CN113571452B - Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer - Google Patents
Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer Download PDFInfo
- Publication number
- CN113571452B CN113571452B CN202110832947.9A CN202110832947A CN113571452B CN 113571452 B CN113571452 B CN 113571452B CN 202110832947 A CN202110832947 A CN 202110832947A CN 113571452 B CN113571452 B CN 113571452B
- Authority
- CN
- China
- Prior art keywords
- nitrogen
- positioning rod
- tray body
- silicon wafer
- blowing line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
- F26B25/185—Spacers; Elements for supporting the goods to be dried, i.e. positioned in-between the goods to build a ventilated stack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The embodiment of the invention discloses a device and a method for aligning a nitrogen blowing pipeline in cleaning equipment of a silicon wafer, wherein the device comprises the following components: a tray body having the same shape as the silicon wafer so that the tray body can be caught in the cleaning apparatus in the same manner as the silicon wafer; a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear duct extending in a longitudinal direction of the positioning rod and adapted to be inserted by the nitrogen blowing line, a longitudinal axis of the duct extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen blowing line; and a fixing member for fixing the nitrogen gas blowing line to the purge apparatus at a fixing point of the nitrogen gas blowing line which is not inserted into the duct.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a device and a method for aligning nitrogen blowing pipelines in cleaning equipment of silicon wafers.
Background
In the production of semiconductor silicon wafers, it is often necessary to clean the wafers with a wafer cleaning apparatus, such as a polishing agent remaining on the wafer surface after the wafers are polished. Specifically, in the cleaning process of the silicon wafer, the mechanical arm grabs the silicon wafer to be cleaned and places the silicon wafer on a chuck of the cleaning device, the chuck pins fix the silicon wafer to the chuck, a cleaning agent supply pipeline supplies a cleaning agent such as hydrogen fluoride solution, ozone water and ultrapure water to the surface of the silicon wafer rotating along with the chuck to clean the silicon wafer, and a cylindrical cleaning cover is further arranged on the periphery of the chuck to restrict the flow of the cleaning agent.
After the cleaning operation of the silicon wafer is completed, nitrogen is generally blown onto the surface of the silicon wafer by using a nitrogen blowing pipeline to blow the cleaning liquid remained on the surface of the silicon wafer to dry the silicon wafer. Specifically, the nitrogen gas blowing line is fixed to the silicon wafer cleaning apparatus at a fixed point, such as to the upper edge of the cleaning hood, from which the nitrogen gas blowing line extends in a suspended manner toward the center of the silicon wafer to blow nitrogen gas toward the silicon wafer. The requirements for the direction and angle of the suspended portion of the nitrogen gas blowing line are high so that the nitrogen gas ejected from the outlet of the nitrogen gas blowing line can directly reach the center of the silicon wafer to dry the surface of the silicon wafer in an efficient manner while the silicon wafer rotates together with the chuck.
In the process of maintaining the silicon wafer cleaning equipment or in the process of placing the silicon wafer on the chuck or taking the silicon wafer from the chuck by using the mechanical arm, the nitrogen blowing pipeline which is externally hung from the fixed point may be touched, and because the nitrogen blowing pipeline is flexible, deformation is generated after the nitrogen blowing pipeline is touched and cannot be recovered, so that the deformed nitrogen blowing pipeline cannot blow nitrogen to the center of the silicon wafer, and in order to improve the production efficiency, the nitrogen blowing time is generally shorter, about 10 seconds, so that the drying of the whole surface of the silicon wafer cannot be completed under the condition, or a part of the surface of the silicon wafer may not be dried, thereby causing the surface pollution of the silicon wafer to exceed the standard and affecting the qualification rate of the silicon wafer.
Disclosure of Invention
In order to solve the above-mentioned technical problems, it is desirable to provide a device and a method for aligning a nitrogen blowing pipeline in a cleaning device for a silicon wafer, in which when the nitrogen blowing pipeline is mistouched to deform and thus cannot be accurately blown to the center of the silicon wafer in the cleaning device, the nitrogen blowing pipeline can be realigned, so that nitrogen ejected from an outlet of the nitrogen blowing pipeline can directly reach the center of the silicon wafer, and therefore, the surface of the silicon wafer is dried in an efficient manner, and the silicon wafer qualification rate is prevented from being affected.
The technical scheme of the invention is realized as follows:
In a first aspect, an embodiment of the present invention provides an apparatus for aligning a nitrogen purge line in a cleaning apparatus for a silicon wafer, the apparatus comprising:
a tray body having the same shape as the silicon wafer so that the tray body can be caught in the cleaning apparatus in the same manner as the silicon wafer;
a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear duct extending in a longitudinal direction of the positioning rod and adapted to be inserted by the nitrogen blowing line, a longitudinal axis of the duct extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen blowing line;
And a fixing member for fixing the nitrogen gas blowing line to the purge apparatus at a fixing point of the nitrogen gas blowing line which is not inserted into the duct.
In a second aspect, an embodiment of the present invention provides a method for aligning a nitrogen purge line in a cleaning apparatus for a silicon wafer, where the method is applied to an apparatus provided by the embodiment of the present invention, and the method includes:
s701: clamping the device on the cleaning equipment by the tray body;
s702: inserting the nitrogen pipeline into the pore canal of the positioning rod;
S703: fixing the nitrogen blowing line to the purge apparatus at a fixing point of the nitrogen blowing line that is not inserted into the duct;
s704: moving the positioning rod in the through hole toward the tray body by a distance greater than a length of the nitrogen blowing line inserted into the duct;
s705: the tray body and the fixing block and the positioning rod are removed from the cleaning apparatus.
The embodiment of the invention provides a device and a method for aligning a nitrogen blowing pipeline in a cleaning device of a silicon wafer, because a pore canal is linear, after the nitrogen blowing pipeline is inserted into the pore canal of a positioning rod, the inserted part, namely the tail end part of the nitrogen blowing pipeline, is shaped into a linear shape, which is favorable for accurately controlling the flow direction of the conveyed nitrogen.
Drawings
FIG. 1 is a schematic diagram of a cleaning apparatus for silicon wafers;
FIG. 2 is a schematic view of an apparatus for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to an embodiment of the present invention;
FIG. 3 is a schematic view of an apparatus for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to another embodiment of the present invention;
FIG. 4 is a schematic view of an apparatus for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to another embodiment of the present invention;
FIG. 5 is a schematic view of an apparatus for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to another embodiment of the present invention;
FIG. 6 is a schematic view of an apparatus for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to another embodiment of the present invention;
fig. 7 is a schematic view of a method for aligning nitrogen purge lines in a cleaning apparatus for silicon wafers according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Fig. 1 shows a cleaning apparatus CA for cleaning a silicon wafer W. The cleaning apparatus CA may include, as shown in fig. 1: a chuck CH for carrying a silicon wafer W, as shown by hatched areas for clarity in fig. 1; a plurality of chuck pins CP for fixing the wafer W to the chuck CH, six of which are exemplarily shown in fig. 1; a cleaning liquid delivery line CL for delivering a cleaning liquid to the silicon wafer W; a cylindrical cleaning cap CS provided on the outer periphery of the chuck CH to restrict the flow of the cleaning liquid; and a nitrogen gas blowing line L for blowing nitrogen gas to the center of the wafer W to dry the wafer W after the wafer W is cleaned.
As shown in fig. 1, for the nitrogen blowing line L, it may be fixed to the upper edge of the purge cap CS at a fixed point LP, and a portion from the fixed point LP to the end of the nitrogen blowing line L is suspended, so that the suspended portion is deformed when touched, and since the nitrogen blowing line L is flexible, the suspended portion is not recovered after being deformed, so that nitrogen gas cannot be blown to the center of the wafer W, and drying of the entire wafer W cannot be achieved when the wafer W rotates together with the chuck CH.
Based on this, an embodiment of the present invention provides an apparatus 1 for aligning a nitrogen gas blowing line L in a cleaning device CA of a silicon wafer W as shown in fig. 1, referring to fig. 2, the apparatus 1 may include:
A tray 10, the tray 10 having the same shape as the silicon wafer W as shown in fig. 1, so that the tray 10 can be clamped in the cleaning apparatus CA in the same manner as the silicon wafer W, for example, as can be understood in conjunction with fig. 1 and shown in fig. 2, the tray 10 can be carried on a chuck CH of the cleaning apparatus CA and fixed to the chuck CH by six chuck pins CP;
A positioning rod 20 obliquely disposed on the tray body 10, the positioning rod 20 being formed with a linear-type duct 21 extending in a longitudinal direction of the positioning rod 20 and adapted to be inserted by the nitrogen blowing duct L (shown by a grid hatched area for clarity purposes in fig. 2), as schematically shown by a broken line inside the positioning rod 20 in fig. 2, a longitudinal axis 21X of the duct 21 extending through a center 11C of the upper surface 11 of the tray body 10 in an insertion direction D of the nitrogen blowing duct L, as schematically shown by a cross, here, for the manner of disposing the positioning rod 20, for example, the positioning rod 20 may be integrally formed with the tray body 10, or may be disposed on the tray body 10 in other manners as described in detail below;
As a fixing member 30 schematically shown in fig. 2, the fixing member 30 is used to fix the nitrogen gas blowing line L to the purge apparatus CA at a fixing point LP of the nitrogen gas blowing line L that is not inserted into the duct 21, as shown in fig. 2, the fixing point LP may be a point of the nitrogen gas blowing line L that is in contact with the upper edge of the cylindrical purge hood CS, as schematically shown by a black hatched area in the nitrogen gas blowing line L in fig. 2, and the nitrogen gas blowing line L is also specifically fixed to the upper edge of the purge hood CS of the purge apparatus CA by the fixing member 30.
Since the duct 21 is linear, after the nitrogen gas blowing line L is inserted into the duct 21 of the positioning rod 20, the inserted portion, i.e., the end portion of the nitrogen gas blowing line L is shaped to be linear, which is advantageous in accurately controlling the flow direction of the supplied nitrogen gas, and since the longitudinal axis 21X of the duct 21 passes through the center 11C of the upper surface 11 of the disk 10, the nitrogen gas supplied through the nitrogen gas blowing line L inserted into the duct 21 via the end portion can directly reach the center 11C of the upper surface 11 of the disk 10 under the effect of inertia, which would be the case of clamping the wafer W in the cleaning apparatus CA.
The tray 10 and the positioning rod 20 may be integrally formed as described above, but in this case, since the tray 10 and the positioning rod 20 together constitute an irregular structure, it is difficult for the manufacturing of the device 1. Based on this, in a preferred embodiment of the present invention, referring to fig. 3, the apparatus 1 further includes a fixing block 40 provided on the tray 10, the fixing block 40 being formed with a through hole 41, and the positioning rod 20 being fitted in the through hole 41. The formation of the through-hole 41 in the fixing block 40 is easy, for example, it can be formed simply by drilling, and furthermore, fitting the rod-like member into the through-hole is easy to achieve, thereby facilitating the production and manufacture of the device 1.
In one specific implementation of fitting the positioning rod 20 into the through hole 41 of the fixing block 40, referring to fig. 4, the fixing block 40 is formed with a screw hole 42 in a direction perpendicular to the through hole 41, and the outer circumferential surface 20S of the positioning rod 20 is formed with a recess 22, so that the positioning rod 20 can be fixed to the fixing block 40 by screwing a screw S into the screw hole 42 in a direction shown by a straight arrow in fig. 4 and fitting with the recess 22.
As can be understood with reference to fig. 2, after the nitrogen gas blowing line L is aligned by the apparatus 1 according to the present invention, the tray 10 and the positioning rod 20 provided on the tray 10 are also required to be removed from the cleaning apparatus CA so that the wafer W can be chucked in the cleaning apparatus CA to be cleaned and dried. In the process of removing the tray 10 and the positioning rod 20, it is necessary to ensure that no interference is generated to the portion of the nitrogen gas blowing line L from the fixed point LP to the end to avoid deformation of the portion, resulting in that nitrogen gas cannot be directly injected to the center of the wafer W. In the case shown in fig. 2, it is necessary that the tray body 10, the positioning rod 20, the chuck CH and the chuck pins CP move together in the direction of the longitudinal axis 21X of the duct 21 to the right and downward with respect to the purge hood CS to ensure that no interference is generated with the nitrogen gas blowing line L, and it is obvious that it is difficult to achieve such movement. Based on this, in the preferred embodiment of the present invention, referring to fig. 5, in the case where the apparatus 1 includes the fixing block 40, the fixing block 40 is disposed in the tray 10 at a position closer to the radial center of the tray 10 or to the center 11C of the upper surface 11 of the tray 10 as shown in fig. 5 than the end LT of the nitrogen gas blowing line L inserted into the duct 21, the positioning rod 20 is movable toward the tray 10 in the through hole 41 in the direction of the longitudinal axis 21X of the duct 21, as shown by the black arrow in fig. 5, and the movable distance MD of the positioning rod 20 (the distance between the end of the positioning rod 20 and the center 11C of the upper surface 11 of the tray 10 as shown in fig. 5) is greater than the length L1 of the nitrogen gas blowing line L inserted into the duct 21. Thereby, by moving the positioning rod 20, the nitrogen gas blowing line L can be made in a state not inserted into the duct 21, and the tray body 10, the fixing block 40, and the positioning rod 20 can be removed from the cleaning apparatus CA only by moving the tray body 10 away from the nitrogen gas blowing line L with respect to the chuck CH, for example, in the horizontal direction.
In order to facilitate checking whether the nitrogen blowing line L is aligned, it is desirable that the tray 10 of the apparatus 1 is still caught in the cleaning device CA, and the fixing block 40 and the positioning rod 20 are removed from the cleaning device CA, as can be understood with reference to fig. 5, so that the fixing block 40 is detachably provided on the tray 10 in the preferred embodiment of the present invention. In this way, it is possible to realize a check whether the nitrogen blowing line L is aligned, specifically, for example, it is possible to spray the liquid on the upper surface 11 of the tray body 10, then normally supply the nitrogen through the nitrogen blowing line L and rotate the tray body 10 together with the chuck CH, stop the supply of the nitrogen after, for example, 10 seconds and stop the rotation of the chuck CH, and indicate that the nitrogen blowing line L has been aligned if the liquid sprayed on the upper surface 11 of the tray body 10 can be blown dry.
For the implementation of the removable positioning of the fixing block 40 on the tray 10, in a preferred embodiment of the present invention, referring to fig. 6, the device 1 further comprises a catch 50 integrally formed with the fixing block 40, the catch 50 comprising a catch portion 51 cooperating with the periphery of the tray 10 to position the fixing block 40 with respect to the tray 10. The manner in which the fixing block 40 is provided does not have any influence on the upper surface 11 of the tray 10 nor on the above-described detection result.
In order to achieve more accurate positioning of the nitrogen blowing line L, in a preferred embodiment of the present invention, referring to fig. 5, the length L1 of the nitrogen blowing line L inserted into the duct 21 is not less than one third of the radius of the tray 10.
Since, as previously described, during the nitrogen blowing line L blowing nitrogen gas to dry the wafer W, the tray body 10, the positioning rod 20 and possibly the fixing block 40 and the snapper 50 all need to be removed from the cleaning apparatus CA, thereby leaving a portion of the nitrogen blowing line L from the fixing point LP to the end LT in a suspended state as can be understood with reference to fig. 2, in order that the portion is not deformed by gravity, in a preferred embodiment of the present invention, the length L2 of the nitrogen blowing line L from the fixing point LP to the end LT is not more than one half of the radius of the tray body 10 with reference to fig. 2.
Preferably, the disk 10 is made of PEEK material.
Referring to fig. 7, an embodiment of the present invention also provides a method for aligning a nitrogen gas blowing line L in a cleaning apparatus CA of a silicon wafer W, which is applied to the apparatus 1 as shown in fig. 5, which may include:
S701: clamping the device 1 on the cleaning apparatus CA with the tray 10;
s702: inserting the nitrogen line into the aperture 21 of the positioning rod 20;
S703: fixing the nitrogen gas blowing line L to the purge apparatus CA at a fixing point LP of the nitrogen gas blowing line L that is not inserted into the duct 21;
S704: moving the positioning rod 20 in the through hole 41 toward the tray 10 by a distance greater than the length of the nitrogen blowing line L inserted into the duct 21;
S705: the tray 10 and the fixing blocks 40 and the positioning rod 20 are removed from the cleaning apparatus CA.
It should be noted that: the technical schemes described in the embodiments of the present invention may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A device for aligning nitrogen purge lines in a silicon wafer cleaning apparatus, the device comprising:
a tray body having the same shape as the silicon wafer so that the tray body can be caught in the cleaning apparatus in the same manner as the silicon wafer;
a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear duct extending in a longitudinal direction of the positioning rod and adapted to be inserted by the nitrogen blowing line, a longitudinal axis of the duct extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen blowing line;
And a fixing member for fixing the nitrogen gas blowing line to the purge apparatus at a fixing point of the nitrogen gas blowing line which is not inserted into the duct.
2. The device of claim 1, further comprising a fixing block provided on the tray body, the fixing block being formed with a through hole, the positioning rod being fitted in the through hole.
3. The apparatus according to claim 2, wherein the fixing block is formed with a screw hole in a direction perpendicular to the through hole, and an outer circumferential surface of the positioning rod is formed with a recess, so that the positioning rod can be fixed to the fixing block by screwing a screw into the screw hole and fitting the recess.
4. A device according to claim 2 or 3, wherein the fixing block is provided in the tray body at a position closer to a radial center of the tray body than an end of the nitrogen gas blowing line inserted into the tunnel, the positioning rod is movable toward the tray body in the through-hole in a direction of a longitudinal axis of the tunnel, and a movable distance of the positioning rod is greater than a length of the nitrogen gas blowing line inserted into the tunnel.
5. The apparatus of claim 4, wherein the fixed block is removably disposed on the tray.
6. The device of claim 5, further comprising a catch integrally formed with the fixed block, the catch comprising a catch portion that mates with a periphery of the disk to position the fixed block relative to the disk.
7. The apparatus of claim 1, wherein the nitrogen purge line is inserted into the tunnel to a length not less than one third of a radius of the tray.
8. The apparatus of claim 1, wherein a length of the nitrogen purge line from the fixed point to the tip is no more than one half a radius of the tray.
9. The device of claim 1, wherein the disk is made of PEEK material.
10. A method for aligning nitrogen purge lines in a silicon wafer cleaning apparatus, the method being applied to the apparatus of claim 4, the method comprising:
s701: clamping the device on the cleaning equipment by the tray body;
s702: inserting the nitrogen blowing pipeline into the pore canal of the positioning rod;
S703: fixing the nitrogen blowing line to the purge apparatus at a fixing point of the nitrogen blowing line that is not inserted into the duct;
s704: moving the positioning rod in the through hole toward the tray body by a distance greater than a length of the nitrogen blowing line inserted into the duct;
s705: the tray body and the fixing block and the positioning rod are removed from the cleaning apparatus.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832947.9A CN113571452B (en) | 2021-07-22 | 2021-07-22 | Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer |
| TW111126617A TWI840883B (en) | 2021-07-22 | 2022-07-15 | Device and method for adjusting nitrogen blowing pipeline in silicon wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832947.9A CN113571452B (en) | 2021-07-22 | 2021-07-22 | Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113571452A CN113571452A (en) | 2021-10-29 |
| CN113571452B true CN113571452B (en) | 2024-07-05 |
Family
ID=78166446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110832947.9A Active CN113571452B (en) | 2021-07-22 | 2021-07-22 | Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113571452B (en) |
| TW (1) | TWI840883B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101069888A (en) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | Method and apparatus for washing single silicon-chip |
| CN106413990A (en) * | 2014-05-23 | 2017-02-15 | 株式会社荏原制作所 | Pressure calibration jig and substrate processing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004065664A1 (en) * | 2003-01-23 | 2004-08-05 | Ebara Corporation | Plating device and plating method |
| JP4734063B2 (en) * | 2005-08-30 | 2011-07-27 | 東京エレクトロン株式会社 | Substrate cleaning apparatus and substrate cleaning method. |
| CN202700885U (en) * | 2012-07-31 | 2013-01-30 | 海南英利新能源有限公司 | Blowing device for silicon wafer transmission track |
| CN210427190U (en) * | 2019-08-20 | 2020-04-28 | 山东中瑞全兴检测技术有限公司 | Nitrogen blow-drying instrument |
| CN112750734B (en) * | 2020-12-30 | 2023-03-14 | 上海至纯洁净系统科技股份有限公司 | Single wafer carrier cleaning and drying device |
| CN112736006B (en) * | 2020-12-30 | 2023-03-21 | 上海至纯洁净系统科技股份有限公司 | Device for cleaning multiple kinds of single-wafer carriers |
-
2021
- 2021-07-22 CN CN202110832947.9A patent/CN113571452B/en active Active
-
2022
- 2022-07-15 TW TW111126617A patent/TWI840883B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101069888A (en) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | Method and apparatus for washing single silicon-chip |
| CN106413990A (en) * | 2014-05-23 | 2017-02-15 | 株式会社荏原制作所 | Pressure calibration jig and substrate processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113571452A (en) | 2021-10-29 |
| TWI840883B (en) | 2024-05-01 |
| TW202302232A (en) | 2023-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108780746B (en) | Substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus | |
| TWI556881B (en) | Substrate processing apparatus and substrate processing method | |
| JP5789400B2 (en) | Liquid processing method and liquid processing apparatus | |
| JP3894526B2 (en) | Cutting equipment | |
| US9728396B2 (en) | Substrate cleaning method and substrate cleaning apparatus | |
| TWI679695B (en) | Liquid processing method, substrate processing device and memory medium | |
| US20180254200A1 (en) | Substrate processing apparatus | |
| KR102297377B1 (en) | Substrate treating apparatus | |
| TWI830833B (en) | cutting device | |
| CN113571452B (en) | Device and method for aligning nitrogen blowing pipeline in cleaning equipment of silicon wafer | |
| JP7391793B2 (en) | Substrate processing equipment and substrate processing method | |
| CN202807879U (en) | Manipulator and base plate transporting device | |
| US20060096622A1 (en) | Dry cleaning apparatus used to manufacture semiconductor devices | |
| KR102629525B1 (en) | Substrate processing apparatus | |
| KR102622807B1 (en) | Cleaning member, substrate cleaning apparatus, and substrate processing apparatus | |
| JP6952579B2 (en) | Substrate processing equipment and substrate processing method | |
| JPH09306974A (en) | Work holder | |
| KR20010103518A (en) | Chuck for fixing wafer | |
| US20070227565A1 (en) | Workstation and cleaning apparatus thereof | |
| JP2005150468A (en) | Substrate drying apparatus and substrate polishing apparatus | |
| JP2003243333A (en) | Spray tip and cleaning equipment | |
| KR102406089B1 (en) | Apparatus for removing a particle on back nozzle | |
| JP2004047520A (en) | Cleaning equipment, polishing system employing it, process for producing semiconductor device using the polishing system, and semiconductor device produced by the method | |
| KR20250075803A (en) | Apparatus for downsizing wafer | |
| JP4337589B2 (en) | Semiconductor wafer surface treatment equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant after: Xi'an Yisiwei Material Technology Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |