CN113683053A - Micro block array moving assembly and manufacturing method thereof - Google Patents
Micro block array moving assembly and manufacturing method thereof Download PDFInfo
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- CN113683053A CN113683053A CN202111074897.9A CN202111074897A CN113683053A CN 113683053 A CN113683053 A CN 113683053A CN 202111074897 A CN202111074897 A CN 202111074897A CN 113683053 A CN113683053 A CN 113683053A
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- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00198—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
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- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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Abstract
本申请公开了一种微型块阵列移动组件和制作方法，该组件包括移动部件，移动部件透明基板；位于透明基板上表面的透明介质体；分布在透明介质体背离透明基板的表面的透明触头阵列，透明触头阵列背离透明基板的表面为平面，且透明触头阵列兼具柔性和刚性。本申请中移动部件为透明的，在推岛时可清晰的观察到微型块的运动情况和自回复情况，有利于自回复的判断；透明触头阵列背离透明基板的表面为平面，与微型块为面接触，增加微型块受力均匀性，同时还可以增加与微型块之间的粘附力，提升转移成功率；透明触头阵列可以实现同时对多个微型块进行推岛和转岛，提升推动、转移和自回复判断的效率；透明触头阵列兼具柔性和刚性，避免对微型块造成损伤。
The present application discloses a micro-block array moving assembly and a manufacturing method. The assembly includes a moving part, a transparent substrate of the moving part; a transparent medium located on the upper surface of the transparent substrate; and transparent contacts distributed on the surface of the transparent medium away from the transparent substrate The surface of the transparent contact array facing away from the transparent substrate is a plane, and the transparent contact array has both flexibility and rigidity. In this application, the moving parts are transparent, and the movement and self-recovery of the micro-block can be clearly observed when the island is pushed, which is conducive to the judgment of self-recovery; the surface of the transparent contact array facing away from the transparent substrate is a plane, and the micro-block is Surface contact increases the force uniformity of the micro-blocks, and at the same time, it can increase the adhesion between the micro-blocks and improve the transfer success rate; the transparent contact array can push and rotate multiple micro-blocks at the same time. The efficiency of push, transfer and self-recovery judgment; the transparent contact array has both flexibility and rigidity to avoid damage to the micro-block.
Description
Technical Field
The application relates to the technical field of ultra-sliding islands, in particular to a micro block array moving assembly and a manufacturing method thereof.
Background
The ultra-smooth structure refers to the phenomenon that the friction and abrasion between two atomic-level smooth and non-metric contact Van der Waals solid surfaces (such as two-dimensional material surfaces of graphene, molybdenum disulfide and the like) are almost zero.
The self-recovery performance of the ultra-sliding island of the two-dimensional material is judged when the ultra-sliding device with the structure is manufactured, the island is pushed by the probe, the island is layered up and down, then the probe is released to observe whether the upper layer separation part performs self-recovery motion, and if the upper layer separation part performs self-recovery, the upper layer part is judged to be the ultra-sliding piece and the ultra-sliding piece is transferred to a target substrate from an original material system. At present, when the ultra-sliding island is pushed and rotated, the operation is carried out by a probe. The use of the probe as a tool has many limitations, for example, because the probe can only operate one ultra-smooth island at a time, the operation efficiency is low, and large-scale island pushing and island transferring are difficult to realize; the probe is pointed, the contact area between the probe and the ultra-sliding island is small, the ultra-sliding island is easy to be stressed unevenly, the problem of rotation instability and locking of the ultra-sliding island are easy to occur in the island pushing process, the self-recovery characteristic is not easy to judge, the adhesion force between the probe and the ultra-sliding island is small, the operation skill is strong, and the transfer success rate of the ultra-sliding island is low; in addition, the probe can partially shield the ultra-smooth island below in the island pushing process, so that the judgment of self-recovery capability is not facilitated.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a micro block array moving assembly and a manufacturing method thereof, so that the moving efficiency and the transfer success rate of micro blocks are improved, locking when the micro blocks push an island is avoided, and self-reply judgment is facilitated.
In order to solve the above technical problem, the present application provides a micro block array moving assembly, including a moving part, the moving part including:
a transparent substrate;
the transparent medium body is positioned on the upper surface of the transparent substrate;
the transparent contact array is distributed on the surface of the transparent medium body deviating from the transparent substrate, the surface of the transparent contact array deviating from the transparent substrate is a plane, and the transparent contact array has flexibility and rigidity.
Optionally, the transparent dielectric body and the transparent contact array are of an integrated structure.
Optionally, the number of the transparent dielectric bodies is multiple.
Optionally, the method further includes:
a displacement stage for adjusting the displacement of the target substrate and the array of microblocks and applying a shear force between the layers of the microblocks when the transparent contact array is in contact with the array of microblocks.
Optionally, the method further includes:
and the three-dimensional displacement frame is used for adjusting the displacement of the transparent contact array.
Optionally, the method further includes:
and an angle-of-rotation displacement stage for adjusting a relative angle of rotation between the target substrate and the transferred micro-blocks.
The application also provides a manufacturing method of the micro block array moving assembly, which comprises the following steps:
preparing a substrate and a transparent substrate;
manufacturing a first groove array on the substrate, filling transparent liquid into the first groove array, and curing the transparent liquid to form a transparent contact array; the bottom of the first groove is a plane, and the transparent contact array has flexibility and rigidity;
and manufacturing a transparent dielectric body on the upper surface of the transparent substrate, and placing the transparent contact array transferred from the substrate on the surface of the transparent dielectric body deviating from the transparent substrate, wherein the bottom of the transparent contact array is far away from the transparent substrate.
Optionally, the manufacturing a first groove array on the substrate, filling transparent liquid into the first groove array, and curing the transparent liquid to form a transparent contact array includes:
manufacturing a second groove on the substrate;
manufacturing the first groove array at the bottom of the second groove;
filling the first groove array and the second groove with the transparent liquid, and curing the transparent liquid to form a combination of the transparent medium body and the transparent contact array;
correspondingly, the manufacturing of the transparent dielectric body on the upper surface of the transparent substrate, and the placing of the transparent contact array transferred from the substrate on the surface of the transparent dielectric body, which is away from the transparent substrate, includes:
and placing the assembly transferred from the substrate on the transparent substrate, wherein the transparent medium body is directly contacted with the transparent substrate.
Optionally, the step of forming a second groove on the substrate includes:
coating photoresist on the substrate, and carrying out exposure and development on the photoresist;
etching the substrate to form the second groove;
fabricating the first groove array at the bottom of the second groove comprises:
coating photoresist on the bottom of the second groove, and exposing and developing the photoresist;
and etching the bottom of the second groove to form the first groove array.
Optionally, curing the transparent liquid comprises:
and heating the transparent liquid to solidify the transparent liquid.
The utility model provides a micro-block array moving assembly, includes moving part, moving part includes: a transparent substrate; the transparent medium body is positioned on the upper surface of the transparent substrate; the transparent contact array is distributed on the surface of the transparent medium body deviating from the transparent substrate, the surface of the transparent contact array deviating from the transparent substrate is a plane, and the transparent contact array has flexibility and rigidity.
Therefore, the micro block array moving assembly comprises the transparent substrate, the transparent medium body and the transparent contact array which are all transparent, so that the motion condition of the micro block can be clearly observed when the island is pushed, and the self-recovery condition of the micro block can be clearly observed after the micro block assembly and the micro block are separated, so that the judgment of the self-recovery of the micro block is facilitated; the surface of the transparent contact array, which is far away from the transparent substrate, is a plane, namely the surface of the transparent contact in the transparent contact array, which is far away from the transparent substrate, is a plane, and the surface of the transparent contact array is in surface contact with the micro-block, so that the contact area is increased, the stress uniformity of the micro-block is increased, the locking condition caused by rotation instability is avoided, the self-recovery judgment of the micro-block is facilitated, meanwhile, the adhesion force between the transparent contact array and the micro-block can be increased, and the transfer success rate is improved; the transparent contact array can realize pushing and transferring a plurality of miniature blocks at the same time, and the efficiency of pushing, transferring and self-recovery judgment is improved; and, transparent contact array has flexibility and rigidity concurrently, avoids causing the damage to the microblock, guarantees simultaneously that promotion and transfer go on smoothly.
In addition, the application also provides a manufacturing method of the micro block array moving assembly with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a micro block array moving assembly according to an embodiment of the present disclosure;
FIG. 2 is a flow chart of a method for fabricating a micro block array moving assembly according to an embodiment of the present disclosure;
fig. 3-5 are process flow diagrams for preparing transparent dielectric bodies and transparent contacts according to the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, current pushing and transferring of micro-blocks relies on probes for operation. There are many limitations to using the probe as a tool, for example, since the probe can operate only one micro-block at a time, the operation efficiency is low, and it is difficult to realize large-scale pushing and transferring; the probe is pointed, the contact area between the probe and the miniature block is small, the miniature block is easy to be stressed unevenly, the rotation instability is easy to occur in the island pushing process, the miniature block is further locked, the judgment of the self-recovery characteristic is not facilitated, the adhesion force between the probe and the miniature block is smaller, the operation skill is strong, and the transfer success rate of the miniature block is low; in addition, the probe can partially shield the micro-block below in the process of pushing the island, which is not beneficial to judging the self-recovery capability.
In view of the above, the present application provides a micro block array moving assembly, please refer to fig. 1, where fig. 1 is a schematic structural diagram of a micro block array moving assembly provided in an embodiment of the present application, including a moving part, where the moving part includes:
a transparent substrate;
the transparent medium body is positioned on the upper surface of the transparent substrate;
the transparent contact array is distributed on the surface of the transparent medium body deviating from the transparent substrate, the surface of the transparent contact array deviating from the transparent substrate is a plane, and the transparent contact array has flexibility and rigidity.
The transparent substrate includes, but is not limited to, a glass substrate or a transparent acryl substrate, etc.
The transparent contact array comprises a plurality of transparent contacts, and the number of the transparent contacts is set according to the requirement.
The transparent contact can be in the shape of a cylinder, a circular truncated cone, a truncated pyramid or the like, and the requirement can be met as long as the surface deviating from the transparent substrate is a plane.
It should be noted that the transparent dielectric body and the transparent contact array are not limited in this application and may be configured by themselves. For example, the transparent dielectric body and the transparent contact array may be separate and then bonded together; in order to simplify the manufacturing process, the transparent medium body and the transparent contact array are of an integrated structure.
It should be noted that, in the present application, the material of the transparent contact array is not limited, and may be selected by itself. For example, the transparent contact array may be made of Polydimethylsiloxane (PDMS), or a photoresist, or a resin adhesive, or the like. Similarly, the material of the transparent dielectric body is not specifically limited in the application, and can be selected by self. For example, the material of the transparent dielectric body may be polydimethylsiloxane, or photoresist, or resin glue, etc.
The number of the transparent dielectric bodies may be one or more, and when the number of the transparent dielectric bodies is more than one, the transparent dielectric bodies are preferably uniformly distributed on the transparent substrate.
The micro block array moving assembly comprises a transparent substrate, a transparent medium body and a transparent contact array, which are all transparent, so that when the island is pushed, the motion condition of the micro block can be clearly observed, and after the micro block assembly and the micro block are separated, the self-recovery condition of the micro block can be clearly observed, namely, the judgment of the self-recovery of the micro block is facilitated; the surface of the transparent contact array, which is far away from the transparent substrate, is a plane, namely the surface of the transparent contact in the transparent contact array, which is far away from the transparent substrate, is a plane, and the surface of the transparent contact array is in surface contact with the micro-block, so that the contact area is increased, the stress uniformity of the micro-block is increased, the locking condition caused by rotation instability is avoided, the self-recovery judgment of the micro-block is facilitated, meanwhile, the adhesion force between the transparent contact array and the micro-block can be increased, and the transfer success rate is improved; the transparent contact array can realize pushing and transferring a plurality of miniature blocks at the same time, and the efficiency of pushing, transferring and self-recovery judgment is improved; and, transparent contact array has flexibility and rigidity concurrently, avoids causing the damage to the microblock, guarantees simultaneously that promotion and transfer go on smoothly.
On the basis of the above embodiments, in an embodiment of the present application, the micro block array moving assembly further includes:
a displacement stage for adjusting the displacement of the target substrate and the array of microblocks and applying a shear force between the layers of the microblocks when the transparent contact array is in contact with the array of microblocks.
When the island pushing operation is carried out, the horizontal displacement of the micro block array is adjusted by the displacement platform so as to enable the micro block array to be opposite to the transparent contact array, when the transparent contact array is contacted with the micro block array, the shearing force is applied between the micro block layers by adjusting the horizontal displacement of the micro block, so that the upper layer and the lower layer of the micro block slide relatively, and the micro block or the micro block array is pushed away in batches.
When the island is rotated, the transparent contact array adsorbs micro blocks or micro block arrays, the displacement table adjusts the horizontal displacement of the target substrate so as to enable the target substrate to be opposite to the transparent contact array, and then the vertical displacement of the target substrate is adjusted to be in contact with the transparent contact array.
Further, in order to facilitate control of displacement of the moving member, the micro block array moving assembly further includes:
and the three-dimensional displacement frame is used for adjusting the displacement of the transparent contact array.
And fixing the transparent substrate on a three-dimensional displacement frame, and adjusting the displacement of the transparent contact array in the horizontal and vertical directions through the movement of the three-dimensional displacement frame.
On the basis of any of the above embodiments, in an embodiment of the present application, the micro block array moving assembly further includes:
and an angle-of-rotation displacement stage for adjusting a relative angle of rotation between the target substrate and the transferred micro-blocks.
When the research on the change of the physical quantity along with the corner of the ultra-smooth sheet requires that the micro-block and the target substrate form a specific angle, the corner displacement table can accurately adjust the rotating angle of the target substrate.
Referring to fig. 2, fig. 2 is a flowchart of a method for manufacturing a micro block array moving assembly according to an embodiment of the present disclosure, where the method includes:
step S101: a substrate and a transparent substrate are prepared.
The transparent substrate is a clean substrate.
The substrate is not limited in this application, and a semiconductor substrate is used for convenience of manufacturing.
Step S102: manufacturing a first groove array on the substrate, filling transparent liquid into the first groove array, and curing the transparent liquid to form a transparent contact array; the bottom of the first groove is a plane, and the transparent contact array has flexibility and rigidity.
The method for manufacturing the first groove array is not limited in this application, and for example, photolithography, laser grooving, or the like may be used.
Transparent liquid is the material of the transparent contact array, for example, when the transparent contact array is PDMS, the transparent liquid is PDMS transparent solution; when the transparent contact array is a photoresist, the transparent liquid is a liquid photoresist.
When the transparent liquid is the PDMS transparent solution and the PDMS transparent solution is prepared, the prepolymer a: and the crosslinking agent B is 1-10: 1 so that the transparent contact body has proper flexibility and rigidity, the transparent contact body is uniformly stirred by using a stirring rod, and the solution is statically placed in a vacuum tank and vacuumized so as to remove bubbles.
To speed up the fabrication efficiency, curing the transparent liquid comprises:
and heating the transparent liquid to solidify the transparent liquid.
Step S103: and manufacturing a transparent dielectric body on the upper surface of the transparent substrate, and placing the transparent contact array transferred from the substrate on the surface of the transparent dielectric body deviating from the transparent substrate, wherein the bottom of the transparent contact array is far away from the transparent substrate.
When the transparent dielectric body and the transparent contact array are independently bonded together, the transparent dielectric body can be separately manufactured and adhered to the transparent substrate.
And transferring the transparent contact array from the substrate, namely obtaining the transparent contact array by adopting an over-mold method.
When the transparent medium body and the transparent contact array are of an integrated structure, the manufacturing method of the micro-block array moving assembly comprises the following steps:
step S201: a substrate and a transparent substrate are prepared.
Step S202: and manufacturing a second groove on the substrate.
When the photolithography is used, fabricating a second groove on the substrate includes:
coating photoresist on the substrate, and carrying out exposure and development on the photoresist;
and etching the substrate to form the second groove.
Step S203: and manufacturing the first groove array at the bottom of the second groove.
When the photolithography is used, the manufacturing of the first groove array at the bottom of the second groove includes:
coating photoresist on the bottom of the second groove, and exposing and developing the photoresist;
and etching the bottom of the second groove to form the first groove array.
A schematic structural view of the substrate with the first and second grooves etched is shown in fig. 3.
Step S204: filling the first groove array and the second groove with the transparent liquid, and curing the transparent liquid to form a combination of the transparent medium body and the transparent contact array; wherein, the bottom of the first groove is a plane.
The first array of wells and the second well are filled with a transparent liquid as shown in fig. 4. And the transparent liquid in the second groove is solidified to form a transparent medium body.
Step S205: and placing the assembly transferred from the substrate on the transparent substrate, wherein the transparent medium body is directly contacted with the transparent substrate.
The combination of a transparent dielectric body and a transparent contact array obtained by the overmolding process is shown in fig. 5.
The following explains the process of the micro block array moving assembly in the present application for pushing and rotating the graphite island.
And 2, applying micro-displacement along any horizontal direction by using a piezoelectric displacement platform, wherein the upper-layer graphite island and the transparent contact array are kept relatively static, the lower-layer graphite island slides relatively to the upper-layer graphite island, and the graphite islands or the graphite island array are pushed away in batches. The sliding distance is controlled to be one half of the side length of the graphite island.
And 3, controlling the graphite island array to descend along the vertical direction by using a piezoelectric micromotion displacement table so as to separate the graphite island from the transparent contact array. Because the self-restoring force exists in the sliding interface, the graphite island with the self-restoring characteristic automatically restores to the position before sliding, and the non-recoverable graphite island stays at the position after sliding, so that the batch judgment of the self-restoring characteristic of the graphite island is completed.
And 4, controlling the graphite island array to move along the vertical direction by using the piezoelectric micro-motion transparent contact array until the graphite island array is contacted with the transparent contact array again, continuously applying displacement along the original horizontal direction by using a piezoelectric micro-motion displacement table, and completely sliding the graphite island array out of the original position, namely completely separating the graphite island array from the lower-layer graphite. The graphite island array is adhered below the transparent contact array due to van der waals interaction between the graphite island and the transparent contact.
And 5, fixing the clean silicon substrate on a piezoelectric micromotion displacement table. And controlling the silicon substrate to rotate by 30 degrees by using a corner displacement platform, and aligning the transferred graphite island array with the target position of the surface of the lower silicon substrate by using a small three-dimensional displacement frame and a piezoelectric micromotion displacement platform under a microscope.
And 6, controlling the silicon substrate to slowly rise by using the piezoelectric micro-motion displacement table until the transparent contact array is contacted with the target position. The graphite island array is transferred to a target location because the van der waals forces between the graphite island and silicon substrate interface are greater than the van der waals forces between the graphite island and the transparent contact.
And 7, controlling the graphite island array and the transparent contact array to be separated from each other by using the piezoelectric micromotion displacement table, and transferring the graphite island to the target position of the silicon substrate. The transparent contact arrays with different sizes and shapes can realize batch self-recovery judgment and transfer of graphite island arrays with different quantities and scales.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The micro block array moving assembly and the manufacturing method thereof provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A micro-tiling array movement assembly comprising a movement component, the movement component comprising:
a transparent substrate;
the transparent medium body is positioned on the upper surface of the transparent substrate;
the transparent contact array is distributed on the surface of the transparent medium body deviating from the transparent substrate, the surface of the transparent contact array deviating from the transparent substrate is a plane, and the transparent contact array has flexibility and rigidity.
2. The micro-block array motion assembly of claim 1, wherein the transparent dielectric body and the transparent contact array are a unitary structure.
3. The micro block array moving assembly as claimed in claim 1, wherein the number of the transparent dielectric bodies is plural.
4. The micro-tiling array movement assembly of claim 3, further comprising:
a displacement stage for adjusting the displacement of the target substrate and the array of microblocks and applying a shear force between the layers of the microblocks when the transparent contact array is in contact with the array of microblocks.
5. The micro-tiling array movement assembly of claim 1, further comprising:
and the three-dimensional displacement frame is used for adjusting the displacement of the transparent contact array.
6. The microblock array moving assembly according to any one of claims 1 to 5, further comprising:
and an angle-of-rotation displacement stage for adjusting a relative angle of rotation between the target substrate and the transferred micro-blocks.
7. A method for manufacturing a micro block array moving assembly is characterized by comprising the following steps:
preparing a substrate and a transparent substrate;
manufacturing a first groove array on the substrate, filling transparent liquid into the first groove array, and curing the transparent liquid to form a transparent contact array; the bottom of the first groove is a plane, and the transparent contact array has flexibility and rigidity;
and manufacturing a transparent dielectric body on the upper surface of the transparent substrate, and placing the transparent contact array transferred from the substrate on the surface of the transparent dielectric body deviating from the transparent substrate, wherein the bottom of the transparent contact array is far away from the transparent substrate.
8. The method of claim 7, wherein fabricating a first array of wells on the substrate, filling the first array of wells with a transparent liquid, and curing the transparent liquid to form an array of transparent contacts comprises:
manufacturing a second groove on the substrate;
manufacturing the first groove array at the bottom of the second groove;
filling the first groove array and the second groove with the transparent liquid, and curing the transparent liquid to form a combination of the transparent medium body and the transparent contact array;
correspondingly, the manufacturing of the transparent dielectric body on the upper surface of the transparent substrate, and the placing of the transparent contact array transferred from the substrate on the surface of the transparent dielectric body, which is away from the transparent substrate, includes:
and placing the assembly transferred from the substrate on the transparent substrate, wherein the transparent medium body is directly contacted with the transparent substrate.
9. The method of claim 8, wherein forming a second recess in the substrate comprises:
coating photoresist on the substrate, and carrying out exposure and development on the photoresist;
etching the substrate to form the second groove;
fabricating the first groove array at the bottom of the second groove comprises:
coating photoresist on the bottom of the second groove, and exposing and developing the photoresist;
and etching the bottom of the second groove to form the first groove array.
10. The method of fabricating a micro-block array moving assembly according to any one of claims 7 to 9, wherein the solidifying the transparent liquid comprises:
and heating the transparent liquid to solidify the transparent liquid.
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