CN113677170A - Electronic device and heat dissipation method - Google Patents
Electronic device and heat dissipation method Download PDFInfo
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- CN113677170A CN113677170A CN202111089827.0A CN202111089827A CN113677170A CN 113677170 A CN113677170 A CN 113677170A CN 202111089827 A CN202111089827 A CN 202111089827A CN 113677170 A CN113677170 A CN 113677170A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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Abstract
本申请实施例公开了一种电子设备以及散热方法；其中，所述电子设备包括有壳体，散热件以及驱动机构；所述壳体内部设置有容置空间，所述散热件及所述驱动机构均设置在所述容置空间中，所述驱动机构与所述散热件连接，在所述驱动机构的驱动下，所述散热件可在所述容置空间中移动。本申请实施例为电子设备提供了一种散热方案，所述散热件为可移动式设计，能对电子设备内部的不同发热区域进行散热，具有散热效果好的特点。
The embodiment of the present application discloses an electronic device and a heat dissipation method; wherein, the electronic device includes a housing, a heat sink and a driving mechanism; an accommodating space is provided inside the housing, and the heat sink and the drive mechanism The mechanisms are all arranged in the accommodating space, the driving mechanism is connected with the heat sink, and the heat sink can move in the accommodating space under the driving of the driving mechanism. The embodiment of the present application provides a heat dissipation solution for an electronic device. The heat dissipation member is a movable design, which can dissipate heat from different heat-generating areas inside the electronic device, and has the characteristics of good heat dissipation effect.
Description
Technical Field
The application belongs to the technical field of electronics, and particularly relates to electronic equipment and a heat dissipation method.
Background
With the continuous pursuit of users for games, video experiences, and the like, more and more high-power electronic devices are integrated into electronic devices such as smart phones. However, as the performance of electronic devices is gradually increased, serious heat generation problems are caused. On the one hand, chips inside electronic devices generate a lot of heat during operation, which accumulates inside the device, creating thermal stresses and strains that may damage the internal structure and thus risk failure of the electronic device. On the other hand, heat accumulated inside the electronic device is transferred to the housing of the device, which may form a local high temperature area, which the user may feel noticeably hot after touching the area, which may result in a poor user experience.
In the related art, in order to dissipate heat of an electronic device, a heat dissipation device is generally installed inside the electronic device to dissipate heat from a heat source inside the electronic device. However, due to the limitations of the internal space and structure of the electronic device, and the large number and the distributed distribution of heat sources inside the electronic device, the conventional heat dissipation device cannot cover all the heat sources inside the electronic device, and thus it is difficult to achieve effective heat dissipation. The heat generation phenomenon of electronic equipment still exists universally and is not solved well.
Disclosure of Invention
The application aims at providing an electronic device, and the problem that the heating phenomenon is serious due to poor heat dissipation performance of the existing electronic device is solved at least.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides an electronic device, where the electronic device includes:
the shell is internally provided with an accommodating space;
the heat dissipation piece is arranged in the accommodating space; and
the driving mechanism is arranged in the accommodating space and connected with the heat dissipation piece, and the heat dissipation piece can move in the accommodating space under the driving of the driving mechanism.
In a second aspect, an embodiment of the present application provides a heat dissipation method, where the heat dissipation method is applied to the electronic device, and the heat dissipation method includes:
determining a heat generation area of the electronic device;
when the heat dissipation piece is not positioned in the heating area, the driving mechanism is started, and the heat dissipation piece is moved to the heating area for heat dissipation;
after the temperature of the heat generation region is reduced to a target temperature, the heat sink is moved to a low temperature region, which is lower than the target temperature, to release heat.
In the embodiment of the application, the driving mechanism drives the heat dissipation member to move in the electronic equipment, namely, a movable heat dissipation member is provided for the electronic equipment, so that the heat dissipation member can be moved to the heating area corresponding to the heat source to perform accurate heat dissipation, and the temperature of the heating area can be reduced. According to the scheme of the embodiment of the application, the radiating piece can cover heat sources at different positions in the electronic equipment in real time under the smaller designed volume, the radiating piece can take away heat in time, the heat accumulation in the electronic equipment is avoided, high-efficiency heat dissipation of the electronic equipment can be achieved, and the problem of poor heat dissipation of the electronic equipment is solved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is one of schematic structural diagrams of an electronic device provided according to an embodiment of the present application;
fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application.
Reference numerals:
1-a housing, 2-a heat sink, 3-a first motor, 4-a first lead screw, 5-a first connector, 6-a first stopper, 7-a second motor, 8-a second lead screw, 9-a second connector, 10-a support, 11-a second stopper, 12-a first magnet, 13-a first slider, 14-a first slide rail, 15-a first stopper, 16-a second magnet, 17-a second slider, 18-a second slide rail, 19-a second stopper.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A specific structure of an electronic apparatus according to an embodiment of the present application is described below with reference to fig. 1 and 2.
The electronic device provided by the embodiment of the application, referring to fig. 1 and fig. 2, includes a housing 1, a heat sink 2, and a driving mechanism; an accommodating space is arranged inside the shell 1, and the heat sink 2 and the driving mechanism are both arranged in the accommodating space; the driving mechanism is connected with the heat dissipation member 2, and the heat dissipation member 2 can move in the accommodating space under the driving of the driving mechanism.
The housing 1 is, for example, a middle frame of the electronic device.
The housing 1 may be used to support the driving mechanism and the heat sink 2.
In the embodiment of the application, the driving heat dissipation member 2 is controlled by the driving mechanism to move inside the electronic device, that is, a movable heat dissipation member is provided for the electronic device, so that the heat dissipation member 2 can be moved to a heating area corresponding to a heat source to perform accurate heat dissipation, and the temperature of the heating area can be reduced.
The scheme of this application embodiment, wherein radiating piece 2 can realize covering in real time the heat source of different positions in the electronic equipment under the less circumstances of design volume ratio, radiating piece 2 can in time take away the heat, avoids the inside heat of electronic equipment to gather to can realize electronic equipment's high-efficient heat dissipation, improve the not good problem of electronic equipment heat dissipation.
The driving mechanism can drive the heat dissipation member 2 to move in different directions inside the electronic device, so as to effectively dissipate heat of heat sources at different positions in the electronic device.
In some embodiments of the present application, referring to fig. 1 and 2, the drive mechanism comprises: a first drive assembly and a second drive assembly; the first driving assembly is connected with the second driving assembly, the first driving assembly is connected with the heat sink 2, and the second driving assembly is connected with the shell 1; the first driving component drives the heat sink 2 to move in a first direction relative to the housing 1, and the second driving component drives the first driving component to drive the heat sink 2 to move in a second direction relative to the housing 1.
Referring to fig. 1 and 2, the first driving assembly can be used to drive the heat sink 2 to move in a first direction, such as an X-axis direction or a transverse direction. The second driving component can be used to drive the first driving component to move the heat sink 2 connected thereto in a second direction, i.e., to drive and control the heat sink 2 to move in the second direction, where the second direction is, for example, a Y-axis direction or a longitudinal direction. The second direction is, for example, perpendicular to the first direction.
In the solution of the present application, the driving control of the moving position of the heat dissipation member 2 in the electronic device can be realized by the first driving component and the second driving component. That is, the heat dissipation member 2 can move relative to the housing 1 to move to a target position (i.e., a heat generation region) according to a heat source distribution condition in the electronic device, so that heat dissipation can be performed on the heat generation region in the electronic device, and heat is prevented from being accumulated inside the electronic device and damaging internal electronic devices.
In the related art, a heat sink is generally installed at a heat source position inside an electronic device and covers the heat source. Taking a smart phone as an example, the heat sources include a CPU, a UFS, a 5G radio frequency chip, a battery, a charging chip, a camera module, a speaker, and the like, and these heat sources are actually distributed at different positions in the phone. Under different application scenes, the working devices are different, and the positions of heating areas are different. Due to the limitations of space and structure in the electronic device, the size of the installed heat dissipation device cannot actually ensure to cover all heat sources in the electronic device, so that it is difficult to achieve an effective heat dissipation effect, and heat is still easily accumulated in the electronic device, which results in serious heat generation of the electronic device.
In the embodiment of the application, the first driving component and the second driving component drive the heat dissipation member 2 to move in the electronic device, so that the heat dissipation member 2 can move to the heating area corresponding to the heat source to perform more effective heat dissipation, and the temperature of the heating area can be reduced.
The scheme that this application embodiment provided, wherein radiating piece 2 need not to design to be bulky and cover whole heat source, and this is because radiating piece 2 is in first drive assembly and/or under second drive assembly's control, its position can be changed wantonly to the targeted heat source to different positions in the electronic equipment covers in real time, avoids the inside heat of electronic equipment to gather, thereby can realize electronic equipment's high-efficient heat dissipation, and then has improved the not good problem of electronic equipment heat dissipation.
That is to say, according to the embodiment of the application, a heat dissipation scheme is provided for the electronic device, wherein the position of the heat dissipation member 2 can move along with the change of the heating area in the electronic device, and the heat dissipation device has the characteristics of good heat dissipation effect and high heat dissipation efficiency. Therefore, the scheme of the application well overcomes the defect problems in the prior art.
In some embodiments of the present application, at least one of the first drive assembly and the second drive assembly is a linear drive.
Specifically, referring to fig. 1 and 2, the first driving assembly can drive the heat sink 2 to move in a translational manner along the X-axis direction (or transverse direction), for example, and the second driving assembly can drive the heat sink 2 to move in a translational manner along the Y-axis direction (or longitudinal direction), for example. On this basis, the first driving assembly and the second driving assembly are used for driving the heat dissipation member 2 to move in different directions in the XY plane, that is, the position of the heat dissipation member 2 is adjusted in real time, so that the heat dissipation member 2 can move to any position, and the heat dissipation requirements of heat sources distributed at different positions in the electronic device are met.
In some embodiments of the present application, referring to fig. 1, the first driving assembly includes a first motor 3, a first lead screw 4, and a first connecting member 5. The second drive assembly is connected to the first motor 3, and the heat sink 2 is connected to the first connector 5, so that the first drive assembly together with the heat sink 2 can be moved relative to the housing 1 when the second drive assembly is driven. And, the first motor 3 is in transmission connection with one end of the first lead screw 4, the first connecting piece 5 is movably arranged on the first lead screw 4 and in threaded fit with the first lead screw 4, the first motor 3 drives the first lead screw 4 to rotate, and the first lead screw 4 drives the first connecting piece 5 to move along the first lead screw 4.
The first motor 3 can drive the first lead screw 4 to rotate, and the first lead screw 4 can rotate clockwise or counterclockwise, which is not limited in this application.
When the first lead screw 4 rotates, the first connecting piece 5 can linearly move along the first lead screw 4, and at this time, the first lead screw 4 can also be used for providing guidance for the linear movement of the first connecting piece 5. That is, in the embodiment of the present application, it is designed to convert the rotational motion of the first motor 3 into the linear motion of the first link 5.
The first connecting piece 5 is fixedly connected with the heat dissipation piece 2.
For example, the first connector 5 is fixedly connected to the heat sink 2 by at least one fastener, such as a screw, a bolt, etc., which is not limited in this application.
For another example, the first connecting element 5 is fixedly connected to the heat sink 2 by welding.
Of course, the first connector 5 and the heat sink 2 may be detachably connected, and this design facilitates replacement of the heat sink 2.
In the embodiment of the present application, the rotational motion of the first motor 3 is converted into the linear motion of the first connecting member 5, and since the first connecting member 5 is connected to the heat dissipating member 2, the heat dissipating member 2 can be displaced in the first direction (the transverse direction or the X-axis direction shown in fig. 1) when the first connecting member 5 performs the linear motion along the first lead screw 4.
Optionally, a first limiting member 6 is disposed at an end of the first lead screw 4 away from the first motor 3.
The first limiting member 6 is, for example, a stopper.
The first limiting member 6 can be used to limit the maximum stroke of the first connecting member 5 on the first lead screw 4, and can also effectively prevent the first connecting member 5 from being disengaged from the first lead screw 4 during movement, so as to ensure that the heat sink 2 normally moves in the first direction.
With continued reference to fig. 1, in the above-described embodiment, the second driving assembly is similar in structure to the first driving assembly, except that it is disposed in a different direction. The second driving assembly is used for driving the heat sink 2 to move in a second direction. In this way, the heat sink 2 can be moved in different directions.
For example, referring to fig. 1, the second driving assembly includes a second motor 7, a second lead screw 8 and a second connecting member 9. The second motor 7 is fixedly arranged on a supporting piece 10, the supporting piece 10 is connected with the shell 1, and the second connecting piece 9 is connected with the first motor 3. The second motor 7 is in transmission connection with one end of the second lead screw 8, the second connecting piece 9 is movably arranged on the second lead screw 8 and in threaded fit with the second lead screw 8, the second motor 7 drives the second lead screw 8 to rotate, and the second lead screw 8 drives the second connecting piece 9 to move along the second lead screw 8.
The second motor 7 can drive the second lead screw 8 to rotate, and the second lead screw 8 can rotate in a clockwise direction or in a counterclockwise direction, which is not limited in the present application.
The second connecting piece 9 can move linearly along the second lead screw 8. The second lead screw 8 is used for providing guidance for the linear motion of the second connecting piece 9. In the exemplary embodiment of the present application, the rotational movement of the second electric motor 7 is converted into a linear movement of the second connecting element 9.
Wherein, the second connecting piece 9 is fixedly connected with the first motor 3 of the first driving assembly. In this way, the second connector 9 can carry the first drive assembly together with the heat sink 2 in a second direction (the longitudinal or Y-axis direction shown in fig. 1), with the aim of making possible a position adjustment of the heat sink 2 in the second direction. The position of the heat dissipation member 2 in the first direction is adjusted by combining the first driving assembly, so that the heat dissipation member 2 can move in an XY plane, and the heat dissipation member 2 can be moved to a target position for heat dissipation, so that an effect of accurately dissipating heat of a heating area in the electronic equipment is achieved.
For example, the second connecting member 9 is fixedly connected with the first motor 3 through a connecting shaft.
For another example, the second connecting member 9 is detachably connected to the first motor 3.
Optionally, a second limiting member 11 is disposed at an end of the second lead screw 8 away from the second motor 7.
The second limiting member 11 is, for example, a stopper.
The second limiting member 11 may be configured to limit a maximum stroke of the second connecting member 9, so as to prevent the second connecting member 9 from being disengaged from the second lead screw 8, and thus it may be ensured that the first driving assembly connected to the second connecting member 9 can stably drive the heat sink 2 to move in the second direction, so as to adjust a position of the heat sink 2 in the second direction.
The second limiting member 11 may be the same as the first limiting member 6, but may be designed in a different form as long as the limiting effect on the second connecting member 9 can be achieved.
The support member 10 is, for example, a block structure, and is used to stably fix the second motor 7 on the housing 1.
Further, the first motor 3 and the second motor 7 are both servo motors, for example.
First lead screw 4 with all be provided with the screw thread on the second lead screw 8, but its size such as length can be adjusted according to actual need is nimble, and this application does not do the restriction to this.
In the present embodiment, the first driving assembly and the second driving assembly are not limited to the structure shown in fig. 1, and may have other structural forms, which will be described in detail below.
In other embodiments of the present application, referring to fig. 2, the first driving assembly includes a first magnet 12, a first slider 13 and a first slide rail 14, and the first slider 13 is provided with a first coil, which may form a slider with a coil. The second driving assembly is connected with the first magnet 12, and the heat sink 2 is connected with the first slider 13. The first magnet 12 is connected to one end of the first slide rail 14, and the first slider 13 is slidably disposed on the first slide rail 14. When a first current is applied to the first coil, the first slider 13 moves along the first slide rail 14 in a direction approaching the first magnet 12; when the first coil is energized with the second current, the first slider 13 moves along the first slide rail 14 in a direction away from the first magnet 12. Optionally, the first magnet 12 is a permanent magnet.
The first magnet 12 is capable of generating a permanent magnetic field.
After being electrified, the first coil cooperates with the first magnet 12, i.e. the first coil can generate driving force for the movement of the first slider 13 on the first slide rail 14.
By controlling the direction of the current passing through the first coil, and changing the stress condition of the first slider 13 in the magnetic field according to the characteristics of like mutual repulsion and opposite attraction, the first slider 13 can slide on the first slide rail 14, so that the heat sink 2 can be driven to move in a first direction (the X-axis direction or the transverse direction in fig. 2).
Wherein the first current is in an opposite direction to the second current.
In this way, the first coil can generate magnetic fields in different directions, so that the first coil and the permanent magnetic field of the first magnet 12 form the condition of like polarity repulsion and opposite polarity attraction.
Furthermore, the displacement distance of the first slider 13 on the first slide rail 14 can be adjusted by controlling the magnitudes of the first current and the second current, so that the heat sink 2 can be driven to move to a target position in, for example, a first direction.
The first coil may be wound around an outer wall of the first slider 13, for example, and is integrated with the first slider 13.
The first sliding block 13 may be made of a plastic material or a metal material, which is not limited in this application.
Optionally, the heat sink 2 is fixedly connected to the first slider 13. In this way, the first slider 13 can move to move the heat sink 2 synchronously.
For example, the first sliding block 13 is fixedly connected to the heat sink 2 by at least one fastener, such as a screw, a bolt, etc., which is not limited in this application.
For another example, the first slider 13 is fixedly connected to the heat sink 2 by welding.
Of course, the heat sink 2 and the first slider 13 may be detachably connected, so that the heat sink 2 is easily replaced.
Optionally, a first stop 15 is disposed at an end of the first slide 14 away from the first magnet 12.
The first stopper 15 is, for example, a stopper.
The first stop member 15 can be used to limit the maximum travel of the first slider 13 on the first slide rail 14, and also prevent the first slider 13 from slipping off the first slide rail 14, so as to ensure that the heat sink 2 can move normally in the first direction.
Referring to fig. 2, in this embodiment, the second driving assembly is similar in structure to the first driving assembly except that the second driving assembly is arranged in a different direction, and is used for driving the heat sink 2 to move in a second direction.
For example, referring to fig. 2, the second driving assembly includes a second magnet 16, a second slider 17 and a second slide rail 18, and a second coil is disposed on the second slider 17. The second magnet 16 is fixedly arranged on the housing 1, and the second slider 17 is connected with the first slide rail 14. The second magnet 16 is connected to one end of the second slide rail 18, and the second slider 17 is slidably disposed on the second slide rail 18. When a third current is applied to the second coil, the second slider 17 moves along the second slide rail 18 in a direction approaching the second magnet 16. When the second coil is energized with a fourth current, the second slider 17 moves along the second slide rail 18 in a direction away from the second magnet 16. The second magnet 16 may be the same as the first magnet 12, such as a permanent magnet.
The second magnet 16 is capable of generating a permanent magnetic field.
After the second coil is energized, it cooperates with the second magnet 16, i.e. it can generate a driving force for the movement of the second slider 17 on the second slide rail 18.
By controlling the direction of the current passing through the second coil, and changing the stress condition of the second slider 17 in the magnetic field according to the characteristics of like mutual repulsion and opposite attraction, the second slider 17 can slide on the second slide rail 18, so that the first driving assembly and the heat sink 2 can be driven to move in a second direction (Y-axis direction or longitudinal direction in fig. 2).
Wherein the third current is in an opposite direction to the fourth current.
In this way, the second coil can generate magnetic fields in different directions, so as to form the condition of like polarity repulsion and opposite polarity attraction with the permanent magnetic field of the second magnet 16.
Furthermore, the displacement distance of the second slider 17 on the second slide rail 18 can be adjusted by controlling the magnitudes of the third current and the fourth current, so that the heat sink 2 can be driven to move to a target position in, for example, a second direction.
The second coil may be wound around an outer wall of the second slider 17, for example.
The second sliding block 17 may be made of a plastic material or a metal material, which is not limited in this application. The material of the second sliding block 17 may be the same as or different from the material of the first sliding block 13, and those skilled in the art can flexibly set the material according to specific situations.
It should be noted that specific magnitudes and directions of the first current, the second current, the third current, and the fourth current may be adjusted by those skilled in the art according to actual needs, and this is not limited in this application.
Optionally, the first slide rail 14 of the first driving assembly is fixedly connected with the second slide block 17. In this way, the second slider 17 can carry the whole first driving assembly to move in the second direction (the longitudinal direction or Y-axis direction shown in fig. 2), so that the heat dissipation member 2 connected with the first driving assembly can be carried to move in the second direction, and the final purpose is to realize the position adjustment of the heat dissipation member 2 in the second direction.
Optionally, a second stop 19 is provided at an end of the second slide rail 18 remote from the second magnet 16.
The second stop 19 may be identical to the first stop 15, for example a stop.
The second stop member 19 can be used to limit the maximum travel of the second slider 17 on the second slide rail 18, and also can prevent the second slider 17 from slipping off the second slide rail 18, so as to ensure that the first driving assembly connected to the second slider 17 can stably drive the heat sink 2 to move in the second direction, so as to adjust the position of the heat sink 2 in the second direction.
For example, a groove is formed on the first slide rail 14, a steel ball is arranged at the moving end of the first slider 13, the steel ball is embedded in the groove and can slide in the groove, and the first slider 13 can slide on the first slide rail 14. Thus, the steel ball slide rail structure is formed, and has the characteristics of easy disassembly and assembly and smoothness and soundless motion.
The second slider 17 may have the same structure as the first slider 13, and the second slide rail 18 may have the same structure as the first slide rail 14. The second slide block 17 and the second slide rail 18 also form a structural form of a steel ball slide rail.
Referring to fig. 2, the embodiment can also achieve the effect of adjusting the position of the heat sink 2, thereby achieving efficient heat dissipation. The electromagnetic drive is utilized, and the electromagnetic drive has the characteristics of sensitive response, high control precision, small volume and light weight.
In some embodiments of the present application, referring to fig. 1 and 2, the heat sink 2 is a vapor chamber.
The vapor chamber has excellent heat-conducting property, heat generated by a heat source in the electronic equipment is transmitted to the evaporation end of the vapor chamber, and the internal condensate liquid quickly absorbs the heat and is converted into gas to absorb the heat; the gas is diffused to the condensation end under the driving of vapor pressure, is condensed into liquid and releases heat, and finally flows back to the evaporation end through the capillary structure. That is, the condensate is circulated in a 'gas-liquid/heat absorption-heat release' mode uninterruptedly, so that the high-efficiency heat conduction is realized, and the effect of reducing the temperature of a heat source is finally achieved.
Wherein, a heat-conducting gel layer is arranged on the bottom surface of the soaking plate.
The bottom of the soaking plate is coated with heat-conducting gel which has strong fluidity and is beneficial to heat conduction.
In some embodiments of the present application, the electronic device further includes a display screen and a rear cover, and the housing 1 is connected between the display screen and the rear cover.
The heat dissipation member 2 is arranged inside the electronic device, and the heat dissipation member 2 can be driven by the first driving assembly and/or the second driving assembly to move in position, so that efficient heat dissipation is realized, and the electronic device is prevented from generating heat seriously.
The housing 1 is, for example, a middle frame of an electronic device, and the housing 1 and the rear cover may form an outer shell of the electronic device. The display screen is used for displaying information of the electronic equipment.
The electronic device provided by the embodiment of the application is, for example, a smart phone, a tablet computer, a notebook computer, and the like, and the specific type of the electronic device is not limited in the application.
The application also provides a heat dissipation method, and the heat dissipation method is applied to the electronic equipment.
The heat dissipation method provided by the embodiment of the application comprises the following steps:
and S1, determining the heat generation area of the electronic equipment.
For example, the system collects the temperature inside the electronic device from a temperature sensor (NTC) integrated within the electronic device and identifies heat generating areas.
S2, when the heat dissipation member 2 is not located in the heat generation region, activating the driving mechanism (e.g., at least one of the first driving component and the second driving component) to move the heat dissipation member 2 to the heat generation region for heat dissipation.
Wherein, the system will judge whether the heat sink 2 covers the heating area first.
If the heat dissipation member 2 just covers the heating area, the heat dissipation member 2 can directly perform heat dissipation processing on the heating area, and at this time, the heat dissipation member 2 does not need to be driven and controlled to move in the electronic device.
If the heat dissipation member 2 does not cover the heat generation area, the relative distances Δ x and Δ y between the heat dissipation member 2 and the heat generation area need to be obtained (see fig. 1 and 2); the heat sink 2 is moved by the first drive assembly in the X-axis direction (i.e., laterally) by a distance ax, and the first drive assembly together with the heat sink 2 is moved by the second drive assembly in the Y-axis direction (i.e., longitudinally) by a distance ay. By adjusting the position of the heat radiating member 2 through this process, the heat generating area can be effectively covered.
Wherein, the heat sink 2 is selected to adopt a soaking plate.
When adjusting the position of the heat sink 2, the adjustment is not limited to the adjustment in the X direction and then the adjustment in the Y direction. The Y direction may be adjusted first and then the X direction, or only one of the two directions may be adjusted, which is related to the relative position of the heat dissipation member and the heat generation region, and this is not limited in this application.
S3, moving the heat sink 2 to a low temperature region to release heat after the temperature of the heat generating region is lowered to a target temperature, wherein the temperature of the low temperature region is lower than the target temperature.
For example, a temperature value of the heat-generating region is collected by a temperature sensor (i.e., NTC) in the electronic device, and when the heat-generating region is lowered to a target temperature and maintained at the target temperature for a certain period of time, the heat-dissipating member 2 may be moved to other lower temperature positions, so that the heat-dissipating member 2 can perform rapid heat dissipation.
The heat dissipation method can meet the heat dissipation requirements of heat sources at different positions in the electronic equipment.
Other configurations and operations of the electronic device according to the embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An electronic device, comprising:
the shell is internally provided with an accommodating space;
the heat dissipation piece is arranged in the accommodating space; and
the driving mechanism is arranged in the accommodating space and connected with the heat dissipation piece, and the heat dissipation piece can move in the accommodating space under the driving of the driving mechanism.
2. The electronic device of claim 1, the drive mechanism comprising: a first drive assembly and a second drive assembly;
the first driving assembly is connected with the second driving assembly, the first driving assembly is connected with the heat dissipation member, and the second driving assembly is connected with the shell;
the first driving assembly drives the heat dissipation member to move in a first direction relative to the housing, the second driving assembly drives the first driving assembly, and the first driving assembly drives the heat dissipation member to move in a second direction relative to the housing.
3. The electronic device of claim 2, wherein the first driving assembly comprises a first motor, a first lead screw, and a first connector;
the second driving assembly is connected with the first motor, and the heat dissipation member is connected with the first connecting member;
the first motor is in transmission connection with one end of the first lead screw, the first connecting piece is movably arranged on the first lead screw and in threaded fit with the first lead screw, the first motor drives the first lead screw to rotate, and the first lead screw drives the first connecting piece to move along the first lead screw.
4. The electronic device of claim 3, wherein the second driving assembly comprises a second motor, a second lead screw, and a second connector;
the second motor is fixedly arranged on a supporting piece, the supporting piece is connected with the shell, and the second connecting piece is fixedly connected with the first motor;
the second motor is in transmission connection with one end of the second lead screw, the second connecting piece is movably arranged on the second lead screw and in threaded fit with the second lead screw, the second motor drives the second lead screw to rotate, and the second lead screw drives the second connecting piece to move along the second lead screw.
5. The electronic device according to claim 4, wherein a first stopper is disposed at an end of the first lead screw away from the first motor; and/or the presence of a gas in the gas,
and a second limiting part is arranged at one end of the second lead screw, which is far away from the second motor.
6. The electronic device of claim 2, wherein the first driving assembly comprises a first magnet, a first slider and a first slide rail, and a first coil is disposed on the first slider;
the second driving assembly is connected with the first magnet, and the heat dissipation piece is connected with the first sliding block;
the first magnet is connected with one end of the first slide rail, and the first slide block is slidably arranged on the first slide rail;
when the first coil is electrified with a first current, the first sliding block moves towards the direction close to the first magnet along the first sliding rail;
when the first coil is electrified with a second current, the first sliding block moves along the first sliding rail in a direction away from the first magnet.
7. The electronic device of claim 6, wherein the second driving assembly comprises a second magnet, a second slider and a second slide rail, and a second coil is disposed on the second slider;
the second magnet is fixedly arranged on the shell, and the second sliding block is connected with the first sliding rail;
the second magnet is connected with one end of the second slide rail, and the second slide block is slidably arranged on the second slide rail;
when a third current is conducted to the second coil, the second slider moves towards the direction close to the second magnet along the second slide rail;
and under the condition that the second coil is electrified with fourth current, the second sliding block moves along the second sliding rail in the direction away from the second magnet.
8. The electronic device of claim 7, wherein an end of the first sliding rail away from the first magnet is provided with a first stop; and/or
And a second stop piece is arranged at one end, far away from the second magnet, of the second slide rail.
9. The electronic device of claim 1, wherein the heat sink is a heat spreader.
10. A heat dissipation method applied to the electronic device according to any one of claims 1 to 9, the heat dissipation method comprising:
determining a heat generation area of the electronic device;
when the heat dissipation piece is not positioned in the heating area, the driving mechanism is started, and the heat dissipation piece is moved to the heating area for heat dissipation;
after the temperature of the heat generation region is reduced to a target temperature, the heat sink is moved to a low temperature region, which is lower than the target temperature, to release heat.
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| CN202111089827.0A CN113677170A (en) | 2021-09-16 | 2021-09-16 | Electronic device and heat dissipation method |
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