CN113649791B - A stacking fixture for stacking solid capacitors - Google Patents
A stacking fixture for stacking solid capacitors Download PDFInfo
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- CN113649791B CN113649791B CN202110844136.0A CN202110844136A CN113649791B CN 113649791 B CN113649791 B CN 113649791B CN 202110844136 A CN202110844136 A CN 202110844136A CN 113649791 B CN113649791 B CN 113649791B
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- pressing cover
- crystal fixing
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- 239000003990 capacitor Substances 0.000 title claims abstract description 44
- 239000007787 solid Substances 0.000 title description 9
- 239000013078 crystal Substances 0.000 claims abstract description 36
- 238000003825 pressing Methods 0.000 claims description 62
- 230000006835 compression Effects 0.000 claims description 26
- 238000007906 compression Methods 0.000 claims description 26
- 238000003475 lamination Methods 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
本发明提供一种用于叠层固态电容的叠层夹具，通过将叠层夹具设计成由上至下依次设置的上压紧盖，上晶固定板，下晶固定板以及下压紧盖形式，引线框架位于上晶固定板与下晶固定板之间，上晶固定板与上晶固定板开设有与引线框架的多个引线架单元一一对应设置的上放置孔阵列与下放置孔阵列，再通过设置在上压紧盖与下压紧盖上对应设置的上压紧块阵列与下压紧块阵列，结合定位销和定位孔之间的配合，能够快速批量化实现多个引线架单元与位于上放置孔阵列以及下放置孔阵列两个方向的电容晶片的组装，并且单面完成后不需要拆卸上压紧盖与下压紧盖，减少了生产工序，显著提高了生产效率，降低生产成本，并且电容晶片与引线架单元的组装效果更优。
The present invention provides a stacking fixture for stacked solid-state capacitors. The stacking fixture is designed to be in the form of an upper clamping cover, an upper crystal fixing plate, a lower crystal fixing plate and a lower clamping cover which are sequentially arranged from top to bottom. A lead frame is located between the upper crystal fixing plate and the lower crystal fixing plate. The upper crystal fixing plate and the upper crystal fixing plate are provided with an upper placement hole array and a lower placement hole array which are arranged one-to-one with a plurality of lead frame units of the lead frame. Then, an upper clamping block array and a lower clamping block array which are correspondingly arranged on the upper clamping cover and the lower clamping cover are combined with the cooperation between positioning pins and positioning holes. Therefore, the assembly of a plurality of lead frame units and capacitor wafers located in two directions of the upper placement hole array and the lower placement hole array can be realized quickly and in batches. After the single-sided completion, the upper clamping cover and the lower clamping cover do not need to be disassembled, thereby reducing the production process, significantly improving the production efficiency, reducing the production cost, and achieving a better assembly effect of the capacitor wafer and the lead frame unit.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a lamination clamp for laminating a solid capacitor.
Background
The capacitor is an indispensable important element in a power supply circuit of the computer system, various boards and chipsets on the main board need to use various types of voltage power supplies, and capacitors are needed to be used for filtering the power supplies to ensure the stable operation of the main board and the boards, so that the voltage stability is ensured. Compared with a common liquid aluminum electrolytic capacitor, the solid capacitor adopts conductive polymer as a dielectric material, and the material does not react with aluminum oxide, so that explosion phenomenon is avoided after the material is electrified; at the same time, it is a solid product, and there is no bursting caused by thermal expansion. The solid capacitor has the advantages of environmental protection, low impedance, high and low temperature stability, high ripple resistance, high reliability and the like, and is the highest-order product in the current electrolytic capacitor products.
The existing laminated fixture for assembling the capacitor wafer and the lead frame can only be assembled on one side, when the capacitor wafer on the other side of the lead frame is assembled, the whole laminated fixture is required to be disassembled, and after the capacitor wafer on the other side is reassembled, the capacitor wafer on the other side and the lead frame are assembled, so that the production efficiency is low, the working procedure is complex, the production cost is high, and the assembly effect is general.
In view of this, there is a need to propose a lamination fixture for laminating solid state capacitors that solves or at least alleviates the above-mentioned drawbacks.
Disclosure of Invention
The invention mainly aims to provide a lamination fixture for laminating a solid capacitor, which solves the problems that the existing lamination fixture can only be assembled on one side, and when a capacitor wafer on the other side of a lead frame is assembled, the whole lamination fixture needs to be disassembled and then assembled, so that the production efficiency is low, the working procedure is complicated, the production cost is high, and the assembly effect is general.
In order to achieve the above object, the present invention provides a lamination fixture for laminating a solid capacitor, comprising an upper pressing cover, an upper die fixing plate, a lower die fixing plate and a lower pressing cover, which are sequentially arranged from top to bottom; wherein,
The lower die fixing plate is provided with a lower placement hole array which corresponds to the single lead frame units of the lead frame one by one, the hole wall of each lower placement hole is provided with a first preset inclination, the aperture of one side, close to the lead frame, of the lower placement hole is smaller than the aperture of one side, far away from the lead frame, of the lower die fixing plate, and the top surface of the lower die fixing plate is provided with at least two positioning pins in an upward protruding mode;
The top of the lower pressing cover is provided with a lower groove for embedding the lower crystal fixing plate, the length of the lower groove is matched with that of the lower crystal fixing plate, the bottom surface of the lower groove protrudes upwards to form a lower pressing block array corresponding to the lower placing hole array, and the lower pressing cover is detachably connected with the upper pressing cover through a connecting part;
The upper die fixing plate is provided with an upper placement hole array which corresponds to the single lead frame units of the lead frame one by one, the hole wall of each upper placement hole is provided with a second preset inclination, the aperture of one side, close to the lead frame, of the upper placement hole is smaller than the aperture of one side, far away from the lead frame, of the upper die fixing plate, and the upper die fixing plate is also provided with a second positioning hole matched with the positioning pin;
The bottom of the upper pressing cover is provided with an upper groove for embedding the upper crystal fixing plate, the length of the upper groove is matched with that of the upper crystal fixing plate, and the bottom surface of the upper groove is downwards protruded and extended to form an upper pressing block array corresponding to the upper placing hole array.
Preferably, the connecting portion is a magnet assembly, the magnet assembly comprises a magnet block seat and a magnet, a plurality of upper counter bores for placing the magnet block seat are formed in the bottom of the upper pressing cover, a plurality of lower counter bores for placing the magnet are formed in the top of the lower pressing cover, and the lower counter bores are in one-to-one correspondence with the upper counter bores.
Preferably, the upper counter bore is arranged between the upper groove and the edge of the upper pressing cover, and is arranged along the width direction of the upper pressing cover, and the lower counter bore is arranged between the lower groove and the edge of the lower pressing cover, and is arranged along the width direction of the lower pressing cover.
Preferably, the cross sections of the upper placing hole and the lower placing hole are rectangular.
Preferably, the first preset inclination is consistent with the second preset inclination, and the first preset inclination and the second preset inclination are both set between 10 degrees and 20 degrees.
Preferably, the number of the positioning pins is four; wherein, each lead frame is correspondingly provided with two positioning pins.
Preferably, the top of the upper pressing cover is further provided with two upper support plates which are arranged at intervals in parallel and extend along the length direction of the upper pressing cover, and the bottom of the lower pressing cover is further provided with two lower support plates which are arranged at intervals in parallel and extend along the length direction of the lower pressing cover.
Preferably, the thickness of the upper crystal fixing plate is consistent with that of the lower crystal fixing plate.
Preferably, the depth of the upper groove is consistent with the thickness of the upper crystal fixing plate, and the depth of the lower groove is consistent with the thickness of the lower crystal fixing plate; the bottom surfaces of the upper groove and the lower groove are rectangular, the width of the upper groove is consistent with that of the upper crystal fixing plate, and the width of the lower groove is consistent with that of the lower crystal fixing plate.
Preferably, the minimum distance between the upper groove and the upper counter bore is set to be 1.2-1.8 mm, and the minimum distance between the lower groove and the lower counter bore is set to be 1.2-1.8 mm.
Compared with the prior art, the invention has the following beneficial effects:
According to the lamination clamp for the laminated solid capacitor, the lamination clamp is designed into the upper compression cover, the upper crystal fixing plate, the lower crystal fixing plate and the lower compression cover which are sequentially arranged from top to bottom, the lead frames are arranged between the upper crystal fixing plate and the lower crystal fixing plate, the upper crystal fixing plate and the upper crystal fixing plate are provided with the upper placement hole array and the lower placement hole array which are arranged in one-to-one correspondence with the lead frame units of the lead frames, and the upper compression block array and the lower compression block array which are arranged on the upper compression cover and the lower compression cover are combined with the matching between the positioning pins and the positioning holes, so that the assembly of a plurality of lead frame units and capacitor wafers positioned in the two directions of the upper placement hole array and the lower placement hole array can be realized in a rapid batch mode, the upper compression cover and the lower compression cover do not need to be disassembled after single-sided completion, the production procedures are reduced, the production efficiency is remarkably improved, the production cost is reduced, and the assembly effect of the capacitor wafers and the lead frame units is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the overall structure at another view angle in one embodiment of the present invention;
FIG. 3 is an exploded view of one embodiment of the present invention;
FIG. 4 is an exploded view at another perspective in one embodiment of the present invention;
FIG. 5 is a schematic view of the structure of the upper pressing cover in one embodiment of the present invention;
FIG. 6 is a schematic view of the structure of the lower pressing cover in one embodiment of the present invention;
FIG. 7 is a schematic view of the structure of the upper die fixing plate according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a lower die fixing plate according to an embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Reference numerals illustrate:
An upper pressing cover 100; an upper groove 110; an upper compression block array 120; an upper counterbore 130; an upper support plate 140; a die attach plate 200; placing an array of holes 210 thereon; upper placement hole 211; a second positioning hole 212; a lower die fixing plate 300; a lower placement hole array 310; a lower placement hole 311; a positioning pin 320;
a lower pressing cover 400; a lower groove 410; a lower compression block array 420; a lower counterbore 430; a lower support plate 440; a lead frame 500; a connection part 600; a suction block seat 611; a magnet 612.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1-8, a lamination jig for laminating solid capacitors according to an embodiment of the present invention includes an upper pressing cover 100, an upper die fixing plate 200, a lower die fixing plate 300 and a lower pressing cover 400, which are sequentially disposed from top to bottom; wherein,
The lower die fixing plate 300 is provided with a lower placement hole array 310 corresponding to a single lead frame unit (not labeled in the figure) of the lead frame 500 one by one, the hole wall of each lower placement hole 311 has a first preset inclination, the hole diameter of one side of the lower placement hole 311 close to the lead frame 500 is smaller than the hole diameter of one side far away from the lead frame 500, and the top surface of the lower die fixing plate 300 is provided with at least two positioning pins 320 in an upward protruding manner. It should be understood by those skilled in the art that the lower placement hole array 310 needs to be matched with the plurality of lead frame units of the lead frame 500, the lower placement hole 311 of the lower die fixing plate 300 is placed with a capacitor chip (not shown), the capacitor chip on the lower placement hole 311 is assembled with the lead frame units of the lead frame 500 between the upper die fixing plate 200 and the lower die fixing plate 300 by pressing the lower pressing block array 420 of the lower pressing cover 400 through the lower placement hole 311, and thus, the hole wall of the lower placement hole 311 is designed to have a first preset slope, and the hole diameter of the side of the lower placement hole 311 close to the lead frame 500 is smaller than the hole diameter of the side far from the lead frame 500, so that the capacitor chip can be placed on the lower placement hole 311 on one hand, and the capacitor chip can be assembled with the lead frame units through the lower placement hole 311 on the other hand.
In addition, the positioning pins 320 are used for positioning the lower die fixing plate 300, the lead frame 500 and the upper die fixing plate 200 together, so that the lower placing holes 311, the lead frame units and the upper placing holes 211 are arranged in a one-to-one correspondence manner, and batch assembly of a plurality of capacitor chips and the lead frame units is further realized. In a preferred embodiment, the number of the positioning pins 320 is four; wherein, each lead frame 500 is correspondingly provided with two positioning pins 320. It should be noted that the number of the positioning pins 320 provided for each lead frame 500 should be not less than two, and too many positioning pins should not be needed, which would cause complicated and difficult positioning.
The top of the lower pressing cover 400 is formed with a lower groove 410 into which the lower die fixing plate 300 is inserted, the length of the lower groove 410 is matched with the length of the lower die fixing plate 300, the bottom surface of the lower groove 410 protrudes upwards to form a lower pressing block array 420 corresponding to the lower placing hole array 310, and the lower pressing cover 400 is detachably connected with the upper pressing cover 100 through a connecting portion 600. It should be noted that, in order to make the structure of the entire lamination jig more compact and the positioning effect better, the top of the lower pressing cover 400 in the present application is formed with a lower groove 410 for the lower die fixing plate 300 to be inserted, and the lower pressing block array 420 is used to press out the capacitor die placed on the lower placing hole 311 and complete the assembly with the lead frame unit. Further, it should be noted that the connection portion 600 includes, but is not limited to, a bolt connection, a screw connection, a snap connection, a magnet attraction connection, as long as the detachable fixed connection between the upper and lower pressing covers 100 and 400 is achieved, and the assembly of the capacitor chip and the lead frame unit is completed as the connection portion 600 of the present application.
The upper die fixing plate 200 is provided with an upper placement hole array 210 corresponding to the single lead frame units of the lead frame 500 one by one, the hole wall of each upper placement hole 211 has a second preset inclination, the hole diameter of one side of the upper placement hole 211 close to the lead frame 500 is smaller than the hole diameter of one side far away from the lead frame 500, and the upper die fixing plate 200 is also provided with a second positioning hole 212 matched with the positioning pin 320. Also, the upper placing hole array 210 needs to be matched with the plurality of lead frame units of the lead frame 500, the upper placing hole 211 of the upper die fixing plate 200 is placed with the capacitor wafer, the capacitor wafer located on the upper placing hole 211 is pressed through the upper placing hole 211 by the upper pressing block array 120 on the upper pressing cover 100, so that the capacitor wafer located on the upper placing hole 211 is assembled with the lead frame units of the lead frame 500 located between the upper die fixing plate 200 and the lower die fixing plate 300, therefore, the hole wall of the upper placing hole 211 is designed to have a second preset slope, and the hole diameter of the side of the upper placing hole 211 close to the lead frame 500 is smaller than the hole diameter of the side far away from the lead frame 500, so that the capacitor wafer can be placed on the upper placing hole 211 on one hand, and the capacitor wafer can be assembled with the lead frame units through the upper placing hole 211 on the other hand.
An upper groove 110 for embedding the upper die fixing plate 200 is formed at the bottom of the upper pressing cover 100, the length of the upper groove 110 is matched with the length of the upper die fixing plate 200, and an upper pressing block array 120 corresponding to the upper placing hole array 210 protrudes downwards from the bottom surface of the upper groove 110. It should be noted that, in order to make the structure of the entire lamination jig more compact and the positioning effect better, the top of the upper pressing cover 100 in the present application is formed with an upper groove 110 into which the upper die fixing plate 200 is inserted, and the upper pressing block array 120 is used to press out the capacitor die placed on the upper placing hole 211 and complete the assembly with the lead frame unit.
In the scheme of the application, the stacked fixture is designed into the form of the upper compression cover 100, the upper crystal fixing plate 200, the lower crystal fixing plate 300 and the lower compression cover 400 which are sequentially arranged from top to bottom, the lead frame 500 is positioned between the upper crystal fixing plate 200 and the lower crystal fixing plate 300, the upper crystal fixing plate 200 and the upper crystal fixing plate 200 are provided with the upper array holes and the lower array holes which are arranged in one-to-one correspondence with the plurality of lead frame units of the lead frame 500, and then the upper compression block array 120 and the lower compression block array 420 which are arranged on the upper compression cover 100 and the lower compression cover 400 are arranged correspondingly, so that the assembly of the lead frame units and capacitor wafers positioned in two directions of the upper placing holes 211 and the lower placing holes 311 can be realized in a rapid batch manner, the upper compression cover 100 and the lower compression cover 400 do not need to be disassembled after one-sided completion, the production procedures are reduced, the production efficiency is remarkably improved, the production cost is reduced, and the assembly effect of the capacitor wafers and the lead frame units is better.
As a preferred embodiment of the present invention, the connection portion 600 is a magnet assembly (not shown), the magnet assembly (not shown) includes a magnet block seat 611 and a magnet 612, the bottom of the upper pressing cover 100 is provided with a plurality of upper counter bores 130 for placing the magnet block seat 611, the top of the lower pressing cover 400 is provided with a plurality of lower counter bores 430 for placing the magnet 612, and the lower counter bores 430 are disposed in one-to-one correspondence with the upper counter bores 130. The upper compression cover 100 and the lower compression cover 400 are flexibly connected in an adsorption mode through the magnet 612, and the adsorption force of the magnet 612 is adjustable, so that the magnet can be adaptively set according to actual needs.
Further, the upper counterbore 130 is disposed between the upper groove 110 and the edge of the upper pressing cover 100, and is arranged along the width direction of the upper pressing cover 100, and the lower counterbore 430 is disposed between the lower groove 410 and the edge of the lower pressing cover 400, and is arranged along the width direction of the lower pressing cover 400.
Further, the cross sections of the upper placing hole 211 and the lower placing hole 311 are rectangular. It should be noted that, since the capacitor wafer is placed on the upper placing hole 211 and the lower placing hole 311, the shapes of the upper placing hole and the lower placing hole 311 need to match the shape of the capacitor wafer. Therefore, the specific shapes of the upper placing hole 211 and the lower placing hole 311 should be determined according to actual situations. Preferably, the cross sections of the upper placing hole 211 and the lower placing hole 311 in this embodiment are rectangular.
Further, the first preset inclination is consistent with the second preset inclination, and the first preset inclination and the second preset inclination are both set between 10 degrees and 20 degrees. It can be appreciated that in other embodiments, the first preset slope may not be identical to the second preset slope, and may be specifically set according to actual needs, where the first preset slope and the second preset slope are set to be identical to each other, so as to facilitate processing, assembling and production of the equal-size multi-chip capacitor wafer.
As a specific embodiment of the present invention, two upper support plates 140 disposed at intervals in parallel and extending along the length direction of the upper compression cover 100 are further formed at the top of the upper compression cover 100, and two lower support plates 440 disposed at intervals in parallel and extending along the length direction of the lower compression cover 400 are further formed at the bottom of the lower compression cover 400. It should be noted that in other embodiments, the upper support plate 140 and the lower support plate 440 may be configured in other manners, which not only reduces the weight of the entire lamination jig, but also facilitates external fixation and external stress, thereby improving the applicability of the entire lamination jig.
Further, the thickness of the upper die fixing plate 200 is identical to that of the lower die fixing plate 300. It can be appreciated that the thicknesses of the upper die-fixing plate 200 and the lower die-fixing plate 300 may be set to be inconsistent, and the thicknesses are set to be consistent in this embodiment, which is more convenient for mass production in the same batch.
As a specific embodiment of the present invention, the depth of the upper groove 110 is consistent with the thickness of the upper die-fixing plate 200, and the depth of the lower groove 410 is consistent with the thickness of the lower die-fixing plate 300; the bottom surfaces of the upper groove 110 and the lower groove 410 are rectangular, the width of the upper groove 110 is consistent with the width of the upper die-fixing plate 200, and the width of the lower groove 410 is consistent with the width of the lower die-fixing plate 300. In order to make the overall structure of the entire lamination jig more compact and reasonable, the depth of the upper groove 110 in this embodiment is consistent with the thickness of the upper die-fixing plate 200, and the depth of the lower groove 410 is consistent with the thickness of the lower die-fixing plate 300.
Further, the minimum distance between the upper groove 110 and the upper counterbore 130 is set to be 1.2-1.8 mm, and the minimum distance between the lower groove 410 and the lower counterbore 430 is set to be 1.2-1.8 mm. It should be clear to those skilled in the art that the minimum distance between the upper groove 110 and the upper counterbore 130 is the minimum distance between the edge of the upper groove 110 and the edge of the upper counterbore 130, the minimum distance between the lower groove 410 and the lower counterbore 430 is the minimum distance between the edge of the lower groove 410 and the edge of the lower counterbore 430, and the specific value may be set according to actual needs.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (10)
1. The lamination clamp for laminating the solid-state capacitor is characterized by comprising an upper compression cover, an upper crystal fixing plate, a lower crystal fixing plate and a lower compression cover which are sequentially arranged from top to bottom; wherein,
The lower die fixing plate is provided with a lower placement hole array which corresponds to the single lead frame units of the lead frame one by one, the hole wall of each lower placement hole is provided with a first preset inclination, the aperture of one side, close to the lead frame, of the lower placement hole is smaller than the aperture of one side, far away from the lead frame, of the lower die fixing plate, and the top surface of the lower die fixing plate is provided with at least two positioning pins in an upward protruding mode;
The top of the lower pressing cover is provided with a lower groove for embedding the lower crystal fixing plate, the length of the lower groove is matched with that of the lower crystal fixing plate, the bottom surface of the lower groove protrudes upwards to form a lower pressing block array corresponding to the lower placing hole array, and the lower pressing cover is detachably connected with the upper pressing cover through a connecting part;
The upper die fixing plate is provided with an upper placement hole array which corresponds to the single lead frame units of the lead frame one by one, the hole wall of each upper placement hole is provided with a second preset inclination, the aperture of one side, close to the lead frame, of the upper placement hole is smaller than the aperture of one side, far away from the lead frame, of the upper die fixing plate, and the upper die fixing plate is also provided with a second positioning hole matched with the positioning pin;
The bottom of the upper pressing cover is provided with an upper groove for embedding the upper crystal fixing plate, the length of the upper groove is matched with that of the upper crystal fixing plate, and the bottom surface of the upper groove is downwards protruded and extended to form an upper pressing block array corresponding to the upper placing hole array.
2. The laminated fixture of claim 1, wherein the connecting portion is a magnet assembly, the magnet assembly comprises a magnet block seat and a magnet, a plurality of upper counter bores for placing the magnet block seat are formed in the bottom of the upper pressing cover, a plurality of lower counter bores for placing the magnet are formed in the top of the lower pressing cover, and the lower counter bores are arranged in one-to-one correspondence with the upper counter bores.
3. The stack clamp according to claim 2, wherein the upper counterbore is provided between the upper groove and the side portion of the upper pressing cover and is arranged in the width direction of the upper pressing cover, and the lower counterbore is provided between the lower groove and the side portion of the lower pressing cover and is arranged in the width direction of the lower pressing cover.
4. The laminate fixture of claim 1 wherein the upper and lower placement holes are rectangular in cross-section.
5. The lamination jig of claim 4, wherein the first predetermined slope is consistent with the second predetermined slope and is each set between 10-20 degrees.
6. The laminate fixture of claim 1, wherein the number of locating pins is four; wherein, each lead frame is correspondingly provided with two positioning pins.
7. The stack clamp according to any one of claims 1 to 6, wherein the top of the upper pressing cover is further formed with two upper support plates arranged in parallel and spaced apart, and extending in the longitudinal direction of the upper pressing cover, and the bottom of the lower pressing cover is further formed with two lower support plates arranged in parallel and spaced apart, and extending in the longitudinal direction of the lower pressing cover.
8. The stack clamp of any one of claims 1-6, wherein the upper die holding plate is of uniform thickness as the lower die holding plate.
9. The stack clamp of claim 8, wherein the upper groove has a depth that is consistent with the thickness of the upper die-retention plate and the lower groove has a depth that is consistent with the thickness of the lower die-retention plate; the bottom surfaces of the upper groove and the lower groove are rectangular, the width of the upper groove is consistent with that of the upper crystal fixing plate, and the width of the lower groove is consistent with that of the lower crystal fixing plate.
10. A stack clamp according to claim 3, characterized in that the minimum distance between the upper groove and the upper counterbore is set to between 1.2 and 1.8mm, and the minimum distance between the lower groove and the lower counterbore is set to between 1.2 and 1.8 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110844136.0A CN113649791B (en) | 2021-07-26 | 2021-07-26 | A stacking fixture for stacking solid capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110844136.0A CN113649791B (en) | 2021-07-26 | 2021-07-26 | A stacking fixture for stacking solid capacitors |
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| Publication Number | Publication Date |
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| CN113649791A CN113649791A (en) | 2021-11-16 |
| CN113649791B true CN113649791B (en) | 2024-11-12 |
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| CN202110844136.0A Active CN113649791B (en) | 2021-07-26 | 2021-07-26 | A stacking fixture for stacking solid capacitors |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215942046U (en) * | 2021-07-26 | 2022-03-04 | 湖南盛通电子科技有限公司 | Lamination clamp for lamination solid capacitor |
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