CN113654552B - A MEMS inertial measurement device capable of withstanding large overloads - Google Patents
A MEMS inertial measurement device capable of withstanding large overloads Download PDFInfo
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- 238000005259 measurement Methods 0.000 title claims abstract description 41
- 238000013016 damping Methods 0.000 claims abstract description 40
- 238000012545 processing Methods 0.000 claims abstract description 17
- 238000004382 potting Methods 0.000 claims abstract description 16
- 230000008093 supporting effect Effects 0.000 claims abstract description 13
- 230000005484 gravity Effects 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- MEKOFIRRDATTAG-UHFFFAOYSA-N 2,2,5,8-tetramethyl-3,4-dihydrochromen-6-ol Chemical compound C1CC(C)(C)OC2=C1C(C)=C(O)C=C2C MEKOFIRRDATTAG-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 10
- 239000000565 sealant Substances 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/166—Mechanical, construction or arrangement details of inertial navigation systems
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Abstract
本发明公开了一种能抗大过载的MEMS惯性测量装置，包括基座以及位于基座上的支架组件、减振垫和支撑螺钉，支架组件包括支架、处理板、芯片和灌封胶层，处理板固定于支架上且与多个芯片连接，灌封胶层填充于支架与多个芯片的空隙处以使每一个芯片悬浮安装在基座上；支撑螺钉依次穿设于支架及减振垫与基座连接，减振垫设于基座与支架的接触位置处。该能抗大过载的MEMS惯性测量装置的目的是解决现有的MEMS惯性测量装置抗过载能力不足的问题。
The present invention discloses a MEMS inertial measurement device capable of resisting large overload, comprising a base and a bracket assembly, a vibration-damping pad and a supporting screw located on the base, wherein the bracket assembly comprises a bracket, a processing board, a chip and a potting glue layer, wherein the processing board is fixed on the bracket and connected to a plurality of chips, and the potting glue layer is filled in the gap between the bracket and the plurality of chips so that each chip is suspended and mounted on the base; the supporting screws are sequentially passed through the bracket and the vibration-damping pad and connected to the base, and the vibration-damping pad is arranged at the contact position between the base and the bracket. The purpose of the MEMS inertial measurement device capable of resisting large overload is to solve the problem of insufficient overload resistance of existing MEMS inertial measurement devices.
Description
Technical Field
The invention relates to the technical field of MEMS inertial measurement devices, in particular to a MEMS inertial measurement device capable of resisting large overload.
Background
The micro-electro-mechanical system (MEMS) based inertial measurement device and the inertial measurement system are the best choices meeting the requirements under the condition of specific precision requirements, and compared with the traditional inertial measurement assembly, the inertial measurement device has the characteristics of small volume and weight, high reliability, long service life and the like. The MEMS inertial measurement device, although having a strong resistance to vibration and impact, is still not directly applicable in high overload environments.
In view of the foregoing, it is highly desirable to provide a MEMS inertial measurement unit that is resistant to large overloads.
Disclosure of Invention
First, the technical problem to be solved
The invention aims to provide an MEMS inertial measurement device capable of resisting large overload so as to solve the technical problem that the existing MEMS inertial measurement device is insufficient in overload resistance.
(II) technical scheme
The invention provides an MEMS inertial measurement device capable of resisting large overload, which comprises a base, a bracket assembly, a vibration reduction pad and supporting screws, wherein the bracket assembly is positioned on the base, the bracket assembly comprises a bracket, a processing plate, chips and a potting adhesive layer, the processing plate is fixed on the bracket and connected with a plurality of the chips, the potting adhesive layer is filled in the gap between the bracket and the chips to enable each chip to be mounted on the base in a suspended manner, the supporting screws sequentially penetrate through the bracket and the vibration reduction pad and are connected with the base, and the vibration reduction pad is arranged at the contact position of the base and the bracket.
Further, the support is hollow polygon prism, a plurality of chips are located the outside of support, the processing board is fixed in the top opening part of support, at least one edges and corners department of support all pass through the damping pad with the pedestal connection.
Further, the plurality of chips comprise an accelerometer chip and a gyro chip, the accelerometer chip and the gyro chip are respectively fixed on corresponding circuit boards, and the circuit boards are connected with the processing board.
Further, the circuit board is connected with the processing board in a floating manner.
Further, the accelerometer chip and the gyro chip are three.
Further, the support screw is screw-coupled to the base and is used to adjust the elasticity of the vibration-damping pad.
Further, the vibration damping pad comprises a first vibration damping portion, a connecting portion and a second vibration damping portion which are sequentially connected, the first vibration damping portion and the second vibration damping portion are symmetrically arranged at two ends of the connecting portion, and the horizontal plane where the gravity center of the support assembly is located overlaps with the horizontal plane where the gravity center of the vibration damping pad is located.
Further, the four corner portions are located at four corners of the support respectively, the corner portions are boss-shaped, and the first vibration reduction portions and the second vibration reduction portions are located on the upper end face and the lower end face of the corner portions respectively.
Further, the line connecting the intersection of the lines between the two spaced apart corner portions and the center of gravity of the bracket assembly is perpendicular to the base.
Further, the vibration reduction pad is made of super-elastic rubber.
Further, the pouring sealant layer is made of silicone rubber.
(III) beneficial effects
Compared with the prior art, the invention has the following advantages:
According to the MEMS inertial measurement device capable of resisting large overload, vibration reduction of the bracket assembly is achieved through the vibration reduction pad, each chip is used as a whole to move slightly along with the potting adhesive layer under the impact state through the potting adhesive layer, so that the effect of protecting electronic components is achieved, and the large overload resistance is improved through the two-stage vibration reduction mode. Under the environment of large overload outside, the internal devices of the MEMS inertial measurement device are effectively protected, so that the sensitive components work in the sustainable mechanical environment.
Drawings
FIG. 1 is a schematic diagram of a MEMS inertial measurement unit capable of resisting large overload according to an embodiment of the present invention;
FIG. 2 is an exploded view of a MEMS inertial measurement unit with high overload resistance according to an embodiment of the present invention;
FIG. 3 is a graph of performance of a MEMS inertial measurement unit capable of resisting large overloads provided by an embodiment of the present invention;
Fig. 4 is an impact test diagram of a MEMS inertial measurement unit capable of resisting large overload according to an embodiment of the present invention.
In the figure:
1 base, 2 vibration damping pad, 201 first vibration damping part, 202 connecting part, 203 second vibration damping part, 3 supporting screw, 4 support, 401 corner part, 5 processing board, 6 pouring sealant layer, 7 accelerometer chip, 8 gyro chip, 9 circuit board, A ideal waveform upper limit curve, B channel 2 feedback curve, C ideal waveform curve, D ideal waveform lower limit curve, E channel 1 feedback curve.
Detailed Description
The advantages and features of the present invention will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings, in which specific embodiments of the invention are shown and described. It should be noted that the drawings are in a very simplified form and are adapted to non-precise proportions, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the invention.
It should be noted that, in order to clearly illustrate the present invention, various embodiments of the present invention are specifically illustrated by the present embodiments to further illustrate different implementations of the present invention, where the various embodiments are listed and not exhaustive. Furthermore, for simplicity of explanation, what has been mentioned in the previous embodiment is often omitted in the latter embodiment, and therefore, what has not been mentioned in the latter embodiment can be referred to the previous embodiment accordingly.
In order to solve the problems of vibration reduction and installation stress, the existing MEMS inertial measurement assembly adopts different vibration reduction structures, and three vibration reduction modes are basically summarized as follows:
1) A PCB flexible board is adopted, and is installed and fixed in a gluing mode;
2) A common PCB is adopted, slotting is carried out in the PCB, and the connection area of a PCB fixing area and an MEMS chip mounting area is reduced, so that the influence of PCB mounting stress on the MEMS chip is reduced as much as possible;
3) Damping is performed on a damping pad for a bracket on which a MEMS chip is mounted.
The key points of the three structural forms are to solve the vibration reduction and assembly stress problems of the MEMS inertial measurement assembly. From the viewpoint of vibration reduction indexes, the problem of the overload resistance of about 20000g of the MEMS inertial measurement unit cannot be solved.
According to the MEMS inertial measurement device capable of resisting large overload, shown in fig. 1-2, the MEMS inertial measurement device comprises a base 1, a bracket assembly, a vibration reduction pad 2 and a support screw 3, wherein the bracket assembly is positioned on the base 1, the bracket assembly comprises a bracket 4, a processing plate 5, chips and a potting adhesive layer 6, the processing plate 5 is fixed on the bracket 4 and connected with the chips, the potting adhesive layer 6 is filled in a gap between the bracket 4 and the chips to enable each chip to be mounted on the base 1 in a suspended mode, the support screw 3 sequentially penetrates through the bracket 4 and the vibration reduction pad 2 and is connected with the base 1, and the vibration reduction pad 2 is arranged at a contact position between the base 1 and the bracket 4.
In the above embodiment, the weapon system can generate huge impact at the moment of emission, the flexible contact between the base 1 and the bracket 4 is realized through the vibration reduction pad 2, the supporting screw 3 passes through the vibration reduction pad 2 to be in contact with the base 1, and the rigidity of the vibration reduction pad 2 is adjusted by adjusting the length of the supporting screw 3, so that the inertial measurement device achieves the impact isolation effect, the working environment of the measurement assembly is greatly improved, but after the huge impact, all devices can not be ensured to survive and reliably work, so that the potting adhesive layer 6 made of special silicone rubber is used for potting the inside of the measurement system for further improving the impact resistance of electronic devices. It is also well documented in many harsh mechanical tests that encapsulated electronics can operate reliably.
In some alternative embodiments, as shown in fig. 1-2, the support 4 is a hollow polygonal prism, a plurality of chips are located on the outer side of the support 4, the processing board 5 is fixed at the top opening of the support 4, and at least one corner 401 of the support 4 is connected to the base 1 through the vibration-damping pad 2.
Specifically, as shown in fig. 2, the support 4 is a quadrangular prism, so that it has four corner portions 401, and a mounting hole can be formed at each corner portion 401 for mounting the vibration-damping pad 2, and the support screw 3 is inserted into the mounting hole to fix the vibration-damping pad 2 between the support 4 and the base 1, so that the direct contact between the base 1 and the support 4 is prevented when the overload impact is large, and the vibration-damping effect is achieved.
In some alternative embodiments, the plurality of chips includes an accelerometer chip 7 and a gyro chip 8, the accelerometer chip 7 and the gyro chip 8 being respectively secured to corresponding circuit boards 9, the circuit boards 9 being connected to the processing board 5. The accelerometer chip 7 and the gyro chip 8 are arranged on independent circuit boards 9, and the circuit boards 9 are connected through wires for information transmission.
In some alternative embodiments, the circuit board 9 is suspended from the process board 5. Specifically, since the circuit board 9 is fastened to the mounting bracket by a screw, when the temperature changes, the center of the circuit board 9 will slightly deform, and the deformation will cause the MEMS chip to generate stress, so that the sensitive device will drift in zero position along with the temperature. In the scheme, the mounting screw of the circuit board is canceled, the circuit board 9 for mounting the MEMS chip is directly bonded on the bracket 4 by using a special adhesive, when the temperature changes, the circuit board 9 can be freely stretched, distortion cannot occur, the problem of mounting stress caused by temperature influence is avoided, and the problem of complex stress can be solved. The circuit boards 9 are separated from the shell in a rigid connection state, the potting adhesive layers 6 are filled around the circuit boards 9, and under the impact state, each circuit board 9 as a whole moves slightly along with the potting adhesive layers 6, so that the electronic components are protected.
In some alternative embodiments, the accelerometer chip 7 and the gyro chip 8 are each three. In particular, three accelerometer chips 7 and three gyro chips 8 are employed in the design in view of the characteristics of the MEMS inertial device application.
In some alternative embodiments, the support screw 3 is screwed to the base 1 and is used to adjust the elasticity of the vibration-damping pad 2. Specifically, screw holes matched with the supporting screws 3 can be formed in corresponding positions on the base 1, when the vibration reduction pad 2 needs to be extruded, the supporting screws 3 can be screwed down, and when the vibration reduction pad 2 needs to be released, the supporting screws 3 can be unscrewed. So that the elasticity of the vibration damping pad 2 can be freely adjusted, and the vibration damping pad 2 can be pressed or released according to actual needs.
In some alternative embodiments, the vibration damping pad 2 includes a first vibration damping portion 201, a connecting portion 202 and a second vibration damping portion 203 that are sequentially connected, where the first vibration damping portion 201 and the second vibration damping portion 202 are symmetrically disposed at two ends of the connecting portion 203, and a horizontal plane where a center of gravity of the bracket assembly is located overlaps a horizontal plane where a center of gravity of the vibration damping pad 2 is located.
In the above embodiment, the center of gravity of the vibration damping pad 2 installed at the corner 401 is in the same plane with the center of gravity of the bracket assembly, and is uniformly distributed along the plane of the center of gravity, so that disturbance modes such as disturbance and torsion can be avoided as much as possible during operation, good sensitive devices are ensured, and a working environment is ensured, so that the vibration damping effect of the vibration damping pad 2 can reach an optimal state, and meanwhile, the upper and lower bidirectional vibration damping is realized through the first vibration damping portion 201 and the second vibration damping portion 202, so that the vibration damping effect is improved.
In some alternative embodiments, as shown in fig. 1-2, four corner portions 401 are respectively located at four corners of the support 4, the corner portions 401 are in a boss shape, and the first vibration reduction portion 201 and the second vibration reduction portion 202 are respectively located at upper and lower end surfaces of the corner portions 401.
Specifically, the number of the corner portions 401 of the support 4 is not specifically limited, of course, the number of the corner portions 401 is actually determined according to the structural characteristics of the support 4, in general, the support 4 on the base 1 needs at least three corner portions 401 to achieve a stable support effect, the support 4 shown in fig. 1 is similar to a cube, therefore, the support 4 has four corner portions 401, the support assembly is mounted on the base 1 through mounting holes uniformly distributed around, the boss-shaped corner portions 401 are convenient for mounting the support screws 3, and the first vibration reduction portion 201 and the second vibration reduction portion 202 are respectively located on the upper end face and the lower end face of the corner portions 401 to achieve a better vibration reduction effect.
In some alternative embodiments, the line of intersection of the line between two spaced apart corners 401 and the center of gravity of the bracket assembly is perpendicular to the base 1.
In particular, such an arrangement can satisfy a symmetrical distribution along the center of gravity of the bracket assembly between the corner portions 401, ensuring a better supporting effect of the bracket 4.
In some alternative embodiments, the vibration dampening shoe 2 is a superelastic rubber material. The rubber vibration damping pad is simple in structure, stable in reliability and good in economical efficiency. The superelastic properties have low modulus and high ductility properties, nonlinear stress strain curves, and little incompressibility.
In some alternative embodiments, the potting adhesive 6 is a silicone rubber material. Wherein, the pouring sealant is a specially configured double-component silicone rubber, and has good insulating property, good fluidity and good bonding property. In order to enhance the heat conductivity, the aluminum oxide component is added in the proportion. Fully stirring at normal temperature, vacuumizing, curing at normal temperature, and after curing, performing filling, shaping and adjusting.
The inertial measurement device adopts a two-stage vibration reduction mode, and as shown in fig. 4, the inertial measurement device has the capacity of resisting 20000g of large overload. The first-stage vibration reduction adopts a vibration reduction pad mode, and through four-point vibration reduction support on the gravity center plane of the vibration reduction load, the vibration load can absorb overload with larger energy, and the vibration reduction body can keep certain precision to a certain extent. The second-stage vibration reduction is to enable the MEMS device to be mounted on the vibration-reduced body in a suspension mode through the special pouring sealant, so that the problem of working stress is solved, and the vibration-resistant capacity of the MEMS device is improved.
The data of each point in fig. 4 are shown in the following table 1:
As can be seen from the errors of the acceleration measurement value and the pulse width measurement value between the channel 1 (input impact quantity of the inertia measurement device), the channel 2 (output impact quantity of the detected sensor) and the ideal waveform, the highest point of the feedback curve E of the channel 1 is infinitely close to the highest point of the ideal waveform curve C, but cannot exceed the highest point, when the time reaches 0.180ms, the five curves reach the highest point, the ideal waveform curve C at the same moment is always positioned between the ideal waveform upper limit curve A and the ideal waveform lower limit curve D, the acceleration value corresponding to the highest point of the feedback curve B of the channel 2 is close to half of the highest point of the feedback curve E of the channel 1, the vibration reduction effect on large overload impact is almost half of the overload impact force, and the vibration reduction effect is very obvious.
Table 1 vibration damping front-to-rear comparison
The inertial measurement device solves the problem of large overload resistance of the MEMS inertial system. The product has the capability of adapting to harsh mechanical environment, wherein after the vibration reduction measures are taken, the effect under various large impact conditions is shown in fig. 3, and the vibration reduction efficiency can be gradually reduced along with the continuous increase of the bearable force after the vibration reduction measures are taken. The MEMS inertial body system technical index can be stronger in environment adaptability than the shoulder inertial body system technical index. Compared with the prior art, the device has the advantages of small volume, high reliability, strong overload resistance and the like.
While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and are herein described in detail. It should be understood that the invention is not to be limited to the particular embodiments disclosed, but on the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit or scope of the invention as defined by the appended claims. The same component numbers may be used throughout the drawings to refer to the same or like parts.
The present invention is not described in detail as being well known to those skilled in the art.
Claims (5)
1. The MEMS inertial measurement device capable of resisting large overload is characterized by comprising a base (1), a bracket assembly, a vibration reduction pad (2) and supporting screws (3), wherein the bracket assembly is positioned on the base (1), the bracket assembly comprises a bracket (4), a processing plate (5), chips and a potting adhesive layer (6), the processing plate (5) is fixed on the bracket (4) and is connected with a plurality of the chips, the potting adhesive layer (6) is filled in gaps between the bracket (4) and the chips to enable each chip to be mounted on the base (1) in a suspended mode, the supporting screws (3) sequentially penetrate through the bracket (4) and the vibration reduction pad (2) to be connected with the base (1), and the vibration reduction pad (2) is arranged at a contact position between the base (1) and the bracket (4);
The chips comprise accelerometer chips (7) and gyro chips (8), wherein the accelerometer chips (7) and the gyro chips (8) are respectively fixed on corresponding circuit boards (9), and the circuit boards (9) are connected with the processing board (5);
The circuit board (9) is connected with the processing board (5) in a suspending way;
The vibration reduction pad (2) comprises a first vibration reduction part (201), a connecting part (202) and a second vibration reduction part (203) which are sequentially connected, wherein the first vibration reduction part (201) and the second vibration reduction part (203) are symmetrically arranged at two ends of the connecting part (202), and the horizontal plane where the gravity center of the bracket component is located overlaps with the horizontal plane where the gravity center of the vibration reduction pad (2) is located;
Four corner parts (401) are respectively positioned at four corners of the bracket (4), the corner parts (401) are boss-shaped, and the first vibration reduction parts (201) and the second vibration reduction parts (203) are respectively positioned at the upper end face and the lower end face of the corner parts (401);
The intersection point of the connecting line between the two separated edge corners (401) and the connecting line of the gravity center of the bracket component are perpendicular to the base (1).
2. The MEMS inertial measurement unit according to claim 1, wherein the frame (4) is hollow and polygonal, the chips are located outside the frame (4), the processing board (5) is fixed at a top opening of the frame (4), and at least one corner (401) of the frame (4) is connected to the base (1) through the vibration-absorbing pad (2).
3. MEMS inertial measurement unit able to resist large overloads according to claim 1, characterized in that the support screw (3) is screwed to the base (1) and is used to adjust the elasticity of the damping pad (2).
4. A MEMS inertial measurement unit according to any one of claims 1 to 3, wherein the damping pad (2) is of superelastic rubber material.
5. A MEMS inertial measurement unit according to any one of claims 1-3, wherein the potting compound (6) is of silicone rubber material.
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| CN114718986A (en) * | 2022-04-26 | 2022-07-08 | 中国电子科技集团公司第二十六研究所 | Fully suspended vibration isolation method and structure for electronic equipment |
| CN114698316B (en) * | 2022-04-26 | 2024-10-29 | 中国电子科技集团公司第二十六研究所 | Assembly tool and assembly method for full-suspension type vibration isolation and impact isolation structure of electronic equipment |
| CN115096147A (en) * | 2022-05-09 | 2022-09-23 | 艾索信息股份有限公司 | Processing module and shell warhead |
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| CN111397601A (en) * | 2020-04-10 | 2020-07-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | Little inertia measurement unit shock-resistant damping structure and damping system |
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| CN102175243B (en) * | 2011-01-24 | 2012-10-17 | 中北大学 | A Multiple Anti-High Overload Device Applicable to Semi Strapdown Inertial Measurement System |
| US9175959B2 (en) * | 2011-02-22 | 2015-11-03 | Trw Automotive U.S. Llc | Measuring device mounting method and structure |
| US10132630B2 (en) * | 2013-01-25 | 2018-11-20 | MCube Inc. | Multi-axis integrated MEMS inertial sensing device on single packaged chip |
| KR20150090629A (en) * | 2014-01-29 | 2015-08-06 | 삼성전기주식회사 | Acceleration Sensor |
| CN106871895B (en) * | 2017-04-28 | 2019-03-29 | 上海拓攻机器人有限公司 | A kind of inertial measuring unit and unmanned vehicle |
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| CN108692723A (en) * | 2018-04-02 | 2018-10-23 | 中国兵器工业集团第二四研究所苏州研发中心 | A kind of micro-inertia measuring modular construction of anti high overload |
| CN111397601A (en) * | 2020-04-10 | 2020-07-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | Little inertia measurement unit shock-resistant damping structure and damping system |
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