CN113560843B - Circuit board mounting structure, periscopic camera module and assembling method thereof - Google Patents
Circuit board mounting structure, periscopic camera module and assembling method thereof Download PDFInfo
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- CN113560843B CN113560843B CN202110969688.4A CN202110969688A CN113560843B CN 113560843 B CN113560843 B CN 113560843B CN 202110969688 A CN202110969688 A CN 202110969688A CN 113560843 B CN113560843 B CN 113560843B
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000005452 bending Methods 0.000 claims abstract description 59
- 238000009434 installation Methods 0.000 claims abstract description 59
- 238000003384 imaging method Methods 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 16
- 230000008569 process Effects 0.000 abstract description 21
- 230000008093 supporting effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 230000009471 action Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 239000004576 sand Substances 0.000 description 4
- 206010070834 Sensitisation Diseases 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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Abstract
The utility model relates to a circuit board mounting structure, periscopic camera module and assembly method thereof, circuit board mounting structure includes mount pad and circuit board, the mount pad has the installation face, the first installation department of circuit board is attached in the installation face, along first direction, the length dimension of installation face is greater than the length dimension of first installation department, first direction is on a parallel with the installation face, and first direction perpendicular to first installation department is towards the surface of second installation department, wherein, it is provided with the boss to correspond the protrusion of kink position department on the installation face, the kink can with the boss butt, so that the second installation department sets up along with the kink is to the direction slope of keeping away from the mount pad. The second installation part is obliquely arranged along with the bending part in the direction away from the installation seat under the supporting effect of the boss, so that the second installation part can be smoothly attached to the components protruding out of the installation seat, and the whole assembly process is not influenced.
Description
Technical Field
The application relates to the technical field of optical imaging modules, in particular to a circuit board mounting structure, a periscopic camera module and an assembling method thereof.
Background
Because the size of the periscopic module of making a video recording can be reduced effectively to the formula of making a video recording module, still can greatly promote the effective focus of the module of making a video recording simultaneously, consequently, it obtains more and more extensive application in people's daily life. In the equipment production process, the components and parts lectotype collocation in the periscopic camera module of different patterns is different, may appear the uneven phenomenon of degree of the convex-concave of the different subassemblies in the periscopic camera module to lead to the circuit pin pad of the different subassemblies of periscopic camera module not on same straight line, be not convenient for assemble.
Disclosure of Invention
Therefore, the circuit board mounting structure, the periscopic camera module and the assembly method thereof are provided for solving the problem that circuit pin pads of different components of the periscopic camera module are not on the same straight line and are inconvenient to assemble due to the fact that the concave-convex degrees of different parts in the periscopic camera module are not uniform.
The embodiment of the application provides a circuit board mounting structure, includes: a mounting seat having a mounting surface; the circuit board comprises a bending part, a first mounting part and a second mounting part, wherein the first mounting part and the second mounting part are respectively connected to two opposite sides of the bending part; the mounting surface is provided with a boss in a protruding mode corresponding to the position of the bent portion, and the bent portion can be abutted against the boss so that the second mounting portion is obliquely arranged along with the bent portion in the direction away from the mounting seat.
Based on circuit board mounting structure in this application embodiment, through the kink protrusion that corresponds the circuit board on the installation face of mount pad set up the boss, attach behind the installation face at the first installation department of circuit board, because along first direction, the length dimension of installation face is greater than the length dimension of first installation department, the kink of circuit board just lies in the position department corresponding with the boss on the installation face here, make the kink can be direct and boss butt, the second installation department sets up along with the kink is common under the butt effect of boss to the direction slope of keeping away from the mount pad, make the second installation department can attach smoothly on protruding in the components and parts of mount pad, do not influence holistic assembling process.
In one embodiment, the distance between the side of the boss facing the first mounting part and the side of the first mounting part facing the boss is not less than 0.5 mm.
Based on the embodiment, the distance between one side of the boss facing the first installation part and one side of the first installation part facing the boss is set to be not less than 0.5mm, an error space is reserved for the assembling process, the boss cannot be in contact with the first installation part in the process of attaching the first installation part to the installation surface, and the problem of uneven integral structure caused by the contact of the boss and the first installation part cannot occur.
In one embodiment, the thickness dimension of the first mounting portion is larger than that of the bending portion along the direction perpendicular to the mounting surface, the bending portion is arranged at a distance from the mounting surface, and the protruding dimension of the boss is larger than the distance between the bending portion and the mounting surface.
Based on the above embodiment, because in the direction of following the perpendicular to installation face, the thickness dimension of first installation department is greater than the thickness dimension of kink, consequently when first installation department is attached in the installation face, can set up kink and installation face interval, meanwhile, through being greater than the interval between kink and the installation face with the protruding size of boss for the second installation department sets up along with the kink is in the slope of the direction of keeping away from the mount pad under the butt effect of boss, the second installation department is unlikely to appear interfering with other components and parts, can attach smoothly on the components and parts of protrusion in the mount pad.
In one embodiment, the protruding dimension of the boss is equal to the difference between the thickness dimension of the first mounting portion and the thickness dimension of the bent portion in the direction perpendicular to the mounting surface.
Based on above-mentioned embodiment, through setting up the protruding size of boss to be equal to the difference between the thickness size of first installation department and the thickness size of kink for under the prerequisite that rationally sets up the relative position relation between kink and the first installation department, can guarantee that the boss has suitable protrusion degree, make the second installation department along with the kink to the direction slope setting of keeping away from the mount pad under the butt effect of boss.
In one embodiment, in the second direction, the boss comprises a continuous rib; or the second direction, the boss includes two at least lugs that the interval set up, and the second direction is on a parallel with the installation face, and the second direction is on a parallel with the surface that first installation department faced the second installation department.
Based on above-mentioned embodiment, along the second direction, the boss can be including the sand grip of continuous setting, and the sand grip is better to the butt supporting effect of kink, makes the kink whole can be under the effect of sand grip to the same angle of the orientation slope that is kept away from the mount pad, and the processing setting of sand grip is more convenient. The boss can also include two at least lugs that the interval set up, and the lug that the interval set up can play good butt supporting effect to the kink equally, and simultaneously, the material of lug is still less.
In one embodiment, the mounting base further comprises a balancing weight, and the balancing weight is arranged on the surface, away from the mounting base, of the second mounting portion.
Based on above-mentioned embodiment, through set up the balancing weight on the surface that deviates from the mount pad at the second installation department, can exert a drive power of the direction slope that deviates from the mount pad to the second installation department, make the second installation department further slope, just also can attach smoothly on the components and parts of protrusion in the mount pad, do not influence holistic equipment process.
The embodiment of the application still provides a periscopic module of making a video recording, includes: the circuit board mounting structure as described above; the photosensitive chip is arranged between the first mounting part and the mounting surface; the periscopic lens component is fixed on the mounting seat and is positioned on a photosensitive path of the photosensitive chip; and the functional component is connected to one side of the mounting seat along the first direction, and the second mounting part is attached to the functional component.
Based on the periscopic camera module in the embodiment of the application, the boss is arranged on the mounting surface of the mounting seat in the periscopic camera module in a protruding mode corresponding to the bending part of the circuit board, the first mounting part of the circuit board is attached to the mounting surface, the length dimension of the mounting surface is larger than that of the first mounting part along the first direction, so that the bending part of the circuit board is located at the position corresponding to the boss on the mounting surface, the bending part can be directly abutted against the boss, the second mounting part is obliquely arranged along with the bending part under the abutting effect of the boss and in the direction away from the mounting seat, the second mounting part is not interfered with the functional assembly, the circuit board can be smoothly attached to the functional assembly protruding out of the mounting seat, and the whole assembling process of the periscopic camera module is not influenced.
In one embodiment, the periscopic lens assembly comprises a light steering piece and an imaging lens, the light steering piece is arranged in the mounting seat, the imaging lens is located on the light inlet side of the light steering piece, and the photosensitive chip is located on the light outlet side of the light steering piece.
Based on above-mentioned embodiment, locate the mount pad through the light steering part with among the periscopic lens subassembly in, make imaging lens be located the income of light steering part and close the side, the sensitization chip is located the light-emitting side of light steering part, and in the use of periscopic camera module, external light incides to light steering part after passing imaging lens, is gone out and is received by the sensitization chip behind the light steering part conversion angle to realize the formation of image.
In one embodiment, the functional component includes an auto-focusing component and an optical anti-shake component, the auto-focusing component is connected to one side of the mounting base along the first direction, the optical anti-shake component is connected to one side of the auto-focusing component, and the second mounting portion is sequentially attached to the auto-focusing component and the optical anti-shake component.
Based on the above embodiment, the auto-focusing assembly is connected to one side of the mounting base along the first direction, and is electrically connected with the whole module through the second mounting part attached to the auto-focusing assembly, so that the auto-focusing function can be realized. Similarly, the optical anti-shake component is connected to one side of the automatic focusing component and electrically connected with the whole module through the second installation part attached to the optical anti-shake component, so that the optical anti-shake function can be realized.
The embodiment of the application also provides an assembling method of the periscopic camera module, which comprises the following steps: attaching the surface of the first installation part with the photosensitive chip to the installation surface, and abutting the boss with the bending part; bending the joint of the bending part and the boss to the direction away from the mounting seat; connecting the functional component to one side of the mounting seat along a first direction; the first direction is parallel to the mounting surface and is vertical to the surface of the first mounting part facing the second mounting part; and bending the joint of the bending part and the functional component to the direction close to the mounting seat, so that the second mounting part is attached to the functional component.
According to the assembling method of the periscopic camera module, the bent part and the boss are bent in the direction away from the mounting seat, so that the functional component can be normally connected to one side of the mounting seat along the first direction without interference between the functional component and the circuit board, and then the bent part and the functional component are bent in the direction close to the mounting seat, so that the second mounting part is attached to the functional component, and the assembly of the periscopic camera module is smoothly completed.
According to the circuit board mounting structure, the periscopic camera module and the assembling method of the periscopic camera module based on the embodiment of the application, the boss is arranged on the mounting surface of the mounting base in a protruding mode corresponding to the bending portion of the circuit board, after the first mounting portion of the circuit board is attached to the mounting surface, the length size of the mounting surface is larger than that of the first mounting portion along the first direction, therefore, the bending portion of the circuit board is located at the position corresponding to the boss on the mounting surface, the bending portion can be directly abutted to the boss, the second mounting portion is arranged in an inclined mode along with the bending portion under the abutting action of the boss and in a direction away from the mounting base, the second mounting portion can be smoothly attached to a component protruding out of the mounting base, and the whole assembling process is not affected.
Drawings
Fig. 1 is an assembly schematic diagram of a periscopic camera module in the prior art;
fig. 2 is a schematic overall structure diagram of a circuit board mounting structure provided in an embodiment of the present application;
FIG. 3 is an enlarged partial view of FIG. 2 at A;
fig. 4 is a schematic view of an overall structure of a circuit board provided in an embodiment of the present application;
FIG. 5 is a schematic overall structure diagram of a mounting base provided in an embodiment of the present application;
FIG. 6 is a schematic view of an overall structure of a mounting base according to another embodiment of the present disclosure;
fig. 7 is a schematic overall structural diagram of the periscopic camera module according to the embodiment of the present application;
fig. 8 is a flowchart of a periscopic camera module assembly method according to an embodiment of the present disclosure;
fig. 9 is a schematic structural view of a periscopic camera module according to an embodiment of the present disclosure in a first state during an assembly process;
fig. 10 is a schematic structural view of a periscopic camera module according to an embodiment of the present disclosure in a second state during an assembly process;
fig. 11 is a schematic structural view of a periscopic camera module in a third state in an assembly process according to an embodiment of the present disclosure;
fig. 12 is a schematic structural diagram of a periscopic camera module in a fourth state in an assembly process according to an embodiment of the present application.
Reference numerals: 10. a periscopic camera module; 100. a circuit board mounting structure; 110. a mounting seat; 111. a mounting surface; 112. a boss; 120. a circuit board; 121. a first mounting portion; 122. a bending section; 123. a second mounting portion; 130. a balancing weight; 200. a photosensitive chip; 300. a periscopic lens assembly; 310. a light redirecting element; 320. an imaging lens; 400. a functional component; 410. an auto-focus assembly; 420. an optical anti-shake assembly.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 is an assembly schematic diagram of a periscopic camera module in the prior art, and as shown in fig. 1, in a current periscopic camera module 11, due to different types and collocations of components, a phenomenon that the convex-concave degrees of different components are not uniform may occur, so that circuit pin pads of different components of the periscopic camera module 11 are not on the same line, and a circuit board 12 is easily interfered with other components, so that the assembly is not convenient.
Fig. 2 is a schematic overall structure diagram of a circuit board mounting structure 100 according to an embodiment of the present application, fig. 3 is a schematic partial enlarged view of a portion a in fig. 2, and fig. 4 is a schematic overall structure diagram of a circuit board 120 according to an embodiment of the present application.
In order to at least partially solve the above problem, referring to fig. 2 to 4, an embodiment of the present application provides a circuit board mounting structure 100, where the circuit board mounting structure 100 includes a mounting base 110 and a circuit board 120. The mounting base 110 is used for mounting components or assemblies such as a lens assembly and a photosensitive element, and is convenient to connect and assemble with the circuit board 120.
Specifically, the mounting base 110 has a mounting surface 111, and the shape and structure of the mounting base 110 are not limited, and any one of the outer surfaces thereof may be used as the mounting surface 111 to connect with the circuit board 120. The circuit board 120 includes a bending portion 122, and a first mounting portion 121 and a second mounting portion 123 respectively connected to two opposite sides of the bending portion 122, wherein the first mounting portion 121 and the second mounting portion 123 are respectively connected to other components in the periscopic camera module to cooperatively implement an imaging function, and the bending portion 122 is used for connecting and fixing the first mounting portion 121 and the second mounting portion 123, and can be bent. In order to satisfy the respective functions, the first mounting portion 121 and the second mounting portion 123 are made of a hard circuit board 120 layer having a certain rigidity, and the bent portion 122 is made of a soft circuit board 120 layer which is relatively soft and easy to bend. The first mounting portion 121 is attached to the mounting surface 111, so that the components mounted in the mounting base 110 can be electrically connected to the circuit board 120. In some embodiments, as shown in fig. 4, the circuit board 120 may further include more mounting portions, and adjacent mounting portions are connected by the bending portion 122, so as to realize electrical connection at various positions on the circuit board 120.
In the first direction a in fig. 2, the length of the mounting surface 111 is greater than the length of the first mounting portion 121, that is, the mounting surface 111 is higher than the first mounting portion 121, the first direction a is parallel to the mounting surface 111, and the first direction a is perpendicular to the surface of the first mounting portion 121 facing the second mounting portion 123, so that the portion of the mounting surface 111 higher than the first mounting portion 121 is disposed corresponding to the bent portion 122 in the circuit board 120. The mounting surface 111 is provided with a protruding portion 112 protruding from a position corresponding to the bent portion 122, so that the bent portion 122 can directly abut against the protruding portion 112, and the bent portion 122 is easily bent, so that the second mounting portion 123 is inclined along with the bent portion 122 in a direction away from the mounting base 110 under the abutting action of the protruding portion 112.
In the circuit board mounting structure 100 in the embodiment of the application, the boss 112 is protruded from the mounting surface 111 of the mounting base 110 corresponding to the bending portion 122 of the circuit board 120, after the first mounting portion 121 of the circuit board 120 is attached to the mounting surface 111, because the length of the mounting surface 111 is greater than that of the first mounting portion 121 along the first direction a, the bending portion 122 of the circuit board 120 is located at the position corresponding to the boss 112 on the mounting surface 111, so that the bending portion 122 can be directly abutted against the boss 112, the second mounting portion 123 is inclined away from the mounting base 110 together with the bending portion 122 under the abutting action of the boss 112, so that the second mounting portion 123 is not interfered, and can be smoothly attached to the component protruded from the mounting base 110, and the whole assembly process is not affected.
The boss 112 is disposed on the portion of the mounting surface 111 higher than the first mounting portion 121, and in order to reserve a sufficient space for disposing the boss 112, in some embodiments, a distance between a side of the boss 112 facing the first mounting portion 121 and a side of the first mounting portion 121 facing the boss 112 is not less than 0.5 mm. By setting the distance between the side of the boss 112 facing the first mounting part 121 and the side of the first mounting part 121 facing the boss 112 to be not less than 0.5mm, an error space is reserved for the assembling process, and in the process of attaching the first mounting part 121 to the mounting surface 111, the boss 112 does not contact with the first mounting part 121, and the problem of uneven overall structure caused by the contact of the boss 112 and the first mounting part 121 does not occur.
As described above, the first mounting portion 121 and the second mounting portion 123 are made of the hard circuit board 120 layer having a certain rigidity, and the bending portion 122 is made of the soft circuit board 120 layer which is relatively soft and easy to bend, in some embodiments, the number of the hard circuit board 120 layers is not less than six, and meanwhile, the number of the soft circuit board 120 layers is less than the number of the hard circuit board 120 layers but not less than two, so that, along the direction perpendicular to the mounting surface 111, the thickness dimension of the first mounting portion 121 is greater than the thickness dimension of the bending portion 122, the bending portion 122 is spaced from the mounting surface 111, and the protruding dimension of the boss 112 is greater than the spacing between the bending portion 122 and the mounting surface 111. Because the thickness dimension of the first mounting portion 121 is greater than the thickness dimension of the bending portion 122 in the direction perpendicular to the mounting surface 111, the bending portion 122 and the mounting surface 111 can be arranged at an interval while the first mounting portion 121 is attached to the mounting surface 111, and meanwhile, the protruding dimension of the boss 112 is greater than the distance between the bending portion 122 and the mounting surface 111, so that the second mounting portion 123 is inclined along with the bending portion 122 in the direction away from the mounting base 110 under the abutting action of the boss 112, the second mounting portion 123 does not interfere with other components, and can be smoothly attached to the components protruding from the mounting base 110.
In addition to the above embodiment, further, in the direction perpendicular to the mounting surface 111, the projection 112 protrudes by a size equal to a difference between a thickness size of the first mounting portion 121 and a thickness size of the bent portion 122. Through setting up the protruding size of boss 112 to be equal to the difference between the thickness size of first installation department 121 and the thickness size of kink 122 for on the premise of rationally setting up the relative position relation between kink 122 and first installation department 121, can guarantee that boss 112 has suitable protrusion degree, make second installation department 123 along with kink 122 to the direction slope setting of keeping away from mount pad 110 under the butt effect of boss 112.
Fig. 5 is a schematic overall structural diagram of a mount provided in an embodiment of the present application, and fig. 6 is a schematic overall structural diagram of a mount provided in another embodiment of the present application.
The boss 112 is used for abutting against the bending portion 122, so that the second mounting portion 123 is inclined along with the bending portion 122 in a direction away from the mounting seat 110, therefore, the specific structure of the boss 112 is not limited, and may have various structural forms, in some embodiments, as shown in fig. 5, along the second direction b, the boss 112 includes continuously arranged convex strips, the second direction b is parallel to the mounting surface 111, and the second direction b is parallel to the surface of the first mounting portion 121 facing the second mounting portion 123, the abutting support effect of the convex strips on the bending portion 122 is better, so that the bending portion 122 as a whole can be inclined by the same angle in the direction away from the mounting seat 110 under the action of the convex strips, and the processing and setting of the convex strips are more convenient. In other embodiments, as shown in fig. 6, in the second direction b, the boss 112 includes at least two spaced bumps, and the spaced bumps can also provide a good abutting and supporting effect for the bending portion 122, and at the same time, the material of the bumps is less.
The angle of the second mounting portion 123 inclined with the bent portion 122 in the direction away from the mounting seat 110 is determined by the protruding degree of the boss 112, and the larger the protruding degree of the boss 112 is, the larger the bending degree of the bent portion 122 after being abutted by the boss 112 is, the larger the angle of the second mounting portion 123 inclined with the bent portion 122 is, the smaller the protruding degree of the boss 112 is, the smaller the bending degree of the bent portion 122 after being abutted by the boss 112 is, and the smaller the angle of the second mounting portion 123 inclined with the bent portion 122 is. In order to further increase the inclination angle of the second mounting portion 123 along with the bending portion 122, in one embodiment, the circuit board mounting structure 100 further includes a weight 130, and the weight 130 is disposed on a surface of the second mounting portion 123 away from the mounting base 110. Through set up balancing weight 130 on the surface that deviates from mount pad 110 at second installation department 123, can exert the drive power of a direction slope that is kept away from mount pad 110 to second installation department 123, make second installation department 123 further slope, just also can attach smoothly on the components and parts of protrusion in mount pad 110, do not influence holistic equipment process. The weight block 130 can be made of a metal block, and the weight balancing effect is better.
Fig. 7 is a schematic overall structural diagram of the periscopic camera module 10 according to the embodiment of the present application.
In a second aspect, referring to fig. 7, the present embodiment further provides a periscopic camera module 10, where the periscopic camera module 10 includes the circuit board mounting structure 100, the photosensitive chip 200, the periscopic lens assembly 300, and the functional assembly 400.
The light sensing chip 200 is disposed between the first mounting portion and the mounting surface, the periscopic lens assembly 300 is fixed to the mounting base 110, and the periscopic lens assembly 300 is located on the light sensing path of the light sensing chip 200, so that the light emitted from the periscopic lens assembly 300 can be received by the light sensing chip 200 for imaging. Along the first direction a, the functional element 400 is connected to one side of the mounting base 110, and the second mounting portion is attached to the functional element 400. The types of the functional components 400 are different according to the different functional configurations of the periscopic camera module 10, and the functional components 400 include, but are not limited to, an auto-focus component 410, an optical anti-shake component 420, and the like, which can play a role in assisting in improving the imaging effect of the periscopic camera module 10.
In the periscopic camera module 10 in the embodiment of the present application, the mounting surface of the mounting base 110 is provided with the protruding boss corresponding to the bending portion of the circuit board 120, after the first mounting portion of the circuit board 120 is attached to the mounting surface, since the length dimension of the mounting surface is greater than the length dimension of the first mounting portion along the first direction a, the bending portion of the circuit board 120 is located at the position corresponding to the protruding boss on the mounting surface, so that the bending portion can be directly abutted against the boss, the second mounting portion is inclined along with the bending portion in the direction away from the mounting base 110 under the abutting action of the boss, so that the second mounting portion is not interfered with the functional component 400, and can be smoothly attached to the functional component 400 protruding from the mounting base 110, without affecting the overall assembly process of the periscopic camera module 10.
Specifically, in some embodiments, the periscopic lens assembly 300 includes a light diverting member 310 and an imaging lens 320, the light diverting member 310 is disposed in the mounting base 110, the imaging lens 320 is located on the light incident side of the light diverting member 310, and the photosensitive chip 200 is located on the light emitting side of the light diverting member 310. The light diverting member 310 is used for diverting light to realize a periscopic effect, specifically, the light diverting member 310 may be a reflecting prism, a plane mirror, or the like, and the imaging lens 320 includes at least one lens for converging light to perform imaging. Through locating light steering member 310 in periscopic lens subassembly 300 in mount pad 110, make imaging lens 320 be located the income of light steering member 310 and close the side, photosensitive chip 200 is located the light-emitting side of light steering member 310, and in the use of periscopic camera module 10, external light incides to light steering member 310 after passing imaging lens 320, is emergent and is received by photosensitive chip 200 behind the conversion angle of light steering member 310 to realize the formation of image.
Specifically, in some embodiments, the functional device 400 includes an auto-focusing device 410 and an optical anti-shake device 420, the auto-focusing device 410 is connected to one side of the mounting base 110, the optical anti-shake device 420 is connected to one side of the auto-focusing device 410, and the second mounting portion is sequentially attached to the auto-focusing device 410 and the optical anti-shake device 420. Along the first direction a, the auto-focusing assembly 410 is connected to one side of the mounting base 110, and electrically connected to the whole module through the second mounting portion attached thereto, so that the auto-focusing function can be realized. Similarly, the optical anti-shake device 420 is connected to one side of the auto-focus device 410, and electrically connected to the whole module through the second mounting portion attached thereto, so as to achieve the optical anti-shake function.
Fig. 8 is a flowchart of an assembly method of the periscopic camera module 10 according to the embodiment of the present application, fig. 9 is a schematic structural diagram of the periscopic camera module 10 according to the embodiment of the present application in a first state during an assembly process, fig. 10 is a schematic structural diagram of the periscopic camera module 10 according to the embodiment of the present application in a second state during an assembly process, fig. 11 is a schematic structural diagram of the periscopic camera module 10 according to the embodiment of the present application in a third state during an assembly process, and fig. 12 is a schematic structural diagram of the periscopic camera module 10 according to the embodiment of the present application in a fourth state during an assembly process.
In a third aspect, referring to fig. 8, an embodiment of the present application further provides an assembling method of a periscopic camera module, in an assembling process, a structure of the periscopic camera module is as shown in fig. 9 to 12, and the assembling method includes the following steps:
s102, the surface of the first mounting portion 121 having the photosensitive chip 200 is attached to the mounting surface 111, and the boss 112 abuts against the bent portion 122.
As shown in fig. 9, the photosensitive chip 200 is attached to the first mounting portion 121 of the circuit board 120, the surface of the circuit board 120 away from the photosensitive chip 200 is attached to the carrier plate and fixed, and then the mounting base 110 and the circuit board 120 are assembled, and the mounting surface 111 of the mounting base 110 and the surface of the first mounting portion 121 having the photosensitive chip 200 are attached together, so as to obtain the periscopic imaging module 10 in the first state. At this time, the boss 112 protruding from the mounting surface 111 abuts against the bent portion 122 of the circuit board 120.
And S104, bending the part where the bent part is abutted to the boss in a direction away from the mounting seat 110.
As shown in fig. 10, the periscopic camera module is detached from the carrier plate, the direction in which the periscopic camera module is placed is redefined, and the joint between the bent portion and the boss is bent in the direction away from the mounting base 110, so that the periscopic camera module in the second state is obtained. Thus, the second mounting portion does not interfere with the functional module 400, and the functional module 400 can be smoothly connected to the mounting base 110.
And S106, connecting the functional component 400 to one side of the mounting seat 110 along a first direction a, wherein the first direction a is parallel to the mounting surface 111, and the first direction a is perpendicular to the surface of the first mounting part 121 facing the second mounting part 123.
As shown in fig. 11, the functional units 400 are sequentially connected to the mount base 110 without being obstructed or interfered by the second mounting portion, and the periscopic imaging module in the third state is obtained.
And S108, bending the part where the bent part is abutted to the functional component 400 to a direction close to the mounting seat 110, so that the second mounting part is attached to the functional component 400.
As shown in fig. 12, after the functional assembly 400 is assembled with the mounting base 110, the second mounting portion of the floating portion is bent and fixed by hot pressing through the special bending jig, so that the second mounting portion is attached to the functional assembly 400, the periscopic imaging module 10 in the fourth state is obtained, and the assembly of the periscopic imaging module 10 is smoothly completed.
In the assembling method of the periscopic camera module 10 in the embodiment of the present application, the abutting portion of the bending portion 122 and the boss 112 is bent toward the direction away from the mounting base 110, so that the functional component 400 can be normally connected to one side of the mounting base 110 along the first direction a, and the interference between the functional component 400 and the circuit board 120 does not occur, and then the abutting portion of the bending portion 122 and the functional component 400 is bent toward the direction close to the mounting base 110, so that the second mounting portion 123 is attached to the functional component 400, thereby smoothly completing the assembling of the periscopic camera module 10.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A circuit board mounting structure, comprising:
a mounting seat having a mounting surface; and
the circuit board comprises a bending part, a first mounting part and a second mounting part, wherein the first mounting part and the second mounting part are respectively connected to two opposite sides of the bending part;
the mounting surface is provided with a boss in a protruding mode corresponding to the bent part, and the bent part can be abutted against the boss, so that the second mounting part is obliquely arranged along with the bent part in a direction away from the mounting seat.
2. The wiring board mounting structure according to claim 1, wherein a distance between a side of the boss facing the first mounting portion and a side of the first mounting portion facing the boss is not less than 0.5 mm.
3. The circuit board mounting structure according to claim 1, wherein a thickness dimension of the first mounting portion is larger than a thickness dimension of the bent portion in a direction perpendicular to the mounting surface, the bent portion is spaced apart from the mounting surface, and a protruding dimension of the boss is larger than a distance between the bent portion and the mounting surface.
4. The circuit board mounting structure according to claim 3, wherein a dimension of the boss projection in a direction perpendicular to the mounting surface is equal to a difference between a thickness dimension of the first mounting portion and a thickness dimension of the bent portion.
5. The circuit board mounting structure according to claim 1, wherein in the second direction, the boss includes a rib provided continuously; or
Along the second direction, the boss includes two at least lugs that the interval set up, the second direction is on a parallel with the installation face, just the second direction is on a parallel with first installation department faces the surface of second installation department.
6. The circuit board mounting structure of claim 1, further comprising a weight block disposed on a surface of the second mounting portion facing away from the mounting base.
7. The utility model provides a periscopic module of making a video recording which characterized in that includes:
the wiring board mounting structure according to any one of claims 1 to 6;
the photosensitive chip is arranged between the first mounting part and the mounting surface;
the periscopic lens component is fixed on the mounting seat and is positioned on a photosensitive path of the photosensitive chip; and
the functional component is connected to one side of the mounting seat along the first direction, and the second mounting part is attached to the functional component.
8. The periscopic camera module of claim 7, wherein the periscopic lens assembly comprises a light diverting member and an imaging lens, the light diverting member is disposed in the mounting base, the imaging lens is disposed on a light incident side of the light diverting member, and the photosensitive chip is disposed on a light emergent side of the light diverting member.
9. The periscopic camera module of claim 7, wherein the functional components include an auto-focus component and an optical anti-shake component, the auto-focus component is connected to one side of the mounting base along the first direction, the optical anti-shake component is connected to one side of the auto-focus component, and the second mounting portion is sequentially attached to the auto-focus component and the optical anti-shake component.
10. A method of assembling a periscopic camera module according to any one of claims 7 to 9, comprising the steps of:
attaching the surface of the first installation part with the photosensitive chip to the installation surface, and abutting the boss with the bending part;
bending the joint of the bending part and the boss towards the direction away from the mounting seat;
connecting a functional component to one side of the mounting seat along a first direction; the first direction is parallel to the mounting surface, and the first direction is perpendicular to the surface of the first mounting part facing the second mounting part;
and bending the abutting part of the bent part and the functional component towards the direction close to the mounting seat, so that the second mounting part is attached to the functional component.
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| CN202110969688.4A CN113560843B (en) | 2021-08-23 | 2021-08-23 | Circuit board mounting structure, periscopic camera module and assembling method thereof |
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| CN202110969688.4A CN113560843B (en) | 2021-08-23 | 2021-08-23 | Circuit board mounting structure, periscopic camera module and assembling method thereof |
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| CN113560843A (en) | 2021-10-29 |
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