CN113690157B - Baffle control method and control system for wafer processing unit - Google Patents
Baffle control method and control system for wafer processing unit Download PDFInfo
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- CN113690157B CN113690157B CN202010420087.3A CN202010420087A CN113690157B CN 113690157 B CN113690157 B CN 113690157B CN 202010420087 A CN202010420087 A CN 202010420087A CN 113690157 B CN113690157 B CN 113690157B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a baffle control method and a control system for a wafer processing unit, wherein the method comprises the following steps: judging whether a wafer exists on a robot for transferring the wafer; if yes, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the first unit; if not, judging whether a second unit with a wafer exists currently, and if so, moving the robot to the front of the second unit; and controlling the first unit or the second unit to open a baffle. According to the method, the current state of the robot arm is judged, the unit for processing the wafer in the next step is further determined, and the opening or closing of the corresponding baffle plate is controlled, so that the opening and closing of the baffle plate can be more accurate, and the process of processing and the quality of products can be guaranteed.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a baffle control method and a baffle control system for a wafer processing unit.
Background
Wafers refer to substrates (also called substrates) for manufacturing semiconductor transistors or integrated circuits, and are referred to as wafers because they are crystalline materials and are circular in shape, and are typically silicon, germanium, gaAs, inP, gaN, etc., where silicon is most commonly used, and if crystalline materials are not specifically identified, silicon wafers are commonly referred to, on which various circuit element structures can be fabricated and formed into integrated circuit products having specific electrical functions.
In processing a wafer by a wafer stage, it is generally necessary to move the wafer to each processing unit such as a hot plate unit, a coating unit, etc. by a robot or the like for processing. Some of these units require a stable temperature (e.g., a hot plate unit), some require contamination prevention (e.g., a spin unit), and all require a shutter to be installed, the hot plate unit opens the shutter only when transferring wafers, and the spin unit closes the shutter only when processing wafers. In the prior art, the opening and closing of each unit baffle cannot be accurately and effectively controlled, and the processing process of the wafer and the quality of the wafer are affected.
Disclosure of Invention
The invention aims to provide a baffle control method and a control system for a wafer processing unit, which are capable of enabling the opening and closing of a baffle to be more accurate by judging the current state of a robot arm so as to further determine the unit for processing a wafer in the next step and controlling the opening or closing of the corresponding baffle, thereby being beneficial to ensuring the processing progress and the product quality.
The technical scheme provided by the invention is as follows:
the invention provides a baffle control method for a wafer processing unit, which comprises the following steps:
judging whether a wafer exists on a robot for transferring the wafer;
if yes, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the first unit; if not, judging whether a second unit with a wafer exists currently, and if so, moving the robot to the front of the second unit;
and controlling the first unit or the second unit to open a baffle.
Judging whether a wafer exists on a robot for transferring the wafer or not, if so, indicating that the robot is transferring the wafer at the moment, and accurately controlling the first unit to open a baffle by moving the robot to the first unit for processing the wafer at the next step; if the wafer does not exist on the robot, the wafer is in processing, and the second unit can be accurately controlled to open the baffle by moving the robot to the front of the second unit where the wafer exists currently, so that the baffle is more accurately opened and closed, and the process of processing and the quality of products are guaranteed.
Further, after controlling the first unit or the second unit to open the shutter, the method further comprises the steps of:
the robot adds wafers from the first unit or removes wafers from the second unit;
and controlling the first unit or the second unit to close the baffle.
Further, before the robot adds a wafer from the first unit or removes a wafer from the second unit, the method further includes the steps of:
judging whether the baffle is opened or not, if so, adding a wafer from the first unit by the robot or removing the wafer from the second unit by the robot; if not, repeatedly judging whether the baffle is opened or not.
By judging whether the baffle is opened before adding the wafer from the first unit or removing the wafer from the second unit, the baffle is prevented from being opened due to control errors and the like, and the processing progress of the wafer is prevented from being influenced.
Further, before controlling the first unit or the second unit to open the shutter, the method further comprises the steps of:
judging whether the local machine of the first unit or the second unit is in a standby state;
if yes, controlling the first unit or the second unit to open a baffle; if not, repeatedly judging whether the first unit or the second unit is in a standby state.
By judging whether the first unit or the second unit is in a standby state or not before controlling the first unit or the second unit to open the baffle, the wafer can be ensured to be processed in the first unit or the second unit, the next operation can be performed, and the influence on the processing of the wafer is avoided.
Further, when the determining whether the second unit with the wafer exists currently, the method further includes the steps of:
if not, repeatedly judging whether the wafer exists on the robot for transferring the wafer.
The invention also provides a baffle control system for the wafer processing unit, which is based on the baffle control method for the wafer processing unit and comprises the following steps:
the first judging module is used for judging whether a wafer exists on the robot or not;
the second judging module is used for judging whether a second unit with a wafer exists currently or not when the first judging module judges that the wafer does not exist on the robot;
the driving module is used for driving the robot to move to the front of the local of the first unit for processing the wafer in the next step when the first judging module judges that the wafer exists on the robot, or driving the robot to move to the front of the local of the second unit when the first judging module judges that the wafer does not exist on the robot and the second judging module judges that the second unit with the wafer exists currently;
and the baffle opening module is used for controlling the first unit or the second unit to open the baffle.
Further, the method further comprises the following steps:
an operation module for controlling the robot to add wafers from the first unit or to remove wafers from the second unit;
and the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
Further, the method further comprises the following steps:
a third judging module for judging whether the baffle is opened before the operating module controls the robot to add the wafer from the first unit or controls the robot to remove the wafer from the second unit,
and if the judgment is negative, the third judgment module repeatedly judges whether the baffle is opened or not.
Further, the method further comprises the following steps:
a fourth judging module for judging whether the first unit or the second unit is in a standby state or not before the baffle opening module controls the first unit or the second unit to open the baffle,
and if the judgment is negative, the fourth judgment module repeatedly judges whether the first unit or the second unit is in a standby state.
Further, when the second judging module judges that the second unit with the wafer does not exist currently, the first judging module repeatedly judges whether the wafer exists on the robot or not.
According to the baffle control method and the baffle control system for the wafer processing unit, whether the wafer exists on the robot for transferring the wafer or not is judged, if so, the fact that the robot is transferring the wafer at the moment is indicated, and the baffle can be accurately controlled to be opened by the first unit by moving the robot to the front of the first unit for processing the wafer at the next step; if the wafer does not exist on the robot, the wafer is in processing, and the second unit can be accurately controlled to open the baffle by moving the robot to the front of the second unit where the wafer exists currently, so that the baffle is more accurately opened and closed, and the process of processing and the quality of products are guaranteed.
Drawings
The above features, technical features, advantages and implementation modes of the present invention will be further described in the following description of preferred embodiments with reference to the accompanying drawings in a clear and understandable manner.
FIG. 1 is a schematic overall flow diagram of an embodiment of the present invention;
FIG. 2 is a flow chart of a baffle control method for a wafer processing unit according to an embodiment of the present invention;
fig. 3 is a schematic flow chart between a and B in fig. 2.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will explain the specific embodiments of the present invention with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
For the sake of simplicity of the drawing, the parts relevant to the present invention are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.
Example 1
In one embodiment of the present invention, as shown in fig. 1, the present invention provides a baffle control method for a wafer processing unit, comprising the steps of:
s1, judging whether a wafer exists on a robot for transferring the wafer.
S2, if yes, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the first unit; if not, judging whether a second unit with a wafer exists currently, and if so, moving the robot to the front of the second unit.
S3, controlling the first unit or the second unit to open the baffle.
Further, after controlling the first unit or the second unit to open the shutter, the method further comprises the steps of:
s4, adding the wafer from the first unit by the robot or removing the wafer from the second unit by the robot.
S5, controlling the first unit or the second unit to close the baffle.
Further, when judging whether the second unit with the wafer exists currently, the method further comprises the steps of:
if not, repeatedly judging whether the wafer exists on the robot for transferring the wafer.
Judging whether a wafer exists on a robot for transferring the wafer or not, if so, indicating that the robot is transferring the wafer at the moment, and accurately controlling the first unit to open a baffle by moving the robot to the first unit for processing the wafer at the next step; if the wafer does not exist on the robot, the wafer is in processing, and the second unit can be accurately controlled to open the baffle by moving the robot to the front of the second unit where the wafer exists currently, so that the baffle is more accurately opened and closed, and the process of processing and the quality of products are guaranteed.
Example 2
In one embodiment of the present invention, as shown in fig. 2 and 3, on the basis of embodiment 2, before the robot adds a wafer from the first unit or removes a wafer from the second unit, the method further includes the steps of:
judging whether the baffle is opened or not, if so, adding the wafer from the first unit by the robot or removing the wafer from the second unit by the robot; if not, repeatedly judging whether the baffle is opened.
By judging whether the baffle is opened before adding the wafer from the first unit or removing the wafer from the second unit, the baffle is prevented from being opened due to control errors and the like, and the processing progress of the wafer is prevented from being influenced.
Preferably, before controlling the first unit or the second unit to open the shutter, the method further comprises the steps of:
judging whether the local of the first unit or the second unit is in a standby state; if yes, controlling the first unit or the second unit to open the baffle; if not, repeatedly judging whether the local of the first unit or the second unit is in a standby state.
By judging whether the first unit or the second unit is in a standby state or not before controlling the first unit or the second unit to open the baffle, the wafer can be ensured to be processed in the first unit or the second unit, the next operation can be performed, and the influence on the processing of the wafer is avoided.
Example 3
In one embodiment of the present invention, based on embodiment 1 or 2, the present invention further provides a baffle control system for a wafer processing unit, which includes a first determining module, a second determining module, a driving module, and a baffle opening module based on the above-mentioned baffle control method for a wafer processing unit.
The first judging module is used for judging whether a wafer exists on the robot or not; the second judging module is used for judging whether a second unit with the wafer exists currently or not when the first judging module judges that the wafer does not exist on the robot.
Preferably, when the second judging module judges that the second unit with the wafer does not exist currently, the first judging module repeatedly judges whether the wafer exists on the robot or not.
The driving module is used for driving the robot arm to move to the front of the machine of the first unit for processing the wafer in the next step when the first judging module judges that the wafer exists on the robot arm; or when the first judging module judges that the wafer does not exist on the robot, and the second judging module judges that the second unit with the wafer exists currently, the robot is driven to move to the front of the local machine of the second unit.
The baffle opening module is used for controlling the first unit or the second unit to open the baffle.
Judging whether a wafer exists on a robot for transferring the wafer or not through a first judging module, if so, indicating that the robot is transferring the wafer at the moment, and accurately controlling the first unit to open a baffle through a baffle opening module by moving the robot to the first unit of the next wafer to be processed through a driving module; if the first judging module judges that the wafer does not exist on the robot, and the second judging module judges that the second unit with the wafer exists currently, the fact that the wafer is in processing is explained, the robot is moved to the front of the machine of the second unit with the wafer currently through the driving module, and then the baffle opening module can accurately control the second unit to open the baffle, so that the opening and closing of the baffle are more accurate, and the process of processing and the quality of products are guaranteed.
Example 4
In an embodiment of the present invention, based on embodiment 3, the baffle control system for a wafer processing unit further includes an operation module and a baffle closing module, where the operation module is used to control the robot to add a wafer from the first unit or control the robot to remove a wafer from the second unit; the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
Preferably, the baffle control system for the wafer processing unit further comprises a third judging module, wherein the third judging module is used for judging whether the baffle is opened before the operation module controls the robot to add the wafer from the first unit or control the robot to remove the wafer from the second unit; if yes, the operation module controls the robot to add the wafer from the first unit or controls the robot to remove the wafer from the second unit, and if no, the third judgment module repeatedly judges whether the baffle is opened.
By judging whether the baffle is opened before adding the wafer from the first unit or removing the wafer from the second unit, the baffle is prevented from being opened due to control errors and the like, and the processing progress of the wafer is prevented from being influenced.
Preferably, the baffle control system for a wafer processing unit further comprises a fourth judging module, wherein the fourth judging module is used for judging whether the first unit or the second unit is in a standby state or not before the baffle opening module controls the first unit or the second unit to open the baffle; if the first unit or the second unit is in the standby state, the baffle opening module controls the first unit or the second unit to open the baffle, and if the second unit or the first unit is in the standby state, the fourth judging module judges whether the first unit or the second unit is in the standby state.
By judging whether the first unit or the second unit is in a standby state or not before controlling the first unit or the second unit to open the baffle, the wafer can be ensured to be processed in the first unit or the second unit, the next operation can be performed, and the influence on the processing of the wafer is avoided.
It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. A baffle control method for a wafer processing unit is characterized by comprising the following steps:
judging whether a wafer exists on a robot for transferring the wafer;
if yes, determining a first unit for processing the wafer in the next step, and moving the robot to the front of the first unit; if not, judging whether a second unit with a wafer exists currently, and if so, moving the robot to the front of the second unit;
and controlling the first unit or the second unit to open a baffle.
2. The baffle control method for a wafer process unit according to claim 1, wherein: after controlling the first unit or the second unit to open the baffle, the method further comprises the steps of:
the robot adds wafers from the first unit or removes wafers from the second unit;
and controlling the first unit or the second unit to close the baffle.
3. The baffle control method for a wafer process unit according to claim 2, wherein: before the robot adds a wafer from the first unit or removes a wafer from the second unit, the method further comprises the steps of:
judging whether the baffle is opened or not, if so, adding a wafer from the first unit by the robot or removing the wafer from the second unit by the robot; if not, repeatedly judging whether the baffle is opened or not.
4. The baffle control method for a wafer process unit according to claim 1, wherein: before controlling the first unit or the second unit to open the baffle, the method further comprises the steps of:
judging whether the local machine of the first unit or the second unit is in a standby state;
if yes, controlling the first unit or the second unit to open a baffle; if not, repeatedly judging whether the first unit or the second unit is in a standby state.
5. The baffle control method for a wafer process unit according to claim 1, wherein: when the second unit with the wafer is judged to exist currently, the method further comprises the steps of:
if not, repeatedly judging whether the wafer exists on the robot for transferring the wafer.
6. A barrier control system for a wafer processing unit, based on the barrier control method for a wafer processing unit according to any one of claims 1 to 5, comprising:
the first judging module is used for judging whether a wafer exists on the robot or not;
the second judging module is used for judging whether a second unit with a wafer exists currently or not when the first judging module judges that the wafer does not exist on the robot;
the driving module is used for driving the robot to move to the front of the local of the first unit for processing the wafer in the next step when the first judging module judges that the wafer exists on the robot, or driving the robot to move to the front of the local of the second unit when the first judging module judges that the wafer does not exist on the robot and the second judging module judges that the second unit with the wafer exists currently;
and the baffle opening module is used for controlling the first unit or the second unit to open the baffle.
7. The baffle control system for a wafer processing unit of claim 6, further comprising:
an operation module for controlling the robot to add wafers from the first unit or to remove wafers from the second unit;
and the baffle closing module is used for controlling the first unit or the second unit to close the baffle.
8. The baffle control system for a wafer processing unit of claim 7, further comprising:
a third judging module for judging whether the baffle is opened before the operating module controls the robot to add the wafer from the first unit or controls the robot to remove the wafer from the second unit,
and if the judgment is negative, the third judgment module repeatedly judges whether the baffle is opened or not.
9. The baffle control system for a wafer processing unit of claim 6, further comprising:
a fourth judging module for judging whether the first unit or the second unit is in a standby state or not before the baffle opening module controls the first unit or the second unit to open the baffle,
and if the judgment is negative, the fourth judgment module repeatedly judges whether the first unit or the second unit is in a standby state.
10. The baffle control system for a wafer processing unit of claim 6, wherein: and when the second judging module judges that the second unit with the wafer does not exist currently, the first judging module repeatedly judges whether the wafer exists on the robot or not.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010420087.3A CN113690157B (en) | 2020-05-18 | 2020-05-18 | Baffle control method and control system for wafer processing unit |
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| CN202010420087.3A CN113690157B (en) | 2020-05-18 | 2020-05-18 | Baffle control method and control system for wafer processing unit |
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| CN113690157B true CN113690157B (en) | 2024-02-20 |
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| CN113690157A (en) | 2021-11-23 |
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