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CN113571442B - Wafer processing apparatus and wafer transfer method - Google Patents

Wafer processing apparatus and wafer transfer method Download PDF

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Publication number
CN113571442B
CN113571442B CN202010356380.8A CN202010356380A CN113571442B CN 113571442 B CN113571442 B CN 113571442B CN 202010356380 A CN202010356380 A CN 202010356380A CN 113571442 B CN113571442 B CN 113571442B
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China
Prior art keywords
communication port
controller
door
door plate
machine
Prior art date
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Application number
CN202010356380.8A
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Chinese (zh)
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CN113571442A (en
Inventor
梁学玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Priority to CN202010356380.8A priority Critical patent/CN113571442B/en
Priority to US17/599,705 priority patent/US12099309B2/en
Priority to PCT/CN2021/090097 priority patent/WO2021218942A1/en
Publication of CN113571442A publication Critical patent/CN113571442A/en
Application granted granted Critical
Publication of CN113571442B publication Critical patent/CN113571442B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer processing apparatus and a wafer transfer method capable of improving a production speed and improving productivity, wherein the wafer processing apparatus includes: a first machine; the second machine comprises a mechanical arm, the mechanical arm conveys the wafer to the machine through a communication port, and the communication port is arranged between the first machine and the second machine; the door plate is arranged on the first machine table and is used for sealing the communication port: a detector for detecting a current position of the door panel; the driver is connected to the door plate and used for driving the door plate to move so as to open the communication port or close the communication port; and the controller is connected to the detector, the driver and the mechanical arm and is used for controlling the door plate to move according to the current position of the door plate detected by the detector so as to open and close the communication port and controlling the mechanical arm to convey the wafer.

Description

Wafer processing apparatus and wafer transfer method
Technical Field
The invention relates to the field of semiconductor production and processing, in particular to a wafer processing device and a wafer conveying method.
Background
In the manufacture of semiconductor devices, exposure machines and TRACK machines, i.e., gumming and developing machines, are often used. And conveying the wafer into the exposure machine by the TRACK machine to perform an exposure process.
In the prior art, when the TRACK machine is about to convey the wafer into the exposure machine, the sealing door between the exposure machine and the TRACK machine is not opened in time. In this case, the wafer production process is delayed, which results in a slow wafer production speed and a low productivity.
Disclosure of Invention
The invention aims to provide a wafer processing device and a wafer conveying method, which can improve the production speed and the production rate.
In order to solve the above technical problems, the following provides a wafer processing apparatus, including: a first machine; the second machine comprises a mechanical arm, the mechanical arm conveys the wafer to the machine through a communication port, and the communication port is arranged between the first machine and the second machine; the door plate is arranged on the first machine table and is used for sealing the communication port: a detector for detecting a current position of the door panel; the driver is connected to the door plate and used for driving the door plate to move so as to open the communication port or close the communication port; and the controller is connected to the detector, the driver and the mechanical arm and is used for controlling the door plate to move according to the current position of the door plate detected by the detector so as to open and close the communication port and controlling the mechanical arm to convey the wafer.
Optionally, the method further comprises: the safety module is connected with the controller and the mechanical arm and comprises a detection unit, wherein the detection unit is used for detecting the opening and closing state of the communication port, and when the detection unit detects that the communication port is closed, the safety module controls the mechanical arm to stop conveying wafers to the first machine.
Optionally, the detector includes: a light source connected to the controller and disposed toward the surface of the door panel for projecting detection light toward the door panel under the control of the controller; the photoresistor receiver is connected to the controller and is arranged on the surface of one side of the door plate, which faces the second machine table, and is used for detecting light signals; the light source is arranged at a preset position, so that light emitted from the preset position can be received by the photoresistor receiver when the communication port is closed.
Optionally, the number of the door panels is two, the door panels are respectively arranged on two opposite sides of the communication port, and the opening and the closing of the communication port are realized by moving the two door panels; the number of the photoresistor receivers is two, and the photoresistor receivers are arranged on one side of the door plate facing the second machine table and are respectively arranged on the two door plates; the detector further comprises: the metal sheet and the inductive switch sensor are respectively arranged on the same side surfaces of the two door plates, the inductive switch sensor is connected to the controller, the positions of the metal sheet and the inductive switch sensor are arranged oppositely, the distances between the metal sheet and the inductive switch sensor are different, and the electrical parameters output by the inductive switch sensor are changed.
Optionally, the driver includes: a motor driving module connected to the controller; the stepping motor is connected to the motor driving module and operates under the control of the motor driving module; a driving gear connected to the stepping motor for rotating around a rotation axis of the driving gear driven by the stepping motor, the rotation axis being perpendicular to the door panel surface; the gear strip is installed in a matched mode with the driving gear, the door plate moves relative to the installation position of the driving gear when the driving gear rotates, and the door plate is installed to the gear strip and moves under the driving of the gear strip.
Optionally, the method further comprises: the sliding rail is overlapped with the moving path of the door plate in the length direction, and is arranged on the moving path of the door plate, and the door plate is arranged on the sliding rail and can slide along the length direction of the sliding rail; the rotating wheel is fixedly arranged on the door plate and in a sliding rail groove of the sliding rail, and can rotate in the sliding rail groove along the length direction of the sliding rail; the sliding rail is arranged above the door plate, the gear strip is arranged below the door plate, and the driving gear is arranged below the gear strip.
Optionally, the system further comprises an interaction module, wherein the interaction module comprises: a housing; the display unit is arranged on the outer surface of the shell, connected to the controller and used for displaying the open-close state of the communication port; the key is arranged in the shell, connected to the controller and used for enabling a user to manually control the movement of the door plate so as to control the opening and closing of the communication port.
Optionally, the controller is further provided with an alarm, and the alarm comprises at least one of a buzzer and an LED lamp.
The following also provides a wafer transfer method for transferring a wafer between a first machine and a second machine of the wafer processing apparatus, comprising the following steps: and when the second machine table is ready to convey the wafer to the first machine table through the communication port, controlling the detector to detect the opening and closing state of the communication port, and controlling the door plate to move to open the communication port when the communication port is closed.
Optionally, the number of the door panels is two, the door panels are respectively arranged on two opposite sides of the communication port, and the opening and the closing of the communication port are realized by moving the two door panels; when the door plate is controlled to move to open the communication port, the method further comprises the following steps: and controlling the detector to detect the distance between the two door plates, and controlling the driver to slow down the moving speed of the door plates when the distance between the two door plates is in a preset range.
Optionally, the detector includes: a light source connected to the controller and disposed toward the surface of the door panel for projecting detection light toward the door panel under the control of the controller; the two photoresistor receivers are connected to the controller, are arranged on one side of the door plate facing the second machine table, and are respectively arranged on the two door plates and used for detecting light signals; when the light emitted by the light source is received by more than one photoresistor receiver, the detector sends a signal corresponding to the closing of the communication port to the controller.
Optionally, the wafer processing apparatus further includes: the safety module comprises a detection unit, a controller and a mechanical arm, wherein the detection unit is connected to the controller and the mechanical arm and is used for detecting the opening and closing states of the communication ports, and controlling the mechanical arm to stop conveying wafers to the first machine when the detection unit detects that the communication ports are closed; when the detection unit detects that the communication port is closed, the controller controls the light source to project detection light to the door plate.
Optionally, the detector further includes a metal sheet and an inductive switch sensor, which are respectively disposed on the same side surfaces of the two door panels, the distances between the metal sheet and the inductive switch sensor are different, and the electrical parameters output by the inductive switch sensor change, so that the detector is controlled to detect the open-close state of the communication port, and the detector further includes the following steps: and when the electrical parameter output by the inductive switch sensor is in a preset electrical parameter range, reducing the driving speed of the driver.
The wafer processing device and the wafer conveying method are provided with the detector, the driver and the controller, and can timely and automatically move the door plate and open the communication port when the detector detects that the current door plate is closed and the communication port is closed, so that machine shutdown caused by closing of the communication port can be effectively prevented, a user does not need to manually move the door plate and open the communication port, and the production speed and the production rate of wafers are effectively improved.
Drawings
Fig. 1 is a schematic diagram illustrating connection relationships between modules of a wafer processing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of a wafer processing apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic side view of a wafer processing apparatus according to an embodiment of the present invention.
Fig. 4 is an enlarged partial schematic view of a wafer processing apparatus according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an interactive module according to an embodiment of the present invention.
Fig. 6 is a schematic circuit diagram of an alarm in one embodiment of the invention.
Detailed Description
It is found that an important reason for low wafer production speed is that a door plate separating an exposure machine and a TRACK machine in the prior art is controlled by the exposure machine, a control handle is positioned on one side of the exposure machine, and the situation that the exposure machine and the TRACK machine are forgotten to be opened and closed often occurs during manual control, so that the normal work of the exposure machine and the TRACK machine is affected.
In addition, in the wafer transmission process, when the door plate is detected not to be opened, a manager is required to enter an operation room where the TRACK machine and the exposure machine are located, and the door plate between the exposure machine and the TRACK machine is opened manually, so that a large amount of time is required to be consumed, delay of the wafer production flow is caused, and the production speed and the production rate of the wafers are affected.
Moreover, the TRACK machine may need to be restarted for software. When the TRACK machine is restarted, the air flow in the TRACK machine needs to be completely closed. At this time, the door plate needs to be controlled to be in a closed position, so that the communication port of the exposure machine is closed, and the air pressure change in the TRACK machine table is prevented from causing the air pressure change of the exposure machine, thereby causing the downtime of the exposure machine. In the prior art, a user is required to go to an operation room where the TRACK machine and the exposure machine are located, and a door plate between the exposure machine and the TRACK machine is opened manually, so that the production speed and the production efficiency of wafers are also affected.
Referring to fig. 1 to 3, fig. 1 is a schematic diagram illustrating connection relationships between modules of a wafer processing apparatus according to an embodiment of the present invention, fig. 2 is a schematic diagram illustrating a structure of the wafer processing apparatus according to an embodiment of the present invention, and fig. 3 is a schematic diagram illustrating a side view of the wafer processing apparatus according to an embodiment of the present invention.
In the embodiments shown in fig. 1 to 3, there is provided a wafer processing apparatus including: a first machine; the second machine comprises a mechanical arm 104, the mechanical arm 104 transmits the wafer to the machine through a communication port 201, and the communication port 201 is arranged between the first machine and the second machine; the door panel 200 is disposed on the first machine, and is configured to close the communication port 201: a detector 103 for detecting a current position of the door panel 200; a driver 105 connected to the door panel 200 for driving the door panel 200 to move to open the communication port or close the communication port 201; and a controller 102 connected to the detector 103, the driver 105 and the robot 104, for controlling the door panel 200 to move according to the current position of the door panel 200 detected by the detector 103, so as to open and close the communication port 201, and controlling the robot 104 to transfer the wafer.
In this embodiment, the wafer processing apparatus includes the detector 103, the driver 105, and the controller 102, and when the detector 103 detects that the current door panel 200 is closed and the communication port 201 is closed, the door panel 200 is moved timely and automatically, and the communication port 201 is opened, so that a machine shutdown caused by closing of the communication port 201 can be effectively prevented, and a user does not need to manually move the door panel 200 and open the communication port 201, thereby effectively improving the production speed and the production efficiency of the wafer.
In one embodiment, the wafer processing apparatus further includes: the safety module 101 is connected to the controller 102 and the mechanical arm 104, and includes a detection unit, configured to detect an open/close state of the communication port 201, where the safety module 101 controls the mechanical arm 104 to stop transferring the wafer to the first machine when the detection unit detects that the communication port 201 is closed.
In a specific embodiment, a signal processing circuit is also disposed between the detection unit of the security module 101 and the controller 102, so that the signal sent by the detection unit can be amplified, so that the controller 102 can perform better recognition.
In a specific embodiment, the first machine is an exposure machine, the second machine is a TRACK machine, and the security module 101 is also disposed in the TRACK machine, for controlling the mechanical arm 104 of the TRACK machine to stop or continue to transfer the wafer into the exposure machine.
In a specific embodiment, the controller 102 may directly control the mechanical arm 104 to stop working without providing the safety module 101.
In one embodiment, the detector 103 includes: a light source 301 connected to the controller 102 and disposed toward the surface of the door panel 200, for projecting detection light toward the door panel 200 under the control of the controller 102; the photoresistor receiver 203 is connected to the controller 102, and is disposed on a side surface of the door panel 200 facing the second machine, and is used for detecting light signals; the light source 301 is disposed at a preset position, so that the light emitted from the preset position can be received by the photoresistor receiver 203 when the communication port 201 is closed. In other embodiments, it may be configured that the light is not received by the photoresistor receiver 203 only when the communication port is completely opened.
In one embodiment, the light source 301 starts to project the detection light to the door panel 200 when the detection unit of the security module 101 detects that the current communication port 201 is closed. And when the detecting unit does not detect that the current communication port 201 is closed, the light source 301 does not perform the action of projecting light.
In another embodiment, the light source 301 may start emitting the inspection light to the door panel 200 whenever the second station starts transferring the wafer to the first station.
In this embodiment, the action of the light source 301 projecting the detection light to the door panel 200 is periodically performed, so as to be able to check whether the door panel 200 is in the closed position in time, and close the communication port 201. In this way, when the second machine station transfers the wafer to the first machine station, the door panel 200 can be controlled to move in time, so that the communication port 201 is opened, and larger production delay is avoided, but the energy consumption is larger.
When the door panel 200 is in the closed position, so that the communication port 201 is closed, the detection light is directly projected to the photoresistor receiver 203, the photoresistor receiver 203 outputs a corresponding electrical signal to the controller 102, and the controller 102 controls the driver 105 to move the door panel 200 according to the control signal until the communication port 201 is opened.
In a specific embodiment, the number of the door panels 200 is two, and the door panels are respectively arranged at two opposite sides of the communication port 201, and the opening and closing of the communication port 201 are realized by moving the two door panels 200; the number of the photoresistor receivers 203 is two, and the photoresistor receivers are arranged on one side of the door plate 200 facing the second machine table and are respectively arranged on the two door plates 200; the detector 103 further comprises: the metal sheet 2041 and the inductive switch sensor 2042 are respectively disposed on the same side surfaces of the two door panels 200, the inductive switch sensor 2042 is connected to the controller 102, the positions of the metal sheet 2041 and the inductive switch sensor 2042 are disposed opposite to each other, the distances between the metal sheet 2041 and the inductive switch sensor 2042 are different, and the electrical parameters output by the inductive switch sensor 2042 are changed.
In this embodiment, it is determined that the door panel 200 is in the closed position and the communication port 201 is in the closed state as long as one of the photo-resistive receivers 203 receives the light signal. In some embodiments, the communication port 201 may be configured to be closed when both of the photo-resistive receivers 203 receive the optical signal. The present embodiment may set that when one of the photoresistor receivers 203 receives the optical signal, the communication port 201 is determined to be in a closed state.
In some other embodiments, only one photoresistor receiver 203 may be provided on two of the door panels 200, or more than three photoresistor receivers 203 may be provided. The plurality of photoresistor receivers 203 may prevent erroneous decisions from occurring due to failure of one of the photoresistor receivers 203.
In one embodiment, the photoresistor receiver 203 comprises a photosensor that converts optical signals to electrical signals using a photosensor. The sensitive wavelength of the photosensor is near the visible wavelength, including infrared wavelength and ultraviolet wavelength.
Referring to fig. 3, in this embodiment, the light source 301 is disposed on the robot arm 104 of the second machine, the photoresistor receiver 203 receives the detection light from the light source 301 and outputs a corresponding voltage signal, and the controller 102 controls the driver 105 to move the door panel 200 according to the voltage signal.
In this embodiment, the metal sheet 2041 and the inductive switch sensor 2042 are used, and when the distance between the metal sheet 2041 and the inductive switch sensor 2042 is changed, the electrical parameter output from the inductive switch sensor 2042 to the controller 102 is directly changed, and the controller 102 can perform corresponding control according to the change of the electrical parameter.
For example, when the distance between the metal sheet 2041 and the inductive switch sensor 2042 is very small, the inductive switch sensor 2042 outputs an electrical parameter corresponding to the distance, and the controller 102 controls the driver 105 according to the electrical parameter to reduce the moving speed of the door panel 200, so as to prevent the door panel 200 from moving too fast when being very close to another door panel 200, and damage to the door panel 200 and damage to the driver 105.
The sheet metal 2041 and inductive switch sensor 2042 in this embodiment are also effective to prevent the actuator 105 from being damaged when both door panels 200 are in the closed state, as the actuator 105 is still being actuated.
In one embodiment, when the distance between the metal sheet 2041 and the inductive switch sensor 2042 is 10mm, the electrical parameter output by the inductive switch sensor 2042 is a preset electrical parameter, and the driver 105 is controlled to achieve the decelerating motion of the door panel 200.
In one embodiment, the inductive switch sensor 2042 includes an oscillator, a switching circuit, and an amplifying output circuit. The oscillator generates an alternating magnetic field, and when the metal target approaches the magnetic field and reaches an induction distance, eddy currents are generated in the metal target, so that the metal oscillator is attenuated, and vibration is stopped. The oscillation and stop change of the oscillator is processed by the post-stage amplifying circuit and converted into a switch signal to trigger the driving controller 102, thereby achieving the purpose of non-contact detection.
In one embodiment, the metal sheet 2041 comprises at least one of an iron sheet, a copper sheet, a chromium sheet, and the like.
In this embodiment, the switch signal is linearly related to the distance between the metal sheet 2041 and the inductive switch sensor 2042, so that when the electrical parameter output by the inductive switch sensor 2042 is within a predetermined range, the distance between the two door panels 200 can be considered to be relatively close, and the moving speed of the door panels 200 needs to be reduced.
In one embodiment, a signal conditioning circuit is further disposed between the inductive switch sensor 2042 and the controller 102. In one embodiment, the inductive switch sensor 2042 is connected to the controller 102 via the signal conditioning circuit, and the signal conditioning circuit amplifies, stabilizes, filters the analog signal output by the inductive switch sensor 2042, and performs analog-to-digital conversion to obtain a digital signal that can be recognized by the controller 102.
In one embodiment, the driver 105 includes: a motor drive module connected to the controller 102; the stepping motor is connected to the motor driving module and operates under the control of the motor driving module; a driving gear 205 connected to the stepper motor for rotating around a rotation axis of the driving gear 205, the rotation axis direction being perpendicular to the surface of the door panel 200, under the driving of the stepper motor; the gear strip 206 is mounted in cooperation with the driving gear 205, and moves relative to the mounting position of the driving gear 205 when the driving gear 205 rotates, the door panel 200 is mounted right above the gear strip 206 and moves under the driving of the gear strip 206, as shown in fig. 4, the lower surface of the gear strip 206 is provided with teeth 401, and the teeth 401 cooperate with the driving gear 205, so that the gear strip 206 drives the door panel 200 mounted on the gear strip 206 to move left and right when the driving gear 205 rotates.
In this embodiment, the deceleration of the driver 105 corresponds to a decrease in the rotational speed of the stepper motor. When the door panels 200 approach each other, so that the inductive switch sensor 2042 outputs corresponding electrical parameters, the control voltage output by the motor driving module to the stepper motor is also changed, so that the rotor speed of the stepper motor is reduced, the speed of the driving gear 205 is reduced, and the moving speed of the gear rack 206 is also reduced.
In a specific embodiment, the stepper motor rotates at a certain angle under the control of the motor driving module, so that the gear 205 installed on the stepper motor moves to further drive the gear strip 206 to move left and right, thereby realizing the movement of the door panel 200 and realizing the opening and closing of the communication port 201. In one embodiment, the gear bar 206 is welded under the door panel 200, and the door panel 200 is synchronized with the movement of the gear bar 206.
Since the control accuracy of the stepper motor is very high, the rotation angle of the gear 205 can be well determined, so that the position of the gear strip 206 can be well determined, and when the stepper motor is controlled, the torque and the rotation speed of the stepper motor can be controlled by controlling the electric signal fed into the stepper motor. The rotating speed of the rotor of the stepping motor is controlled by the input electric signal and can react rapidly.
In this embodiment, the stepper motor is positioned by pulses, and the stepper motor receives 1 pulse and rotates by an angle corresponding to 1 pulse, thereby realizing displacement. Because the stepping motor itself possesses the function of sending out pulses, so every time the stepping motor rotates an angle, the corresponding quantity of pulses can be sent out, thus, the pulse received by the stepping motor forms a call or is called a closed loop, so that the controller 102 can know how many pulses are sent out to the stepping servo motor and how many pulses are received back, the rotation of the stepping motor can be precisely controlled, and the precise positioning can be realized, and the positioning precision can even reach 0.001mm.
In a specific embodiment, the stepper motor can calculate the rotation angle according to the photoelectric code disc, and the rotation angle corresponding to the rotor of the stepper motor is recorded by the voltage dependent resistor output pressure value through the storage circuit. The working principle of the photoelectric code disk is as follows: when the code wheel rotates at different positions, the combination of signals output by the photosensitive elements reflects a certain regular digital quantity and represents the angular displacement of the code wheel shaft.
In this embodiment, the controller 102 drives the stepper motor to rotate clockwise or counterclockwise through the motor drive module. In one embodiment, the motor drive module is implemented by a motor drive chip, which is connected to the stepper motor. By arranging the motor driving chip, the stepping motor can not only receive the signal of the controller 102 to rotate correspondingly, but also transmit the feedback signal detected by the stepping motor to the microprocessor to form closed-loop control.
In one embodiment, the wafer processing apparatus further includes: a slide rail 202 having a length direction coincident with a movement path of the door panel 200 and being installed on the movement path of the door panel 200, the door panel 200 being installed to the slide rail 202 and being capable of sliding along the length direction of the slide rail 202; the rotating wheel 207 is fixedly arranged on the door plate 200 and in a sliding rail 202 groove of the sliding rail 202, and can rotate in the sliding rail 202 groove along the length direction of the sliding rail 202; the sliding rail 202 is disposed directly above the door panel 200, the gear bar 206 is disposed below the door panel 200, and the driving gear 205 is disposed below the gear bar 206.
In this embodiment, the inner wall of the sliding rail 202 is smooth, the runner 207 is clamped in the groove of the sliding rail 202, and the friction force between the runner 207 and the sliding rail 202 is small, so that the door panel 200 is prevented from being influenced by the large friction force between the sliding rail 202 and the runner 207 when the door panel 200 moves.
In this embodiment, two wheels 207 are provided per door panel 200 to balance the forces. The number of wheels 207 on a single door panel 200 may be practically set as desired. Bolts and bolt holes are provided in the runner 207 to fix the door panel 200 to the runner 207. When the stepping motor drives the lower gear 206 to move, the upper track groove and the rollers can support the weight of the sealing door and reduce friction, so that the door plate 200 can stably and efficiently move.
In a specific embodiment, the method further comprises an interaction module 500, wherein the interaction module comprises: a housing; a display unit disposed on the outer surface of the housing and connected to the controller 102 for displaying an open/closed state of the communication port; a key, disposed in the housing and connected to the controller 102, for a user to manually control the movement of the door panel 200, thereby controlling the opening and closing of the communication port 201.
In one embodiment, the closed state of the door panel 200 may be checked in real time through the display unit. The display unit provides a friendly human-machine interface for a user, the user can intuitively see the current condition of the door panel 200, and the keys can also be used for realizing manual opening and closing of the door panel 200.
Fig. 5 is a schematic structural diagram of an interaction module according to an embodiment of the invention. In this embodiment, the display unit includes an on indicator 501, an in-motion indicator 502, an off indicator 503, and an operating status indicator 506 of the inductive switch sensor 2042, so that the current state of the door panel 200 and the operating status of the inductive switch sensor 2042 can be displayed in real time.
In this embodiment, when the distance between the two door panels 200 is 0CM, the communication port 201 is in a closed state, and the closing indicator 503 is turned on, the opening indicator 501 is turned off, and the inductive switch sensor 2042 is turned on, so that the door panel 200 is in a closed state. When the distance between the left and right door panels 200 is greater than or equal to 40cm, the robot arm 104 can send the wafer into the communication port 201 at this time, the door panels 200 are in an open state, the open state indicator lamp 501 is turned on, and other indicator lamps are turned off. In one embodiment, the controller 102 may calculate the arc length of the revolution, i.e., the horizontal displacement of the door panel 200, by multiplying the rotor rotation angle of the stepper motor by the radius of the gear 205.
In a specific embodiment, by setting the key, it is ensured that a user can manually control the opening or closing of the door panel 200, so that the operation of the wafer processing apparatus is more convenient. In fig. 5, an open key 504 and a close key 505 are included for controlling the door panel 200 to be opened and controlling the door panel 200 to be closed, respectively.
In one other embodiment, the keys include an open key 504 and a close key 505, and a pause key. When the open key 504 is pressed, the controller 102 controls the stepper motor to rotate forward, so as to drive the two door panels 200 to move in directions away from each other. When the closing key 505 is pressed, the controller 102 controls the stepper motor to rotate reversely, so as to drive the two door panels 200 to move towards each other, so as to close the communication port 201. When the pause key is pressed, the controller 102 controls the stepping motor to stop rotating, and the door panel 200 is not moved any more.
In a specific embodiment, the display unit may further comprise a touch screen in addition to the corresponding indicator light. The touch screen may also be used directly to indicate whether the door panel 200 is in a closed state.
In this embodiment, the touch screen is connected to a decoding chip through a touch screen interface circuit, and the decoding chip is connected to the controller 102. In one embodiment, the model number of the decoding chip is ADS7843. The controller 102 drives the decoding chip to enable the touch screen to display corresponding information, the driving decoding chip can convert an input signal sensed by the touch screen into an output signal, the output signal is sent to the controller 102, and the controller 102 drives corresponding execution devices to achieve corresponding functions.
In a specific embodiment, the controller 102 includes at least one of a programmable logic device, a microcontroller 102, and a single chip microcomputer.
In one embodiment, the wafer processing apparatus further includes stoppers disposed at two ends of the sliding rail 202, for respectively restricting the two door panels 200, so as to prevent the two door panels 200 from moving in a direction away from each other, so as to slide out of the sliding rail 202.
In this embodiment, the stopper includes stoppers 208 provided at both ends of the slide rail 202. In a specific embodiment, a sensing unit is disposed on a side of the stopper facing the door panel 200, and the sensing unit is also connected to the controller 102, and sends a control command to inform the controller 102 to stop the driving of the door panel 200 by the driver 105 when the sensing unit detects that the door panel 200 has touched the stopper 208.
In one embodiment, the wafer processing apparatus further comprises an alarm connected to the controller 102, the alarm comprising at least one of a buzzer and an LED lamp. By setting the alarm, the user can be timely and effectively informed of the current opening and closing state of the communication port 201.
Referring to fig. 6, a schematic circuit diagram of an alarm in one embodiment is shown. Three interfaces P1.0, P1.1 and P1.2 are included in the figure as connection interfaces for the controller 102 and alarms. When the controller 102 detects that the value is normal, the controller 102 provides a low level for the P1.0 interface, so that the green LED lamp connected to the P1.0 interface is turned on, and the controller 102 also provides a low level for the P1.2 interface, so that the triode Q1 in the figure is turned off, and the buzzer does not work. When the controller 102 detects a numerical anomaly, the controller 102 provides a low level to the P1.1 interface and the red LED indicator lights are turned on. The controller 102 also provides a high level to the P1.2 interface, so that the triode Q1 connected with the buzzer is turned on, and the buzzer works.
In one embodiment, the controller 102 controls the alarm to sound an alarm after the communication port 201 has been closed for a period of time.
In one embodiment, the wafer processing apparatus further includes a timer, connected to the controller 102, for counting a time period during which the communication port 201 is continuously in a closed state.
In this embodiment, the timer counts from zero when the inductive switch sensor 2042 outputs the preset electrical parameter, and if the duration of the inductive switch sensor 2042 outputting the preset electrical parameter exceeds the preset duration, for example, 3 hours, the controller 102 drives an alarm to alarm, so as to prompt the staff. And when the staff confirms that no abnormality exists, the timer is restored to the initial 0 state through the reset key, and the timer is restarted.
In this embodiment, there is also provided a wafer transfer method for transferring a wafer between a first machine and a second machine of the wafer processing apparatus, including the steps of: when the second machine is ready to transfer the wafer to the first machine through the communication port 201, the detector 103 is controlled to detect the open/close state of the communication port 201, and when the communication port 201 is closed, the door panel 200 is controlled to move to open the communication port 201.
In this embodiment, the wafer conveying method employs the detector 103, the driver 105 and the controller 102, and when the detector 103 detects that the current door panel 200 is closed and the communication port 201 is closed, the door panel 200 is timely and automatically moved to open the communication port 201, so that machine shutdown caused by closing of the communication port 201 can be effectively prevented, and a user does not need to manually move the door panel 200 and open the communication port 201, thereby effectively improving the production speed and the production efficiency of the wafer.
In a specific embodiment, the number of the door panels 200 is two, and the door panels are respectively arranged at two opposite sides of the communication port 201, and the opening and closing of the communication port 201 are realized by moving the two door panels 200; when controlling the door panel 200 to move to open the communication port 201, the method further comprises the steps of: the detector 103 is controlled to detect the distance between the two door panels 200, and when the distance between the two door panels 200 is within a preset range, the driver 105 is controlled to slow down the moving speed of the door panels 200.
In one embodiment, the detector 103 includes: a light source 301 connected to the controller 102 and disposed toward the surface of the door panel 200, for projecting detection light toward the door panel 200 under the control of the controller 102; two photoresistor receivers 203 connected to the controller 102, each of which is disposed on a side of the door panel 200 facing the second machine, and each of which is disposed on two of the door panels 200, for detecting light signals; when the light emitted from the light source 301 is received by one or more of the photoresistor receivers 203, the detector 103 sends a signal corresponding to the closing of the communication port 201 to the controller 102.
In one embodiment, the wafer processing apparatus further includes: the safety module 101 comprises a detection unit, a controller 102 and a mechanical arm 104, wherein the detection unit is connected to the controller 102 and is used for detecting the open-close state of the communication port 201 and controlling the mechanical arm 104 to stop conveying the wafer to the first machine when the detection unit detects that the communication port 201 is closed; when the detection unit detects that the communication port 201 is closed, the controller 102 controls the light source 301 to project detection light to the door panel 200.
In a specific embodiment, the detector 103 further includes a metal sheet 2041 and an inductive switch sensor 2042, which are disposed on the same side surface of the two door panels 200, respectively, the metal sheet 2041 and the inductive switch sensor 2042 have different distances, and the electrical parameters outputted by the inductive switch sensor 2042 change, so that the detector 103 is controlled to detect the open/close state of the communication port 201, and the method further includes the following steps: when the electrical parameter outputted from the inductive switch sensor 2042 is within a predetermined electrical parameter range, the driving speed of the driver 105 is reduced.
In a specific embodiment, the wafer processing apparatus further includes a timer, connected to the controller 102, configured to count a duration of time that the communication port 201 is continuously in a closed state, and further includes the following steps: when the electrical parameter output by the inductive switch sensor 2042 is within a preset electrical parameter range, the timer is controlled to start timing from zero, and an alarm is sent out when the timing length of the timer is larger than a preset value.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.

Claims (13)

1. A wafer processing apparatus, comprising:
a first machine;
the second machine comprises a mechanical arm, the mechanical arm conveys the wafer to the machine through a communication port, and the communication port is arranged between the first machine and the second machine;
the door plate is arranged on the first machine table and is used for sealing the communication port:
a detector for detecting a current position of the door panel;
the driver is connected to the door plate and used for driving the door plate to move so as to open the communication port or close the communication port;
and the controller is connected to the detector, the driver and the mechanical arm, and is used for controlling the door plate to move according to the current position of the door plate detected by the detector so as to open and close the communication port, controlling the mechanical arm to transmit the wafer, controlling the detector to detect the open and close state of the communication port when the second machine is ready to transmit the wafer to the first machine through the communication port, and controlling the door plate to move so as to open the communication port when the communication port is closed.
2. The wafer processing apparatus according to claim 1, further comprising:
the safety module is connected with the controller and the mechanical arm and comprises a detection unit, wherein the detection unit is used for detecting the opening and closing state of the communication port, and when the detection unit detects that the communication port is closed, the safety module controls the mechanical arm to stop conveying wafers to the first machine.
3. The wafer processing apparatus of claim 1, wherein the detector comprises:
a light source connected to the controller and disposed toward the surface of the door panel for projecting detection light toward the door panel under the control of the controller;
the photoresistor receiver is connected to the controller and is arranged on the surface of one side of the door plate, which faces the second machine table, and is used for detecting light signals;
the light source is arranged at a preset position, so that light emitted from the preset position can be received by the photoresistor receiver when the communication port is closed.
4. The wafer processing apparatus according to claim 3, wherein the number of the door panels is two, which are respectively provided on opposite sides of the communication port, and the opening and closing of the communication port is achieved by moving the two door panels;
the number of the photoresistor receivers is two, and the photoresistor receivers are arranged on one side of the door plate facing the second machine table and are respectively arranged on the two door plates;
the detector further comprises:
the metal sheet and the inductive switch sensor are respectively arranged on the same side surfaces of the two door plates, the inductive switch sensor is connected to the controller, the positions of the metal sheet and the inductive switch sensor are arranged oppositely, the distances between the metal sheet and the inductive switch sensor are different, and the electrical parameters output by the inductive switch sensor are changed.
5. The wafer processing apparatus of claim 1, wherein the driver comprises:
a motor driving module connected to the controller;
the stepping motor is connected to the motor driving module and operates under the control of the motor driving module;
a driving gear connected to the stepping motor for rotating around a rotation axis of the driving gear driven by the stepping motor, the rotation axis being perpendicular to the door panel surface;
the gear strip is installed in a matched mode with the driving gear, the door plate moves relative to the installation position of the driving gear when the driving gear rotates, and the door plate is installed to the gear strip and moves under the driving of the gear strip.
6. The wafer processing apparatus according to claim 5, further comprising:
the sliding rail is overlapped with the moving path of the door plate in the length direction, and is arranged on the moving path of the door plate, and the door plate is arranged on the sliding rail and can slide along the length direction of the sliding rail; the rotating wheel is fixedly arranged on the door plate and in a sliding rail groove of the sliding rail, and can rotate in the sliding rail groove along the length direction of the sliding rail;
the sliding rail is arranged above the door plate, the gear strip is arranged below the door plate, and the driving gear is arranged below the gear strip.
7. The wafer processing apparatus of claim 1, further comprising an interaction module, the interaction module comprising:
a housing;
the display unit is arranged on the outer surface of the shell, connected to the controller and used for displaying the open-close state of the communication port;
the key is arranged in the shell, connected to the controller and used for enabling a user to manually control the movement of the door plate so as to control the opening and closing of the communication port.
8. The wafer processing apparatus of claim 1, further comprising an alarm coupled to the controller, the alarm comprising at least one of a buzzer and an LED lamp.
9. A wafer transfer method for transferring a wafer between a first station and a second station of the wafer processing apparatus according to any one of claims 1 to 8, comprising the steps of: and when the second machine table is ready to convey the wafer to the first machine table through the communication port, controlling the detector to detect the opening and closing state of the communication port, and controlling the door plate to move to open the communication port when the communication port is closed.
10. The wafer transfer method according to claim 9, wherein the number of the door panels is two, which are respectively provided at opposite sides of the communication port, and the opening and closing of the communication port is achieved by moving the two door panels; when the door plate is controlled to move to open the communication port, the method further comprises the following steps:
and controlling the detector to detect the distance between the two door plates, and controlling the driver to slow down the moving speed of the door plates when the distance between the two door plates is in a preset range.
11. The wafer transfer method of claim 10, wherein the detector comprises:
a light source connected to the controller and disposed toward the surface of the door panel for projecting detection light toward the door panel under the control of the controller;
the two photoresistor receivers are connected to the controller, are arranged on one side of the door plate facing the second machine table, and are respectively arranged on the two door plates and used for detecting light signals;
when the light emitted by the light source is received by more than one photoresistor receiver, the detector sends a signal corresponding to the closing of the communication port to the controller.
12. The wafer transfer method according to claim 11, wherein the wafer processing apparatus further comprises:
the safety module comprises a detection unit, a controller and a mechanical arm, wherein the detection unit is connected to the controller and the mechanical arm and is used for detecting the opening and closing states of the communication ports, and controlling the mechanical arm to stop conveying wafers to the first machine when the detection unit detects that the communication ports are closed;
when the detection unit detects that the communication port is closed, the controller controls the light source to project detection light to the door plate.
13. The wafer transfer method according to claim 10, wherein the detector further comprises a metal sheet and an inductive switch sensor, which are respectively disposed on the same side surfaces of the two door panels, wherein the metal sheet and the inductive switch sensor have different distances, and wherein the inductive switch sensor outputs electrical parameters that change, and the detector is controlled to detect the open/close state of the communication port, and further comprising the steps of: and when the electrical parameter output by the inductive switch sensor is in a preset electrical parameter range, reducing the driving speed of the driver.
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