CN113714586A - Method for welding platinum target and back plate - Google Patents
Method for welding platinum target and back plate Download PDFInfo
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- CN113714586A CN113714586A CN202111115508.2A CN202111115508A CN113714586A CN 113714586 A CN113714586 A CN 113714586A CN 202111115508 A CN202111115508 A CN 202111115508A CN 113714586 A CN113714586 A CN 113714586A
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 207
- 238000003466 welding Methods 0.000 title claims abstract description 115
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005219 brazing Methods 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000945 filler Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000013077 target material Substances 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 4
- 238000003892 spreading Methods 0.000 claims description 4
- 230000007480 spreading Effects 0.000 claims description 4
- 238000007514 turning Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 4
- 238000001035 drying Methods 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 238000003754 machining Methods 0.000 abstract description 4
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 15
- 229910000990 Ni alloy Inorganic materials 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001513 hot isostatic pressing Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a method for welding a platinum target and a back plate, which comprises the following brief steps: pretreating the welding surface of the platinum target and the back plate; carrying out chemical copper plating treatment on the welding surface of the platinum target; heating the welding surfaces of the platinum target and the back plate to a constant temperature; pouring molten brazing filler metal onto the welding surface of the platinum target and the back plate, and quickly and uniformly paving the molten brazing filler metal on the whole welding surface by using a scraper; starting an ultrasonic vibration instrument to apply to the welding surface of the platinum target and the back plate, and adding molten brazing filler metal at one side; and butting the welding surfaces of the platinum target and the back plate, pressurizing, processing according to a heating and cooling process, and performing finish machining to obtain the platinum target with the back plate. The welding rate detected by C-Scan ultrasonic scanning after welding is over 99 percent, which shows that the welding strength of the technical method can meet the working requirement of the platinum target.
Description
Technical Field
The invention belongs to the field of target material manufacturing, and particularly relates to a platinum target material welding method.
Background
As a capacitor having a ferroelectric film structure as a semiconductor memory with a higher density, an upper electrode and a lower electrode of the capacitor are generally formed of a platinum film formed by sputtering or the like, and a material for such a platinum film is a high-purity platinum target. The high-purity platinum target material is bound on the back plate to be used, the back plate mainly plays roles of fixing, strengthening and the like, the platinum target can be bombarded by high-energy particles in the sputtering process, the welding quality of the platinum target and the back plate greatly influences the later sputtering efficiency and the performance of a deposited platinum film, in order to achieve high sputtering efficiency, the sputtering platinum film with excellent performance is ensured to be obtained, and good welding quality requirements must be met between the platinum target and the back plate.
The welding method mainly comprises various welding modes such as brazing, diffusion welding, electron beam welding and the like. Brazing refers to a welding method of using brazing filler metal lower than the melting point of a weldment among welded assemblies, heating the brazing filler metal and the weldment to the melting temperature of the brazing filler metal at the same time, and filling gaps of solid workpieces with liquid brazing filler metal to connect metals. The working environment temperature is low in the brazing process, the generated stress is small, the deformation of the welded assembly is small, so that brazing can be used between two metals with large performance difference, a plurality of welding joints can be connected simultaneously, the appearance of the brazed joint is flat, welding equipment is simple, the production investment is small, and the like. Diffusion welding and electron beam welding realize material welding at high temperature, are difficult to weld materials with large difference in performance, have unfavorable changes in microstructure, tissue uniformity and grain size, cause problems of platinum metal oxidation and the like, and have harsh use environment and high equipment cost.
At present, in the manufacturing aspect of the platinum target, mainly the molding aspect of the target is emphasized, like the nickel-platinum alloy sputtering target disclosed in the Chinese patent document 1 and the preparation method thereof and the U.S. patent document 2, the preparation process of the target is emphasized, and the welding technology of the target and the back plate is not involved; the patent document 3 discloses a nickel-platinum alloy target material with a copper alloy backboard and a preparation method thereof, wherein the nickel-platinum target material and a backboard material are put in a sheath together after being subjected to surface polishing in advance, and are subjected to hot isostatic pressing at a temperature of more than 575 ℃ and 800 ℃ after being subjected to vacuum pumping and sealing, so that the target material and the backboard form a linked body. To ensure the welding of the platinum target to the backing plate
Patent document 1: CN111286703A
Patent document 2: US10297430B2
Patent document 3: CN 104178739A.
Disclosure of Invention
The platinum target has high density, low strength and high price, the consumption of noble metal can be increased by directly processing the platinum target, the platinum target can be processed into a required size after being welded with a back plate, the loss is reduced, and the cost is reduced. The welding quality of the platinum target and the backboard meets the requirement of the processing precision of the platinum target and also meets the requirement of the strength without off-target in sputtering.
In order to strengthen the welding strength of the platinum target, a brazing mode at a lower temperature is adopted, so that a reliable welding layer is formed between the platinum target and the back plate, and the specific implementation technical mode is as follows:
(1) and (4) preprocessing the welding surface of the platinum target and the back plate.
The connection strength of the platinum target and the back plate is related to the roughness of the connection surface, the coarsened surface is mainly combined mechanically, and the clean and smooth surface is mainly combined metallurgically, so that the combination between molecules can be achieved. Experimental research shows that when the roughness of the back plate is below 0.8 mu m, the brazing filler metal is easy to permeate into the secondary surface of the back plate, so that the metallurgical bonding is achieved, and the connection strength of the platinum target and the back plate is increased; when the roughness of the welding surface of the platinum target is less than 0.8 mu m, the chemical copper plating treatment of the step (2) is also facilitated. And (3) processing the platinum target and the back plate welding surface to the required roughness, and then cleaning by acid cleaning, alcohol and deionized water to remove oil stains and impurities on the surface.
(2) And carrying out chemical copper plating treatment on the welding surface of the platinum target.
Due to the high density of platinum (21.45 g/cm)3) Large inertia force during processing, if the welding strength of the platinum target and the back plate is not goodBecause the miss is easy to cause and the rotation speed of the platinum target during processing is limited, in order to further improve the welding strength, the welding surface of the platinum target is subjected to chemical copper plating treatment, and the wettability of the welding surface and the brazing filler metal is improved to enhance the welding strength. The thickness of the electroless copper plating layer is 0.02-0.15 mm, the plating layer is easy to damage when being too thin, the requirement on the plating layer process is high when being too thick, and the welding effect is reduced. The platinum target welding surface after the chemical copper plating treatment is cleaned and dried again.
(3) And (3) placing the platinum target material and the back plate on a heating platform with the welding surfaces facing upwards, and heating the platinum target material and the back plate to a constant temperature.
The temperature required by welding the platinum target and the back plate is selected to be close to the melting temperature of the brazing filler metal and the temperature of 165-190 ℃ for forming metallization with the platinum target and the back plate metal, the brazing filler metal, the back plate and the platinum target are oxidized and deformed due to overhigh temperature, and unnecessary cost is increased; the low temperature is difficult to achieve the metallurgical layer bonding, and the welding strength is reduced.
(4) And pouring molten brazing filler metal onto the welding surface of the platinum target and the back plate, and quickly and uniformly spreading the brazing filler metal on the whole welding surface by using a scraper.
After the platinum target and the back plate are uniformly preheated on the heating platform, molten brazing filler metal is poured onto the welding surface, then the brazing filler metal is quickly and uniformly spread to the whole welding surface by using a scraper, the spreading of the brazing filler metal can prevent the back plate and the platinum target from contacting with the atmosphere, the oxidation by the air can be prevented, the spreading time of the scraper cannot be too long, and the effect is good within 1min of control.
(5) Starting an ultrasonic vibration instrument to apply to the welding surface of the platinum target and the back plate, and adding the molten brazing filler metal at the same time.
The bottom surface of the heating platform plate is connected with a vibration device, so that the vibration function of the heating platform is realized, the usable range of the vibration frequency is 500-2500 HZ, and the vibration function of the heating platform can promote the welding fusion of the brazing filler metal, the platinum target and the back plate; the brazing filler metal layer overflows when the vibration frequency is too high, and the welding strength cannot be enhanced when the vibration frequency is too low. When an ultrasonic vibration instrument is used for applying ultrasonic waves to the spread brazing filler metal, the vibration function of the heating platform is also started, so that the brazing filler metal can quickly infiltrate the platinum target and the back plate to a great extent; in addition, bubbles and impurities can be removed through ultrasonic vibration, the aged brazing filler metal can be replaced by adding new molten brazing filler metal, and the place with insufficient brazing filler metal can be made up, so that the brazing filler metal, a platinum target and a back plate form a firm metallurgical welding layer; and (3) the welding surface of the platinum target and the back plate receives ultrasonic waves for 3-5 times, and after the brazing filler metal and the welding surface are metalized after the platinum target and the back plate are continuously kept for 10-30 min, the redundant brazing filler metal on the welding surface of the platinum target and the back plate is scraped.
(6) And butting the welding surfaces of the platinum target and the back plate, pressurizing 1-2 kg of balancing weight, and further carrying out metallization treatment according to a heating and cooling process to complete the welding of the platinum target and the back plate.
After the steps are completed, butting the welding surfaces of the platinum target and the back plate, pressurizing 1-2 kg of balancing weight, heating to 200-240 ℃ at a speed of 2-4 ℃/min, preserving heat for 30-70 min, then cooling to 100-130 ℃ at a speed of 1-3 ℃/min, preserving heat for 10-60 min, cooling to 50-80 ℃, turning off an electric heating power supply of a heating platform, naturally cooling to room temperature to obtain a target material of the platinum target and the back plate, and processing by a precision machine to obtain the platinum target material.
In the technical scheme, the brazing filler metal is indium brazing filler metal.
In the technical scheme, the platinum target is a pure platinum target or a platinum alloy target.
Through the implementation of the technical scheme, compared with the prior art, the invention has the advantages that:
1. in the prior art, welding connection is mostly carried out in the modes of mechanical or hot isostatic pressing high-temperature and high-pressure diffusion welding and the like, the cost and the manufacturing period can be increased, the welding of the platinum target and the back plate can be realized at lower temperature through brazing filler metal welding, the platinum target structure is not influenced, the controllability is good, the cost is low, and the period is fast.
2. In order to improve the welding strength of the platinum target and the backboard, the brazing filler metal and the copper metal have very good wettability, and the brazing filler metal and the copper plating layer form a transition layer during welding by adopting chemical copper plating treatment on the welding surface of the platinum target, so that the welding strength of the platinum target and the backboard is enhanced.
3. The micro-vibration function added by the heating platform is combined with the ultrasonic wave, so that the brazing filler metal is further promoted to be combined with the platinum target and the welding layer metallurgically combined with the back plate stroke, and the welding strength is enhanced.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the present invention is not limited to the following examples.
Example 1
A method for welding a pure platinum target and a back plate comprises the following specific implementation technical steps:
(1) after the pure platinum target and the welding surface of the back plate are precisely processed, the pure platinum target and the back plate are cleaned by acid cleaning, alcohol and deionized water, and oil contamination impurities of the pure platinum target and the back plate are removed, so that the welding surface with the roughness of 0.8 mu m is obtained.
(2) And (3) carrying out chemical copper plating treatment on the welding surface of the pure platinum target, wherein the thickness of a copper plating layer is 0.15mm, and cleaning the welding surface.
(3) Placing the pure platinum target material and the back plate on a heating platform with the welding surfaces facing upwards, and starting the heating platform to 170 ℃ to ensure that the temperatures of the pure platinum target material and the back plate uniformly reach the platform temperature.
(4) And pouring the molten brazing filler metal onto the welding surface of the pure platinum target and the back plate, and quickly and uniformly paving the whole welding surface by using a scraper, wherein the paving time cannot be more than 1 min.
(5) Adjusting the vibration frequency of the heating platform to be 550HZ, simultaneously starting an ultrasonic vibration instrument to apply to the welding surface of the pure platinum target and the back plate, adding molten brazing filler metal while adding, repeatedly applying ultrasonic waves to the welding surface of the pure platinum target and the back plate for 3 times, and keeping for 15min and scraping off the redundant brazing filler metal on the surface by using a scraper.
(6) Butting the pure platinum target and the welding surface of the back plate, pressurizing 1kg of balancing weight, heating to 200 ℃ at the speed of 2 ℃/min, preserving heat for 38min, then cooling to 100 ℃ at the speed of 3 ℃/min, preserving heat for 25min, cooling to 60 ℃, turning off an electric heating power supply of a heating platform, naturally cooling to room temperature, and performing precision machining to obtain the pure platinum target with the back plate.
Example 2
A method for welding a platinum-nickel alloy material and a back plate comprises the following specific implementation technical steps:
(1) after the platinum-nickel alloy target and the welding surface of the back plate are precisely processed, the platinum-nickel alloy target and the welding surface of the back plate are cleaned by acid cleaning, alcohol and deionized water, and oil contamination impurities of the platinum-nickel alloy target and the back plate are removed, so that the welding surface with the roughness of 0.6 mu m is obtained.
(2) And (3) carrying out chemical copper plating treatment on the welding surface of the platinum-nickel alloy target material, wherein the thickness of a copper plating layer is 0.12mm, and cleaning the welding surface.
(3) The platinum-nickel alloy target and the back plate are placed on a heating platform with welding surfaces facing upwards, and the temperature of the heating platform is started to 180 ℃, so that the temperature of the platinum-nickel alloy target and the temperature of the back plate uniformly reach the temperature of the platform.
(4) And pouring the molten brazing filler metal onto the welding surface of the platinum-nickel alloy target and the back plate, and quickly and uniformly paving the whole welding surface by using a scraper, wherein the paving time cannot be more than 1 min.
(5) Adjusting the vibration frequency of the heating platform to 750HZ, simultaneously starting an ultrasonic vibration instrument to apply to the welding surface of the platinum-nickel alloy target and the back plate, adding molten brazing filler metal while adding, repeatedly applying ultrasonic waves to the welding surface of the platinum-nickel alloy target and the back plate for 5 times, and keeping for 10min and scraping off the redundant brazing filler metal on the surface by using a scraper.
(6) Butting the platinum-nickel alloy target and the welding surface of the back plate, pressurizing 2kg of balancing weight, heating to 220 ℃ at a speed of 1 ℃/min, preserving heat for 38min, then cooling to 110 ℃ at a speed of 2 ℃/min, preserving heat for 25min, cooling to 60 ℃, turning off an electric heating power supply of a heating platform, naturally cooling to room temperature, and performing precision machining to obtain the platinum-nickel alloy target with the back plate.
And (3) obtaining the high-purity platinum target after finish machining, and detecting the welding rate by using a C-Scan instrument in the embodiment 1 and the embodiment 2, wherein the welding rate reaches more than 99 percent, which indicates that the welding effect can meet the working requirement of the platinum target.
The present invention describes in detail the welding process of the platinum target and the back plate, the method of the present invention meets the requirement of the platinum target material, and is also suitable for industrial production operation, the listed embodiments do not limit the present invention, and any person skilled in the art may make possible variations and modifications without departing from the spirit and scope of the present invention, therefore, the protection scope of the present invention shall be subject to the scope defined by the claims of the present invention.
Claims (10)
1. A method for welding a platinum target and a back plate is characterized by comprising the following specific operation steps:
(1) pretreating the welding surface of the platinum target and the back plate;
(2) carrying out chemical copper plating treatment on the welding surface of the platinum target;
(3) placing the platinum target material and the back plate on a heating platform with the welding surfaces facing upwards, and heating the platinum target material and the back plate to a constant temperature;
(4) pouring molten brazing filler metal onto the welding surface of the platinum target and the back plate, and quickly and uniformly paving the molten brazing filler metal on the whole welding surface by using a scraper;
(5) starting an ultrasonic vibration instrument to apply to the welding surface of the platinum target and the back plate, and adding molten brazing filler metal at one side;
(6) and butting the welding surfaces of the platinum target and the back plate, pressurizing 1-2 kg of balancing weight, and further carrying out metallization treatment according to a heating and cooling process to complete the welding of the platinum target and the back plate.
2. The welding method according to claim 1, wherein the pre-treating in step (1) comprises: firstly, the welding surface of the platinum target and the backboard is processed to the roughness below 0.8 mu m, then the platinum target and the backboard are cleaned by acid liquor, alcohol and deionized water, and finally the drying treatment is carried out.
3. The soldering method according to claim 1, wherein the thickness of the copper plating layer after the electroless copper plating of the platinum target solder surface in the step (2) is 0.02 to 0.15 mm. And cleaning and drying the platinum target welding surface after copper plating.
4. The soldering method according to claim 1, wherein the temperature of heating the platinum target and the backing plate in the step (3) is 165-190 ℃.
5. The welding method according to claim 1, wherein a vibration device is connected to the lower portion of the plane of the heating platform in the step (3), so that the heating platform has a vibration function, the vibration frequency is 500-2500 HZ, and the heating platform is always in an open state except for the cooling stage in the steps (5) - (6).
6. Welding method according to claim 1, characterised in that the blade spreading time in step (4) cannot exceed 1 min.
7. The welding method according to claim 1, wherein the ultrasonic instrument turned on in the step (5) is applied to the welding surface of the platinum target and the backboard 3-5 times, and then the temperature is kept for 10-30 min and the excess solder on the welding surface of the platinum target and the backboard is scraped.
8. The welding method according to claim 1, wherein the heating and cooling process in the step (6) is as follows:
heating to 200-240 ℃ at the speed of 2-4 ℃/min, preserving heat for 30-70 min, then cooling to 100-130 ℃ at the speed of 1-3 ℃/min, preserving heat for 10-60 min, cooling to 50-80 ℃, and then turning off the electric heating power supply of the heating platform to naturally cool to room temperature.
9. The welding method according to claim 1, wherein the solder is an indium-based solder.
10. The welding method of claim 1, wherein the platinum target is a pure platinum target or a platinum alloy target.
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| CN202111115508.2A CN113714586A (en) | 2021-09-23 | 2021-09-23 | Method for welding platinum target and back plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111115508.2A CN113714586A (en) | 2021-09-23 | 2021-09-23 | Method for welding platinum target and back plate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867978A (en) * | 1994-08-26 | 1996-03-12 | Sumitomo Chem Co Ltd | Soldering method for sputtering target |
| JPH08218166A (en) * | 1995-02-10 | 1996-08-27 | Sumitomo Chem Co Ltd | Sputtering target bonding method |
| CN101648305A (en) * | 2009-08-24 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding method of large-size target assembly |
| CN101648308A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Manufacturing method of target material assembly |
| CN109423614A (en) * | 2017-08-22 | 2019-03-05 | 宁波江丰电子材料股份有限公司 | Target material assembly manufacturing method |
| CN113042842A (en) * | 2021-03-24 | 2021-06-29 | 河南东微电子材料有限公司 | Method for welding ruthenium target and back plate |
-
2021
- 2021-09-23 CN CN202111115508.2A patent/CN113714586A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867978A (en) * | 1994-08-26 | 1996-03-12 | Sumitomo Chem Co Ltd | Soldering method for sputtering target |
| JPH08218166A (en) * | 1995-02-10 | 1996-08-27 | Sumitomo Chem Co Ltd | Sputtering target bonding method |
| CN101648308A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Manufacturing method of target material assembly |
| CN101648305A (en) * | 2009-08-24 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding method of large-size target assembly |
| CN109423614A (en) * | 2017-08-22 | 2019-03-05 | 宁波江丰电子材料股份有限公司 | Target material assembly manufacturing method |
| CN113042842A (en) * | 2021-03-24 | 2021-06-29 | 河南东微电子材料有限公司 | Method for welding ruthenium target and back plate |
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Application publication date: 20211130 |