CN113690621B - Miniaturized high efficiency bluetooth antenna based on multilayer PCB board - Google Patents
Miniaturized high efficiency bluetooth antenna based on multilayer PCB board Download PDFInfo
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- CN113690621B CN113690621B CN202111005749.1A CN202111005749A CN113690621B CN 113690621 B CN113690621 B CN 113690621B CN 202111005749 A CN202111005749 A CN 202111005749A CN 113690621 B CN113690621 B CN 113690621B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/10—Resonant antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The invention discloses a miniaturized high-efficiency Bluetooth antenna based on a multilayer PCB. The invention comprises n antenna units which are vertically stacked, a bottom radiation patch printed on the lower surface of the last antenna unit, and 4 feed electrodes respectively printed on the two ends of the upper surface and the lower surface of the antenna unit; and a matching circuit is built around the antenna by adopting inductance and capacitance with proper values, so that the antenna with small size can generate proper resonance, the size and the weight of the whole structure are effectively reduced while the performance of the antenna is ensured, meanwhile, a unique resonance structure is adopted, the effective path of current is increased, the bandwidth is widened, and the transmission and the coupling of signals are completed. The antenna thus achieves a compact, efficient and low cost design.
Description
Technical Field
The invention belongs to the technical field of radio frequency/microwave/communication, and particularly relates to an antenna designed by utilizing a PCB (printed circuit board), in particular to a miniaturized high-efficiency Bluetooth antenna based on a multilayer PCB.
Background
Bluetooth is a radio technology supporting short-range communication (typically within 10 m) of devices, enabling wireless information exchange between numerous devices including mobile phones, wireless headsets, notebook computers, etc. By using the Bluetooth technology, the communication between mobile communication terminal devices can be effectively simplified, so that the data transmission becomes quicker and more efficient, and the road is widened for wireless communication. However, since the technology cannot integrate the antenna into the chip, the antenna is another critical component affecting the transmission characteristics of the bluetooth module except for the core system chip in the bluetooth module. At present, most Bluetooth antennas based on PCB are not small enough in size, have too low gain and are not far away in transmission distance. Due to these factors, miniaturized bluetooth antennas have certain advantages. Meanwhile, the processing cost of part of the antennas is high, such as LTCC structures, dielectric antennas and the like. The proper antenna is selected to be beneficial to matching the appearance of the product and improving the transmission characteristic of the Bluetooth module, and the cost of the whole Bluetooth module can be further reduced.
Disclosure of Invention
The invention aims to solve the problems of higher processing cost and miniaturization of the traditional Bluetooth antenna, and provides a miniaturized high-efficiency Bluetooth antenna based on a multilayer PCB. The gain of the antenna is higher than that of a common Bluetooth antenna, and the overall structure size is 3.2mm 1.6mm 1mm, so that the antenna is light in weight, low in cost and easy to integrate.
The technical scheme adopted by the invention is as follows:
a miniaturized high efficiency bluetooth antenna based on a multi-layer PCB board, the antenna comprising:
n antenna units stacked up and down, wherein n is more than or equal to 1;
A bottom radiation patch printed on a lower surface of the last antenna unit;
4 feed electrodes (1-1), (1-2), (1-3) and (1-4) respectively printed on both ends of the upper and lower surfaces of the antenna unit;
wherein the antenna unit includes:
A first dielectric substrate (2-1);
the second dielectric substrate (2-2) is positioned below the first dielectric substrate (2-1);
a plurality of first metallized vias and a second metal via (3-9) extending through the first dielectric substrate (2-1) and the second dielectric substrate (2-2);
a top radiation patch printed on the upper surface of the first dielectric substrate (2-1);
The middle layer radiation patch is printed at the middle position of the first medium substrate (2-1) and the second medium substrate (2-2);
The top layer radiation patch comprises a plurality of top layer radiation branches, and the middle layer radiation patch comprises a plurality of middle layer radiation branches; each top layer radiation branch is connected with each middle layer radiation branch through a plurality of first metallized through holes and one second metal through hole (3-9) to form two annular (LOOP) structures with similar resonant frequencies;
Preferably, the top layer radiation patch comprises a first top layer radiation branch (5-1), a second top layer radiation branch (5-2), a third top layer radiation branch (5-3), a fourth top layer radiation branch (5-4), a fifth top layer radiation branch (5-5) and a sixth top layer radiation branch (5-6); one end of the first top layer radiation branch (5-1) and one end of the second top layer radiation branch (5-2) are contacted with the feed electrode (1-1), one end of the fifth top layer radiation branch (5-5) and one end of the sixth top layer radiation branch (5-6) are contacted with the feed electrode (1-3);
The intermediate layer radiation patch comprises a first intermediate layer folding radiation branch, a second intermediate layer folding radiation branch, a fourth intermediate layer radiation branch (6-4) and a fifth intermediate layer radiation branch (6-5); the first intermediate layer folding radiation branch is of an integrated structure and comprises a first intermediate layer radiation branch (6-1), a second intermediate layer radiation branch (6-2) and a third intermediate layer radiation branch (6-3); the second intermediate layer folding radiation branch is of an integrated structure and comprises a sixth intermediate layer radiation branch (6-6), a seventh intermediate layer radiation branch (6-7) and an eighth intermediate layer radiation branch (6-8);
Two LOOP-Like (LOOP) structures with similar resonant frequencies are specifically:
The first method comprises the steps that an eighth intermediate layer radiation branch (6-8) passes through a seventh intermediate layer radiation branch (6-7) and passes through Kong Jiedi four top layer radiation branches (5-4) through a first metallization, the output end of the fourth top layer radiation branch (5-4) passes through Kong Jiedi three intermediate layer radiation branches (6-3) through the first metallization, the third intermediate layer radiation branch (6-3) passes through the first intermediate layer radiation branch (6-1), the second intermediate layer radiation branch (6-2) passes through Kong Jiedi three top layer radiation branches (5-3) through the first metallization, the third top layer radiation branch (5-3) passes through Kong Jiedi six intermediate layer radiation branches (6-6) through the first metallization, and the sixth intermediate layer radiation branch (6-6) is coupled to a feed electrode (1-3) through a second metal via hole (3-9) through the eighth intermediate layer radiation branch (6-8);
Secondly, a sixth top layer radiation branch (5-6) passes through Kong Jiedi five middle layer radiation branches (6-5) through first metallization, a fifth middle layer radiation branch (6-5) passes through Kong Jiedi two top layer radiation branches (5-2) through first metallization, a second top layer radiation branch (5-2) is connected with the first top layer radiation branch (5-1) through a feed electrode (1-1), the first top layer radiation branch (5-1) passes through Kong Jiedi four middle layer radiation branches (6-4) through first metallization, a fourth middle layer radiation branch (6-4) passes through Kong Jiedi five top layer radiation branches (5-5) through first metallization, and the fifth top layer radiation branch (5-5) is coupled to the feed electrode (1-3);
the resonance frequency points of the two LOOP structures are adjacent, so that the resonance bandwidth is widened;
The bottom radiation patch is of an axisymmetric structure and comprises a first radiation patch (4-1), a first strip patch (4-2), a second radiation patch (4-3), a second strip patch (4-4) and a third radiation patch (4-5) which are sequentially cascaded; the first radiation patch (4-1) is connected with the second radiation patch (4-3) through the first strip patch (4-2), and the second radiation patch (4-3) is connected with the third radiation patch (4-5) through the second strip patch (4-4); the first radiation patch (4-1) and the third radiation patch (4-5) are respectively contacted with the feed electrodes (1-2) and (1-4). The third radiating patch (4-5) is coupled to the eighth intermediate layer radiating stub (6-8) via a second metal via (3-9). The input signals are coupled to the radiation patches on the upper surface and the lower surface of the dielectric substrate (2_1), so that the effective path of current is increased, and the radiation gain of the antenna is improved;
preferably, the second radiation patch (4-3) is provided with a groove in the side edge of the rectangular patch so as to realize the adjustment of impedance, the size of the groove is related to the impedance, and the larger the groove is, the smaller the impedance is;
Preferably, gaps are reserved among the first top layer radiation branches (5-1), the second top layer radiation branches (5-2), the third top layer radiation branches (5-3), the fourth top layer radiation branches (5-4), the fifth top layer radiation branches (5-5) and the sixth top layer radiation branches (5-6); more preferably, the distance between the adjacent top layer radiation branches is equal to the width of the top layer radiation branches;
Preferably, gaps are reserved among the second intermediate layer radiation branch (6-2), the third intermediate layer radiation branch (6-3), the fourth intermediate layer radiation branch (6-4), the fifth intermediate layer radiation branch (6-5), the sixth intermediate layer radiation branch (6-6) and the seventh intermediate layer radiation branch (6-7); more preferably, the distance between adjacent intermediate layer radiation branches is equal to the width of the intermediate layer radiation branches;
preferably, the width of all radiation branches is the same;
Preferably, the diameter of the first metallized via is equal to the width of the radiating patch;
the feed electrode (1-2) is used as an input end of the integral structure, and a matching circuit built by a capacitor inductor is connected to the outside of the feed electrode, so that signals are input and coupled to other structures;
preferably, the planar structure antenna is not limited to the above regular shape structure, but may be various conformal structures such as a circular shape, an elliptical shape, or an irregular shape;
The antenna based on the PCB structure is provided with a matching circuit built by an inductance capacitor at the periphery thereof, and the feeding mode is not limited to coaxial feeding, but also comprises microstrip feeding, slot coupling feeding and coplanar waveguide feeding.
The beneficial effects of the invention are as follows:
1. the invention adopts the PCB with a planar structure to manufacture the antenna, thereby realizing the low profile characteristic of the antenna.
2. The invention adopts a multi-layer PCB structure, prolongs the effective path of current, and adopts an irregular gradual change pattern to design the radiation patch on the lower surface of the second dielectric substrate, so that the impedance matching performance is better, and the radiation efficiency is higher.
3. The invention adopts the metallized via holes to connect the multi-layer PCB structure, the antenna unit not only enables the input signal to be coupled to the upper layer structure through the metallized via holes, but also enables the radiation patches of the upper two-layer PCB to form a loop, thereby generating two resonance points, and the radiation patches of the upper two-layer PCB adopt a double resonance structure, and have two similar resonance points, thereby widening the bandwidth.
4. The invention has the advantages that the impedance matching performance of the antenna under the condition of small size is better, the matching circuit built by the capacitor and the inductor is added at the periphery of the antenna, and the performance of the antenna is improved.
5. The antenna of the invention has small volume, light weight and overall size of about 3.2mm 1.6mm 1mm, and has low cost and is convenient for mass production.
Drawings
Fig. 1 is a schematic diagram of the overall structure of an antenna;
Fig. 2 (a) is a schematic diagram of a radiation patch structure on the lower surface of the second dielectric substrate (2-2);
fig. 2 (b) is a schematic diagram of a radiation patch structure of the upper and lower surfaces of the first dielectric substrate (2-1);
FIG. 3 is a graph showing the test results of the S-parameters of the antenna shown in FIG. 1;
FIG. 4 is a graph showing the radiation pattern of the H-plane of the antenna shown in FIG. 1;
FIG. 5 is a graph corresponding to the E-plane radiation pattern of the antenna of FIG. 1;
FIG. 6 (a) is a graph of gain corresponding to the antenna of FIG. 1 in the 2.0-3.0GHz band;
FIG. 6 (b) is a graph of gain corresponding to the antenna of FIG. 1 in the 5.0-6.0GHz band;
The marks in the figure: the feed electrode A1-1, the feed electrode B1-2, the feed electrode C1-3, the feed electrode D1-4, the first dielectric substrate 2-1, the second dielectric substrate 2-2, the first metal via A3-1, the first metal via B3-2, the first metal via C3-3, the first metal via D3-4, the first metal via E3-5, the first metal via F3-6, the first metal via G3-7, the first metal via H3-8, the second metal via 3-9, the first radiation patch 4-1, the first strip patch 4-2, the second radiation patch 4-3, the second strip patch 4-4, the third radiation patch 4-5, the first top layer radiation branch 5-1, the second top layer radiation branch 5-2, the third top layer radiation branch 5-3, the fourth top layer radiation branch 5-4, the fifth top layer radiation intermediate layer 5-5, the sixth top layer 6, the third top layer radiation intermediate layer 6-6, the fourth top layer 6-6, the seventh radiation intermediate layer 6-6, the third top layer 6-6, the seventh radiation intermediate layer 6-6, the third top layer 6-6 and the seventh radiation intermediate layer 6-6.
Detailed Description
In order to more clearly illustrate the problems, technical solutions and advantages that the present invention solves, the following description of the specific embodiments of the present invention is provided for the purpose of illustrating and explaining the present invention, and the preferred embodiments are not limited to the present invention, but are intended to be within the scope of the present invention as modified, equivalent replaced and improved within the spirit and principle of the present invention.
As shown in fig. 1, 2 (a) and 2 (B), a miniaturized high-efficiency bluetooth antenna based on a multi-layer PCB board comprises an antenna unit, a bottom radiation patch printed on the lower surface of the antenna unit, feeding electrodes A1-1, feeding electrodes B1-2, feeding electrodes C1-3 and feeding electrodes D1-4 printed on both ends of the upper and lower surfaces of the antenna unit; the antenna unit comprises a first dielectric substrate 2-1 and a second dielectric substrate 2-2 which are stacked up and down, a top layer radiation patch printed on the upper surface of the first dielectric substrate 2-1, an intermediate layer radiation patch printed in the middle of the first dielectric substrate 2-1 and the second dielectric substrate 2-2, and a first metal via A3-1, a first metal via B3-2, a first metal via C3-3, a first metal via D3-4, a first metal via E3-5, a first metal via F3-6, a first metal via G3-7, a first metal via H3-8 and a second metal via 3-9 which penetrate through the first dielectric substrate 2-1 and the second dielectric substrate 2-2;
The first medium substrate 2-1 and the second medium substrate 2-2 are made of common FR4 boards;
The upper surface of the first medium substrate 2-1 is printed with a top layer radiation patch (a first top layer radiation branch 5-1, a second top layer radiation branch 5-2, a third top layer radiation branch 5-3, a fourth top layer radiation branch 5-4, a fifth top layer radiation branch 5-5 and a sixth top layer radiation branch 5-6), the left and right sides of the first medium substrate are printed with a feed electrode A1-1 and a feed electrode C1-3, the lower surface is printed with an intermediate layer radiation patch (a first intermediate layer radiation branch 6-1, a second intermediate layer radiation branch 6-2, a third intermediate layer radiation branch 6-3, a fourth intermediate layer radiation branch 6-4, a fifth intermediate layer radiation branch 6-5, a sixth intermediate layer radiation branch 6-6, a seventh intermediate layer radiation branch 6-7 and an eighth intermediate layer radiation branch 6-8), and two resonant circuits are formed by connecting the first intermediate layer radiation patch, the first intermediate layer radiation branch 6-3, the first intermediate layer radiation patch, the first intermediate layer 3-4, the first intermediate layer radiation patch, the first intermediate layer 3-5, the first intermediate layer radiation patch 3-7 and the first intermediate layer 7, and the second intermediate layer 7 are connected by the first metal via A3-2; the lower surface of the second dielectric substrate 2-2 is printed with a first radiation patch 4-1, a first strip patch 4-2, a second radiation patch 4-3, a second strip patch 4-4 and a third radiation patch 4-5, the left and right sides of the second dielectric substrate 2-2 are printed with a feed electrode B1-2 and a feed electrode D1-4, and the second dielectric substrate 2-2 is connected with a fifth top layer radiation branch 5-5, a sixth top layer radiation branch 5-6 and an eighth middle layer radiation branch 6-8 on the surface of the first dielectric substrate 2-1 through a second metal via hole 3-9, and input signals are coupled to other radiation patches, so that resonance of a corresponding frequency band is generated;
The feed electrode C1-3 and the feed electrode D1-4 are conducted through the second metal via hole 3-9, so that signal coupling is realized;
the eighth intermediate layer radiation branch 6-8 passes through the seventh intermediate layer radiation branch 6-7 and passes through Kong Jiedi-4 of four top layer radiation branches through the first metallization, the output end of the fourth top layer radiation branch 5-4 passes through 6-3 of Kong Jiedi three intermediate layer radiation branches through the first metallization, the third intermediate layer radiation branch 6-3 passes through 6-1 of the first intermediate layer radiation branch, the second intermediate layer radiation branch 6-2 passes through 5-3 of the third top layer radiation branch through the first metallization and passes through 5-3 of the Kong Jiedi three top layer radiation branch, the third top layer radiation branch 5-3 passes through 6-6 of Kong Jiedi six intermediate layer radiation branches through the first metallization, and the sixth intermediate layer radiation branch 6-6 is coupled to the feed electrode 1-3 through 6-8 of the eighth intermediate layer radiation branch through 3-9 of the second metal via; the sixth top layer radiating branch 5-6 is metallized through Kong Jiedi five intermediate layer radiating branches 6-5 by a first, the fifth intermediate layer radiating branch 6-5 is metallized through Kong Jiedi two top layer radiating branches 5-2 by the first, the second top layer radiating branch 5-2 is connected with the first top layer radiating branch 5-1 by a feed electrode 1-1, the first top layer radiating branch 5-1 is metallized through Kong Jiedi four intermediate layer radiating branches 6-4 by the first, the fourth intermediate layer radiating branch 6-4 is metallized through Kong Jiedi five top layer radiating branches 5-5 by the first, and the fifth top layer radiating branch 5-5 is coupled to the feed electrode 1-3; the whole structure forms two annular LOOP structures with similar resonant frequencies;
one end of the first intermediate layer radiation branch 6-1 is connected with one end of the second intermediate layer radiation branch 6-2 and one end of the third intermediate layer radiation branch 6-3, and one end of the eighth intermediate layer radiation patch 6-8 is connected with one end of the sixth intermediate layer radiation patch 6-6 and one end of the seventh intermediate layer radiation patch 6-7;
The first radiation patch 4-1, the first strip patch 4-2, the second radiation patch 4-3, the second strip patch 4-4 and the third radiation patch 4-5 are positioned on the lower surface of the second dielectric substrate 2-2, wherein one end of the first radiation patch 4-1 is contacted with the feed electrode B1-2, and the other end is connected with the first strip patch 4-2; while the other end of the first strip patch 4-2 is connected to the second radiation patch 4-3; while the other end of the second radiation patch 4-3 is connected with the second strip-shaped patch 4-4; while the other end of the second strip patch 4-4 is connected to a third radiation patch 4-5; the other end of the third radiation patch 4-5 is in contact with the feed electrode D1-4, and meanwhile, the third radiation patch 4-5 is also connected with the eighth intermediate layer radiation branch 6-8 and the feed electrode C-3 through the second metal via hole 3-9, so that an input signal is coupled to two layers of radiation patches on the upper surface and the lower surface of the first dielectric substrate 2-1, the effective path of current is increased, and the radiation gain of the antenna is improved;
as shown in fig. 3, the antenna of this embodiment has two resonance points, one is 2.45GHz and the other is 5.5GHz. The invention is an antenna working in dual frequency bands, the standing wave ratio is smaller than 1.5, and the impedance matching is good.
As shown in fig. 4, the test result of the typical radiation pattern of the working frequency band of the antenna shows that the antenna has good omni-directional characteristic and can meet the communication requirement of Bluetooth.
As shown in FIG. 5, according to the typical radiation pattern test result of the working frequency band of the antenna, the E face can see that the direction of the antenna is not greatly distorted, and the communication requirement of Bluetooth can be met.
As shown in fig. 6, the gain curve of the working frequency band of the antenna can be seen from the result that the gain of the antenna is close to 2dB in the 2.4GHz frequency band, and the gain is higher compared with that of the partial PCB board bluetooth antenna.
The above embodiments are not intended to limit the present invention, and the present invention is not limited to the above embodiments, and falls within the scope of the present invention as long as the present invention meets the requirements.
Claims (7)
1. Miniaturized high efficiency bluetooth antenna based on multilayer PCB board, its characterized in that, the antenna includes:
n antenna units stacked up and down, wherein n is more than or equal to 1;
A bottom radiation patch printed on a lower surface of the last antenna unit;
4 feed electrodes (1-1), (1-2), (1-3) and (1-4) respectively printed on both ends of the upper and lower surfaces of the antenna unit;
wherein the antenna unit includes:
A first dielectric substrate (2-1);
The second dielectric substrate (2-2) is positioned below the first dielectric substrate (2-1);
A plurality of first metallized vias and a second metal via (3-9) extending through the first dielectric substrate (2-1) and the second dielectric substrate (2-2);
a top radiation patch printed on the upper surface of the first dielectric substrate (2-1);
The middle layer radiation patch is printed at the middle position of the first medium substrate (2-1) and the second medium substrate (2-2);
The top layer radiation patch comprises a first top layer radiation branch (5-1), a second top layer radiation branch (5-2), a third top layer radiation branch (5-3), a fourth top layer radiation branch (5-4), a fifth top layer radiation branch (5-5) and a sixth top layer radiation branch (5-6); one end of the first top layer radiation branch (5-1) and one end of the second top layer radiation branch (5-2) are contacted with the feed electrode (1-1), one end of the fifth top layer radiation branch (5-5) and one end of the sixth top layer radiation branch (5-6) are contacted with the feed electrode (1-3); the middle layer radiation patch comprises a first middle layer folding radiation branch, a second middle layer folding radiation branch, a fourth middle layer radiation branch (6-4) and a fifth middle layer radiation branch (6-5); the first intermediate layer folding radiation branch is of an integrated structure and comprises a first intermediate layer radiation branch (6-1), a second intermediate layer radiation branch (6-2) and a third intermediate layer radiation branch (6-3); the second intermediate layer folding radiation branch is of an integrated structure and comprises a sixth intermediate layer radiation branch (6-6), a seventh intermediate layer radiation branch (6-7) and an eighth intermediate layer radiation branch (6-8); each top layer radiation branch is connected with each middle layer radiation branch through a plurality of first metallized through holes and one second metal through hole (3-9) to form two annular LOOP structures with similar resonant frequencies;
the two annular LOOP structures with similar resonant frequencies are specifically:
The first method comprises the steps that an eighth intermediate layer radiation branch (6-8) passes through a seventh intermediate layer radiation branch (6-7) and passes through Kong Jiedi four top layer radiation branches (5-4) through a first metallization, the output end of the fourth top layer radiation branch (5-4) passes through Kong Jiedi three intermediate layer radiation branches (6-3) through the first metallization, the third intermediate layer radiation branch (6-3) passes through the first intermediate layer radiation branch (6-1), the second intermediate layer radiation branch (6-2) passes through Kong Jiedi three top layer radiation branches (5-3) through the first metallization, the third top layer radiation branch (5-3) passes through Kong Jiedi six intermediate layer radiation branches (6-6) through the first metallization, and the sixth intermediate layer radiation branch (6-6) is coupled to a feed electrode (1-3) through a second metal via hole (3-9) through the eighth intermediate layer radiation branch (6-8);
Secondly, a sixth top layer radiation branch (5-6) passes through Kong Jiedi five middle layer radiation branches (6-5) through first metallization, a fifth middle layer radiation branch (6-5) passes through Kong Jiedi two top layer radiation branches (5-2) through first metallization, a second top layer radiation branch (5-2) is connected with the first top layer radiation branch (5-1) through a feed electrode (1-1), the first top layer radiation branch (5-1) passes through Kong Jiedi four middle layer radiation branches (6-4) through first metallization, a fourth middle layer radiation branch (6-4) passes through Kong Jiedi five top layer radiation branches (5-5) through first metallization, and the fifth top layer radiation branch (5-5) is coupled to the feed electrode (1-3).
2. The miniaturized high-efficiency Bluetooth antenna based on the multilayer PCB as set forth in claim 1, wherein the bottom radiation patch has an axisymmetric structure and comprises a first radiation patch (4-1), a first strip patch (4-2), a second radiation patch (4-3), a second strip patch (4-4) and a third radiation patch (4-5) which are sequentially cascaded; the first radiation patch (4-1) is connected with the second radiation patch (4-3) through the first strip patch (4-2), and the second radiation patch (4-3) is connected with the third radiation patch (4-5) through the second strip patch (4-4); the first radiation patch (4-1) and the third radiation patch (4-5) are respectively contacted with the feed electrodes (1-2) and (1-4); the third radiating patch (4-5) is coupled to the eighth intermediate layer radiating stub (6-8) via a second metal via (3-9).
3. A miniaturized high efficiency bluetooth antenna based on a multi-layer PCB according to claim 2, wherein the second radiating patch (4-3) is a rectangular patch with slots in the sides for impedance adjustment.
4. The miniaturized high-efficiency bluetooth antenna based on a multi-layer PCB according to claim 1, wherein a gap is left between a first top layer radiating stub (5-1), a second top layer radiating stub (5-2), a third top layer radiating stub (5-3), a fourth top layer radiating stub (5-4), a fifth top layer radiating stub (5-5), and a sixth top layer radiating stub (5-6); a gap is reserved among the second intermediate layer radiation branch (6-2), the third intermediate layer radiation branch (6-3), the fourth intermediate layer radiation branch (6-4), the fifth intermediate layer radiation branch (6-5), the sixth intermediate layer radiation branch (6-6) and the seventh intermediate layer radiation branch (6-7).
5. A miniaturized high-efficiency bluetooth antenna based on a multilayer PCB according to claim 1, characterized in that the feeding electrode (1-2) is used as input terminal, and the matching circuit built by capacitor and inductor is connected on the outside thereof, so as to input and couple the signal to the rest of the structure.
6. A miniaturized high efficiency bluetooth antenna based on a multi-layer PCB as set forth in claim 1, wherein the antenna planar structure is circular, elliptical or irregular.
7. A miniaturized high efficiency bluetooth antenna based on a multi-layer PCB according to claim 6 wherein the antenna feed comprises, but is not limited to, coaxial feed, microstrip feed, slot coupled feed or coplanar waveguide feed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111005749.1A CN113690621B (en) | 2021-08-30 | 2021-08-30 | Miniaturized high efficiency bluetooth antenna based on multilayer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111005749.1A CN113690621B (en) | 2021-08-30 | 2021-08-30 | Miniaturized high efficiency bluetooth antenna based on multilayer PCB board |
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