CN113709919A - Chip heating plate and preparation method and application thereof - Google Patents
Chip heating plate and preparation method and application thereof Download PDFInfo
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- CN113709919A CN113709919A CN202110962152.XA CN202110962152A CN113709919A CN 113709919 A CN113709919 A CN 113709919A CN 202110962152 A CN202110962152 A CN 202110962152A CN 113709919 A CN113709919 A CN 113709919A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
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Abstract
The invention provides a chip heating plate and a preparation method and application thereof, wherein a heating surface of the chip heating plate sequentially comprises a blank area, a central heating area and an edge heating area which are concentric; the central heating area and the edge heating area are both provided with grooves concentric with the chip heating plate; a heating wire is arranged in the groove; the radius of the blank area is 15-25% of the radius of the chip heating plate; the width of the central heating area is 50-60% of the radius of the chip heating disc; the distance between the heating wires of the central heating area is 17-23 mm; the distance between the heating wires of the edge heating zone is 5-8 mm; the chip heating plate effectively solves the problem of uneven temperature in the heating process by reasonably optimizing the distribution of the heating wires; the preparation method has simple process flow and lower cost and is beneficial to industrial application.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a chip heating plate and a preparation method and application thereof.
Background
With the continuous progress of science and technology, the demand of the market for semiconductors is continuously increased, chips are basic materials for manufacturing semiconductor chips, the dispensing technology of chips is the most important key technology in the advanced electronic manufacturing industry, and the dispensing technology is widely applied to chip packaging and integrated circuit equipment and aims to reduce the failure probability of elements caused by cold and heat changes, falling, vibration and other factors in the use process of products so as to prolong the service life of the products. Therefore, the dispensing technology is used as the key and core of the electronic packaging technology, and the improvement of the technical level is directly related to the quality of the packaging technology.
In the dispensing process of the chip, the temperature of the chip needs to reach the preset temperature, and the chip is easy to burst when the temperature is lower than the preset temperature, so that the chip heating device has a crucial influence on the dispensing process. However, the current chip heating device is easy to generate temperature difference, which causes the problems of poor dispensing effect, low product yield and the like. Therefore, the chip heating device is further improved, and the important significance is achieved for effectively ensuring the dispensing effect.
CN212370488U discloses a wafer operation platform and have its point gum machine, this wafer operation platform can be used for the point gum machine body to carry out the point to the wafer and glue, and the point gum machine body is mobile between point gum position and heat preservation position, and the point gum machine includes: a heat generating support table; the upper surface of the heater is formed into a heating surface, the wafer is positioned above the heating surface, and the dispenser body is positioned above the wafer when the dispenser body is positioned at the dispensing position; the dispensing heat-preservation platform is arranged on one side of the heating support platform and is provided with a heat-preservation surface capable of heating the dispenser body, and when the dispenser body is positioned at a heat-preservation position, the dispenser body is close to the heat-preservation surface; the heater strip of this heater in the point gum machine is equidistant to be arranged with the centre of a circle, can lead to the regional heat dissipation in the middle of the actual disk body slow during heating to make middle temperature than the edge height, lead to whole heat subsection inhomogeneous, thereby influence the point and glue the effect.
In addition, in order to ensure that the heating effect is uniform, heating wires at the central part and the edge part of the heating plate are divided into two groups in the prior art, and different control systems are adopted to control the heating power so as to ensure the final dispensing effect.
In summary, how to provide a heating plate with low cost, simple operation and ensured heating uniformity is a problem to be solved urgently at present.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a chip heating plate and a preparation method and application thereof, wherein the chip heating plate effectively solves the problem of uneven temperature in the heating process by reasonably adjusting the layout of heating wires; the preparation method has simple process flow and lower cost and is beneficial to industrial application.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a chip heating plate, wherein a heating surface of the chip heating plate sequentially comprises a blank area, a central heating area and an edge heating area, which are concentric, along a radius outwards; the central heating area and the edge heating area are both provided with grooves concentric with the chip heating plate; a heating wire is arranged in the groove;
the radius of the blank area is 15-25% of the radius of the chip heating disc, such as 15%, 17%, 19%, 21%, 23% or 25% and the like; the width of the central heating area is 50-60% of the radius of the chip heating disc, such as 50%, 52%, 54%, 56%, 58% or 60%, etc.;
the space between the heating wires of the central heating area is 17-23mm, such as 17mm, 18mm, 19mm, 20mm, 21mm, 22mm or 23 mm;
the spacing of the heating wires of the edge heating zone is 5 to 8mm, for example 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm or 8mm, and the selection of the above values is not limited to the values listed, but other values not listed within the respective value ranges are equally applicable.
According to the invention, the chip heating plate effectively avoids the problem of uneven overall heat distribution caused by poor heat dissipation effect of the central position by optimizing the layout of the heating wires in the heating surface, so that the dispensing effect of the chip is improved, and the yield is improved; moreover, the heating uniformity is further ensured by further controlling the distribution density of the heating wires of the central heating area and the edge heating area; if the distance between the heating wires of the central heating area is too large, the heat of the central area is insufficient, and the dispensing effect is affected; if the distance between the heating wires of the central heating area is too small, the heat cannot be effectively balanced, and the problem of overhigh central temperature is caused; if the distance between the heating wires in the edge heating area is too large, insufficient heat in the edge area can be caused, and the dispensing effect is affected; if the spacing between the heating wires in the edge heating zone is too small, too high a temperature in the edge zone may result, which may cause a temperature imbalance with the central portion. The chip heating plate is simple in structure, only needs one set of heating control system, does not need to set the heating control system for the central area and the edge area respectively, saves cost, reduces failure rate, and has good industrial application prospect.
The following technical solutions are preferred technical solutions of the present invention, but not limited to the technical solutions provided by the present invention, and technical objects and advantageous effects of the present invention can be better achieved and achieved by the following technical solutions.
As a preferable technical scheme of the invention, the material of the chip heating plate is aluminum alloy.
Preferably, the diameter of the chip heating plate is 319-320mm, such as 319mm, 319.2mm, 319.4mm, 319.6mm, 319.8mm or 320mm, but not limited to the values listed, and other values not listed in the range of values are equally applicable.
Preferably, the thickness of the chip heating plate is 21-23mm, such as 21mm, 21.5mm, 22mm, 22.5mm or 23mm, but not limited to the recited values, and other values not recited in the range of values are also applicable.
As a preferred technical solution of the present invention, the central heating zone and the edge heating zone are both provided with a thermal sensor.
In a preferred embodiment of the invention, the depth of the groove is 1.8-2.2mm, for example 1.8mm, 1.85mm, 1.9mm, 1.95mm, 2mm, 2.05mm, 2.1mm, 2.15mm or 2.2mm, but is not limited to the values listed, and other values not listed in the numerical range are equally applicable.
Preferably, the width of the groove is 1.8-2.2mm, such as 1.8mm, 1.85mm, 1.9mm, 1.95mm, 2mm, 2.05mm, 2.1mm, 2.15mm, 2.2mm, etc., but is not limited to the recited values, and other values not recited in this range of values are equally applicable.
As a preferable technical scheme of the invention, the chip heating plate is provided with a threaded hole, a through hole and a blind hole.
Preferably, the number of the threaded holes is at least 28, such as 28, 29, 30, 31, 32, etc., but not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the number of through holes is at least 3, such as 3, 4, or 5, but not limited to the recited values, and other values not recited within the range of values are also applicable.
Preferably, the number of blind holes is at least 1, such as 1, 2 or 3, etc., but not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the depth of the blind hole is 0.5mm less than the thickness of the chip heating plate.
In the invention, the threaded holes are M4 threaded holes, the M4 threaded holes are divided into 4 groups to form four circles which are concentric with the heating plate and have different radiuses, the 4 groups of circles are named as a first group, a second group, a third group and a fourth group in sequence along the outward direction of the radiuses, and the threaded holes are used for fixing the heating plate; the diameter of the through hole is 5.5mm, the through hole and the second group of threaded holes are positioned on the same circumference and are uniformly distributed in a staggered mode, and the through hole through which the mandril passes can lift the wafer through the mandril, so that the wafer is convenient to grab; the blind hole is 6.5mm in diameter, is located between second group screw hole and the third group screw hole for insert the thermocouple, monitor actual temperature condition.
In the invention, the arrangement of the groove needs to avoid the hole on the heating plate.
In a second aspect, the invention provides a preparation method of the heating plate, and the preparation method comprises the following steps:
and (3) carrying out rough turning, finish turning, punching, finish milling of grooves, polishing, surface treatment and embedding of heating wires on the blank disc in sequence to obtain the heating disc.
The preparation method has the advantages of simple process flow, simple and convenient operation and contribution to industrial production.
In the invention, in order to ensure the qualification rate of the final product, multiple detections are needed in the preparation process. Carrying out primary size detection after the polishing treatment, and carrying out heating wire electrification detection and secondary size detection after embedding the heating wire; the heater wire energization detection includes detecting whether the heater wire can be normally heated and uniformity of heating temperature using heat sensors of the central heating zone and the edge heating zones.
As a preferable technical scheme of the invention, the diameter of the roughly turned rear disc is 322 and 324mm, such as 322mm, 322.5mm, 323mm, 323.5mm or 324 mm; the thickness is 24-25mm, for example 25mm, 24.5mm or 25mm, and the selection of the above-mentioned values is not limited to the recited values, and other values not recited within the respective numerical ranges are also applicable.
Preferably, the diameter of the fine turning rear disc is 319-320mm, such as 319mm, 319.5mm or 320 mm; the thickness is 21-23mm, for example 21mm, 21.5mm, 22mm, 22.5mm or 23mm, and the selection of the above numerical values is not limited to the listed numerical values, and other numerical values not listed in the respective numerical ranges are also applicable.
As a preferable technical scheme of the invention, the surface treatment is anodic oxidation;
preferably, the surface treatment comprises the steps of:
and (3) soaking the disc after the groove is finely milled in an alkali solution, washing for the first time after soaking, then placing the disc in an acid solution for electrifying and oxidizing, washing for the second time after oxidizing, and then sealing holes with hot water to finish surface treatment.
In the invention, the purpose of sealing the hole by the hot water is as follows: the oxidized surface shows innumerable pores in a microscopic scale, and the pores expand and the openings are closed by soaking in hot water, thereby improving the contamination resistance and the corrosion resistance.
Preferably, the alkali solution comprises a sodium hydroxide solution and/or a potassium hydroxide solution.
Preferably, the soaking time is 1-2min, such as 1min, 1.2min, 1.4min, 1.6min, 1.8min, or 2min, but not limited to the recited values, and other values not recited in the range of values are equally applicable.
Preferably, the acid solution comprises sulfuric acid.
Preferably, the concentration of sulfuric acid is 12-17 wt%, such as 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, or 17 wt%, etc., but is not limited to the recited values, and other values not recited within this range are equally applicable.
Preferably, the time for the electrification oxidation is 60-70min, such as 60min, 62min, 64min, 66min, 68min or 70min, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the hot water is dried after sealing the holes.
According to the invention, the heating plate has wear resistance and insulating property through anodic oxidation treatment.
As a preferable technical scheme of the invention, the heating wire is embedded and then is cleaned and dried.
Preferably, the cleaning agent comprises isopropyl alcohol.
Preferably, the drying temperature is 70-80 deg.C, such as 70 deg.C, 72 deg.C, 74 deg.C, 76 deg.C, 78 deg.C or 80 deg.C, but is not limited to the recited values, and other values not recited in this range are also applicable.
Preferably, the drying time is 2-3 hours, such as 2 hours, 2.2 hours, 2.4 hours, 2.6 hours, 2.8 hours, or 3 hours, but not limited to the recited values, and other values not recited within the range of values are equally applicable.
In a third aspect, the invention provides a use of the heating plate, wherein the chip heating plate is used for heating the chip in a chip dispensing process.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the chip heating plate disclosed by the invention, the heating wire layout of the heating plate is reasonably optimized, so that the problem of uneven overall heat distribution caused by poor heat dissipation effect at the central position is solved, and the dispensing effect and the yield of chips are improved; the chip heating disc is not required to be respectively controlled by 2 groups of heating control systems, and the same effect can be achieved by only using 1 group of heating control system, so that the cost is saved;
(2) the preparation method disclosed by the invention is simple to operate, high in economic benefit and good in industrial application prospect.
Drawings
Fig. 1 is a schematic structural diagram of a heating plate provided in embodiment 1 of the present invention;
the heating device comprises a heating wire, a heating wire and a blind hole.
Detailed Description
In order to better illustrate the present invention and facilitate the understanding of the technical solutions of the present invention, the present invention is further described in detail below. However, the following examples are only simple examples of the present invention and do not represent or limit the scope of the present invention, which is defined by the claims.
The following are typical but non-limiting examples of the invention:
example 1:
the embodiment provides a chip heating plate and a preparation method thereof, and the structural schematic diagram of the chip heating plate is shown in fig. 1.
The heating surface of the chip heating plate sequentially comprises a blank area 1, a central heating area 2 and an edge heating area 3 which are concentric along the radius outwards; the central heating area 2 and the edge heating area 3 are both provided with grooves which are concentric with the chip heating plate and have the depth and width of 2 mm; a heating wire 4 is arranged in the groove;
the radius of the blank area 1 is 15% of the radius of the chip heating plate; the width of the central heating area 2 is 50% of the radius of the chip heating disc;
the space between the heating wires 4 of the central heating area 2 is 17 mm;
the distance between the heating wires 4 of the edge heating zone 3 is 5 mm.
The chip heating plate is an aluminum alloy heating plate, the diameter of the chip heating plate is 320mm, and the thickness of the chip heating plate is 22 mm.
The chip heating plate is provided with 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 21.5 mm.
The preparation method of the heating plate comprises the following steps:
(1) roughly turning a blank disc, wherein the size of the roughly turned blank disc is phi 322 multiplied by 24 mm;
(2) finish turning, wherein the size after finish turning is phi 320 multiplied by 22 mm;
(3) punching 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 21.5mm according to the designed position;
(4) finely milling a groove with the depth and the width of 2mm according to a designed path;
(5) polishing, removing burrs and knife lines, and then carrying out primary size detection;
(6) surface treatment: placing the polished disc in a sodium hydroxide solution for soaking for 1min, washing the disc with clear water after soaking, then placing the disc in a sulfuric acid solution with the concentration of 15 wt% for electrifying and oxidizing for 60min, washing the disc with clear water after oxidizing for the second time, and then sealing the hole with hot water to finish surface treatment;
(7) and embedding a heating wire 4 in the groove, carrying out power-on detection, and then carrying out secondary size detection to obtain the heating plate.
Example 2:
the embodiment provides a chip heating plate and a preparation method thereof, wherein a heating surface of the chip heating plate sequentially comprises a blank area 1, a central heating area 2 and an edge heating area 3 which are concentric along the radius outwards; the central heating area 2 and the edge heating area 3 are both provided with grooves which are concentric with the chip heating plate and have the depth and width of 1.9 mm; a heating wire 4 is arranged in the groove;
the radius of the blank area 1 is 20% of the radius of the chip heating plate; the width of the central heating area 2 is 55% of the radius of the chip heating disc;
the space between the heating wires 4 of the central heating area 2 is 19.9 mm;
the spacing of the heating wires 4 of the edge heating zone 3 is 6.4 mm.
The chip heating plate is an aluminum alloy heating plate, the diameter of the chip heating plate is 319mm, and the thickness of the chip heating plate is 23 mm.
The chip heating plate is provided with 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 21.5 mm.
The preparation method of the heating plate comprises the following steps:
(1) roughly turning a blank disc, wherein the size of the roughly turned blank disc is phi 322 multiplied by 24 mm;
(2) finish turning, wherein the size after finish turning is phi 319 multiplied by 23 mm;
(3) punching 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 22.5mm according to the designed position;
(4) finely milling grooves with the depth and the width of 1.9mm according to a designed path;
(5) polishing, removing burrs and knife lines, and then carrying out primary size detection;
(6) surface treatment: placing the polished disc in a sodium hydroxide solution for soaking for 2min, washing the disc with clear water after soaking, then placing the disc in a sulfuric acid solution with the concentration of 12 wt% for electrifying and oxidizing for 70min, washing the disc with clear water after oxidizing for the second time, and then sealing the hole with hot water to finish surface treatment;
(7) and embedding a heating wire 4 in the groove, carrying out power-on detection, and then carrying out secondary size detection to obtain the heating plate.
Example 3:
the embodiment provides a chip heating plate and a preparation method thereof, wherein a heating surface of the chip heating plate sequentially comprises a blank area 1, a central heating area 2 and an edge heating area 3 which are concentric along the radius outwards; the central heating area 2 and the edge heating area 3 are both provided with grooves which are concentric with the chip heating plate and have the depth and width of 2.2 mm; a heating wire 4 is arranged in the groove;
the radius of the blank area 1 is 25% of the radius of the chip heating plate; the width of the central heating area 2 is 60% of the radius of the chip heating disc;
the space between the heating wires 4 of the central heating area 2 is 23 mm;
the distance between the heating wires 4 of the edge heating zone 3 is 8 mm.
The chip heating plate is an aluminum alloy heating plate, the diameter of the chip heating plate is 320mm, and the thickness of the chip heating plate is 21 mm.
The chip heating plate is provided with 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 20.5 mm.
The preparation method of the heating plate comprises the following steps:
(1) roughly turning a blank disc, wherein the size of the roughly turned blank disc is phi 324 multiplied by 25 mm;
(2) finish turning, wherein the size after finish turning is phi 320 multiplied by 21 mm;
(3) punching 28M 4 threaded holes 5, 3 through holes 6 with the diameter of 5.5mm and 1 blind hole 7 with the diameter of 6.5mm and the depth of 20.5mm according to the designed position;
(4) finely milling grooves with the depth and the width of 2.2mm according to a designed path;
(5) polishing, removing burrs and knife lines, and then carrying out primary size detection;
(6) surface treatment: placing the polished disc in a sodium hydroxide solution for soaking for 1min, washing the disc with clear water after soaking, then placing the disc in a 17 wt% sulfuric acid solution for electrifying and oxidizing for 60min, washing the disc with clear water after oxidizing for the second time, and then sealing the hole with hot water to finish surface treatment;
(7) and embedding a heating wire 4 in the groove, carrying out power-on detection, and then carrying out secondary size detection to obtain the heating plate.
Example 4:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 1 only in that: the radius of blank 1 is 13% of the radius of the chip heating plate, and the width of central heating area 2 is 52% of the radius of the chip heating plate.
Example 5:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 3 only in that: the radius of blank 1 is 27% of the radius of the chip heating plate, and the width of central heating area 2 is 58% of the radius of the chip heating plate.
Example 6:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 1 only in that: keeping the radius of the blank area 1 unchanged, the width of the central heating area 2 is 48% of the radius of the chip heating disc.
Example 7:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 3 only in that: keeping the radius of the blank area 1 unchanged, the width of the central heating area 2 is 62% of the radius of the chip heating disc.
Example 8:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 1 only in that: the distance between the heating wires 4 of the central heating area 2 is 16 mm.
Example 9:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 3 only in that: the distance between the heating wires 4 of the central heating area 2 is 24 mm.
Example 10:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 1 only in that: the distance between the heating wires 4 of the edge heating zone 3 is 4 mm.
Example 11:
the present embodiment provides a chip heating plate, which is different from the heating plate of embodiment 3 only in that: the spacing of the heating wires 4 of the edge heating zone 3 is 9 mm.
Comparative example 1:
this comparative example provides a chip heating plate, which differs only in reference to the heating plate in example 1: the distance between the heating wires 4 of the central heating area 2 and the distance between the heating wires 4 of the edge heating area 3 are both 10 mm.
The chip heating plates obtained in examples 1 to 11 and comparative example 1 were heated with a power of 0.6kW using heat sensors provided in the center heating zone and the edge heating zone, and the temperature uniformity thereof was measured, and the results are shown in table 1. The temperature control requirement is 120 +/-1 ℃, and the product is qualified.
TABLE 1
In the embodiments 1-3, the layout of the heating wires on the chip heating disc is reasonably optimized, so that the temperature uniformity can be ensured only by one group of heating control systems, and the dispensing effect of the chip can be effectively improved; example 4 the area of the blank region was reduced, resulting in an increased area of the central heating zone, resulting in a relatively high intermediate temperature; example 5 increased the area of the blank area, so that the area of the central heating zone was reduced, resulting in a relatively low intermediate temperature; example 6 reduces the area of the central heating zone and increases the area of the edge heating zones, resulting in a relatively high intermediate temperature; example 7 increased the area of the central heating zone and compressed the area of the edge heating zone, resulting in a relatively lower intermediate temperature; example 8 reduces the distribution density of the heating wires in the central heating zone, resulting in relatively high intermediate temperatures; example 9 increases the distribution density of the heating wires in the central heating zone, resulting in relatively low intermediate temperatures; example 10 reduced the distribution density of the heating wires in the edge heating zone, resulting in a relatively low edge temperature; example 11 increases the distribution density of the heating wires of the edge heating zone, resulting in a relatively high edge temperature.
The heating wires of the central heating area and the edge heating area of the heating disc in the comparative example 1 are uniformly distributed and have the same interval, and when the heating disc is heated by the same power, the heat in the central area is dissipated, so that the temperature in the central area is too high, the temperature in the edge heating area is too low, and the dispensing effect is affected.
It can be seen from the above embodiments and comparative examples that the chip heating plate of the invention solves the problem of uneven overall heat distribution caused by poor heat dissipation effect at the center position by reasonably optimizing the layout of the heating wires of the heating plate, and improves the effect of chip dispensing and the yield; the chip heating disc is not required to be respectively controlled by 2 groups of heating control systems, and the same effect can be achieved by only using 1 group of heating control system, so that the cost is saved; the preparation method is simple to operate, high in economic benefit and good in industrial application prospect.
The applicant states that the present invention is illustrated by the above examples to show the products and detailed methods of the present invention, but the present invention is not limited to the above products and detailed methods, i.e. it is not meant that the present invention must rely on the above products and detailed methods to be carried out. It will be apparent to those skilled in the art that any modifications to the present invention, equivalents thereof, additions of additional operations, selection of specific ways, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A chip heating plate is characterized in that a heating surface of the chip heating plate sequentially comprises a blank area with the same center of circle, a central heating area and an edge heating area along the radius outwards; the central heating area and the edge heating area are both provided with grooves concentric with the chip heating plate; a heating wire is arranged in the groove;
the radius of the blank area is 15-25% of the radius of the chip heating plate; the width of the central heating area is 50-60% of the radius of the chip heating disc;
the distance between the heating wires of the central heating area is 17-23 mm;
the distance between the heating wires of the edge heating zone is 5-8 mm.
2. The chip heating plate of claim 1, wherein the material of the chip heating plate is an aluminum alloy;
preferably, the diameter of the chip heating plate is 319-320 mm;
preferably, the thickness of the chip heating plate is 21-23 mm.
3. The chip heater tray of claim 1 or 2, wherein the central heater zone and the edge heater zone are each provided with a thermal sensor.
4. The chip heater tray of any of claims 1-3, wherein the depth of the recess is 1.8-2.2 mm;
preferably, the width of the groove is 1.8-2.2 mm.
5. The chip heater tray of any of claims 1-4, wherein the chip heater tray is provided with threaded holes, through holes, and blind holes;
preferably, the number of the threaded holes is at least 28;
preferably, the number of the through holes is at least 3;
preferably, the number of the blind holes is at least 1;
preferably, the depth of the blind hole is 0.5mm less than the thickness of the chip heating plate.
6. A method of making a chip heater plate according to any one of claims 1-5, comprising the steps of:
and (3) carrying out rough turning, finish turning, punching, finish milling of grooves, polishing, surface treatment and embedding of heating wires on the blank disc in sequence to obtain the heating disc.
7. The method as claimed in claim 6, wherein the roughly turned disc has a diameter of 322-324mm and a thickness of 24-25 mm;
preferably, the diameter of the disc after finish turning is 319-320mm, and the thickness is 21-23 mm.
8. The production method according to claim 6 or 7, wherein the surface treatment is anodic oxidation;
preferably, the surface treatment comprises the steps of:
placing the disc after the groove is finely milled in an alkali solution for soaking, performing primary washing after soaking, then placing the disc in an acid solution for electrifying and oxidizing, performing secondary washing after oxidizing, and then sealing holes with hot water to finish surface treatment;
preferably, the alkali solution comprises a sodium hydroxide solution and/or a potassium hydroxide solution;
preferably, the soaking time is 1-2 min;
preferably, the acid solution comprises sulfuric acid;
preferably, the concentration of the sulfuric acid is 12-17 wt%;
preferably, the time of the electrification oxidation is 60-70 min;
preferably, the hot water is dried after sealing the holes.
9. The production method according to any one of claims 6 to 8, wherein the embedded heating wire is washed and dried;
preferably, the cleaning agent comprises isopropyl alcohol;
preferably, the temperature of the drying is 70-80 ℃;
preferably, the drying time is 2-3 h.
10. Use of the chip heating plate according to any one of claims 1 to 5, wherein the chip heating plate is used for heating chips during chip dispensing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (1)
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| CN115505897A (en) * | 2022-09-22 | 2022-12-23 | 江苏第三代半导体研究院有限公司 | Rotating disc type reactor for preparing epitaxial wafer, preparation method and application |
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| CN115505897A (en) * | 2022-09-22 | 2022-12-23 | 江苏第三代半导体研究院有限公司 | Rotating disc type reactor for preparing epitaxial wafer, preparation method and application |
| CN115505897B (en) * | 2022-09-22 | 2023-10-31 | 江苏第三代半导体研究院有限公司 | Turntable type reactor for preparing epitaxial wafer, preparation method and application |
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