CN113718305A

CN113718305A - Electroplating equipment and electroplating bath for integrated circuit lead frame

Info

Publication number: CN113718305A
Application number: CN202111015748.5A
Authority: CN
Inventors: 苏骞; 刘全胜; 杜应举; 邓亮
Original assignee: Dongguan Allmerit Technology Co Ltd
Current assignee: Dongguan Allmerit Technology Co Ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2021-11-30

Abstract

The integrated circuit lead frame electroplating equipment and electroplating tank of the present invention relate to the technical field of electroplating. The electroplating tank includes a reflow cavity and an electroplating cavity arranged in the reflow cavity; A reflow cavity is formed between the electroplating cavity, an electroplating cavity and an upper opening communicated with the electroplating cavity are formed in the electroplating cavity; during operation, the electroplating solution flows through the electroplating cavity to the upper opening and flows to the electroplating workpiece through the upper opening, and the electroplating solution is subjected to electroplating. The workpiece blocks backflow into the reflow chamber, and the backflowed electroplating solution is discharged to the outside of the reflow chamber; by setting the reflow chamber and arranging the electroplating chamber in the reflow chamber, the electroplating solution flows into the electroplating chamber in the electroplating chamber and is sprayed to the electroplating through the upper opening After the workpiece is placed on the workpiece, it can be reflowed into the reflow cavity in the reflow cavity and discharged to the outside; the electroplating solution can be guided safely and effectively, and the safety factor of electroplating operation is improved.

Description

Electroplating equipment and electroplating bath for integrated circuit lead frame

Technical Field

The invention relates to the technical field of electroplating, in particular to electroplating equipment and an electroplating bath for an integrated circuit lead frame.

Background

The lead frame of the integrated circuit can realize the electrical connection between the leading-out end of the internal circuit of the chip and the external lead, is a key structural member for forming an electrical loop, plays a role of a bridge connected with an external lead, and needs electroplating equipment for electroplating processing in the manufacturing process.

In the electroplating process of the existing electroplating equipment for the lead frame of the integrated circuit, the electroplating solution reflowing from an electroplating workpiece generally flows along the outer edge of the electroplating equipment directly, so that the electroplating solution which is reliably contained and guided is lacked, and the personal safety of operators is greatly threatened.

Disclosure of Invention

The invention aims to provide an electroplating device for an integrated circuit lead frame, which has high electroplating safety coefficient.

The technical scheme adopted by the invention for solving the technical problems is as follows:

the application provides an electroplating bath for an integrated circuit lead frame, which comprises a backflow cavity and an electroplating cavity arranged in the backflow cavity;

a reflux cavity is formed between the inner wall surface of the reflux cavity and the outer wall surface of the electroplating cavity, and an electroplating cavity and an upper opening communicated with the electroplating cavity are formed in the electroplating cavity; when the electroplating device works, electroplating liquid flows to the upper opening through the electroplating cavity and flows onto an electroplating workpiece through the upper opening, the electroplating liquid is prevented by the electroplating workpiece from flowing back to the backflow cavity, and the backflow electroplating liquid is discharged out of the backflow cavity.

In some embodiments, the reflow chamber includes a seat body, the electroplating chamber is disposed on the seat body, and a lead-out groove is disposed on the seat body facing the electroplating chamber; the guiding-out groove body is used for forming the part of the backflow cavity.

In some embodiments, the electroplating cavity includes a bottom plate, the bottom plate is disposed on the seat, an inner frame is disposed on the bottom plate, the inner frame and the bottom plate together form a guide groove, the guide groove is used for forming a part of the electroplating cavity, the bottom plate is provided with a plurality of backflow through holes communicating with the lead-out groove along an outer edge of the inner frame, and at least one connecting portion is formed between two adjacent backflow through holes at intervals.

In some embodiments, the backflow cavity further includes a backflow member disposed on the bottom plate, an inner side wall of the backflow member and an outer side wall of the inner frame together define a portion of the backflow cavity, and each backflow hole is located between the backflow member and the inner frame.

In some embodiments, an outer backflow groove is formed in the outer side of the seat body, an outer backflow annular wall is arranged on the outer side wall of the backflow member, and the outer backflow annular wall and the outer side wall of the backflow member jointly form the outer backflow groove; when the electroplating device works, part of electroplating solution is blocked by an electroplating workpiece and flows to the outer reflux groove, and the electroplating solution is guided to the outer reflux groove by the outer reflux groove and is further discharged to the outside.

In some embodiments, the electroplating chamber further includes a first flow dividing plate disposed on the inner frame, and the first flow dividing plate and the inner frame together form part of the electroplating chamber; the first splitter plate is provided with a shunting avoidance area and a plurality of first shunting holes located outside the shunting avoidance area, and the shunting avoidance area corresponds to the liquid inlet hole arranged at the bottom of the guide groove.

In some embodiments, the electroplating chamber further includes a second flow dividing plate disposed on the first flow dividing plate, the second flow dividing plate is configured to define the electroplating chamber together with the first flow dividing plate and the inner frame, the upper opening is located on the second flow dividing plate at a position far away from the inner frame, the second flow dividing plate is provided with a plurality of second flow dividing holes, and each of the second flow dividing holes is staggered from each of the first flow dividing holes on the first flow dividing plate.

The invention also provides electroplating equipment for the integrated circuit lead frame, which comprises an electrode plate body and the integrated circuit lead frame electroplating bath in any technical scheme, wherein the electrode plate body is arranged on the electroplating cavity, and the electrode plate body is provided with at least one water spray hole group and at least one flow guide groove which is arranged corresponding to the at least one water spray hole group; the at least one water spray hole group comprises a plurality of water spray holes which are arranged at intervals and run through up and down;

when the electroplating device works, electroplating solution is guided to the water spray holes through the electroplating cavity and is sprayed onto an electroplating workpiece through the water spray holes, the electroplating solution flows back by being blocked by the electroplating workpiece, and the reflowing electroplating solution enters the flow guide groove and is guided into the reflow cavity by the flow guide groove and then is discharged out of the electrode plate body.

In some embodiments, the electrode plate body is provided with a plurality of the water spray hole groups, and one flow guide groove is formed between every two adjacent water spray hole groups.

In some embodiments, the at least one water spray hole group includes a plurality of water spray hole groups arranged in a length direction or a width direction of the electrode plate body; every two adjacent all seted up one between the water spray hole group the guiding gutter, every the guiding gutter all has at least one end to be equipped with the confession the opening that the plating solution of backward flow flows this electrode plate body.

The electroplating equipment and the electroplating bath for the integrated circuit lead frame have the advantages that: by arranging the reflux cavity and the electroplating cavity in the reflux cavity, the electroplating solution can flow into the electroplating cavity in the electroplating cavity, is sprayed onto an electroplating workpiece through the upper opening, and then can flow back into the reflux cavity in the reflux cavity and is discharged to the outside; the electroplating solution is guided safely and effectively, and the safety factor of the electroplating operation is improved.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of the structure of an integrated circuit lead frame plating apparatus in accordance with a preferred embodiment of the present invention;

FIG. 2 is a schematic diagram of the electroplating apparatus of the lead frame of the integrated circuit shown in FIG. 1;

FIG. 3 is an exploded view of the electroplating apparatus shown in FIG. 2;

FIG. 4 is a schematic structural view of the electroplating apparatus shown in FIG. 2 from another angle;

FIG. 5 is an exploded view of the electroplating apparatus shown in FIG. 4;

FIG. 6 is a cut-away view of an electrode plate in a preferred embodiment of the invention;

FIG. 7 is an enlarged schematic view of the electroplating apparatus shown in FIG. 3 at A;

FIG. 8 is an enlarged schematic view of the electroplating apparatus shown in FIG. 5 at B;

FIG. 9 is a sectional view of a plating apparatus in a preferred embodiment of the invention;

FIG. 10 is an enlarged schematic view of the electroplating apparatus of FIG. 9 at C;

FIG. 11 is a schematic view, partially in section, of the mating relationship between the die and the electrode plate of FIG. 9 viewed from another angle;

FIG. 12 is a cross-sectional view of the integrated circuit lead frame plating apparatus shown in FIG. 1;

FIG. 13 is an enlarged schematic view of the integrated circuit lead frame plating apparatus of FIG. 12 at D;

FIG. 14 is an enlarged schematic view at E of the integrated circuit lead frame plating apparatus shown in FIG. 12;

FIG. 15 is a schematic structural view of a base plate of the integrated circuit lead frame plating apparatus of FIG. 12;

fig. 16 is an exploded view of the plating cell and fluid transfer tubing set of fig. 1.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 shows an integrated circuit lead frame plating apparatus 10 according to some embodiments of the present invention, the plating apparatus 10 is used for plating a plated workpiece such as a high-density integrated circuit lead frame, and includes a plating device 1 and a plating tank 2 installed below the plating device 1, the plating device 1 is used for spraying a plating solution onto the plated workpiece for plating; the plating tank 2 is used for supplying the plating device 1 with a plating solution to plate a plating workpiece on the plating device 1, and simultaneously, the plating solution after plating flows back.

As shown in fig. 1, the plating apparatus 10 may further include a conductive device 3 mounted on the plating tank 2, a liquid delivery tube group 4 provided on the plating tank 2, the conductive device 3 being configured to deliver an electric current to the plating solution to charge the plating solution so as to enable plating of a plating workpiece; the liquid delivery pipe group 4 is used for guiding the electroplating solution into the electroplating bath 2 and guiding the electroplating solution flowing back in the electroplating bath 2 out of the electroplating equipment 10.

As shown in fig. 2, 3, 4 and 5, the electroplating apparatus 1 may include an electrode plate 11, a mold 12, an electrode holder 14 and a support base 15. The support base 15 is mounted on the plating tank 2 and has an electrode plate accommodating groove 151 that is vertically through and accommodates the electrode plate 11. The electrode holder 14 is mounted below the support base 15, and the electrode plate 11 is mounted above the electrode holder 14 and is accommodated in the electrode plate accommodating groove 151. The mold 12 is mounted on the top of the support base 15, covers the electrode plate accommodating groove 151, and has a bottom surface closely attached to the top surface of the electrode plate 11. The electrode plate 11 serves to guide the plating solution in the plating tank 2 to be sprayed to the mold 12. The die 12 is covered on the electrode plate 11 and has a perforation pattern adapted to a portion to be plated of the plating workpiece. The electrode holder 14 serves to transmit electric current to the electrode plate 11 and to support and fix the electrode plate 11.

As shown in fig. 6 and 7, the electrode plate 11 may include an electrode plate body 11a, and the electrode plate body 11a is provided with at least one water spray hole group 111 and at least one flow guiding groove 113. Each water spray hole group 111 comprises a plurality of water spray holes 112 which are arranged at intervals and run through up and down; in operation, the plating solution is sprayed onto the plating workpiece through the water spraying holes 112, the plating solution is blocked by the plating workpiece and flows back, and the flowing back plating solution enters the diversion trench 113 and is guided to the outside of the electrode plate body 11a by the diversion trench 113.

It is understood that the water spray holes 112 will guide the plating solution to spray onto the plating workpiece, the plating solution will flow back into the guiding channel 113 through the blocking of the plating workpiece, and the guiding channel 113 guides the flowing back plating solution to flow further out of the electrode plate body 11 a. The number of the water spray hole groups 111 is not limited to a plurality of groups, and can be a group, and the water spray hole groups are flexibly adjusted according to the electroplating requirements of the electroplating workpiece; the aperture size and the hole wall profile of the water spraying hole 112 can be flexibly adjusted according to the material of the electroplating workpiece and the electroplating requirement. The returned plating liquid may be guided and discharged through only one guide groove 113, or may be guided and discharged through each of the plurality of guide grooves 113, specifically, the plating liquid returned from the plating workpiece may be guided and discharged efficiently and reliably.

Therefore, in the actual electroplating process, the reflowing electroplating solution can be guided and discharged in time, and the phenomenon that the electroplating solution splashes in a large range due to the fact that the electroplating solution cannot be discharged in time is avoided; secondly, because the backward flow plating solution has obtained timely guide discharge, therefore can also prevent that the backward flow plating solution from causing too much interference to the plating solution of hole for water spraying 112 spun, guaranteed the mobility of plating solution to because of avoiding the plating solution velocity of flow to hang down and lead to the fact the electroplating quality to reduce, improved the electroplating quality.

As shown in fig. 6 and 7, the electrode plate body 11a may be provided with a plurality of water spraying hole groups 111 in some embodiments, and a diversion trench 113 is formed between every two adjacent water spraying hole groups 111. Therefore, the electroplating solution sprayed from each group of water spray hole groups 111 can be discharged from the diversion grooves 113 on one side or two sides of each group of water spray hole groups 111 after the electroplating workpiece blocks backflow, so that the fluidity of the backflow electroplating solution can be further ensured, the splashing of the electroplating solution is further reduced, the electroplating safety coefficient is improved, and the electroplating quality can be further improved.

As shown in FIG. 6, each of the groups of water discharge holes 111 in some embodiments includes a plurality of water discharge holes 112 arranged in a line at equal intervals. As can be understood, the water spray holes 112 in the same water spray hole group 111 are arranged at equal intervals, so that the color of the electroplated layer plated on the electroplated workpiece by the electroplating solution is more uniform, and the electroplating quality is improved. It will also be appreciated that the spacing between the individual water jet holes 112 may vary from one water jet hole group 111 to another.

As shown in fig. 6, the electrode plate body 11a may be provided with a plurality of water spray hole groups 111 in some embodiments, each of the water spray hole groups 111 being arranged in a length direction or a width direction of the electrode plate body 11 a; a diversion trench 113 is disposed between each two adjacent water spray hole groups 111, and at least one end of each diversion trench 113 is provided with an opening 114 for flowing the reflowing electroplating solution out of the electrode plate body 11 a.

Understandably, the arrangement mode of the water spray hole group 111 can be flexibly adjusted according to the actual processing requirement of the electroplating workpiece; of course, in addition to the above arrangement, the water spray hole groups 111 may be arranged in an inclined arrangement, for example, the water spray hole groups 111 may be arranged in parallel with the diagonal line of the electrode plate body 11 a; further, the water spray hole groups 111 may be arranged in a circumferential array or the like. It can be understood that the openings 114 are formed to enable the electroplating solution in the guiding groove 113 to flow out of the electrode plate body 11a, and secondly, the number of the openings 114 is limited to one; the number of the water discharge holes 112 included in each water discharge hole group 111 may be the same or different.

As shown in fig. 2, 8, 9 and 10, the mold 12 may be provided with at least one plating channel 121 in some embodiments, and the plating channel 121 is used for guiding the plating solution sprayed from the water spray holes 112 to the surface of the plating workpiece to be plated. When the mold 12 is correspondingly covered on the electrode plate 11, the electroplating channels 121 respectively correspond to the water spray holes 112, and each electroplating channel 121 is at least communicated with one diversion trench 113.

It will be appreciated that when the dies 12 and 11 are properly aligned and the dies 12 are placed on the electrode plate 11, the plating channels 121 and the water spray holes 112 will be in a predetermined corresponding state. Specifically, the plating channel 121 and the water spraying hole 112 at least include the following corresponding states in more specific embodiments:

first, in some embodiments, when the mold 12 is disposed on the electrode plate 11, the water spray holes 112 correspond to the plating channels 121, i.e., the plating solution sprayed from the single water spray hole 112 will pass through the single plating channel 121 to contact the plating workpiece.

Second, in some embodiments, when the mold 12 is disposed on the electrode plate 11, at least two water spray holes 112 correspond to a single plating channel 121, i.e., at least two water spray holes 112 spray the plating solution through the same plating channel 121 to contact the plating workpiece.

Third, as shown in fig. 10, in a preferred embodiment, when the mold 12 is correspondingly covered on the electrode plate 11, the water spraying holes 112 are aligned with the electroplating channels 121 one by one, that is, the central axis of each water spraying hole 112 is coincided with the central axis of each electroplating channel 121 one by one; thus, the electroplating solution sprayed from the water spray holes 112 will pass through the center of the electroplating channel 121 and contact with the electroplated workpiece, and the reflowing electroplating solution can flow back to the diversion trench 113 along the edge position of the electroplating channel 121 and be discharged; in the preferred embodiment, the smoothness of the backflow of the electroplating solution can be further reduced, the electroplating safety coefficient is improved, meanwhile, the backflow of the electroplating solution is further prevented from disturbing the electroplating solution sprayed out of the water spray holes 112, and the electroplating quality is ensured.

As shown in fig. 11, the width D1 of plating via 121 is greater than the distance D2 between two adjacent channels 113. It can be understood that, when the mold 12 is covered on the electrode plate 11 and the water spraying holes 112 are aligned with the plating channels 121, the width D1 of the plating channel 121 is larger than the distance D2 between two adjacent channels 113, and the plating solution that is blocked by the plating workpiece and flows back can flow back to two adjacent channels 113 along the plating channel 121. Of course, in other embodiments, when the plating channel 121 and the water spraying hole 112 are not aligned, the sizes of D1 and D2 can be flexibly adjusted, so long as the reflowed plating solution can flow back into the guiding gutter 113 through the plating channel 121 and be discharged.

As shown in fig. 2 and 8, the plating channels 121 may be arranged in at least one row in sequence, and the lower surface of the mold 12 may be provided with at least one liquid-drainage groove 122, and the liquid-drainage groove 122 is communicated with each plating channel 121 in the same row. It can understand, when locating the mould 12 corresponding lid on the electrode board 11, the position groove 122 is kept away in the flowing back still will communicate with guiding gutter 113, so, the electroplating solution that is blockked and the backward flow by the electroplating work piece can also get into guiding gutter 113 through position groove 122 is kept away in the flowing back, avoids the electroplating solution to save in electroplating passageway 121, when having reduced the electroplating solution and having sprayed the risk of splashing, has still improved the mobility of electroplating solution.

As shown in fig. 6, the electrode plate 11 may further include a fixing skirt 11b in some embodiments, the fixing skirt 11b being disposed around the electrode plate body 11a, the fixing skirt 11b being used to fix the electrode plate body 11a at a predetermined position. The fixed skirt 11b and the die 12 define a drain chamber 20 communicating with the guide groove 113, and the drain chamber 20 is used for guiding the plating solution discharged from the guide groove 113 to flow along a predetermined trajectory. It is understood that the fixing skirt 11b may be integrally formed, bonded or screwed to the electrode plate body 11 a. Preferably, the lower surface of the fixed skirt 11b may be flush with the lower surface of the electrode plate body 11a, so as to avoid the fixed skirt 11b from obstructing the end of the blowhole 112 and ensure that the plating solution can enter the blowhole 112 and be sprayed out.

Preferably, the height of the upper surface of the fixed skirt 11b is equal to or lower than the height of the bottom of the diversion trench 113 with respect to the electrode plate body 11a, so as to prevent the fixed skirt 11b from obstructing the plating solution retained by the diversion trench 113, ensure that the plating solution in the diversion trench 113 can rapidly flow into the liquid discharge chamber 20 defined by the fixed skirt 11b and the mold 12, and improve the smoothness of the backflow of the plating solution.

As shown in fig. 6 and 9, the electroplating apparatus 1 may further include a supporting member 13 disposed on the fixed skirt 11b in some embodiments, and the supporting member 13 is disposed in the liquid discharge chamber 20; the supporting member 13 is used for supporting the lower surface of the mold 12 and the upper surface of the fixed skirt 11 b.

In the actual electroplating process, an external manipulator and the like can press and hold an electroplating workpiece on the upper surface of the mold 12 through a pressing and holding mechanism, in order to ensure the smoothness of the electroplating workpiece in the electroplating process, the acting force of the manipulator applied to the electroplating workpiece and the mold 12 is generally large, and therefore the mold 12 may deform under the pressing and holding of the manipulator, so that the cavity volume of the liquid discharge cavity 20 defined by the mold 12 and the fixed skirt 11b is reduced, and therefore, the backflow of the electroplating liquid can be hindered, the pressure of the electroplating liquid in the liquid discharge cavity 20 can be increased to bring electroplating risks, the flowability of the electroplating liquid can be reduced, the electroplating of the electroplating workpiece cannot reach the standard, and defective products are generated.

It is also understood that the supporting member 13 may be provided on the lower surface of the mold 12, as long as it can support the lower surface of the mold 12 and the upper surface of the fixed skirt 11b, respectively; secondly, the shape of the supporting member 13 can be flexibly set, for example, the supporting member 13 can be set to be a cylindrical or elliptic cylindrical structure which has a small barrier effect on the fluid; the number and the arrangement positions of the supporting members 13 can be flexibly adjusted or arranged, for example, each supporting member 13 can be symmetrically arranged on two opposite sides of the fixed skirt, so that each position in the liquid discharge chamber 20 can be effectively and reliably supported, and each position in the liquid discharge chamber 20 can normally guide the electroplating liquid to be discharged.

As shown in fig. 3, 4 and 9, the electrode holder 14 may be provided with a through hole 141 in some embodiments, the electrode plate 11 is covered on the through hole 141, and the water spraying hole 112 is communicated with the through hole 141. In operation, the plating solution will flow through the overflow aperture 141 into the spout 112 and be ejected through the spout 112.

It is understood that the electrode plate 11 may be fixed to the electrode holder 14 by screws; the electrode plate 11 can completely cover the notch of the overflowing hole 141, so that the electroplating solution in the overflowing hole 141 can fully enter the water spraying hole 112 for electroplating processing, the direct overflow of the electroplating solution without use is avoided, and the utilization rate of the electroplating solution is improved; of course, the phenomenon that the electroplating effect is influenced by the fact that the reflowing electroplating solution flows into the overflowing hole 141 for secondary electroplating is avoided, and the electroplating processing quality is guaranteed.

As shown in fig. 3, the electrode holder 14 may be provided with at least one limiting protrusion 142 in some embodiments, and each limiting protrusion 142 is used for positioning the electrode plate 11. It can be understood that the number, shape and size of the limiting protrusions 142 can be flexibly set, and the position of the limiting protrusions 142 can also be flexibly set according to the shape and size of the electrode plate 11.

Preferably, the limiting protrusions 142 may be provided with chamfers, and the chamfers are used for guiding the electrode plate 11 and the electrode holder 14 to be aligned accurately, so that the assembly convenience is improved.

As shown in fig. 3, 4 and 9, the supporting base 15 may be provided with an electrode plate receiving slot 151 penetrating up and down in some embodiments; the electrode holder 14 is disposed in the electrode plate accommodating groove 151 and connected to the support base 15; the mold 12 is covered on the electrode plate accommodating groove 151, the lower surface of the mold 12, the wall of the electrode plate accommodating groove 151 and the outer wall of the electrode holder 14 jointly define a secondary drain cavity 30 communicated with the diversion trench 113, and the secondary drain cavity 30 is used for guiding the electroplating solution flowing out along the diversion trench 113 to flow out of the electroplating device 1.

It is understood that during the actual electroplating process, the plating solution enters the water spraying holes 112 from the overflowing holes 141, and then is sprayed onto the electroplating workpiece along the water spraying holes 112, the plating solution is blocked by the electroplating workpiece and flows back into the diversion trench 113, the plating solution flows along the diversion trench 113 to the liquid discharge chamber 20 and is discharged into the secondary liquid discharge chamber 30, and the plating solution is discharged out of the electroplating apparatus 1 along the secondary liquid discharge chamber 30. The die 12 can completely cover the opening of the electrode plate accommodating groove 151, thereby preventing the plating solution in the electrode plate accommodating groove 151 from being sprayed out, and improving the safety factor.

As shown in fig. 3, the supporting base 15 may be provided with a mold positioning groove 155 in some embodiments, and the mold positioning groove 155 is used for positioning the mold 12. The positioning grooves 155 are designed to accurately and reliably position and fix the mold 12, so that the plating channel 121 and the water spray holes 112 can be aligned in a predetermined manner, and the plating solution can flow in the plating apparatus 1 along a predetermined trajectory.

It will be appreciated that the walls of the mold locating slot 155 may be contoured to match the profile of the mold 12 to provide more precise location of the mold 12. A mold positioning pin can be further provided in the dummy positioning groove 155 and used for being inserted into a mold pin hole on the mold to guide the installation of the mold 12, so that the mold 12 and the dummy positioning groove 155 are conveniently positioned.

Further, in some embodiments, the corner positions of the mold positioning grooves 155 may be provided with corner position avoiding grooves for receiving the corner positions of the mold 12, so as to prevent the corners of the mold 12 from being jammed with the groove walls of the mold positioning grooves 155, thereby facilitating the installation of the mold 12.

As shown in fig. 3 and 9, the plating apparatus 1 further includes a fixing member 16 in some embodiments; the mold 12 may be provided with a first mold fixing hole 122, the supporting seat 15 may be provided with a fixing boss 152 exposed in the secondary liquid discharge cavity 30, the supporting seat 15 may be further provided with a second mold fixing hole 153 extending into the fixing boss 152, the fixing member 16 penetrates through the first mold fixing hole 122 and then is screwed with the second mold fixing hole 153, and the fixing member 16 is used for fixing the mold 12 to the supporting seat 15.

It is understood that, in order to ensure that the fixing member 16 can apply a large locking force to fix the mold 12 to the supporting seat 15, the screw-fitting depth between the fixing member 16 and the second mold fixing hole 153 must be sufficiently long, and therefore, the hole depth of the second mold fixing hole 153 must meet certain requirements; in this regard, the arrangement of the fixing boss 152 can ensure the lightness and thinness of the supporting seat 15 while the hole depth of the second mold fixing hole 153 is prolonged, and the size of the cavity contour of the secondary liquid discharge cavity 30 surrounded by the supporting seat 15 is enlarged as much as possible, so that the backflow flow rate of the electroplating solution is ensured as much as possible. The fastener 16 may be a threaded fastener such as a bolt or screw.

As shown in fig. 5 and 9, the electroplating apparatus 1 may further include a locking member 17, the electrode holder 14 has a first locking hole 143, the supporting base 15 has a second locking hole 154, and the locking member 17 penetrates through the first locking hole 143 and is screwed with the second locking hole 154. The locking piece 17 is used for fixing the electrode holder 14 on the supporting seat 15; the locking member 17 may be a screw or a bolt.

In summary, the electrode plate body is provided with the water spray holes and the diversion trenches, the water spray holes guide the electroplating solution to be sprayed onto the electroplating workpiece, the electroplating solution flows back into the diversion trenches under the blockage of the electroplating workpiece, and the diversion trenches guide the flowing-back electroplating solution to flow out of the electrode plate body; thus, the large-scale sputtering of the electroplating solution is avoided, and the safety factor is improved; and secondly, the mutual interference between the electroplating solution sprayed from the water spray holes and the reflowing electroplating solution is reduced as much as possible, the fluidity of the electroplating solution is ensured, and the reduction of electroplating quality caused by the over-low flow rate of the electroplating solution is avoided.

As shown in fig. 12, the plating tank 2 may include a reflow chamber 2a and a plating chamber 2b in some embodiments, the plating chamber 2b is disposed in the reflow chamber 2a, and a reflow chamber 26 is formed between an inner wall surface of the reflow chamber 2a and an outer wall surface of the plating chamber 2 b. The plating chamber 2b is provided with a plating chamber 223 and an upper opening 225, and the upper opening 225 is communicated with the plating chamber 223. The upper cover of the upper opening 225 is provided with the electroplating device 1, and the overflowing hole 141 is communicated with the electroplating cavity 223 through the upper opening 225; the liquid delivery pipe group 4 is connected to the reflow chamber 2a and the plating chamber 2b, respectively, and the liquid delivery pipe group 4 is used for guiding the plating liquid into the plating chamber 223 and guiding the plating liquid refluxed into the reflow chamber 26 out of the reflow chamber 2 a.

It can be understood that, during the electroplating operation, the electroplating solution is driven by an external device or equipment to be injected into the electroplating chamber 223, and enters the overflowing hole 141 through the upper opening 225, and is further sprayed onto the electroplated workpiece to be electroplated, the electroplating solution which flows back through the blocking of the electroplating solution enters the reflow chamber 26, and the electroplating solution which flows back into the reflow chamber 26 is further discharged out of the reflow chamber 2 a.

As shown in fig. 12, 13, 14, 15, and 16, in some embodiments, the reflow chamber 2a includes a base 21, the electroplating chamber 2b is disposed on the base 21, and a guiding-out groove 212 is disposed on the base 21 facing the electroplating chamber 2 b; the lead-out groove 212 is used to form part of the return chamber 26.

It can be understood that the seat body 21 can be fixed on a predetermined electroplating processing station to play a role in supporting and fixing other parts; the channel profile of the lead-out channel 212 can be flexibly set, and a channel profile that facilitates the flow of the liquid plating solution is particularly preferable. The plating chamber 2b may be connected to the base 21 by welding, screwing or other intermediate elements, as long as the plating chamber 2b can be fixed to a predetermined position. The space defined by the channel contour of the lead-out channel 212 is a part of the reflow chamber 26, that is, the plating solution reflowing into the reflow chamber 26 flows through the lead-out channel 212.

As shown in fig. 12, 13, 14, 15, and 16, in some embodiments, the plating chamber 2b may include a bottom plate 22 disposed on the base 21, an inner frame 22a is disposed on the bottom plate 22, the inner frame 22a and the bottom plate 22 together define a guiding groove 224, the guiding groove 224 is used for forming a portion of the plating chamber 223, the bottom plate 22 is provided with a plurality of backflow holes 221 communicating with the guiding groove 212 along an outer edge of the inner frame 22a, and at least one connecting portion 22b is formed between two adjacent backflow holes 221 at intervals.

It will be appreciated that the base plate 22 serves to support the remaining components of the plating chamber 2 b. The inner frame 22a may be a square frame, a circular frame, a trapezoid frame, or a pentagonal frame, and may be flexibly configured according to a pattern to be plated on the plated workpiece and the shape of the plated workpiece. The tank body space defined by the tank body outline of the guide tank 224 is a part of the plating chamber 223, that is, the plating liquid used in the plating chamber 223 flows through the guide tank 224 when flowing. Each of the backflow through holes 221 is exposed in the backflow chamber 26, so that the backflow plating solution can flow through the bottom plate 22 to the lead-out tank 212 and further flow out of the backflow chamber 2 a. The connecting portion 22b is used for providing a supporting force to the electroplating chamber 2b, and the arrangement position thereof is flexibly adjusted, for example, the connecting portion 22b may be arranged at the bottom of the bottom plate 22 and connected to the groove wall of the guiding-out groove 212, as long as the supporting force can be provided to the electroplating chamber 2 b; secondly, the outline of the connecting portion 22b can be flexibly set, for example, a streamline structure with small liquid flow blocking effect can be set; in addition, the installation positions of the connection portions 22b may be distributed in axial symmetry with the central axis of the inner frame 22a, so as to support the plating chamber 2b from various directions, thereby avoiding the damage of the product caused by concentrated action of the acting force on part of the connection portions 22b, and improving the durability, of course, when the inner frame 22a is provided as a circular frame, the connection portions 22b may be installed in a circumferential array with the central axis of the inner frame 22 a.

As shown in fig. 12, 13, 14, 15 and 16, the reflow chamber 2a further includes a reflow member 23 disposed on the bottom plate 22, and the reflow member 23 is used to guide the reflow of the plating solution; the inner side wall of the backflow member 23 and the outer side wall of the inner frame 22a jointly define a part of the backflow cavity 26, and each backflow through hole 221 is located between the backflow member 23 and the inner frame 22 a.

It can be understood that the backflow member 23 can always limit the reflowing electroplating solution between the inner side wall of the backflow member 23 and the outer side wall of the inner frame 22a, so as to avoid the overflow of the electroplating solution to cause personal injury to operators. The opening of each of the return through holes 221 allows the plating liquid between the inner wall of the return member 23 and the outer wall of the inner frame 22a to flow out of the return chamber 2a along a predetermined trajectory. The size of the hole body and the hole wall profile of each backflow through hole 221 can be flexibly adjusted, and the electroplating solution can not overflow to the outside along the backflow through holes 221 under the condition that the electroplating solution can smoothly flow.

As shown in fig. 12 and 16, the outer side of the seat 21 may be provided with an outer backflow groove 211 in some embodiments, the outer side wall of the backflow member 23 is provided with an outer backflow annular wall 231, and the outer backflow annular wall 231 and the outer side wall of the backflow member 23 jointly enclose an outer backflow groove 232; during operation, a part of the plating solution is blocked by the plating workpiece and flows to the outer return flow groove 232, and the plating solution is guided to the outer return flow groove 232 by the outer return flow groove 232 and further discharged to the outside.

It will be appreciated that during electroplating, in addition to the plating solution returned to the reflow chamber 26, a portion of the plating solution may overflow the outer wall of the electroplating apparatus, and the portion of the plating solution is blocked and confined in the outer reflow groove 232 by the outer reflow ring wall 231 when flowing under its own weight, and then further flows into the outer reflow groove 211, and finally flows to the outside. The outer reflux groove 211 can be arranged in an open annular outline, and the electroplating solution in the outer reflux groove 211 can be guided to the outside through a pipeline; the plating solution in the outer reflow groove 232 can be guided to the outer reflow groove 211 through a pipe, and of course, a through hole can be opened at the groove bottom of the outer reflow groove 211 to guide the plating solution out of the outer reflow groove 211.

As shown in fig. 12, 13, 14, 15 and 16, the plating chamber 2b may further include a first current splitter plate 24 disposed on the inner frame 22a in some embodiments, and the first current splitter plate 24 and the inner frame 22a together form a portion of the plating chamber 223; the first flow dividing plate 24 is provided with a flow dividing avoiding area 242 and a plurality of first flow dividing holes 241 located outside the flow dividing avoiding area 242, and the flow dividing avoiding area 242 corresponds to the liquid inlet hole 222 opened at the bottom of the guiding groove 224.

It will be appreciated that the fluid inlet port 222 is in communication with the fluid delivery tube set 4 such that the fluid delivery tube set 4 is capable of delivering plating solution into the plating chamber 223. The shunt avoiding region 242 serves to block the flow of the plating solution. The upper opening 225 is located above the first shunting plate 24, and the plating solution flows through the first shunting plate 24 and then flows through the upper opening 225 onto the plating workpiece. During electroplating, when electroplating solution is injected into the electroplating cavity 223 through the liquid conveying pipe group 4, the electroplating solution can firstly impact the shunting avoiding area, and the first shunting hole 241 is not formed in the shunting avoiding area 242, so that the electroplating solution can be shunted on the shunting avoiding area 242, so that the phenomenon that the electroplating solution flows unevenly due to the fact that the electroplating solution with a high flow speed passes through the part of the electroplating solution on the first shunting plate 24 in a concentrated manner is avoided, and the electroplating uniformity is improved.

As shown in fig. 12, 13, 15 and 16, the plating chamber 2b may further include a second current divider 25 disposed on the first current divider 24, the second current divider 25 is used to define a plating chamber 223 together with the first current divider 24 and the inner frame 22a, the upper opening is located on the second current divider at a position away from the inner frame, a plurality of second current dividing holes 251 are formed on the second current divider 25, and each of the second current dividing holes 251 is staggered from each of the first current dividing holes 241 on the first current divider 24.

It will be appreciated that the sealing engagement between the second flow distribution plate 25 and the first flow distribution plate 24 is the same as the sealing engagement between the second flow distribution plate 25 and the electrode holder 14, so as to ensure that the plating solution does not overflow accidentally during the flow through the first flow distribution plate 24 and the second flow distribution plate 25 to the overflow hole 141. The central axis of each second flow dividing hole 251 is not coincident with the central axis of the first flow dividing hole 241; after the plating solution flows out through the first branch flow hole 241, the plating solution continues to flow along the extending direction of the central axis of the first branch flow hole 241, so that after the central axis of the second branch flow hole 251 is staggered with the central axis of the first branch flow hole 241, the plating solution flowing out from the first branch flow hole 241 impacts the position, on the second branch flow plate 25, where the second branch flow hole 251 is not formed, and is divided, so that the plating solution can be divided again between the second branch flow plate 25 and the first branch flow plate 24, the flow rates of the plating solution after passing through the second branch flow holes 251 are as same as possible, the flow uniformity of the plating solution is improved, and the plating uniformity is further improved.

As shown in fig. 12 and 13, the electrode holder 14 may be disposed on the second diversion plate 25 in some embodiments, the support seat 15 may be disposed on the return member 23, the overflowing hole 141 of the electrode holder 14 is communicated with the plating chamber 223, and the secondary drain chamber 30 is communicated with the return chamber 26. In operation, the electroplating solution is guided into the overflow hole 141 through the plating chamber 223 and further flows into each of the water spraying holes 112, and then is sprayed onto the plating workpiece through the water spraying holes 112, the electroplating solution is blocked by the plating workpiece and flows back, the flowing-back electroplating solution enters the diversion trench 113, is guided into the backflow chamber 26 from the diversion trench 113, and is discharged out of the electrode plate body 11 a.

It is understood that the mounting position of the electrode holder 14 can be flexibly adjusted as long as the plating solution in the plating chamber 223 can be sufficiently introduced into the overflowing hole 141, for example, the electrode holder 14 can be disposed on the first current dividing plate 24 without disposing the second current dividing plate 25; in the case where the first flow dividing plate 24 is not provided, the electrode holder 14 may be provided on the inner frame 22 a. The support seat 15 can be directly or indirectly connected to the return member 23 through other components; however, a sealing fit is required between the support seat 15 and the return member 23 to prevent the returned plating solution from overflowing and causing personal injury to the operator.

As shown in fig. 12 and 13, the conductive device 3 is connected to an external power source for transmitting an electric current to the plating device 1 to charge the plating liquid for plating. The conductive device 3 may include a conductive member 31 in some embodiments, the conductive member 31 is in electrical communication with the electrode holder 14, and the wiring portion 311 of the conductive member 31 is exposed outside the electroplating apparatus 10.

It is understood that the wire connecting portion 311 may be provided in a column shape or other shapes, and may be connected by a wire. The wire connection portion 311 is electrically connected to an external power source, so that the conductive member 31 can transmit electric current to the electrode holder 14 and further to the electrode plate 11, thereby allowing the plating solution discharged through the water discharge hole 112 to carry electric charges.

It will also be appreciated that a corresponding seal may be provided on the conductive member 31 to prevent leakage of the plating solution through the mating gap between the conductive member 31 and the plating apparatus 10.

As shown in fig. 12 and 13, the conductive device 3 may further include a conductive block 32 in some embodiments, the conductive block 32 is disposed on the backflow element 23, and the conductive block 32 is connected to the mounting portion 312 of the conductive element 31, and the conductive block 32 is used to increase a contact area between the electrode holder 14 and the conductive device 3.

It is understood that the mounting portion 312 may be a flat plate, and may be screwed to the return member 23 by a screw passing through the mounting portion 312 and the conductive block 32. After the electrode holder 14 is assembled to the return member 23, the electrode holder 14 abuts against the conductive block 32.

It is also understood that the conductive block 32 may be provided with a flat surface adapted to the electrode holder 14, so as to increase the contact area between the conductive block 32 and the electrode holder 14 as much as possible, to prevent a virtual connection between the electrode holder 14 and the conductive device 3, and to improve the stability of the electrode holder 14.

As shown in fig. 12 and 13, the conductive device 3 may include a plurality of conductive bumps 32 in some embodiments, and the plurality of conductive bumps 32 are respectively contacted with the electrode holder 14 from the same or different positions.

It will be appreciated that the provision of a plurality of conductive bumps 32 ensures that the electrode holder 14 can be connected to an external power source, improving the fault tolerance of the electroplating apparatus 10.

As shown in fig. 12 and 14, the liquid delivery tube set 4 may include an inlet tube 41 and an outlet tube 42 in some embodiments. The liquid inlet pipe 41 is communicated with the plating tank 2, and the liquid inlet pipe 41 is used for feeding the plating solution which is not used for plating into the plating tank 2 so as to make the plating solution flow onto the plating device 1 to plate the plated workpiece. The liquid outlet pipe 42 is communicated with the electroplating bath 2, and the liquid outlet pipe 42 is used for discharging the electroplating solution which flows back after the electroplating use to the outside of the electroplating device 10.

It is understood that the liquid inlet pipe 41 can directly pass through the base 21 to deliver the electroplating solution to the bottom plate 22, so that the electroplating solution for electroplating passes through the first and second

flow dividing plates

24 and 25 and then enters the overflow hole 141, and then is sprayed out to the electroplating workpiece through the water spraying hole 112; the electroplating solution for electroplating process is blocked by the electroplating workpiece and flows back to the reflow cavity 26, and then flows to the liquid outlet pipe 42 through the reflow through hole 221 to be discharged, and the circulation of the electroplating solution on the electroplating equipment is completed.

It can be understood that the respective connection positions of the liquid inlet pipe 41 and the liquid outlet pipe 42 with the plating tank 2 can be flexibly adjusted according to the specific structure of the plating tank 2, as long as the separation between the plating solution not used for plating in the liquid inlet pipe 41 and the plating solution to be discharged from the liquid outlet pipe 42 and flowing back can be avoided; for example, in the case where the outlet tank body 212 is provided in the base body 21, the plating liquid discharged through the return through hole 221 enters the outlet tank body 212 and is discharged through the drain pipe 42, but of course, in the case where the outlet tank body 212 is not provided, the returned plating liquid may be directly discharged through the drain pipe 42. The liquid inlet pipe 41 may be disposed to penetrate through the seat body 21 and then directly communicate with the liquid inlet hole 222 in some embodiments, and of course, the liquid inlet pipe 41 may also be disposed in other manners as long as the liquid inlet pipe 41 can transport the plating solution into the plating chamber 2 b.

As shown in fig. 12 and 14, the liquid conveying pipe assembly 4 may further include a sealing ring 43 and a sealing ring 44 in some embodiments. The sealing ring 43 is sleeved on the liquid inlet pipe 41, and the sealing ring 43 is used for fixing the sealing ring 44. The sealing ring 44 is sleeved on the liquid inlet pipe 41 and is positioned on the sealing ring 43, and the sealing ring 44 is used for abutting against the bottom plate 22.

It can be understood that the sealing ring 43 plays a role of sealing, so as to prevent the input electroplating solution and the returned electroplating solution from generating cross flow at the matching position between the liquid inlet pipe 41 and the bottom plate 22, prevent the unused electroplating solution from being polluted, and improve the quality of the electroplating solution.

As shown in fig. 12, the fluid delivery tubing set 4 may also include an external return tube 45 in some embodiments, the external return tube 45 being in communication with the external return channel 211.

It is understood that a through hole may be formed at the bottom of the outer return flow groove 232, so that the plating liquid flowing out of the outer return flow groove 232 can fall into the outer return flow groove 211 and then be discharged out of the plating apparatus 10 through the outer return pipe 45.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. The electroplating bath for the lead frame of the integrated circuit is characterized by comprising a reflux cavity (2a) and an electroplating cavity (2b) arranged in the reflux cavity (2 a);

a reflow cavity (26) is formed between the inner wall surface of the reflow cavity (2a) and the outer wall surface of the electroplating cavity (2b), and an electroplating cavity (223) and an upper opening (225) communicated with the electroplating cavity (223) are formed in the electroplating cavity (2 b); during operation, the electroplating solution flows to the upper opening (225) through the electroplating cavity (223) and flows onto the electroplating workpiece through the upper opening (225), the electroplating solution is prevented by the electroplating workpiece from flowing back into the backflow cavity (26), and the backflow electroplating solution is discharged out of the backflow cavity (2 a).

2. The electroplating bath of the integrated circuit lead frame according to claim 1, wherein the reflow chamber (2a) comprises a seat body (21), the electroplating chamber (2b) is disposed on the seat body (21), and a lead-out groove (212) is disposed on the seat body (21) facing the electroplating chamber (2 b); the guide-out groove body (212) is used for forming a part of the backflow cavity (26).

3. The electroplating tank of the integrated circuit lead frame according to claim 2, wherein the electroplating cavity (2b) comprises a bottom plate (22), the bottom plate (22) is disposed on the seat (21), an inner frame (22a) is disposed on the bottom plate (22), the inner frame (22a) and the bottom plate (22) jointly enclose a guide groove (224), the guide groove (224) is used for forming a part of the electroplating cavity (223), the bottom plate (22) is provided with a plurality of backflow through holes (221) communicated with the lead-out groove body (212) along the outer edge of the inner frame (22a), and at least one connecting portion (22b) is formed between two adjacent backflow through holes (221) at intervals.

4. The plating bath according to claim 3, wherein the reflow chamber (2a) further comprises a reflow member (23) disposed on the bottom plate (22), an inner sidewall of the reflow member (23) and an outer sidewall of the inner frame (22a) together define a portion of the reflow chamber (26), and each of the reflow holes (221) is located between the reflow member (23) and the inner frame (22 a).

5. The electroplating bath of the integrated circuit lead frame according to claim 4, wherein an outer reflow groove (211) is formed on the outer side of the base body (21), an outer reflow ring wall (231) is arranged on the outer side wall of the reflow member (23), and the outer reflow ring wall (231) and the outer side wall of the reflow member (23) jointly enclose an outer reflow groove (232); in operation, part of the plating solution is blocked by the electroplating workpiece and flows to the outer return flow groove (232), and the plating solution is guided to the outer return flow groove (232) by the outer return flow groove (232) and is further discharged to the outside.

6. The plating bath according to claim 3, wherein the plating chamber (2b) further comprises a first flow divider (24) disposed on the inner frame (22a), the first flow divider (24) being configured to form a portion of the plating chamber (223) together with the inner frame (22 a); the first flow dividing plate (24) is provided with a flow dividing and avoiding area (242) and a plurality of first flow dividing holes (241) positioned outside the flow dividing and avoiding area (242), and the flow dividing and avoiding area (242) corresponds to the liquid inlet hole (222) arranged at the bottom of the guide groove (224).

7. The plating cell according to claim 6, wherein the plating chamber (2b) further comprises a second current divider plate (25) disposed on the first current divider plate (24), the second current divider plate (25) is used to define the plating chamber (223) together with the first current divider plate (24) and the inner frame (22b), the upper opening is located on the second current divider plate at a position away from the inner frame, the second current divider plate (25) has a plurality of second current dividing holes (251), and each of the second current dividing holes (251) is offset from each of the first current dividing holes (241) on the first current divider plate (24).

8. An electroplating device for an integrated circuit lead frame, which is characterized by comprising an electrode plate body (11a) and the integrated circuit lead frame electroplating bath (2) as claimed in any one of claims 1 to 7, wherein the electrode plate body (11a) is arranged on the electroplating cavity (2b), and the electrode plate body (11a) is provided with at least one water spray hole group (111) and at least one diversion trench (113) corresponding to the at least one water spray hole group (111); the at least one water spray hole group (111) comprises a plurality of water spray holes (112) which are arranged at intervals and run through up and down;

during operation, the electroplating solution is guided to the water spray holes (112) through the electroplating chamber (223) and sprayed onto the electroplating workpiece through the water spray holes (112), the electroplating solution flows back through the electroplating workpiece, the flowing-back electroplating solution enters the flow guide groove (113), is guided into the flow guide chamber (26) from the flow guide groove (113), and is discharged out of the electrode plate body (11 a).

9. The electroplating apparatus for the lead frame of the integrated circuit according to claim 8, wherein the electrode plate body (11a) is provided with a plurality of water spray hole groups (111), and one diversion trench (113) is formed between every two adjacent water spray hole groups (111).

10. The integrated circuit lead frame plating apparatus according to claim 8, wherein the at least one water spray hole group (111) includes a plurality of water spray hole groups (111), the plurality of water spray hole groups (111) being arranged in a length direction or a width direction of the electrode plate body (11 a); one flow guide groove (113) is formed between every two adjacent water spray hole groups (111), and at least one end of each flow guide groove (113) is provided with an opening (114) for the reflowed electroplating solution to flow out of the electrode plate body (11 a).