Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
Referring to fig. 1, an embodiment of the present disclosure provides a light emitting module 100, including:
a light emitting cell layer 110 including a plurality of light emitting cells 111;
a backlight isolation layer 120 disposed on the backlight surface 112 of the light emitting unit layer 110;
among them, in part or all of the plurality of light emitting units 111, a light emitting unit optical isolation structure 300 is disposed between two adjacent light emitting units 111.
In this way, the backlight isolation layer 120 can prevent the light emitted from the light emitting unit 111 from being transmitted in an undesired direction (for example, the light emitted from the light emitting unit 111 is transmitted through the backlight surface 112 of the light emitting unit layer 110), and the light emitting unit optical isolation structure 300 can prevent the light emitted from two adjacent light emitting units 111 from being transmitted in an undesired direction (for example, the light emitted from two adjacent light emitting units 111 is transmitted to each other), which is advantageous for improving the display effect.
Referring to fig. 2A, 2B, 2C, 2D, 2E, 2F, 2G, in some embodiments, the backlight isolation layer 120 may include at least one of a backlight DBR reflective layer 121, a backlight metallic reflective layer 122, a backlight absorbing layer 123.
In some embodiments, the backlight DBR reflective layer 121 may include structures and materials that enable light reflection. Alternatively, the structure and material of the reflective layer 121 of the backlight DBR may be determined according to practical situations such as process requirements, as long as the reflective layer can reflect the light emitted from the light emitting unit layer 110.
In some embodiments, the backlight metal reflective layer 122 may include structures and materials that enable light reflection, such as: at least one of metals such as silver and aluminum. Alternatively, the material of the backlight metal reflective layer 122 may be determined according to practical situations such as process requirements, as long as the material can reflect the light emitted from the light emitting unit layer 110.
In some embodiments, the light absorption layer 123 may include structures and materials capable of light absorption, such as: a resin composition. Alternatively, the material for realizing light absorption may also include a Black Matrix (BM). Alternatively, the structure and material of the back light absorption layer 123 may be determined according to practical conditions such as process requirements, so long as the light emitted from the light emitting unit layer 110 can be absorbed.
In some embodiments, the backlight spacer 120 may include other structures and materials besides at least one of the backlight DBR reflective layer 121, the backlight metal reflective layer 122, and the backlight absorbing layer 123. Alternatively, the backlight spacer 120 may not include any one of the backlight DBR reflective layer 121, the backlight metal reflective layer 122, and the backlight absorption layer 123, but include other structures and materials. Optionally, the structure and material of the backlight isolation layer 120 may be determined according to practical conditions such as process requirements; regardless of the structure and material of the backlight spacer 120, the backlight spacer 120 may be used to separate the light emitted from the light emitting unit layer 110 to prevent the light emitted from the light emitting unit 111 from being transmitted in an undesired direction.
In some embodiments, the backlight spacer layer 120 may completely or proportionally separate the light emitted from the light emitting cell layer 110 in a reflective or absorptive manner, such as: the light emitted from the light emitting cell layer 110 is isolated in equal proportions of 100%, 90%, 80%. Alternatively, the proportion of the light emitted from the isolated light emitting cell layer 110 may be determined according to practical circumstances such as process requirements.
In some embodiments, as shown in fig. 2A, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121.
In some embodiments, as shown in fig. 2B, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, such as: one, two, three or more backlight metal reflective layers 122.
In some embodiments, as shown in fig. 2C, the backlight spacer layer 120 may include at least one layer of a backlight absorption layer 123, such as: one, two, three or more layers of the backside light absorption layer 123.
In some embodiments, as shown in fig. 2D, the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight metallic reflective layer 122, for example: one, two, three or more backlight DBR reflective layers 121, and one, two, three or more backlight metallic reflective layers 122. Optionally, the hierarchical relationship between each of the at least one backlight DBR reflective layer 121 and the at least one backlight metal reflective layer 122 may be determined according to practical situations such as process requirements, for example: all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layer 121 are relatively intensively disposed, and all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 are relatively intensively disposed; or, the backlight DBR reflecting layer 121 and the backlight metal reflecting layer 122 are overlapped.
In some embodiments, as shown in fig. 2E, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight absorbing layer 123, for example: one, two, three or more layers of the backlight DBR reflective layer 121, and one, two, three or more layers of the backlight absorbing layer 123. Alternatively, the hierarchical relationship of each of the at least one backlight DBR reflecting layer 121 and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layers 121 are relatively intensively disposed, and all the back light absorbing layers 123 of the at least one back light absorbing layer 123 are relatively intensively disposed; alternatively, the backlight DBR reflection layer 121 and the backlight absorption layer 123 are overlapped.
In some embodiments, as shown in fig. 2F, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122 and at least one backlight light absorbing layer 123, such as: one, two, three or more layers of a back light metal reflecting layer 122, and one, two, three or more layers of a back light absorbing layer 123. Optionally, the hierarchical relationship of each of the at least one backlight metal reflective layer 122 and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 are relatively intensively arranged, and all the backlight absorbing layers 123 of the at least one backlight absorbing layer 123 are relatively intensively arranged; alternatively, the backlight metal reflective layer 122 and the backlight absorption layer 123 are overlapped.
In some embodiments, as shown in fig. 2G, the backlight spacer layer 120 may include at least one backlight DBR reflective layer 121, at least one backlight metallic reflective layer 122, and at least one backlight absorbing layer 123, such as: one, two, three or more backlight DBR reflective layers 121, one, two, three or more backlight metallic reflective layers 122, and one, two, three or more backlight absorbing layers 123. Alternatively, the hierarchical relationship among the at least one backlight DBR reflecting layer 121, the at least one backlight metal reflecting layer 122, and the at least one backlight absorbing layer 123 may be determined according to practical situations such as process requirements, for example: disposing all the backlight DBR reflecting layers 121 of the at least one backlight DBR reflecting layer 121 relatively intensively, disposing all the backlight metallic reflecting layers 122 of the at least one backlight metallic reflecting layer 122 relatively intensively, disposing all the backlight absorbing layers 123 of the at least one backlight absorbing layer 123 relatively intensively; or, at least two of the backlight DBR reflecting layer 121, the backlight metal reflecting layer 122, and the backlight absorbing layer 123 are overlapped.
Referring to fig. 3, in some embodiments, conductive holes 124 supporting the light emitting cell layers 110 to make electrical connection may be disposed in the backlight isolation layer 120. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to practical situations such as process requirements, for example: a plurality of conductive vias 124 may be provided; alternatively, some or all of the plurality of conductive vias 124 may be conductive vias.
Referring to fig. 4A, 4B, and 4C, in some embodiments, the conductive hole 124 may be filled with a conductive material 125, the backlight isolation layer 120 may include at least one of at least one backlight DBR reflecting layer 121 and at least one backlight absorbing layer 123, and at least one of the at least one backlight DBR reflecting layer 121 and the at least one backlight DBR absorbing layer 123 may be in direct contact with the conductive material 125.
In some embodiments, as shown in fig. 4A, the conductive via 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating some or all of the backlight DBR reflective layers 121 of at least one of the backlight DBR reflective layers 121. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
In some embodiments, as shown in fig. 4B, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one layer of the backlight absorption layer 123. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating some or all of the at least one layer of the back light absorbing layers 123. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
In some embodiments, as shown in fig. 4C, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight DBR reflective layer 121 and at least one backlight DBR reflective layer 123. Optionally, a plurality of conductive vias 124 may be provided. Alternatively, some or all of the plurality of conductive vias 124 may be conductive vias capable of penetrating through all of the backlight DBR reflective layer 121 of the at least one layer and all of the backlight DBR reflective layer 121 and the backlight DBR reflective layer 123 of the at least one layer and the backlight absorbing layer 123 of the at least one layer. Alternatively, the number, the arrangement position, and the like of the conductive holes 124 may be determined according to actual conditions such as process requirements.
Referring to fig. 5, in some embodiments, the conductive hole 124 may be filled with a conductive material 125, and the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, and an insulating portion 126 is disposed between the at least one backlight metal reflective layer 122 and the conductive material 125. Alternatively, a plurality of conductive holes 124 may be disposed in the backlight isolation layer 120, and some or all of the plurality of conductive holes 124 may be disposed as shown in fig. 5.
Referring to fig. 6A, 6B, 6C, 6D, in some embodiments, some or all of the area in the insulation 126 is provided with an optical isolation material 127.
In some embodiments, as shown in fig. 6A, both sides of the insulating part 126 may be provided with optical isolation materials 127.
In some embodiments, as shown in fig. 6B, one side of the insulating part 126 may be provided with an optical isolation material 127.
In some embodiments, as shown in fig. 6C, the other side of the insulating part 126, which is opposite to the side in fig. 6B where the optical isolation material 127 is disposed, may be provided with the optical isolation material 127.
In some embodiments, as shown in fig. 6D, all of the regions in the insulation 126 are provided with an optical isolation material 127.
In some embodiments, the area in which the optical isolation material 127 is disposed in the insulating portion 126 may be determined according to actual conditions such as process requirements.
Referring to fig. 7, in some embodiments, a side of the backlight spacer 120 away from the light emitting cell layer 110 may be provided with an electrical connection layer 130.
Referring to fig. 8, in some embodiments, the light emitting cell layer 110 and the electrical connection layer 130 may be electrically connected through the conductive via 124. Alternatively, the electrical connection between the light emitting unit layer 110 and the electrical connection layer 130 may be implemented in other manners besides the conductive via 124 according to practical circumstances such as process requirements.
Referring to fig. 9, in some embodiments, the backlight isolation layer 120 may include at least one backlight metal reflective layer 122, and the at least one backlight metal reflective layer 122 may be provided with an insulating layer 128 insulated from the electrical connection layer 130 and the light emitting cell layer 110.
Referring to fig. 10, in some embodiments, the insulating layer 128 may include at least one of:
a first insulating layer 1281 disposed between the backlight metal reflective layer 122 and the electrical connection layer 130;
and a second insulating layer 1282 disposed between the backlight metal reflective layer 122 and the light emitting cell layer 110.
Referring to fig. 11A, 11B, 11C, 11D, 11E, 11F, 11G, 11H, in some embodiments, a portion or all of at least one of the first insulating layer 1281 and the second insulating layer 1282 may be provided with an optical isolation material 127.
In some embodiments, as shown in FIG. 11A, both sides of the first insulating layer 1281 are provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11B, one side of first insulating layer 1281 is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11C, the other side of the first insulating layer 1281, opposite the side in FIG. 11B where the optical isolation material 127 is disposed, is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11D, the entire area of the first insulating layer 1281 is provided with the optical isolation material 127.
In some embodiments, as shown in FIG. 11E, both sides of the second insulating layer 1282 are provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11F, one side of the second insulating layer 1282 is provided with an optical isolation material 127.
In some embodiments, as shown in FIG. 11G, the other side of the second insulating layer 1282 opposite the side in FIG. 11F where the optical isolation material 127 is disposed is provided with optical isolation material 127.
In some embodiments, as shown in FIG. 11H, the entire area of the second insulating layer 1282 is provided with the optical isolation material 127.
In some embodiments, the area in which the optical isolation material 127 is disposed in the insulating layer 128 (e.g., at least one of the first insulating layer 1281 and the second insulating layer 1282) may be determined based on process requirements, among other practical considerations.
In some embodiments, in conjunction with fig. 1, the backlight isolation layer 120 may be directly disposed on the backlight surface 112 of the light emitting cell layer 110. Alternatively, there may be no other devices or structures between the backlight isolation layer 120 and the backlight surface 112 of the light emitting cell layer 110. Alternatively, other devices or structures may be disposed in a part or all of the area between the backlight isolation layer 120 and the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements.
In some embodiments, the backlight isolation layer 120 may be attached to the backlight surface 112 of the light emitting cell layer 110. Optionally, part or all of the backlight isolation layer 120 may be attached to the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements. Alternatively, in the case that a portion of the backlight isolation layer 120 is attached to the backlight surface 112 of the light emitting unit layer 110, a portion of the backlight isolation layer 120, which is not attached to the backlight surface 112 of the light emitting unit layer 110, may have a certain distance from the backlight surface 112 of the light emitting unit layer 110. Alternatively, the distance may be set according to actual conditions such as process requirements.
Referring to fig. 12A, 12B, and 12C, in some embodiments, the backlight isolation layer 120 may be disposed on a part or all of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 12A, the backlight isolation layer 120 is disposed on the entire area of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 12B, the backlight isolation layer 120 is disposed on a partial area of the backlight surface 112 of the light emitting cell layer 110, which may be a continuous area. Optionally, the continuous region may include at least one edge EG of the backlight surface 112 of the light emitting cell layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included.
In some embodiments, as shown in fig. 12C, a backlight isolation layer 120 (the backlight isolation layer 120 is surrounded by a dotted line for easy identification) is disposed on a partial region of the backlight surface 112 of the light emitting cell layer 110, which may be a discontinuous region. In this case, the backlight spacer layer 120 may be composed of more than one discontinuous layer structure 1201. Alternatively, at least two discontinuous regions may be provided, at least one of which may include at least one edge EG of the backlight surface 112 of the light emitting unit layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included. Alternatively, the position, number, etc. of discontinuous regions for disposing the backlight surfaces 112 of the light emitting unit layers 110 of the backlight isolation layer 120 may be determined according to practical situations such as process requirements, so as to determine the position, number, etc. of the discontinuous layer structures 1201 constituting the backlight isolation layer 120.
In some embodiments, the backlight isolation layer 120 may be disposed on a part or all of the backlight surface 112 of the light emitting unit layer 110 according to practical situations such as process requirements, so long as the backlight isolation layer 120 can isolate the light emitted from the light emitting unit layer 110 to prevent the light emitted from the light emitting unit 111 from being conducted in an undesired direction.
Referring to fig. 13A, 13B, and 13C, in some embodiments, the backlight isolation layer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110. In some embodiments, as shown in fig. 13A, 13B, and 13C, the arrow pattern exemplarily represents a direction of a portion of the light emitting cell layer 110 toward the backlight spacer 120. Optionally, the light transmissive region 1121 is surrounded by a dotted line for ease of identification.
In some embodiments, as shown in fig. 13A, the light transmissive region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes the entire region of the backlight surface 112 of the light emitting unit layer 110. In this case, the backlight spacer 120 may be disposed on the entire area of the backlight surface 112 of the light emitting cell layer 110, so that the backlight spacer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110.
In some embodiments, as shown in fig. 13B, the light transmissive region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes a partial region of the backlight surface 112 of the light emitting unit layer 110, which may be a continuous region. In this case, the backlight spacer 120 may be disposed on a partial region (e.g., the continuous region) of the backlight surface 112 of the light emitting cell layer 110, so that the backlight spacer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110. Optionally, the continuous region may include at least one edge EG of the backlight surface 112 of the light emitting cell layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included.
In some embodiments, as shown in fig. 13C, the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110 includes a partial region of the backlight surface 112 of the light emitting unit layer 110, which may be a discontinuous region. In this case, the backlight isolation layer 120 may be disposed on a partial region (e.g., the discontinuous region) of the backlight surface 112 of the light emitting cell layer 110, so that the backlight isolation layer 120 may be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting cell layer 110. Correspondingly, the backlight spacer layer 120 may be composed of more than one non-continuous layer structure 1201. Alternatively, at least two discontinuous regions may be provided, at least one of which may include at least one edge EG of the backlight surface 112 of the light emitting unit layer 110; or, any edge EG of the backlight surface 112 of the light emitting unit layer 110 is not included. Alternatively, the position, number, etc. of discontinuous regions for disposing the backlight surfaces 112 of the light emitting unit layers 110 of the backlight isolation layer 120 may be determined according to actual light transmittance conditions such as process requirements, so as to determine the position, number, etc. of the discontinuous layer structures 1201 constituting the backlight isolation layer 120.
In some embodiments, the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110 may be determined according to actual light transmission conditions such as process requirements, and the like, and accordingly, the backlight isolation layer 120 is considered to be disposed on the light transmission region 1121 of the backlight surface 112 of the light emitting unit layer 110. Alternatively, the light transmission region 1121 may include a part or all of the region of the backlight surface 112 of the light emitting unit layer 110, may be in the form of a continuous region or a discontinuous region, and may determine the corresponding position, number, etc. according to the actual light transmission condition, such as the process requirement, so long as the backlight isolation layer 120 can isolate the light emitted from the light emitting unit layer 110 to avoid the light emitted from the light emitting unit 111 from being transmitted in an undesired direction as much as possible.
Referring to fig. 14A, 14B, and 14C, in some embodiments, the light emitting cell optical isolation structure 300 may be disposed at a partial or entire region between two adjacent light emitting cells 111.
In some embodiments, as shown in fig. 14A, the light-emitting unit optical isolation structure 300 is disposed at a partial region between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and near one of the light-emitting units 111 (the light-emitting unit 111 located on the left side in the figure).
In some embodiments, as shown in fig. 14B, the light-emitting-unit optical isolation structure 300 is disposed in a partial region between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and being opposite to the position where the light-emitting-unit optical isolation structure 300 is located in fig. 14A (close to the light-emitting unit 111 located on the right side in the figure).
In some embodiments, as shown in fig. 14C, the light-emitting unit optical isolation structure 300 is disposed at the entire region between the adjacent two light-emitting units 111.
In some embodiments, the area where the light-emitting unit optical isolation structure 300 is disposed between two adjacent light-emitting units 111 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
Referring to fig. 15A, 15B, 15C, 15D, and 15E, in some embodiments, a light emitting unit interval region 310 may exist between two adjacent light emitting units 111, and a light emitting unit optical isolation structure 300 may be disposed in part or all of the light emitting unit interval region 310.
In some embodiments, as shown in fig. 15A, a light emitting unit interval region 310 having a rectangular quadrilateral shape may be used as a light emitting unit interval region between two adjacent light emitting units 111; the light-emitting unit interval region 310 may smoothly connect two adjacent light-emitting units 111, so that the projection formed by the two adjacent light-emitting units 111 and the light-emitting unit interval region 310 may form a regular shape such as a rectangular quadrangle as shown in fig. 15A.
In some embodiments, the light emitting cell spacing region 310 between two adjacent light emitting cells 111 may not have the shape of the light emitting cell spacing region 310 as shown in fig. 15A, but have other shapes such as a circle, an ellipse, a triangle, a trapezoid, and the like. Alternatively, in the case where the light-emitting unit interval region 310 between two adjacent light-emitting units 111 has other shapes such as a circle, an ellipse, a triangle, a trapezoid, etc., it is also possible for the light-emitting unit interval region 310 to smoothly connect two adjacent light-emitting units 111, so that the projection formed by the two adjacent light-emitting units 111 and the light-emitting unit interval region 310 together may form a regular shape such as a rectangular quadrangle as shown in fig. 15A.
In some embodiments, the position, shape, size, etc. of the light emitting unit interval region 310 between two adjacent light emitting units 111 may be determined according to practical situations such as process requirements. Alternatively, regardless of the shape of the light-emitting unit interval region 310 between two adjacent light-emitting units 111, the light-emitting unit interval region 310 having an approximately elliptical shape shown by a dotted line in fig. 15B may also be used as the light-emitting unit interval region between two adjacent light-emitting units 111 for convenience of description.
In some embodiments, as shown in fig. 15C, the light-emitting unit optical isolation structure 300 is disposed at a partial region in the light-emitting unit interval region 310 between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and near one of the light-emitting units 111 (the light-emitting unit 111 located on the left side in the drawing).
In some embodiments, as shown in fig. 15D, the light-emitting-unit optical isolation structure 300 is disposed at a partial region in the light-emitting-unit spacing region 310 between two adjacent light-emitting units 111, the partial region being located between the two adjacent light-emitting units 111 and being opposite to the position where the light-emitting-unit optical isolation structure 300 is located in fig. 15C (close to the light-emitting unit 111 located at the right side in the figure).
In some embodiments, as shown in fig. 15E, the light-emitting unit optical isolation structure 300 is disposed at all of the light-emitting unit interval regions 310 between the adjacent two light-emitting units 111.
In some embodiments, the position of the light-emitting unit optical isolation structure 300 disposed in the light-emitting unit interval region 310 between two adjacent light-emitting units 111 may be determined according to practical situations such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
Referring to fig. 16A, 16B, 16C, and 16D, in some embodiments, two adjacent light emitting units 111 may include a first light emitting unit 320 and a second light emitting unit 330, the first light emitting unit 320 may include a first face 321 adjacent to the second light emitting unit 330, and the second light emitting unit 330 may include a second face 331 adjacent to the first light emitting unit 320. Alternatively, the light emitting unit optical isolation structure 300 may be disposed on at least one of the first and second faces 321 and 331, or not in contact with the first and second faces 321 and 331.
In some embodiments, as shown in fig. 16A, the light-emitting unit optical isolation structure 300 is disposed on the first face 321 of the first light-emitting unit 320, in contact with the first face 321 of the first light-emitting unit 320, and not in contact with the second face 331 of the second light-emitting unit 330.
In some embodiments, as shown in fig. 16B, the light emitting cell optical isolation structure 300 is disposed on the second face 331 of the second light emitting cell 330, in contact with the second face 331 of the second light emitting cell 330, and not in contact with the first face 321 of the first light emitting cell 320.
In some embodiments, as shown in fig. 16C, the light emitting cell optical isolation structure 300 is disposed on the first face 321 of the first light emitting cell 320 and the second face 331 of the second light emitting cell 330, in contact with the first face 321 of the first light emitting cell 320 and in contact with the second face 331 of the second light emitting cell 330.
In some embodiments, as shown in fig. 16D, the light emitting cell optical isolation structure 300 is disposed between the first face 321 of the first light emitting cell 320 and the second face 331 of the second light emitting cell 330, without contacting the first face 321 of the first light emitting cell 320 and without contacting the second face 331 of the second light emitting cell 330.
In some embodiments, the arrangement relationship between the light-emitting unit optical isolation structure 300 and the first and second light-emitting units 320 and 330 may be determined according to actual conditions such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by the first and second light-emitting units 320 and 330 from being conducted in an undesired direction (for example, the light emitted by the first and second light-emitting units 320 and 330 is conducted to each other).
Referring to fig. 17A, 17B, 17C, 17D, 17E, 17F, 17G, 17H, 17I, 17J, 17K, 17L, 17M, and 17N, in some embodiments, the light-emitting unit optical isolation structure 300 may be disposed in a light-transmitting region of at least one of the first and second faces 321 and 331.
In some embodiments, the arrow pattern exemplarily represents a direction in which a part of light of the light emitting unit 111 is conducted outward, as shown in fig. 17A, 17B, 17C, 17D, 17E, 17F, 17G, 17H, 17I, 17J, 17K, 17L, 17M, 17N. Optionally, the light transmissive regions 333, 334 are surrounded by dashed lines for ease of identification.
In some embodiments, as shown in fig. 17A, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes the entire region of the first face 321. In this case, the light-emitting unit optical isolation structure 300 may be disposed on and in contact with the entire region of the first face 321, so that the light-emitting unit optical isolation structure 300 may be disposed on the light-transmitting region 333 of the first face 321.
In some embodiments, as shown in fig. 17B, 17C, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes a partial region of the first face 321. In this case, the light-emitting-unit optical isolation structure 300 may be disposed at and in contact with a corresponding partial region of the first face 321, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting region 333 of the first face 321.
In some embodiments, as shown in fig. 17D, the light transmission region 334 of the second side 331 of the second light emitting unit 330 includes the entire region of the second side 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire area of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting area 334 of the second face 331.
In some embodiments, as shown in fig. 17E, 17F, the light transmission region 334 of the second face 331 of the second light emitting unit 330 includes a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed at a corresponding partial region of the second face 331 and in contact with the corresponding partial region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting region 334 of the second face 331.
In some embodiments, as shown in fig. 17G, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 includes the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 includes the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire regions of the first and second surfaces 321 and 331 so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting region 333 of the first surface 321 and the light-transmitting region 334 of the second surface 331.
In some embodiments, as shown in fig. 17H and 17I, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 coincides with the light-transmitting region 334 of the second side 331 (e.g., at least one of the position, the shape, the area, etc. is the same). In this case, the light-emitting-unit optical isolation structure 300 may be disposed at respective partial regions of the first and second faces 321 and 331, and in contact with the respective partial regions of the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting regions 334 of the first and second faces 321 and 331.
In some embodiments, as shown in fig. 17J, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 is not identical to the light-transmitting region 334 of the second side 331 (e.g., at least one of a position, a shape, an area, etc. is not identical). In this case, the light-emitting-unit optical isolation structure 300 may be disposed at respective partial regions of the first and second faces 321 and 331, and in contact with the respective partial regions of the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed at the light-transmitting regions 334 of the first and second faces 321 and 331.
In some embodiments, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 may include the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 may include a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on and in contact with the entire region of the first face 321 and the partial region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting regions 334 of the first face 321 and the second face 331. Alternatively, the light transmission region 333 of the first face 321 of the first light emitting unit 320 may include a partial region of the first face 321, and the light transmission region 334 of the second face 331 of the second light emitting unit 330 may include the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed on the partial region of the first face 321 and the entire region of the second face 331, and in contact with the partial region of the first face 321 and the entire region of the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed on the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, as shown in fig. 17K, the light transmitting region 333 of the first face 321 of the first light emitting unit 320 includes the entire region of the first face 321, and the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between all regions of the first face 321 and all regions of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmissive region 333 of the first face 321 and the light-transmissive region 334 of the second face 331.
In some embodiments, as shown in fig. 17L and 17M, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 coincides with the light-transmitting region 334 of the second side 331 (e.g., at least one of the position, the shape, the area, etc. is the same). In this case, the light-emitting-unit optical isolation structure 300 may be disposed between respective partial regions of the first and second faces 321 and 331 without contacting the first and second faces 321 and 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmissive region 333 of the first face 321 and the light-transmissive region 334 of the second face 331.
In some embodiments, as shown in fig. 17N, the light-transmitting region 333 of the first side 321 of the first light-emitting unit 320 includes a partial region of the first side 321, the light-transmitting region 334 of the second side 331 of the second light-emitting unit 330 includes a partial region of the second side 331, and the light-transmitting region 333 of the first side 321 is not identical to the light-transmitting region 334 of the second side 331 (e.g., at least one of a position, a shape, an area, etc. is not identical). In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the respective partial regions of the first face 321 and the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, the light-transmitting region 333 of the first face 321 of the first light-emitting unit 320 may include the entire region of the first face 321, and the light-transmitting region 334 of the second face 331 of the second light-emitting unit 330 may include a partial region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the entire area of the first face 321 and a partial area of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting areas 334 of the first face 321 and the second face 331. Alternatively, the light transmission region 333 of the first face 321 of the first light emitting unit 320 may include a partial region of the first face 321, and the light transmission region 334 of the second face 331 of the second light emitting unit 330 may include the entire region of the second face 331. In this case, the light-emitting-unit optical isolation structure 300 may be disposed between the partial region of the first face 321 and the entire region of the second face 331 without contacting the first face 321 and the second face 331, so that the light-emitting-unit optical isolation structure 300 may be disposed between the light-transmitting regions 334 of the first face 321 and the second face 331.
In some embodiments, the light transmissive regions 333, 334 of the light emitting unit 111 may be continuous regions. In this case, the light-emitting unit optical isolation structure 300 may be disposed on the continuous region with or without contact with the continuous region, so that the light-emitting unit optical isolation structure 300 may be disposed on the light transmitting regions 333, 334 of the light-emitting unit 111. Alternatively, the light transmitting regions 333, 334 of the light emitting unit 111 may be discontinuous regions. In this case, the light-emitting cell optical isolation structure 300 may be disposed at the discontinuous region, and may be in contact with or not in contact with the discontinuous region, so that the light-emitting cell optical isolation structure 300 may be disposed at the light-transmitting regions 333, 334 of the light-emitting cell 111. Alternatively, the positions, the number, and the like of the discontinuous regions for disposing the light-emitting-unit optical isolation structure 300 may be determined according to actual light transmission conditions such as process requirements, so that the light-emitting-unit optical isolation structure 300 may be disposed in the light-transmitting regions 333, 334 of the light-emitting unit 111 which are present in the discontinuous regions.
In some embodiments, the light-transmitting regions 333 and 334 of the light-emitting unit 111 may be determined according to actual light-transmitting conditions such as process requirements, and the like, and accordingly, the light-emitting unit optical isolation structure 300 is considered to be disposed between the light-transmitting regions 333 and 334 of the light-emitting unit 111 or between the light-transmitting regions 333 and 334 of two adjacent light-emitting units 111. Alternatively, the light-transmitting regions 333 and 334 may include part or all of the light-emitting units 111, may be in the form of continuous regions or discontinuous regions, and the corresponding positions, numbers, etc. may be determined according to actual light-transmitting conditions such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by the first light-emitting unit 320 and the second light-emitting unit 330 is conducted to each other).
In some embodiments, the light emitting cell optical isolation structure 300 may be in direct contact with the backlight isolation layer 120, or have a gap with the backlight isolation layer 120. Alternatively, in a region where a gap exists between the light emitting cell optical isolation structure 300 and the backlight isolation layer 120, another medium may be present or another structure may be provided. Alternatively, the light-isolating material may be partially or entirely disposed at the gap between the light-emitting unit light-isolating structure 300 and the backlight isolation layer 120.
Referring to fig. 18, in some embodiments, a light emitting unit optical isolation structure 300 may include a light emitting unit optical isolation body 301.
Referring to fig. 19, in some embodiments, a light emitting unit optical isolation body 301 may be non-conductive and include an optical isolation material 302.
Referring to fig. 20, in some embodiments, the light emitting unit optical isolation body 301 may be electrically conductive. Optionally, the light emitting unit optical isolation structure 300 may further include: the insulating structure 303 is provided between the light-emitting unit optical isolation body 301 and the light-emitting unit 111 that needs to be insulated from the light-emitting unit optical isolation body 301.
Referring to fig. 21A, 21B, 21C, in some embodiments, an insulating structure 303 may be disposed between the light-emitting unit optical isolation body 301 and at least one of the adjacent two light-emitting units 111.
In some embodiments, as shown in fig. 21A, in the case where two adjacent light emitting units 111 include a first light emitting unit 320, a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the first light emitting unit 320.
In some embodiments, as shown in fig. 21B, in the case where two adjacent light emitting units 111 include a first light emitting unit 320, a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the second light emitting unit 330.
In some embodiments, as shown in fig. 21C, in the case where two adjacent light emitting units 111 include a first light emitting unit 320 and a second light emitting unit 330, an insulating structure 303 is disposed between the light emitting unit optical isolation body 301 and the first light emitting unit 320, and an insulating structure 303 is also disposed between the light emitting unit optical isolation body 301 and the second light emitting unit 330.
In some embodiments, the position of the insulating structure 303 may be considered according to practical situations such as process requirements, as long as the light-emitting unit optical isolation body 301 can be effectively insulated from the adjacent light-emitting unit 111.
Referring to fig. 22A, 22B, 22C, 22D, 22E, in some embodiments, an insulating structure 303 may cover part or all of the light emitting unit optical isolation body 301.
In some embodiments, as shown in fig. 22A, 22B, 22C, 22D, the insulating structure 303 may cover a portion of the light emitting unit optical isolation body 301, for example: the light emitting unit optically isolates one, two, three, or more sides of the body 301.
In some embodiments, as shown in fig. 22E, the insulating structure 303 may cover the entirety of the light emitting unit optical isolation body 301.
In some embodiments, the arrangement of the insulating structure 303 (e.g., covering part or all of the light-emitting unit optical isolation body 301) can be considered according to the actual conditions such as process requirements, so long as the light-emitting unit optical isolation body 301 can be effectively insulated from the adjacent light-emitting unit 111.
In some embodiments, at least one of the light emitting unit optical isolation body 301 and the insulating structure 303 may contain an optical isolation material 302.
Referring to fig. 23A, 23B, 23C, 23D, and 23E, in some embodiments, the insulating structure 303 may contact at least one of the adjacent two light emitting cells 111. Alternatively, the insulating structure 303 may not contact the adjacent two light emitting cells 111.
In some embodiments, as shown in fig. 23A, in the case where two adjacent light emitting cells 111 include a first light emitting cell 320 and a second light emitting cell 330, the insulating structure 303 is in contact with the first light emitting cell 320 and is not in contact with the second light emitting cell 330.
In some embodiments, as shown in fig. 23B, in the case where two adjacent light emitting units 111 include a first light emitting unit 320 and a second light emitting unit 330, the insulating structure 303 is in contact with the second light emitting unit 330 and is not in contact with the first light emitting unit 320.
In some embodiments, as shown in fig. 23C, in the case where the adjacent two light emitting cells 111 include the first light emitting cell 320 and the second light emitting cell 330, the insulating structure 303 as a single body contacts both the first light emitting cell 320 and the second light emitting cell 330.
In some embodiments, as shown in fig. 23D, in the case that the two adjacent light emitting units 111 include the first light emitting unit 320 and the second light emitting unit 330, one insulating structure 303 is in contact with the first light emitting unit 320 and not in contact with the second light emitting unit 330, and the other insulating structure 303 is in contact with the second light emitting unit 330 and not in contact with the first light emitting unit 320, of the two relatively independent insulating structures 303.
In some embodiments, as shown in fig. 23E, in the case where two adjacent light emitting units 111 include the first light emitting unit 320 and the second light emitting unit 330, the insulating structure 303 is not in contact with both the first light emitting unit 320 and the second light emitting unit 330.
In some embodiments, the arrangement of the insulating structure 303 (for example, contacting at least one of the two adjacent light emitting units 111) can be considered according to the actual conditions of the process requirements, etc., as long as the light emitting unit optical isolation body 301 can be effectively insulated from the adjacent light emitting unit 111.
Referring to fig. 24A, 24B, 24C, 24D, in some embodiments, the optical isolation material 302 may include at least one of a light absorbing material 3021, a light reflecting material 3022.
In some embodiments, as shown in FIG. 24A, the optical isolation material 302 may include a light absorbing material 3021.
In some embodiments, as shown in FIG. 24B, the optical isolation material 302 may include an optical reflective material 3022.
In some embodiments, as shown in fig. 24C, 24D, the optical isolation material 302 may include a light absorbing material 3021 and a light reflecting material 3022.
In some embodiments, the optical isolation material 302 can be set according to practical situations such as process requirements, as long as the optical isolation material 302 can effectively realize optical isolation. Alternatively, in the case where the light-absorbing material 3021 and the light-reflecting material 3022 are included in the optical isolation material 302, the positions, proportions, and the like of the light-absorbing material 3021 and the light-reflecting material 3022 to be provided may be considered in accordance with practical circumstances such as process requirements.
Referring to fig. 25A, 25B, 25C, 25D, 25E, 25F, 25G, and 25H, in some embodiments, some or all of the sectional shapes of the light-emitting unit optical isolation structure 300 in the light-exiting direction Z of the light-emitting unit layer 110 include at least one of a right-angled quadrangle, a triangle, and a trapezoid.
In some embodiments, as shown in fig. 25A, the sectional shape of the light-emitting unit optical isolation structure 300 in the light-exiting direction Z of the light-emitting unit layer 110 is a rectangular quadrangle.
In some embodiments, as shown in fig. 25B, the sectional shape of the light-emitting unit optical isolation structure 300 in the light outgoing direction Z of the light-emitting unit layer 110 includes two rectangular quadrangles, and the widths of the two rectangular quadrangles in the plane direction P of the light-emitting unit layer 110 are not the same. Alternatively, a rectangular quadrangle having a relatively small width in the plane direction P of the light emitting cell layer 110 may be close to the light emitting side X of the light emitting cell layer 110, and a rectangular quadrangle having a relatively large width in the plane direction P of the light emitting cell layer 110 may be far from the light emitting side X of the light emitting cell layer 110. Alternatively, the relative positional relationship of the two rectangular parallelograms may be reversed from that shown in the figures, for example: the rectangular quadrangle having a relatively large width in the plane direction P of the light emitting cell layer 110 may be close to the light emitting side X of the light emitting cell layer 110, and the rectangular quadrangle having a relatively small width in the plane direction P of the light emitting cell layer 110 may be far from the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25C, the sectional shape of the light emitting cell optical isolation structure 300 in the light exit direction Z of the light emitting cell layer 110 is a triangle. Alternatively, one side of the triangle may be away from the light emitting side X of the light emitting cell layer 110. Alternatively, one side of the triangle may be close to the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25D, the sectional shape of the light-emitting unit optical isolation structure 300 in the light-exiting direction Z of the light-emitting unit layer 110 includes a rectangular quadrangle and a triangle. Alternatively, the rectangular quadrangle may be distant from the light emitting side X of the light emitting cell layer 110, and the triangle may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, the relative positional relationship of the rectangular quadrangle and the triangle may be reversed from that shown in the drawings, for example: the triangle may be far away from the light emitting side X of the light emitting cell layer 110, and the rectangular quadrangle may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, one side of the triangle may face the light emitting side X of the light emitting cell layer 110, or face away from the light emitting side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25E, the light emitting cell optical isolation structure 300 has a trapezoidal sectional shape along the light exit direction Z of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may be directed toward the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25F, the sectional shape of the light emitting cell optical isolation structure 300 in the light exit direction Z of the light emitting cell layer 110 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrangle may be close to the light emitting side X of the light emitting cell layer 110, and the trapezoid may be distant from the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25G, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 includes a trapezoid and a rectangular quadrangle. Alternatively, the rectangular quadrangle may be distant from the light emitting side X of the light emitting cell layer 110, and the trapezoid may be close to the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110.
In some embodiments, as shown in fig. 25H, the sectional shape of the light emitting cell optical isolation structure 300 in the light outgoing direction Z of the light emitting cell layer 110 includes a trapezoid and a triangle. Alternatively, the trapezoid may be distant from the light exit side X of the light emitting unit layer 110, and the triangle may be close to the light exit side X of the light emitting unit layer 110. Alternatively, the relative positional relationship of the trapezoid and the triangle may be reversed from that shown in the drawings, for example: the trapezoid may be close to the light emitting side X of the light emitting cell layer 110, and the triangle may be away from the light emitting side X of the light emitting cell layer 110. Alternatively, the upper base a of the trapezoid may face the light exit side X of the light emitting cell layer 110, or face away from the light exit side X of the light emitting cell layer 110. Alternatively, one side of the triangle may face the light emitting side X of the light emitting cell layer 110, or face away from the light emitting side X of the light emitting cell layer 110.
In some embodiments, the cross-sectional shape of the light-emitting unit optical isolation structure 300 along the light-emitting direction Z of the light-emitting unit layer 110 may be considered according to practical situations such as process requirements, so long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
In some embodiments, the light-emitting unit optical isolation structure 300 may include structures and materials that enable optical isolation, such as: at least one of metals such as silver and aluminum. Alternatively, the structure and material of the light-emitting unit optical isolation structure 300 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
In some embodiments, the light-emitting unit optical isolation structure 300 may also include other structures and materials capable of performing light absorption, light reflection, and the like, for example: resin compositions, titanium oxides (e.g., TiO2), and the like. Alternatively, the material for realizing light absorption may also include a Black Matrix (BM). Alternatively, the structure and material of the light-emitting unit optical isolation structure 300 may be determined according to practical situations such as process requirements, as long as the light-emitting unit optical isolation structure 300 can prevent the light emitted by two adjacent light-emitting units 111 from being conducted in an undesired direction (for example, the light emitted by two adjacent light-emitting units 111 is conducted to each other).
Referring to fig. 26, in some embodiments, the light emitting module may further include: and a light conversion layer 410 disposed on the light emitting unit layer 110. Alternatively, the light conversion layer 410 may implement color conversion of light by means of wavelength selection, for example: the light from the light emitting cell layer 110 is color-converted.
Referring to fig. 27, in some embodiments, the light conversion layer 410 may be disposed on the light emitting surface S of the light emitting unit layer 110.
In some embodiments, some or all of the plurality of light emitting cells 111 may be an unpackaged structure.
In some embodiments, portions of the plurality of light emitting cells 111 may be unpackaged structures. Alternatively, one, two, three, or more of the plurality of light emitting units 111 may be only light emitting units capable of emitting light, which are completely arranged, and have no encapsulation structure such as an encapsulation layer for encapsulating the light emitting units without encapsulation processing, for example: at least one of the plurality of light emitting cells 111 may be a light emitting cell including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed based on epitaxial growth or the like, but a package structure such as a package layer that packages the light emitting cell including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is not formed without a packaging process.
In some embodiments, all of the plurality of light emitting cells 111 may be an unpackaged structure. Alternatively, all of the plurality of light emitting units 111 may be only light emitting units capable of emitting light, which are completely arranged, and have no encapsulation structure such as an encapsulation layer encapsulating the light emitting units without encapsulation processing, for example: all of the plurality of light emitting cells 111 may be light emitting cells including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed on the basis of epitaxial growth or the like, but without a packaging process, a packaging structure such as a packaging layer that packages the light emitting cells including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is not formed.
In some embodiments, some or all of the plurality of light emitting cells 111 may be an encapsulation structure. Alternatively, one, two, three or more of the plurality of light emitting units 111 may not only be the light emitting units capable of emitting light, but also be packaged to form a package structure such as a package layer for packaging the light emitting units, for example: at least one of the light emitting units 111 may be a light emitting unit including a first semiconductor layer, an active layer, and a second semiconductor layer (or may further include an electrode) formed by epitaxial growth or the like, and a package structure such as a package layer that packages the light emitting unit including the first semiconductor layer, the active layer, and the second semiconductor layer (or may further include an electrode) is formed through a packaging process.
In the case where part or all of the plurality of light emitting units 111 are package structures, the package structure in which one or more light emitting units 111 are packaged may be considered as one light emitting unit 111 as a whole, for example: one package structure includes one light emitting unit 111, and the package structure including the one light emitting unit 111 can be regarded as one light emitting unit 111; for another example: three light emitting units 111 are included in one package structure, and the package structure including the three light emitting units 111 can be regarded as one light emitting unit 111.
In some embodiments, some or all of the plurality of light emitting units 111 may be configured as an unpackaged structure according to practical situations such as process requirements, or some or all of the plurality of light emitting units 111 may be configured as an encapsulated structure according to practical situations such as process requirements, as long as the light emitting unit optical isolation structure 300 can prevent light emitted by two adjacent light emitting units 111 from being conducted in an undesired direction (for example, light emitted by two adjacent light emitting units 111 is conducted to each other).
In some embodiments, the plurality of light emitting units 111 may include: at least one of LED, Mini LED and Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED. Alternatively, the plurality of light emitting units 111 may include at least one Mini LED. Alternatively, the plurality of light emitting units 111 may include at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, and at least one Mini LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one Mini LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include at least one LED, at least one Mini LED, and at least one Micro LED. Alternatively, the plurality of light emitting units 111 may include other light emitting devices other than LEDs, Mini LEDs, Micro LEDs.
In some embodiments, the device type of the light emitting unit 111 may be determined according to practical situations such as process requirements, for example: LED, Mini LED, Micro LED or other light emitting device.
Referring to fig. 28, a display module 700 provided by the embodiment of the disclosure includes the light emitting module 100. In some embodiments, the display module 700 may support 3D display.
Referring to fig. 29, a display screen 800 provided by the embodiment of the disclosure includes the display module 700 described above. In some embodiments, display screen 800 may perform a 3D display.
Referring to fig. 30, a display 900 provided by the embodiment of the present disclosure includes the display screen 800 described above. In some embodiments, display 900 may perform 3D display. In some embodiments, the display 900 may also include other components for supporting the normal operation of the display 900, such as: at least one of a communication interface, a frame, a control circuit, and the like.
The light-emitting module, the display screen and the display provided by the embodiment of the disclosure have the advantages that through the backlight isolation layer arranged on the backlight surface of the light-emitting unit layer and the light-emitting unit optical isolation structure arranged between the adjacent two light-emitting units in the part or the whole part of the plurality of light-emitting units, the light emitted by the light-emitting units is prevented from being conducted to an undesirable direction as much as possible, the display effect is improved, and the possibility of improving the light utilization rate is further provided.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It is clear to those skilled in the art that, for convenience and brevity of description, the working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit may be merely a division of a logical function, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In the drawings, the width, length, thickness, etc. of structures such as elements or layers may be exaggerated for clarity and descriptive purposes. When an element or layer is referred to as being "disposed on" (or "mounted on," "laid on," "attached to," "coated on," or the like) another element or layer, the element or layer may be directly "disposed on" or "over" the other element or layer, or intervening elements or layers may be present, or even partially embedded in the other element or layer.