
Background
Inductors are used in large quantities in electronic circuits as a common electronic component. The existing integrated inductor generally comprises a soft magnetic core body and a winding, wherein the winding is manufactured according to the rules of a certain wire diameter, the number of turns, the inner diameter, the outer diameter, the height and the like of winding and placed in a die cavity, and metal magnetic powder is embedded in the winding and is die-cast to form the integrated inductor. The integrally formed inductor possesses higher inductance and less leakage inductance than conventional inductors. The winding of the conventional integrated inductor is usually connected with an electrode plate in a spot welding mode, one mode is to place a spot-welded wire group and the electrode plate in a die cavity, then metal magnetic powder is filled in the die cavity for die-casting forming, and finally a finished product is formed.
However, the welding spot of spot welding is small, the contact Resistance of the winding and the electrode plate is large due to the two modes, the Direct Current Resistance (DCR) of the finished inductor is large, large conduction loss is brought, the shock Resistance of the spot welding process is relatively poor, the welding spot easily falls off, the welding spot of the finished inductor is positioned inside the magnetic core body, the welding spot cannot be easily perceived after falling off, the open circuit risk is large, the welding spot of the latter is arranged outside the magnetic core body, the welding spot is easily influenced by the external environment, and the inductor fails.
Therefore, there is a need for a method for manufacturing an inductor with a small DCR, a low risk of open circuit, and less susceptibility to external environment, and an inductor to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide an inductor manufacturing method and an inductor, and aims to solve the problems that an inductor DCR in the prior art is large, high in open circuit risk and easy to be influenced by external environment.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a method for manufacturing an inductor, the method comprising the steps of:
s101, manufacturing an integrated magnetic core body;
s102, bending and attaching the pins of the magnetic core body to the surface of the magnetic core body;
s103, fixing the pins and the electrodes in an electroplating mode.
Optionally, in some embodiments, step S101 includes:
s1011, winding the wire group;
s1012, placing the wire group in a mold cavity, and leading out the pins to the outside of the mold cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the magnetic core body.
Optionally, in step S102, before bending the pin, the method includes: flattening the pins to form a sheet structure.
Optionally, in other embodiments, step S101 includes:
s1011, winding the wire group;
s1012, welding the pins and the electrodes, then placing the wire group in a mold cavity, and leading the pins out of the mold cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the magnetic core body.
Optionally, the magnetic material is at least one of carbonyl iron powder, iron silicon chromium powder and iron-based amorphous powder.
Optionally, the wire set is compression molded with the magnetic material at a pressure in a range of 6T/cm2-8T/cm 2.
Optionally, between step S101 and step S102, further comprising: and baking the magnetic core body at the baking temperature of 70-160 ℃.
Optionally, the method comprises, after baking the magnetic core body: and spraying an insulating layer on the surface of the magnetic core body.
Optionally, step S103 includes:
sequentially electroplating a copper layer, a nickel layer and a tin layer at the contact position of the pin and the electrode;
or sequentially electroplating a nickel layer and a tin layer at the contact position of the pin and the electrode.
In another aspect, the present invention provides an inductor manufactured by the above inductor manufacturing method.
The invention has the beneficial effects that:
the invention provides a manufacturing method of an inductor, which comprises the following steps: s101, manufacturing an integrated magnetic core body; s102, bending and attaching the pins of the magnetic core body to the surface of the magnetic core body; s103, fixing the pins and the electrodes in an electroplating mode.
The pins are bent and attached to the surface of the magnetic core body, and the pins and the electrodes are fixed in an electroplating mode, so that the contact area of the pins and the electrodes is increased, the connection stability of the pins and the electrodes is improved, the shock resistance is improved, the reliability is high, the disconnection risk is reduced, and meanwhile, the contact resistance is reduced, so that the DCR is smaller; and the electroplating connection mode is equivalent to covering a protective layer on the surfaces of the pins and the electrodes, so that the pins and the electrode plates can be effectively isolated from being contacted with air, and are not easily influenced by the external environment, the failure risk of the inductor is reduced, and the reliability is higher.
The invention also provides an inductor which is manufactured by the manufacturing method of the inductor, the contact area between the pins of the winding and the electrodes is large, the anti-seismic effect is good, the contact resistance is small, the DCR is small, the circuit is not easy to break, and the protective layers are formed outside the winding and the electrodes, so that the inductor is not easy to lose effectiveness and has high reliability.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an inductor according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an inductor before a lead pin is bent according to a first embodiment of the present invention;
fig. 3 is a front view of an inductor before a lead pin is bent according to a first embodiment of the present invention;
fig. 4 is a front view of an inductor with bent pins according to an embodiment of the present invention;
fig. 5 is a front view of the inductor before bending the pins according to the second embodiment of the present invention.
In the figure:
1. a magnetic core body; 2. a pin; 3. and an electrode.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Example one
The existing winding manufacturing method of the integrally formed inductor generally adopts a spot welding mode to connect with 3 electrodes, wherein one mode is to place a spot-welded wire group and 3 electrodes in a die cavity, then fill metal magnetic powder in the die cavity for die casting and forming to finally form a finished product, and the other mode is to place the winding in the die cavity, fill metal magnetic powder in the die cavity for integrally forming, then extend a pin 2 of the winding out of a magnetic core body 1 and weld the pin with 3 electrodes. However, the pin 2 and the electrode 3 are connected by spot welding, and the welding spot is small, so that the contact Resistance between the winding and the electrode 3 is large due to the two modes, so that the Direct Current Resistance (DCR) of the finished inductor is large, and large conduction loss is caused, and the shock Resistance of the spot welding process is relatively poor, the welding spot is easy to fall off, the welding spot of the former is positioned inside the magnetic core body 1 and is not easy to perceive after falling off, the risk of circuit breaking is large, the welding spot of the latter is arranged outside the magnetic core body 1, and the welding spot is easily influenced by the external environment, so that the inductor fails.
In order to solve the above problem, the present embodiment provides an inductor manufacturing method, as shown in fig. 1, the inductor manufacturing method includes:
s101, manufacturing an integrated magnetic core body 1;
s102, bending and attaching the pins 2 of the magnetic core body 1 to the surface of the magnetic core body 1;
and S103, fixing the pin 2 and the electrode 3 in an electroplating mode.
Bend to magnetic core body 1's surface through the adoption with pin 2 of magnetic core body 1, and pin 2 and electrode 3 are fixed to the mode through electroplating, pin 2 and electrode 3's area of contact has been increased, its shock resistance has been improved, the risk of opening a circuit is low, contact resistance has been reduced simultaneously, therefore DCR is also less, and the mode of electroplating connection is equivalent to having covered the one deck protective layer on pin 2 and electrode 3 surface, can effectively completely cut off pin 2 and 3 contact of electrode and air emergence, be difficult to receive external environment influence, thereby reduce the inefficacy risk of inductor, the reliability is higher.
Optionally, step S101 includes:
s1011, winding a wire group: winding the coil into a wire group which meets the requirements of inner diameter, outer diameter and height according to a certain wire diameter and turns, and removing insulating layers at two ends of the wire group to be used as pins 2 of the wire group;
s1012, placing the wire group in a mold cavity, and leading out the pin 2 to the outside of the mold cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the integrated magnetic core body 1.
Optionally, the magnetic material is at least one of carbonyl iron powder, iron silicon chromium powder, and iron-based amorphous powder, which is not limited in this embodiment.
Alternatively, the wire set is press-formed with the magnetic material under a pressure in the range of 6T/cm2-8T/cm2The selection can be carried out according to actual conditions.
Further, after the magnetic core body 1 is obtained, the magnetic core body 1 is baked, wherein the baking temperature is 70-160 ℃, and the baking time is more than 6 hours.
Further, after the magnetic core body 1 is baked, an insulating layer is sprayed on the surface of the magnetic core body 1. Optionally, the insulating layer is made of at least one of epoxy resin, silicone resin, phenolic resin, and potash water glass, which is not limited in this embodiment. Through at 1 surface spraying insulating layer of magnetic core body, played anticorrosive and insulating effect, can guarantee that the magnetism of 1 inside magnet material of magnetic core body can not leak outward.
Alternatively, as shown in fig. 2 and 3, step S102 includes, before bending the pin 2: the pin 2 that will stretch out the 1 outside of magnetic core body is flattened, makes the lamellar structure to further increase pin 2 and electrode 3's area of contact, reduce contact resistance, reduce DCR, simultaneously, also can further improve the fastness that pin 2 and electrode 3 are fixed, the antidetonation effect is better.
As shown in fig. 4, after flattening the pins 2, the pins 2 are bent and attached to the surface of the magnetic core body 1, and then the pins 2 and the electrodes 3 are fixed by electroplating. Through bending pin 2 to magnetic core body 1 surface, reduced magnetic core body 1's area occupied, save space, make the structure of finished product inductor more regular compact, make things convenient for follow-up use, bend pin 2 to magnetic core body 1 surface simultaneously for magnetic core body 1 can play the effect of support for pin 2 and electrode 3, is of value to follow-up fastness through the fixed pin 2 of mode of electroplating and electrode 3.
Optionally, in step S103, the electroplating includes: and sequentially electroplating a copper layer, a nickel layer and a tin layer at the contact part of the pin 2 and the electrode 3. By electroplating the copper layer, the material layer on the surface of the pin 2 is consistent with the material of the electrode 3, so that the pin 2 and the electrode 3 are tightly attached, a nickel layer can be better electroplated on the surfaces of the pin 2 and the electrode 3, and the connection reliability is ensured; the nickel layer is electroplated, so that the tin layer is favorably attached, the adhesive force to a tin material is increased, and the nickel layer also plays a role in oxidation resistance; because the melting point of the tin material is lower, the finished inductor is conveniently connected with other parts through the tin electroplating layer.
As shown in table 1 below, the same magnetic material and process conditions were used to fabricate inductors (for example 0730-1R5, each of which is fabricated as a 1K sample), and the two inductors were different only in the connection manner of pin 2 and electrode 3: one adopts the mode of conventional spot welding to connect pin 2 and electrode 3, another adopts the inductor manufacturing approach as above-mentioned, buckles pin 2 to the side or the bottom surface of magnetic core body 1, then adopts the mode of electroplating fixed connection with pin 2 and electrode 3, then carries out DCR detection and carries out contrastive analysis because the bad condition that the solder joint arouses to the inductance that two kinds of modes were made.
According to the comparison result, the pin 2 and the electrode 3 which are connected in the electroplating mode have no risks of welding explosion, insufficient welding, circuit breaking and welding deviation, and compared with the pin 2 and the electrode 3 which are fixed in the spot welding mode, the pin 2 and the electrode 3 which are fixed in the electroplating mode effectively reduce the risk of circuit breaking of the inductor, and the reliability is higher.
TABLE 1
In other embodiments, in step S103, the electroplating may include only: and sequentially electroplating a nickel layer and a tin layer at the contact part of the pin 2 and the electrode 3, which is not described in detail in the embodiment.
The implementation also provides an inductor which is manufactured by the inductor manufacturing method. The inductor manufactured by the manufacturing method of the inductor has the advantages that the contact area between the pin 2 of the winding and the electrode 3 is large, the contact resistance is small, the DCR is small, the anti-seismic effect is good, the circuit is not easy to break, the protective layer is formed outside the winding and the electrode 3, the failure is not easy to occur, and the reliability is high.
Example two
The present embodiment provides a method for manufacturing an inductor, which is different from the method for manufacturing an inductor in the first embodiment in that:
step S101 in this embodiment includes:
s1011, winding a wire group: winding the coil into a wire group which meets the requirements of inner diameter, outer diameter and height according to a certain wire diameter and turns, and removing insulating layers at two ends of the wire group to be used as pins 2 of the wire group;
s1012, welding the pin 2 and the electrode 3, then placing the wire group in a die cavity, and leading the pin 2 out of the die cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the magnetic core body 1.
Step S102 includes: and bending and attaching the welded pin 2 and the electrode 3 to the surface of the magnetic core body 1.
As shown in fig. 5, the inductor manufacturing method is suitable for the case where the pin 2 with a small diameter is connected with the electrode 3, and since the diameter of the pin 2 is small, the strength of the pin 2 is reduced after flattening, and the pin 2 is easy to break, and then the circuit is broken, in this embodiment, the pin 2 and the electrode 3 are directly welded without flattening the pin 2, then the wire group is placed in the mold cavity, the pin 2 is led out of the mold cavity, then the pin 2 and the electrode 3 of the magnetic core body 1 are bent and attached to the surface of the magnetic core body 1, and the pin 2 and the electrode 3 are fixed by electroplating.
Through this kind of setting, guaranteed that when the diameter of pin 2 is less, pin 2 and 3 fixed connection's of electrode fastness, the antidetonation is effectual, is difficult to take place the condition of opening circuit, and the reliability is high.
The remaining steps of the inductor manufacturing method in this embodiment are the same as those in the first embodiment, and are not described herein again.
The present application provides an inductor, which is manufactured by the above inductor manufacturing method. The inductor manufactured by the manufacturing method of the inductor has the advantages that the contact area between the pins 2 of the winding and the electrodes 3 is large, the contact resistance is small, the DCR is small, the anti-seismic performance is good, the circuit is not easy to break, the protective layers are formed outside the winding and the electrodes 3, the failure is not easy to occur, and the reliability is high.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A manufacturing method of an inductor is characterized by comprising the following steps:
s101, manufacturing an integrated magnetic core body (1);
s102, bending and attaching the pins (2) of the magnetic core body (1) to the surface of the magnetic core body (1);
s103, fixing the pin (2) and the electrode (3) in an electroplating mode.
2. The method for manufacturing the inductor according to claim 1, wherein the step S101 comprises:
s1011, winding the wire group;
s1012, placing the wire group in a mold cavity, and leading out the pins (2) to the outside of the mold cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the magnetic core body (1).
3. The method for manufacturing an inductor according to claim 2, wherein step S102 comprises, before bending the pin (2): flattening the pins (2) to form a sheet structure.
4. The method for manufacturing the inductor according to claim 1, wherein the step S101 comprises:
s1011, winding the wire group;
s1012, welding the pins (2) and the electrodes (3), then placing the wire group in a mold cavity, and leading the pins (2) out of the mold cavity;
and S1013, filling a magnetic material into the die cavity, and performing compression molding to obtain the magnetic core body (1).
5. The method for manufacturing an inductor according to claim 2 or 4, wherein the magnetic material is at least one of carbonyl iron powder, iron silicon chromium powder and iron-based amorphous powder.
6. The method as claimed in claim 2 or 4, wherein the pressing pressure of the wire set and the magnetic material is 6T/cm2-8T/cm2。
7. The method for manufacturing the inductor according to claim 1, further comprising, between step S101 and step S102: and baking the magnetic core body (1) at the temperature of 70-160 ℃.
8. Method for manufacturing an inductor according to claim 7, characterized in that baking the magnetic core body (1) comprises: and spraying an insulating layer on the surface of the magnetic core body (1).
9. The method for manufacturing an inductor according to claim 1, wherein step S103 comprises:
sequentially electroplating a copper layer, a nickel layer and a tin layer at the contact part of the pin (2) and the electrode (3);
or a nickel layer and a tin layer are sequentially electroplated at the contact part of the pin (2) and the electrode (3).
10. An inductor, characterized in that it is manufactured by the method of manufacturing an inductor according to any one of claims 1 to 9.
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CN115831596A (en) * | 2022-08-29 | 2023-03-21 | 惠州市南磁科技有限公司 | Integrally-formed inductor processing method and integrally-formed inductor |
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JP2016143834A (en) * | 2015-02-04 | 2016-08-08 | Tdk株式会社 | Magnetic core and coil device |
CN109416972A (en) * | 2016-04-20 | 2019-03-01 | 韦沙戴尔电子有限公司 | Shielded inductor and manufacturing method |
CN106548851A (en) * | 2016-08-31 | 2017-03-29 | 珠海经济特区宝诚电子有限公司 | A kind of sectional forming inductor and preparation method thereof |
CN110098042A (en) * | 2019-03-21 | 2019-08-06 | 深圳华络电子有限公司 | A kind of manufacture craft of midget inductor |
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CN115831596A (en) * | 2022-08-29 | 2023-03-21 | 惠州市南磁科技有限公司 | Integrally-formed inductor processing method and integrally-formed inductor |
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