CN113675182B - Planar optical coupling device and method for manufacturing the same - Google Patents

Abstract

The invention discloses a planar optical coupling device and a manufacturing method thereof. The insulating pad sets up on first base island, and the receipts optical chip sets up on the insulating pad, and light guide structure sets up on receiving optical chip, and the luminescence chip sets up on light guide structure, and first pin electric connection is in the positive pole of luminescence chip, and second pin electric connection is in the negative pole of luminescence chip, and first MOSFET chip sets up on first base island and electric connection is in receiving optical chip, and first MOSFET chip and insulating pad are the setting of separating, and encapsulation layer cladding luminescence chip and first MOSFET chip. Therefore, the light transmission efficiency can be effectively improved, and the working stability of the device under a high-voltage state is improved.

Description

Planar optical coupling device and manufacturing method thereof

technical field

The invention relates to the technical field of photocouplers, in particular to a planar photocoupler and a manufacturing method thereof.

Background technique

Optical coupler (optical coupler equipment), also known as photoelectric isolator or optocoupler, referred to as optocoupler, is a device that uses light as a medium to transmit electrical signals. Usually, a light-emitting chip (such as a light-emitting diode LED) and a light-receiving chip ( Such as photosensitive semiconductor tubes, photoresistors) are packaged in the same housing. When the input terminal is powered on, the light-emitting chip will emit light, and the light-receiving chip will generate photocurrent after receiving the light, which flows out from the output terminal, thus realizing the "electricity-optical-electricity" control. The optocoupler, which uses light as a medium to couple the input signal to the output, has the advantages of small size, long life, no contact, strong anti-interference ability, insulation between output and input, and one-way signal transmission. widely used in circuits.

Optocouplers with MOSFET functions are gaining more and more attention, and are mostly used in power management and other aspects. For example, they are used as internal photorelays in charging piles or transformers. Traditional optocouplers with MOSFET functions mainly include up-down opposition type and planar type.

As shown in Figure 1, the light-emitting chip 1 and the light-receiving chip 2 of the up-and-down opposed optocoupler are respectively placed at both ends of the upper and lower brackets, and the MOSFET chip 3 is set in the non-light-receiving area, which has light transmission The inner plastic sealant encapsulates and covers the light-emitting chip 2 and the light-emitting chip 1. Since the light-emitting chip 1 and the light-receiving chip 2 need to be covered by an inner plastic sealant with a light transmittance not greater than 25%, the light beam of the light-emitting chip 1 will The substantial reduction makes the efficiency of the light-receiving chip 2 poor, thereby reducing the overall performance of the product.

As shown in Figure 2, the traditional planar photocoupler needs to set a false support part 5 (False Lead) between the two output pins 6 and 7 to connect the base island and the frame body, otherwise there will be floating )state. Since the MOSFET optocoupler is usually operated at high voltage (250V-600V), the false support portion 5 between the two output pins is likely to cause flashover at the high voltage terminal, resulting in functional failure of the entire product.

Therefore, the main purpose of the present invention is to provide a planar optical coupling device and its manufacturing method to solve the above problems.

Contents of the invention

The object of the present invention is to provide a planar optical coupling device and its manufacturing method, which can effectively improve the light transmission efficiency and improve the working stability of the device under high voltage conditions.

In order to achieve at least one of the above advantages or other advantages, an embodiment of the present invention proposes a planar optical coupling device, which includes a first base island, an insulating spacer, a light-receiving chip, a light-guiding structure, a light-emitting chip, The first pin, the second pin, the first MOSFET chip and the packaging layer.

The insulating spacer is disposed on the first base island, the light-receiving chip is disposed on the insulating spacer, the light-guiding structure is disposed on the light-receiving chip, the light-emitting chip is disposed on the light-guiding structure, and the first pin is electrically connected to the light-emitting chip The positive pole of the light-emitting chip is electrically connected to the second pin, and the first MOSFET chip is arranged on the first base island and electrically connected to the light-receiving chip. The first MOSFET chip is separated from the insulating gasket, and the packaging The layer covers the light emitting chip and the first MOSFET chip.

In some embodiments, the light guide structure may be a light guide glass or a light guide plate.

In some embodiments, the encapsulation layer is made of opaque material.

In some embodiments, the planar optical coupling device further includes a second base island and a second MOSFET chip, the second base island is separated from the first base island, and the second MOSFET chip is set on the second base island and electrically connected to the light-receiving chip.

In some embodiments, the planar optical coupling device further includes a first bonding wire, a second bonding wire, a third bonding wire, a fourth bonding wire, a fifth bonding wire, a sixth bonding wire, and a seventh bonding wire , the two ends of the first bonding wire are respectively connected to the anode of the light-emitting chip and the first pin, and the two ends of the second bonding wire are respectively connected to the negative electrode of the light-emitting chip and the second pin , both ends of the third bonding wire are respectively connected to the first base island and the source of the first MOSFET chip, and both ends of the fourth bonding wire are respectively connected to the first base island and the first MOSFET chip The source electrodes of two MOSFET chips, the two ends of the fifth bonding wire are respectively connected to the first base island and the light-receiving chip, and the two ends of the sixth bonding wire are respectively connected to the gate of the first MOSFET chip pole and the light-receiving chip, and both ends of the seventh bonding wire are respectively connected to the gate of the second MOSFET chip and the light-receiving chip.

In some embodiments, the first bonding wire, the second bonding wire, the third bonding wire, the fourth bonding wire, the fifth bonding wire, the sixth bonding wire, and the The seventh bonding wires are all gold wires.

In order to achieve at least one of the above advantages or other advantages, another embodiment of the present invention further proposes a method for manufacturing a planar optical coupling device. The method for manufacturing a planar optical coupling device includes the following steps: The chip and the first MOSFET chip are placed on the first base island; an insulating gasket is placed between the light-receiving chip and the first base island; a light-guiding structure and a light-emitting chip are sequentially placed above the light-receiving chip; the first MOSFET The chip is electrically connected with the light-receiving chip; and packaged.

Further, after the step of electrically connecting the first MOSFET chip and the light-receiving chip, the following steps are further included: setting a second base island, and the second base island is separated from the first base island; A second MOSFET chip is placed on the second base island, and the second MOSFET chip is electrically connected to the light-receiving chip.

Therefore, using a planar optical coupling device and its manufacturing method provided by the present invention, the design of the planar bracket can effectively improve the light transmission efficiency compared with the traditional up-and-down optocoupler; By setting the insulating spacer, the light-receiving chip and the first MOSFET chip are arranged on the same base island. Compared with the traditional planar optocoupler, the effect of isolation of the light-receiving chip can be achieved without further The false support part is set to avoid the problem of product failure under high pressure operation and ensure the working stability of the product under high pressure.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the preferred embodiments are listed below, and in conjunction with the accompanying drawings, the detailed description is as follows.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic diagram of a cross-sectional structure of a conventional up-and-down opposed optocoupler;

Fig. 2 is a schematic plan view of a conventional planar optocoupler;

Fig. 3 is a schematic cross-sectional structure diagram of a planar optical coupling device of the present invention;

Fig. 4 is a schematic plan view of the planar optical coupling device of the present invention; and

FIG. 5 is a schematic flowchart of a method for manufacturing a planar optical coupling device of the present invention.

Reference signs:

10-planar optical coupling device; 11-first base island; 12-second base island; 14-insulating gasket; 16-light-receiving chip; 18-light guiding structure; 20-light-emitting chip; 21-first lead 22-the second pin; 31-the first MOSFET chip; 32-the second MOSFET chip; 40-packaging layer; 51-the first bonding wire; 52-the second bonding wire; 53-the third bonding wire; 54 - fourth bonding wire; 55 - fifth bonding wire; 56 - sixth bonding wire; 57 - seventh bonding wire; 60 - output.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In describing the present invention, it should be understood that the terms "central", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer" and so on is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or positional relationship. Components must have a particular orientation, or be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, the term "comprising" and any variations thereof mean "comprising at least".

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. The connection, or integrally formed connection; can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "an" are intended to include the plural unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" and/or "comprising" as used herein specify the presence of stated features, integers, steps, operations, units and/or components, but do not exclude the presence or addition of one or more Other features, integers, steps, operations, units, components and/or combinations thereof.

Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a schematic cross-sectional view of the planar optical coupling device 10 of the present invention, and FIG. 4 is a schematic plan view of the planar optical coupling device 10 of the present invention. It should be noted that the encapsulation layer 40 is omitted in FIG. 4 to clearly express the illustrated content. In order to achieve at least one of the above advantages or other advantages, an embodiment of the present invention provides a planar optical coupling device 10 . As shown in the figure, the planar optical coupling device 10 includes a first base island 11, an insulating spacer 14, a light-receiving chip 16, a light-guiding structure 18, a light-emitting chip 20, a first pin 21, a second pin 22, The first MOSFET chip 31 and the encapsulation layer 40 .

The insulating spacer 14 is disposed on the first base island 11 , and is mainly used for electrically isolating the light-receiving chip 16 and the first base island 11 . The light-receiving chip 16 is disposed on the insulating spacer 14 for receiving the light emitted by the light-emitting chip 20 . The light guiding structure 18 is disposed on the light-receiving chip 16 for guiding the light emitted by the light-emitting chip 20 to irradiate the light-receiving chip 16 . The light emitting chip 20 is disposed on the light guide structure 18 , the first pin 21 is electrically connected to the positive pole of the light emitting chip 20 , and the second pin 22 is electrically connected to the negative pole of the light emitting chip 20 . The first MOSFET chip 31 is arranged on the first base island 11 and electrically connected to the light-receiving chip 16. After the first MOSFET chip 31 receives the output voltage of the light-receiving chip 16, it will be converted into a current, and then the output terminal 60 Output current, and can act as a switch, which helps to achieve unidirectional conduction of the circuit. The first MOSFET chip 31 is separated from the insulating spacer 14 , in other words, there is a certain distance between the first MOSFET chip 31 and the insulating spacer 14 and the components placed on the insulating spacer 14 . The encapsulation layer 40 covers the light-emitting chip 20 and the first MOSFET chip 31 to play functions of light blocking and protection.

The working principle of the planar optical coupling device 10 is as follows: when the first pin 21 and the second pin 22 are energized, the light-emitting chip 20 will emit light, and the light will irradiate to the light-receiving chip 16 through the light-guiding structure 18 to receive light. After the chip 16 is irradiated by light, it converts the energy of the received light into electrical energy to generate a photovoltage, which will be applied to the first MOSFET chip 31 to drive the first MOSFET chip 31 to operate, and then output current from the output terminal 60 .

In an embodiment, as shown in FIG. 4 , the planar optical coupling device 10 further includes a second base island 12 and a second MOSFET chip 32 . The second base island 12 is set apart from the first base island 11 , in other words, there is a certain distance between the first base island 11 and the second base island 12 . The second MOSFET chip 32 is disposed on the second base island 12 and is electrically connected to the light-receiving chip 16 . The purpose of the second MOSFET chip 32 is basically the same as that of the first MOSFET chip 31 , and will not be repeated here. With the arrangement of the second MOSFET chip 32 , the planar optical coupling device 10 can have the function of a bidirectional switch.

To further illustrate, the components of the planar optical coupling device 10 may be electrically connected by bonding wires. Specifically, as shown in FIG. 4, the planar optical coupling device 10 also includes a first bonding wire 51, a second bonding wire 52, a third bonding wire 53, a fourth bonding wire 54, a fifth bonding wire 55, a sixth bonding wire the bonding wire 56 , and the seventh bonding wire 57 . Both ends of the first bonding wire 51 are respectively connected to the anode of the light emitting chip 20 and the first pin 21 . Two ends of the second bonding wire 52 are respectively connected to the cathode of the light emitting chip 20 and the second pin 22 . Both ends of the third bonding wire 53 are respectively connected to the source of the first base island 11 and the first MOSFET chip 31 . Both ends of the fourth bonding wire 54 are respectively connected to the source of the first base island 11 and the second MOSFET chip 32 . Two ends of the fifth bonding wire 55 are respectively connected to the first base island 11 and the light-receiving chip 16 .

Both ends of the sixth bonding wire 56 are respectively connected to the gate of the first MOSFET chip 31 and the light receiving chip 16 .

Both ends of the seventh bonding wire 57 are respectively connected to the gate of the second MOSFET chip 32 and the light receiving chip 16 . In an embodiment, the above-mentioned bonding wires may be made of gold wires, which have good electrical conductivity. In one embodiment, the light-receiving chip 16 has a plurality of gates and one source, and the two ends of the fifth bonding wire 55 are respectively connected to the first base island 11 and the source of the light-receiving chip 16, serving as a ground wire to improve safety. property; the two ends of the sixth bonding wire 56 are respectively connected to the gate of the first MOSFET chip 31 and a gate of the light-receiving chip 16 to drive the first MOSFET chip 31; the two ends of the seventh bonding wire 57 are respectively connected to the second The gate of the MOSFET chip 32 and the other gate of the light-receiving chip 16 are used to drive the second MOSFET chip 32 . The first MOSFET chip 31 and the second MOSFET chip 32 can be respectively driven by the multi-gate arrangement of the light-receiving chip 16 to meet usage requirements.

It should be added that the grid is also called G (Gate), which is used as the control electrode. The drain is also called the D pole (Drain), as the supply electrode. The source is also called S pole (Source), as the output pole.

Please refer to FIG. 5 in conjunction with FIG. 3 and FIG. 4 . FIG. 5 is a schematic flowchart of a manufacturing method of the planar optical coupling device 10 of the present invention. In order to achieve at least one of the above advantages or other advantages, another embodiment of the present invention further proposes a method for manufacturing the planar optical coupling device 10 . As shown in the figure, the manufacturing method of the planar optical coupling device 10 includes the following steps:

S100: placing the light-receiving chip and the first MOSFET chip on the first base island;

S200: placing an insulating gasket between the light-receiving chip and the first base island;

S300: Place the light guide structure and the light emitting chip in sequence above the light receiving chip;

S400: electrically connecting the first MOSFET chip to the light-receiving chip;

S500: Perform encapsulation processing.

To further illustrate, the insulating spacer 14 provided in step S200 is separated from the first MOSFET chip 31 by a certain distance. The following steps may also be included between step S400 and step S500: setting the second base island 12; then, placing the second MOSFET chip 32 on the second base island 12, and combining the second MOSFET chip 32 with the light-receiving chip 16 electrical connections. Wherein, the second base island 12 is set apart from the first base island 11 , in other words, there is a certain distance between the first base island 11 and the second base island 12 . In step S500 , encapsulation may be performed by encapsulating the light-emitting chip 20 and the first MOSFET chip 31 with the encapsulation layer 40 .

In one embodiment, the electrical connection method between the components includes: respectively connecting the two ends of the first bonding wire 51 to the anode of the light-emitting chip 20 and the first pin 21; connecting the two ends of the second bonding wire 52 to Connect the negative electrode of the light-emitting chip 20 to the second pin 22; connect the two ends of the third bonding wire 53 to the source of the first base island 11 and the first MOSFET chip 31 respectively; connect the two ends of the fourth bonding wire 54 to The first base island 11 and the source of the second MOSFET chip 32; the two ends of the fifth bonding wire 55 are respectively connected to the first base island 11 and the light-receiving chip 16; the two ends of the sixth bonding wire 56 are respectively connected to the first The gate of the MOSFET chip 31 and the light-receiving chip 16 ; the two ends of the seventh bonding wire 57 are respectively connected to the gate of the second MOSFET chip 32 and the light-receiving chip 16 .

In any of the above-mentioned embodiments, the light guide structure 18 may be a light guide glass or a light guide plate, so as to play a good role in light guide. In any of the above-mentioned embodiments, the encapsulation layer 40 may be made of an opaque material, and under the function of encapsulation protection, the light emitted by the light-emitting chip 20 is prevented from scattering.

In summary, using a planar optical coupling device 10 and its manufacturing method provided by the present invention, the design of the planar support can effectively improve the optical coupling compared with the traditional up-and-down photocoupler. transmission efficiency. By setting the insulating spacer 14, the light-receiving chip 16 and the first MOSFET chip 31 are arranged on the same base island. Compared with the traditional planar photocoupler, the light-receiving chip 16 can be isolated (Isolation ) effect, there is no need to set up false support parts, thereby avoiding the problem of product failure under high-pressure operation, and ensuring the working stability of the product under high-pressure conditions.

Although terms such as MOSFET chips, optocouplers, and base islands are frequently used in this article, the possibility of using other terms is not excluded. These terms are used only for the purpose of describing and explaining the essence of the present invention more conveniently; interpreting them as any kind of additional limitation is against the spirit of the present invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (10)

1. A planar light coupling device, the planar light coupling device comprising:

a first island;

the insulating gasket is arranged on the first base island;

the light receiving chip is arranged on the insulating gasket;

the light guide structure is arranged on the light receiving chip;

the light-emitting chip is arranged on the light guide structure;

the first pin is electrically connected to the positive electrode of the light-emitting chip;

the second pin is electrically connected to the negative electrode of the light-emitting chip;

the first MOSFET chip is arranged on the first base island and is electrically connected with the light receiving chip, and the first MOSFET chip and the insulating gasket are arranged in a spaced mode; and

and the packaging layer is used for coating the light-emitting chip and the first MOSFET chip.

2. The planar light coupling device as claimed in claim 1 wherein the light guiding structure is a light guiding glass or a light guiding plate.

3. The planar light coupling device as claimed in claim 1 wherein the encapsulation layer is made of an opaque material.

4. The planar lightcoupling device of claim 1, further comprising a second island and a second MOSFET die, the second island being spaced apart from the first island, the second MOSFET die being disposed on the second island and electrically connected to the light receiving die.

5. The planar light coupling device according to claim 4, further comprising a first bonding wire, a second bonding wire, a third bonding wire, a fourth bonding wire, a fifth bonding wire, a sixth bonding wire, and a seventh bonding wire, wherein two ends of the first bonding wire are respectively connected to the positive electrode of the light emitting chip and the first pin, two ends of the second bonding wire are respectively connected to the negative electrode of the light emitting chip and the second pin, two ends of the third bonding wire are respectively connected to the first island and the source electrode of the first MOSFET chip, two ends of the fourth bonding wire are respectively connected to the first island and the source electrode of the second MOSFET chip, two ends of the fifth bonding wire are respectively connected to the first island and the light receiving chip, two ends of the sixth bonding wire are respectively connected to the gate electrode of the first MOSFET chip and the light receiving chip, and two ends of the seventh bonding wire are respectively connected to the gate electrode of the second MOSFET chip and the light receiving chip.

6. The planar light coupling device according to claim 5, wherein the first bonding wire, the second bonding wire, the third bonding wire, the fourth bonding wire, the fifth bonding wire, the sixth bonding wire, and the seventh bonding wire are gold wires.

7. A method of manufacturing a planar optical coupling device, comprising the steps of:

placing a light receiving chip and a first MOSFET chip on a first base island;

placing an insulating gasket between the light receiving chip and the first base island;

a light guide structure and a light emitting chip are sequentially arranged above the light receiving chip;

electrically connecting the first MOSFET chip with the light receiving chip; and

and (5) packaging.

8. The method of manufacturing a planar light coupling device according to claim 7, further comprising, after the step of electrically connecting the first MOSFET chip to the light receiving chip, the steps of:

setting a second base island, wherein the second base island is arranged at a distance from the first base island;

and placing a second MOSFET chip on the second base island, and electrically connecting the second MOSFET chip with the light receiving chip.

9. The method of manufacturing a planar light coupling device according to claim 7, wherein the light guiding structure is a light guiding glass or a light guiding plate.

10. The method of manufacturing a planar light coupling device according to claim 7, wherein an encapsulation layer is formed after the encapsulation process, the encapsulation layer being made of an opaque material.

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