CN113637330A - High-strength modified epoxy resin plate and preparation method thereof - Google Patents
High-strength modified epoxy resin plate and preparation method thereof Download PDFInfo
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08J2429/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2429/02—Homopolymers or copolymers of unsaturated alcohols
- C08J2429/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
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- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08J2461/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
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Abstract
The invention discloses a high-strength modified epoxy resin plate and a preparation method thereof. The high-strength modified epoxy resin board material comprises the following components in parts by weight: 100-170 parts of modified epoxy resin, 60-150 parts of curing agent, 40-60 parts of accelerator, 60-90 parts of inorganic flame retardant, 80-120 parts of quartz sand and 80-120 parts of melamine formaldehyde resin. The modified epoxy resin is modified by organic silicon, and then the modified nano silicon dioxide is used for filling and modifying the organic silicon epoxy resin. The prepared epoxy resin plate has high hardness, strong impact property, toughness, heat resistance, chemical corrosion resistance and cohesiveness which are all obviously improved, and the epoxy resin plate has simple production process and low cost and conforms to the large-scale production of the current market.
Description
Technical Field
The invention relates to the technical field of epoxy resin plate preparation processes, in particular to a high-strength modified epoxy resin plate and a preparation method thereof.
Background
The epoxy resin has good mechanical property, adhesive property and chemical stability, and can be widely applied to the fields of adhesion, paint, electronic and electric appliances and the like. However, after the epoxy resin is cured, the material has poor toughness, low impact strength and poor high temperature resistance, so that the epoxy resin needs to be modified to improve the mechanical strength of the epoxy resin.
The epoxy resin plate is also called as an insulating plate and an epoxy plate, the epoxy resin plate is commonly used for laboratory table tops and decorative plates, and the existing epoxy resin plate has poor base material, is not corrosion-resistant, can not resist high temperature and has low impact strength; can not be applied to some special occasions, so the prepared high-strength heat-resistant epoxy resin plate meets the production requirements of the current market.
Disclosure of Invention
The invention aims to provide a high-strength modified epoxy resin plate and a preparation method thereof, so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme:
the high-strength modified epoxy resin board material comprises the following components in parts by weight: 100-170 parts of modified epoxy resin, 60-150 parts of curing agent, 40-60 parts of accelerator, 60-90 parts of inorganic flame retardant, 80-120 parts of quartz sand and 80-120 parts of melamine formaldehyde resin.
The materials required by the modified epoxy resin comprise, by weight: 30-60 parts of bisphenol A epoxy resin, 10-20 parts of stannous octoate, 10-20 parts of vinyl silicone resin, 10-20 parts of diphenyl silanediol, 10-20 parts of 4-4' -diamino diphenyl sulfone, 30-60 parts of nano silicon dioxide and 25-45 parts of dimethyl dichlorosilane. Preferably, the curing agent is polyamide 203.
Preferably, the accelerant is stannous octoate.
Preferably, the inorganic flame retardant is aluminum hydroxide.
As optimization, the quartz sand needs to be subjected to impurity removal test, and the required materials comprise, by weight: 12-21 parts of hydrochloric acid, 4-9 parts of hydrofluoric acid and 4-9 parts of nitric acid.
The melamine formaldehyde resin preferably comprises the following materials by weight: 5-10 parts of formaldehyde, 10-20 parts of sodium hydroxide, 25-50 parts of melamine, 25-50 parts of methanol, 10-20 parts of oxalic acid and 20-40 parts of polyvinyl alcohol.
As optimization, the preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
the epoxy resin has poor toughness and poor heat resistance, and the organosilicon has good heat resistance and good flexibility, the vinyl silicone resin is used for modifying the epoxy resin, so that the impact strength of the epoxy resin is enhanced, but the tensile strength and the brittleness are reduced, and on the basis, the organosilicon resin containing phenyl is continuously added for modification, so that the mechanical property of the epoxy resin is further improved, the toughness and the heat resistance of the epoxy resin are enhanced, but the glass transition temperature is reduced; therefore, the organosilicon epoxy resin is further modified by adopting the nano-silica, the nano-silica has high strength and good toughness, but is easy to agglomerate and difficult to disperse in the epoxy resin, the nano-silica is modified by adopting a silane coupling agent, namely dimethyldichlorosilane, so that the number of hydroxyl groups on the surface of the nano-silica is reduced, the compatibility of the nano-silica and the epoxy resin is improved, and the modified nano-silica is used for filling and modifying the organosilicon epoxy resin, so that the mechanical property of the epoxy resin is effectively improved, the impact strength, the tensile strength, the bending strength and the heat resistance are also improved.
S2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
the quartz sand is a hard, wear-resistant and good in chemical stability, but the quartz sand contains a large amount of impurities, mainly iron, and can affect the chemical corrosion resistance and the impact strength of the epoxy resin plate, so that the quartz sand is purified by adopting impurity removal processes of scrubbing, calcining, water quenching, magnetic separation and acid leaching, and the impact strength and the chemical corrosion resistance of the epoxy resin plate are effectively improved by the quartz sand after impurity removal.
S3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
the melamine formaldehyde resin has great chemical activity, strong adhesion, good water resistance and strong thermal stability, is suitable for the fields of wood, artificial boards and the like, can be used as an adhesive in an epoxy resin board, can generate polyvinyl formal by adding polyvinyl alcohol into the melamine formaldehyde resin, plays a toughening effect and prevents cracking, can also be used as a flame retardant, is used together with aluminum hydroxide, and improves the flame retardant property of the epoxy resin board.
S2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
Compared with the prior art, the invention has the following beneficial effects: the invention modifies the epoxy resin twice, effectively improves the mechanical property of the epoxy resin, enhances the impact strength and the heat resistance, improves the ultraviolet resistance and the waterproof property, uses the polyamide 203 as a curing agent, has stronger adhesive property and water resistance, has stronger heat shock resistance, increases the polyamide dosage, can enhance the impact property of the epoxy resin plate, adds the stannous octoate as an accelerant, can improve the reaction rate, saves the production time, adds the aluminum hydroxide, can make up the defect that the epoxy resin plate is inflammable when being heated, improves the flame retardant property of the epoxy resin plate, carries out impurity removal on the quartz sand, can ensure that the quartz sand is not influenced by impurities in the preparation process of adding the epoxy resin plate, causes the strength and the chemical corrosion resistance to be reduced, prepares the melamine formaldehyde resin, can improve the adhesive property of the epoxy resin plate, the hardness and brittleness are enhanced, and the polyvinyl alcohol is added into the melamine formaldehyde resin to prevent the epoxy resin plate from cracking and prolong the service life.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: the high-strength modified epoxy resin board material comprises the following components in parts by weight: 100 parts of modified epoxy resin, 60 parts of curing agent, 40 parts of accelerator, 60 parts of inorganic flame retardant, 80 parts of quartz sand and 80 parts of melamine formaldehyde resin.
The materials required by the modified epoxy resin comprise, by weight: 30 parts of bisphenol A epoxy resin, 10 parts of stannous octoate, 10 parts of vinyl silicon resin, 10 parts of diphenyl silanediol, 10 parts of 4-4' -diamino diphenyl sulfone, 30 parts of nano silicon dioxide and 25 parts of dimethyl dichlorosilane.
The curing agent is polyamide 203.
The accelerant is stannous octoate.
The inorganic flame retardant is aluminum hydroxide.
The quartz sand needs to be subjected to impurity removal test, and the required materials comprise, by weight: 12 parts of hydrochloric acid, 4 parts of hydrofluoric acid and 4 parts of nitric acid.
The materials required by the melamine formaldehyde resin comprise, by weight: 5 parts of formaldehyde, 10 parts of sodium hydroxide, 25 parts of melamine, 25 parts of methanol, 10 parts of oxalic acid and 20 parts of polyvinyl alcohol.
The preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
s2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
s3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
s2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
Example 2: the high-strength modified epoxy resin board material comprises the following components in parts by weight: 145 parts of modified epoxy resin, 135 parts of curing agent, 50 parts of accelerator, 75 parts of inorganic flame retardant, 100 parts of quartz sand and 100 parts of melamine formaldehyde resin.
The materials required by the modified epoxy resin comprise, by weight: 45 parts of bisphenol A epoxy resin, 15 parts of stannous octoate, 15 parts of vinyl silicon resin, 15 parts of diphenyl silanediol, 14 parts of 4-4' -diamino diphenyl sulfone, 45 parts of nano silicon dioxide and 30 parts of dimethyl dichlorosilane.
The curing agent is polyamide 203.
The accelerant is stannous octoate.
The inorganic flame retardant is aluminum hydroxide.
The quartz sand needs to be subjected to impurity removal test, and the required materials comprise, by weight: 15 parts of hydrochloric acid, 7 parts of hydrofluoric acid and 7 parts of nitric acid.
The materials required by the melamine formaldehyde resin comprise, by weight: 8 parts of formaldehyde, 15 parts of sodium hydroxide, 30 parts of melamine, 30 parts of methanol, 15 parts of oxalic acid and 30 parts of polyvinyl alcohol.
The preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
s2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
s3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
s2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
Example 3: the high-strength modified epoxy resin board material comprises the following components in parts by weight: 155 parts of modified epoxy resin, 140 parts of curing agent, 45 parts of accelerator, 80 parts of inorganic flame retardant, 110 parts of quartz sand and 110 parts of melamine formaldehyde resin.
The materials required by the modified epoxy resin comprise, by weight: 50 parts of bisphenol A type epoxy resin, 13 parts of stannous octoate, 16 parts of vinyl silicon resin, 12 parts of diphenyl silanediol, 16 parts of 4-4' -diamino diphenyl sulfone, 50 parts of nano silicon dioxide and 40 parts of dimethyl dichlorosilane.
The curing agent is polyamide 203.
The accelerant is stannous octoate.
The inorganic flame retardant is aluminum hydroxide.
The quartz sand needs to be subjected to impurity removal treatment, and the required materials comprise, by weight: 13 parts of hydrochloric acid, 5 parts of hydrofluoric acid and 5 parts of nitric acid.
The materials required by the melamine formaldehyde resin comprise, by weight: 4 parts of formaldehyde, 13 parts of sodium hydroxide, 35 parts of melamine, 40 parts of methanol, 18 parts of oxalic acid and 25 parts of polyvinyl alcohol.
The preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
s2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
s3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
s2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
Example 4: the high-strength modified epoxy resin board material comprises the following components in parts by weight: 170 parts of modified epoxy resin, 150 parts of curing agent, 60 parts of accelerator, 90 parts of inorganic flame retardant, 120 parts of quartz sand and 120 parts of melamine formaldehyde resin.
The materials required by the modified epoxy resin comprise, by weight: 60 parts of bisphenol A epoxy resin, 20 parts of stannous octoate, 20 parts of vinyl silicon resin, 20 parts of diphenyl silanediol, 20 parts of 4-4' -diamino diphenyl sulfone, 60 parts of nano silicon dioxide and 45 parts of dimethyl dichlorosilane.
The curing agent is polyamide 203.
The accelerant is stannous octoate.
The inorganic flame retardant is aluminum hydroxide.
The quartz sand needs to be subjected to impurity removal test, and the required materials comprise, by weight: 21 parts of hydrochloric acid, 9 parts of hydrofluoric acid and 9 parts of nitric acid.
The materials required by the melamine formaldehyde resin comprise, by weight: 10 parts of formaldehyde, 20 parts of sodium hydroxide, 50 parts of melamine, 50 parts of methanol, 20 parts of oxalic acid and 40 parts of polyvinyl alcohol.
The preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
s2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
s3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
s2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
Comparative example
Comparative example 1: in comparison with example 1, no quartz sand and melamine formaldehyde resin were added to the raw materials and the process flow was the same as that described herein.
Comparative example 2: in comparison with example 1, no modified epoxy resin was added to the raw materials and the process flow was the same as that described herein.
Experimental data
The examples 1 to 3, the comparative examples 1 and the comparative examples 2 were tested according to GB/T17657-1999 test methods for physical and chemical properties of artificial boards and veneered artificial boards.
| Flexural Strength (MPa) | Hardness of | Grade of resistance to cracking | Cracking rating | |
| Example 1 | 49 | 68 | Level 1 | Level 0 |
| Example 2 | 45 | 65 | Level 1 | Level 0 |
| Example 3 | 48 | 69 | Level 1 | Level 0 |
| Comparative example 1 | 28 | 52 | Grade 3 | Stage 2 |
| Comparative example 2 | 31 | 60 | 4 stage | Level 1 |
And (4) conclusion: the epoxy resin boards prepared in the embodiments 1 to 3 have the advantages of high strength, chemical corrosion resistance, good heat resistance and the like, and the epoxy resin boards are simple in process, low in production cost and high in practicability.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A high-strength modified epoxy resin board is characterized in that: the high-strength modified epoxy resin board material comprises the following components in parts by weight: 100-170 parts of modified epoxy resin, 60-150 parts of curing agent, 40-60 parts of accelerator, 60-90 parts of inorganic flame retardant, 80-120 parts of quartz sand and 80-120 parts of melamine formaldehyde resin.
2. The high-strength modified epoxy resin board according to claim 1, wherein: the materials required by the modified epoxy resin comprise, by weight: 30-60 parts of bisphenol A epoxy resin, 10-20 parts of stannous octoate, 10-20 parts of vinyl silicone resin, 10-20 parts of diphenyl silanediol, 10-20 parts of 4-4' -diamino diphenyl sulfone, 30-60 parts of nano silicon dioxide and 25-45 parts of dimethyl dichlorosilane.
3. The high-strength modified epoxy resin board according to claim 1, wherein: the curing agent is polyamide 203.
4. The high-strength modified epoxy resin board according to claim 1, wherein: the accelerant is stannous octoate.
5. The high-strength modified epoxy resin board according to claim 1, wherein: the inorganic flame retardant is aluminum hydroxide.
6. The high-strength modified epoxy resin board according to claim 1, wherein: the quartz sand needs to be subjected to impurity removal treatment, and the required materials comprise, by weight: 12-21 parts of hydrochloric acid, 4-9 parts of hydrofluoric acid and 4-9 parts of nitric acid.
7. The high-strength modified epoxy resin board according to claim 1, wherein: the materials required by the melamine formaldehyde resin comprise, by weight: 5-10 parts of formaldehyde, 10-20 parts of sodium hydroxide, 25-50 parts of melamine, 25-50 parts of methanol, 10-20 parts of oxalic acid and 20-40 parts of polyvinyl alcohol.
8. A preparation method of a high-strength modified epoxy resin plate is characterized by comprising the following steps: the preparation method comprises the following steps:
s1 preparation of modified epoxy resin:
heating bisphenol A epoxy resin to 90 ℃, adding stannous octoate and vinyl silicone resin, uniformly mixing, adding water to promote reaction, stirring at 90-110 ℃ for reaction for 1h, adding diphenyl silanediol, and continuing to react at 90-110 ℃ for 3-5h to obtain organic silicon modified epoxy resin;
carrying out prehydrolysis on dimethyl dichlorosilane, adding dried nano silicon dioxide after 30min, carrying out ultrasonic treatment for 1h, stirring for 4h at 70 ℃, repeatedly centrifuging and freeze-drying the reaction product to obtain modified nano silicon dioxide;
uniformly mixing modified nano silicon dioxide and organic silicon modified epoxy resin, reacting for 1h at 150 ℃, adding 4-4' -diaminodiphenyl sulfone powder after the reaction is finished, uniformly stirring at 130 ℃, pouring into a polytetrafluoroethylene mold, vacuumizing for 3h, and curing to obtain modified epoxy resin;
s2: impurity removal of quartz sand:
scrubbing quartz sand for 15min, calcining the scrubbed and dried quartz sand at 900 ℃ for 2h, adding hydrochloric acid at 70-80 ℃ for leaching for 4h, then carrying out a magnetic separation test, combining three acids of hydrochloric acid, hydrofluoric acid and nitric acid, leaching out the quartz sand at 70-80 ℃ for 6h, washing the quartz sand to be neutral by deionized water, and drying to obtain the quartz sand after impurity removal;
s3: preparation of melamine formaldehyde resin:
adjusting the pH value of formaldehyde to 8.5-9.0 by using sodium hydroxide, adding melamine, stirring until the melamine is completely dissolved, reacting for 30min when the temperature reaches 85 ℃, keeping the pH value at 8.5-9.0, cooling to 50 ℃, adding methanol, adjusting the pH value to 5.0-5.5 by using an oxalic acid solution, stopping the reaction when white precipitate is generated with water, immediately adjusting the pH value to 8.0 by using sodium hydroxide after discharging, adding the mixture into a polyvinyl alcohol solution, stirring uniformly, and drying to obtain melamine-formaldehyde resin;
s2: preparation of epoxy resin board:
s21: according to the formula amount, mixing and uniformly stirring modified epoxy resin, a curing agent, an accelerator, an inorganic flame retardant, quartz sand and melamine formaldehyde resin;
s22: feeding the raw materials stirred in the step S21 into a spreading machine for prepressing to prepare a plate blank, and feeding the prepared plate blank into a press for press forming;
s23: and (5) pulling out the pressed plate obtained in the step (S22) and then cutting edges.
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