CN113556885A - Welding process based on anti-oxidation protection - Google Patents
Welding process based on anti-oxidation protection Download PDFInfo
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- CN113556885A CN113556885A CN202110728301.6A CN202110728301A CN113556885A CN 113556885 A CN113556885 A CN 113556885A CN 202110728301 A CN202110728301 A CN 202110728301A CN 113556885 A CN113556885 A CN 113556885A
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- 238000003466 welding Methods 0.000 title claims abstract description 361
- 238000000034 method Methods 0.000 title claims abstract description 91
- 230000003064 anti-oxidating effect Effects 0.000 title claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 108
- 238000003892 spreading Methods 0.000 claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- 238000011282 treatment Methods 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 19
- 238000005476 soldering Methods 0.000 claims description 57
- 239000002390 adhesive tape Substances 0.000 claims description 45
- 239000010410 layer Substances 0.000 claims description 31
- 238000007639 printing Methods 0.000 claims description 27
- 230000003647 oxidation Effects 0.000 claims description 19
- 238000007254 oxidation reaction Methods 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 18
- 239000010959 steel Substances 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 11
- 238000005507 spraying Methods 0.000 claims description 9
- 239000013464 silicone adhesive Substances 0.000 claims description 8
- 239000002274 desiccant Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 238000003860 storage Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a welding process based on anti-oxidation protection, which comprises the following steps: determining a first welding site and a second welding site corresponding to a main board to be welded, wherein the first welding site is used for first welding, and the second welding site is used for second welding; forming an anti-oxidation protective layer on the surface of the second welding site to obtain a second welding site containing the anti-oxidation protective layer; carrying out first tin spreading treatment on the first welding site to obtain a first tin spreading site; the thickness of the solder paste of the first tin spreading site is the target solder paste thickness required by the first welding; obtaining a first target element, and welding the first target element on the first tin spreading site to obtain a first welding main board; obtaining a second target element, and welding the second target element on the second welding site to obtain a second welding main board; the method has the characteristic of flexibly assembling elements on the mainboard.
Description
Technical Field
The invention relates to the technical field of element welding, in particular to a welding process based on anti-oxidation protection.
Background
At present, information technology represented by quantum communication, 5G technology, AI technology and IOT is increasingly different, so that daily electronic consumer products are promoted to be more diversified, multifunctional and customized, and iteration is quicker.
The increasing customization requirements of the SMT industry bring design multiple challenges, and customization causes that manufacturers need to match corresponding components according to customer requirements, however, some components on the market are in a long-term material shortage state (such as CPU, GPU, RAM, VRAM, etc.), and if all components matched by the customer requirements are assembled after completion of replenishment, the manufacturing cost and the timely delivery rate of the SMT industry are seriously affected.
Disclosure of Invention
The embodiment of the invention provides a welding process based on anti-oxidation protection, which has the characteristic of flexibly assembling elements on a mainboard.
The invention provides a welding process based on adhesive tape protection, which comprises the following steps: determining a first welding site and a second welding site corresponding to a main board to be welded, wherein the first welding site is used for first welding, and the second welding site is used for second welding; forming an anti-oxidation protective layer on the surface of the second welding site to obtain a second welding site containing the anti-oxidation protective layer; carrying out first tin spreading treatment on the first welding site to obtain a first tin spreading site; the thickness of the solder paste of the first tin spreading site is the target solder paste thickness required by the first welding; obtaining a first target element, and welding the first target element on the first tin spreading site to obtain a first welding main board; and obtaining a second target element, and welding the second target element on the second welding site to obtain a second welding main board.
In an embodiment, the forming an oxidation protection layer on the surface of the second welding site to obtain a second welding site including the oxidation protection layer includes: carrying out adhesive tape protection treatment on the second welding site to obtain a second welding site provided with an adhesive tape; correspondingly, the welding the second target element on the second welding site to obtain a second welded main board includes: and removing the adhesive tape on the second welding site provided with the adhesive tape, and welding the second target element on the second welding site to obtain a second welding main board.
In an embodiment, the first soldering site is subjected to a first tin spreading treatment to obtain a first tin spreading site, including: determining a corresponding printing steel mesh according to the first welding site; and carrying out first tin paving treatment on the first welding site through the printing steel mesh to obtain a first tin paving site.
In an embodiment, the tape protecting process is performed on the second welding site to obtain a second welding site provided with a tape, and the tape protecting process includes: and adhering the residue-free high-temperature-resistant adhesive tape to the second welding site to obtain the second welding site provided with the adhesive tape.
In one embodiment, the tape includes a release liner, a silicone adhesive layer, and a polyimide film layer, wherein the release liner is configured to be attached to the second bonding site.
In an embodiment, the soldering the first target element on the first tin plating site to obtain a first soldering main board includes: and welding the first target element on the first tin spreading site through low-temperature welding to obtain a first welding main board.
In an embodiment, the welding the second target element to the second welding site to obtain a second target element and a second welded main plate includes: carrying out second tin spreading treatment on a second welding site on the first welding main board to obtain a second tin spreading site; and welding the second target element on the second welding site to obtain a second welding main plate.
In an embodiment, performing a second tin spreading process on a second soldering site on the first soldering mother board to obtain a second tin spreading site includes: spraying and printing a specified amount of solder paste onto the second welding site through solder paste spraying and printing to obtain a second tin paving site; and the thickness of the solder paste of the second tin spreading site is the target thickness of the solder paste corresponding to the second welding.
In an embodiment, the forming an oxidation protection layer on the surface of the second welding site to obtain a second welding site including the oxidation protection layer further includes: and forming an organic solderability protection film on the surfaces of the first welding site and the second welding site.
In an embodiment, after the obtaining the first welded main board, the method further comprises: placing the first welding main board in an environment with the temperature range of 15-35 ℃ and the relative humidity range of 3-15% RH to store the first welding main board; or the first welding main board is arranged in an antistatic bag filled with a drying agent, and the antistatic bag is vacuumized to store the first welding main board.
In another aspect, the present invention provides a tape protection based welding system, comprising: the device comprises a determining module, a first welding position and a second welding position, wherein the determining module is used for determining the first welding position and the second welding position corresponding to a main board to be welded, the first welding position is used for first welding, and the second welding position is used for second welding; the anti-oxidation module is used for forming an anti-oxidation protective layer on the surface of the second welding site to obtain a second welding site containing the anti-oxidation protective layer; the tin spreading module is used for carrying out first tin spreading treatment on the first welding site to obtain a first tin spreading site; the thickness of the solder paste of the first tin spreading site is the target solder paste thickness required by the first welding; the welding module is used for obtaining a first target element, welding the first target element on the first tin spreading site and obtaining a first welding main board; and the welding module is further used for obtaining a second target element, and welding the second target element on the second welding site to obtain a second welding main board.
In an embodiment, the oxidation prevention module includes: the protection submodule is used for carrying out adhesive tape protection treatment on the second welding site to obtain the second welding site provided with an adhesive tape; correspondingly, the welding module further comprises: a removing submodule for removing the adhesive tape on the second welding site provided with the adhesive tape; and the welding submodule is used for welding the second target element on the second welding site to obtain a second welding main plate.
In an embodiment, the tin-plating module includes: the determining submodule is used for determining a corresponding printing steel mesh according to the first welding site; and the tin paving submodule is used for carrying out first tin paving treatment on the first welding site through the printing steel mesh to obtain a first tin paving site.
In an embodiment, the protection submodule is further configured to attach a residue-free high temperature resistant adhesive tape to the second welding site, so as to obtain a second welding site provided with the adhesive tape.
In one embodiment, the tape includes a release liner, a silicone adhesive layer, and a polyimide film layer, wherein the release liner is configured to be attached to the second bonding site.
In an embodiment, the soldering module is configured to solder the first target element to the first tin plating site by low temperature soldering, so as to obtain a first soldered main board.
In an implementation manner, the soldering module is further configured to perform a second tin spreading process on a second soldering site on the first soldering motherboard to obtain a second tin spreading site; and welding the second target element on the second welding site to obtain a second welding main plate.
In an embodiment, the soldering module is further configured to spray-print a specified amount of solder paste onto the second soldering site by solder paste spray-printing to obtain a second solder spreading site; and the thickness of the solder paste of the second tin spreading site is the target thickness of the solder paste corresponding to the second welding.
In an embodiment, the oxidation prevention module is further configured to form an organic solderability protection film on the surfaces of the first soldering site and the second soldering site.
In an embodiment, the apparatus further comprises: the storage module is used for placing the first welding main board in an environment with the temperature range of 15-35 ℃ and the relative humidity range of 3-15% RH so as to store the first welding main board; or the first welding main board is arranged in an antistatic bag filled with a drying agent, and the antistatic bag is vacuumized to store the first welding main board.
The welding process provided by the method is suitable for the main board needing to be welded for multiple times, and the method carries out anti-oxidation protection treatment on the second welding site for the second welding before the first welding, so that the second welding site can not be oxidized in the first welding and subsequent storage, the purpose of protecting the second welding site is achieved, all elements are not required to be welded at one time, the production planning of manufacturers is facilitated, and the effect of flexibly assembling the elements on the main board at low cost is realized.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
FIG. 1 is a schematic view of a process for implementing a welding process based on tape protection according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of an adhesive tape according to another embodiment of the present invention;
FIG. 3 is a schematic view of a process for implementing a tape-based protection welding process according to yet another embodiment of the present invention;
fig. 4 is a schematic diagram of an implementation module of a welding system based on tape protection according to an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 is a schematic view of a process for implementing a welding process based on tape protection according to an embodiment of the present invention;
referring to fig. 1, in one aspect, the present invention provides a tape protection based welding process, including: an operation 101 of determining a first welding site and a second welding site corresponding to a main board to be welded, wherein the first welding site is used for first welding, and the second welding site is used for second welding; an operation 102, forming an anti-oxidation protection layer on the surface of the second welding site to obtain a second welding site containing the anti-oxidation protection layer; operation 103, performing a first tin spreading treatment on the first welding site to obtain a first tin spreading site; the thickness of the solder paste at the first tin spreading position is the target solder paste thickness required by the first welding; an operation 104, obtaining a first target element, and welding the first target element on the first tin spreading site to obtain a first welding main board; in operation 105, a second target component is obtained, and the second target component is soldered to the second soldering site to obtain a second soldering mother board.
The welding process provided by the method is suitable for the main board needing to be welded for many times, in particular to the main board with longer interval time between two adjacent welding treatments, before the first welding, the method carries out anti-oxidation protection treatment on the second welding site for the second welding, so that the operation is carried out, the second welding site can not be oxidized in the first welding and subsequent storage, the purpose of protecting the second welding site is achieved, the second welding site for the second welding is not oxidized, the quality of the main board is ensured, the time interval between the first welding and the second welding can be prolonged by applying the method, more distribution time is provided for manufacturers, the manufacturers can conveniently carry out production planning, and the effect of flexibly assembling elements on the main board at low cost is realized.
In operation 101 of the method, the main board to be welded may be a main board that has been subjected to component welding or may be a main board that has not been subjected to component welding. The main board to be welded is further a main board which also needs to be subjected to component welding at least twice. The mainboard is a PCB circuit board. The first welding site refers to a site for welding elements when the main board is welded for the first time, and the second welding site refers to a site for welding elements when the main board is welded for the second time. The first welding and the second welding are only used for distinguishing in terms of time, that is, the first welding is earlier than the second welding, but it is necessary to supplement that a third welding, a fourth welding and the like may also exist between the first welding and the second welding, and details are not described below. Specifically, the first soldering site and the second soldering site may be copper parts, such as copper foils, on the PCB for connecting components. The method can determine the first welding point and the second welding point on the mainboard through machine vision and can also determine the first welding point and the second welding point through a template corresponding to the mainboard.
It should be added that, before operation 101, the method further includes: determining the inventory amount of target elements, determining the target elements with the inventory amount meeting the welding quantity required by the first welding as first target elements, and determining the target elements with the inventory amount not meeting the welding quantity required by the first welding as second target elements. Corresponding first and second weld sites are then determined based on the first and second target elements.
In operation 102 of the method, before the first welding, an anti-oxidation protection layer is formed on the surface of the second welding site, so that the anti-oxidation protection layer covers the surface of the second welding site, and the second welding site is isolated from the external environment, thereby achieving the purpose of protecting the second welding site. Wherein, the anti-oxidation protective layer can be an anti-oxidation protective layer which needs to be removed in the second welding, such as an anti-oxidation protective layer formed by a chemical method; or an oxidation preventing protective layer which does not need to be removed at the time of the second welding, such as an oxidation preventing protective layer formed by a physical method.
In operation 103 of the method, the method may print solder paste on the first soldering site by a printing manner to obtain a first solder spreading site, where it is understood that the first solder spreading site refers to a first soldering site on which the surface of the solder paste is covered, and the first solder spreading process of the method may include multiple solder spreading or may be completed by one solder spreading, where the specific number of times of the first solder spreading is determined according to the structure of the printing steel mesh. The target solder paste thickness required for the first soldering may be the amount of solder paste required for soldering the corresponding first target component to the first soldering site, and it is understood that the solder paste thickness of different components may be the same or different. Furthermore, the method can also adopt tin spraying, tin dipping and the like to obtain the first tin spreading site.
In the present method operation 104, the first target component refers to a target component for which an inventory level is sufficient for the first weld. The method includes the steps that a first target element is welded on a first tin spreading position point, and a first welding main board is obtained. The first soldered motherboard refers to a motherboard that includes a first target element but does not include a second target element.
In the method operation 105, when a second target component is obtained in which the stock quantity satisfies the soldering number required for the second soldering, the second target component is soldered on the second soldering site to obtain a second soldered mother board. It is necessary to supplement that the first soldering and the second soldering can be realized by reflow soldering with a chip mounter and a reflow oven. The method is suitable for the second welding of various types of components. According to actual conditions, the second welding mainboard can be the finished product mainboard, also can be for still need carrying out welded mainboard once more, and is preferred, and the second welding mainboard is the finished product mainboard.
In one embodiment, forming an oxidation protection layer on a surface of the second welding site to obtain a second welding site including the oxidation protection layer in operation 102 includes: carrying out adhesive tape protection treatment on the second welding site to obtain a second welding site provided with an adhesive tape; correspondingly, operation 105 is to solder a second target component to a second soldering site to obtain a second soldering mother board, including: and removing the adhesive tape on the second welding site provided with the adhesive tape, and welding a second target element on the second welding site to obtain a second welding main board.
The anti-oxidation protective layer can be an adhesive tape layer, and the adhesive tape is attached to the surface of the second welding site so as to achieve the purpose of isolating the second welding site from the external environment. In this case, when it is necessary to perform operation 105, it is necessary to remove the adhesive tape on the second welding site to avoid the adhesive tape from affecting the welding, and then weld the second target component on the second welding site.
In an embodiment, the tape protecting process is performed on the second welding site to obtain a second welding site provided with a tape in operation 102, including: and adhering the residue-free high-temperature-resistant adhesive tape to the second welding site to obtain the second welding site provided with the adhesive tape.
The adhesive tape of the method is a residue-free high-temperature-resistant adhesive tape, and specifically can be a polyimide film adhesive tape. The residue-free high-temperature-resistant adhesive tape has the advantages that after the residue-free high-temperature-resistant adhesive tape is removed, no adhesive remains on the surface of the second welding point, so that the quality of the second welding is guaranteed; the residue-free high-temperature-resistant adhesive tape has the characteristic of high temperature resistance, and the welding temperature does not influence the performance of the adhesive tape during the first welding, so that the effect of better protecting a second welding point is achieved.
FIG. 2 is a cross-sectional view of another embodiment of the tape of the present invention.
Referring to fig. 2, in one embodiment, the tape comprises a release liner 201, a silicone adhesive layer 202 and a polyimide film layer 203 arranged in sequence, wherein the release liner 201 is configured to be attached to the second bonding site.
In particular, the tape may be a multilayer tape. Wherein the release liner 201(release liner) faces the second soldering site to avoid adhesive attachment to the second soldering site surface. A silicone adhesive layer 202 (silicone adhesive) is attached to the surface of the release liner 201 and is made of a silicone adhesive for providing adhesion to enable the tape to be attached to the second soldering site surface. The polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and medium resistance, can be used for a long time in the temperature range of-269-280 ℃, plays a role in protecting the second welding site when a first welding site is subjected to element welding, and avoids the second welding site from being damaged by the welding temperature.
Fig. 3 is a schematic flow chart illustrating a welding process based on tape protection according to still another embodiment of the present invention.
Referring to fig. 3, in an embodiment, operation 103, performing a first tin plating process on the first soldering site to obtain a first tin plating site includes: operation 1031, determining a corresponding printing steel mesh according to the first welding site; in operation 1032, a first tin spreading process is performed on the first soldering site through the printed steel mesh to obtain a first tin spreading site.
In operation 1031, carry out the first tin of spreading through steel mesh printing and handle, further, the printing steel mesh can be thickened or made thin according to the tin of spreading that corresponds first welding site needs. The printing steel mesh can be only provided with meshes corresponding to the first welding sites, and the first welding sites can be subjected to first tin paving treatment by a tin spraying or dipping method.
In operation 1032, the printing steel mesh and the main board to be welded are positioned, then printing and tin paving are performed on the printing steel mesh, so that the tin paste covers the first welding site of the main board to be welded through meshes of the steel mesh, and then the tin paste on the surface of the steel mesh is scraped off, so that the first tin paving site can be obtained. It can be supplemented that after the completion of tin spreading treatment, the thickness, volume, area, shape and the like of the first tin spreading point can be detected by matching the SPI tin paste detection equipment with the AOI optical detection equipment so as to ensure that the first tin spreading point meets the welding requirements.
In an embodiment, the operation 104 is to solder a first target component onto a first tin plating site to obtain a first soldered motherboard, including: and welding the first target element on the first tin spreading site through low-temperature welding to obtain a first welding main board.
In order to avoid damaging the second tin spreading site by the first welding, the method adopts a low-temperature welding mode to weld the first target element on the first tin spreading site, correspondingly, the method can adopt low-temperature tin paste to spread tin, and protects the element and the mainboard which can not bear high-temperature reflow welding. Specifically, the solder paste of the method can be a Type4, a Type5 and a Type6 tube solder paste for spray printing. Specifically, the welding temperature of the low-temperature welding is lower than 200 ℃, and further, the welding temperature of the low-temperature welding is lower than 140 ℃.
In one embodiment, the operation 105 of soldering a second target component to a second soldering site to obtain a second target component and obtain a second soldered motherboard includes: firstly, carrying out second tin spreading treatment on a second welding site on a first welding main board to obtain a second tin spreading site; then, a second target component is soldered to the second soldering site, and a second soldering mother board is obtained.
In the process of welding the second target element, the tin spreading treatment and the welding treatment are also included, the tin spreading can be realized by adopting methods of tin spraying, tin dipping and the like, and the welding treatment can be realized by adopting a chip mounter to mount a chip and a reflow oven to perform reflow welding. The second welding of the method can also adopt POP technology to realize the welding of the second target element.
In an embodiment, the second tin spreading process is performed on the second soldering site on the first soldering main board, so as to obtain a second tin spreading site, and the method includes: spraying and printing a specified amount of solder paste onto a second welding site through solder paste spraying and printing to obtain a second tin paving site; and the thickness of the solder paste of the second tin spreading site is the target thickness of the solder paste corresponding to the second welding.
The method accurately sprays and prints a specific amount of solder paste on the surface of the second welding point through the high-speed high-precision spray printing machine, so that the thickness of the solder paste at the second welding point meets the target thickness of the solder paste corresponding to the second welding. The method can also detect the second tin spreading point by matching SPI tin cream detection equipment with AOI optical detection equipment to determine the thickness, volume, area, shape and the like of the second tin spreading point, and then determine the thickness, volume, area, shape and the like of the tin cream required by the second tin spreading treatment according to the thickness, volume, area, shape and the like of the second tin spreading point. And carrying out subsequent welding treatment under the condition that the solder paste of the second tin spreading site meets the requirement.
In an implementation manner, operation 102, forming an oxidation protection layer on a surface of the second welding site to obtain a second welding site including the oxidation protection layer, further includes: and forming organic solderability protection films on the surfaces of the first welding site and the second welding site.
The surface anti-oxidation protection treatment of the method can also be surface treatment directly carried out on the surfaces of the first welding site and the second welding site to form an organic solderability protection film. The solderability protection film is used for isolating the bare copper on the surface of the mainboard to be soldered from the outside air, so as to prevent the bare copper from being oxidized. Specifically, the method may use an OSP process to perform surface treatment on the main board to chemically grow a layer of organic film on the bare copper surface of the main board, and may also use any one of a HASL tin-lead process, a HASL tin-copper process, a chemical nickel plating process, a chemical gold immersion process, an electrolytic nickel process, an electrolytic gold process, a silver immersion process, a tin immersion process, and the like, or other processes to form a protective layer on the surfaces of the first soldering site and the second soldering site. The OSP organic solderability protection film has certain thickness attenuation under the condition of first low-temperature welding, but cracking does not occur, so that the OSP organic solderability protection film can still play a role in protecting a second welding site after the first low-temperature welding is completed.
It is necessary to supplement that, according to the storage time interval of two times of welding, the anti-oxidation protective layer of the method can be a dual anti-oxidation protective layer containing an organic weldable protective film and an adhesive tape, can also be an anti-oxidation protective layer only containing an organic weldable protective film, and can also be an anti-oxidation protective layer only containing an adhesive tape.
In an embodiment, after obtaining the first welded motherboard at operation 104, the method further comprises: placing the first welding main board in an environment with the temperature range of 15-35 ℃ and the relative humidity range of 3-15% RH to store the first welding main board; or the first welding main board is arranged in an anti-static bag filled with a drying agent, and the anti-static bag is vacuumized to store the first welding main board.
In order to further protect the first welding mainboard, the method can also store the first welding mainboard in a moisture-proof cabinet or a drying oven, and the temperature range is adjusted to 15-35 ℃ and the relative humidity range is 3-15% RH, so that the first welding mainboard is in an environment where the first welding mainboard is not easy to oxidize and the humidity sensitive element on the first welding mainboard is not easy to damp, the first welding mainboard is further stored, and the storage life of the first welding mainboard is prolonged.
It is added that if the time interval between the first welding and the second welding is less than 8 months, the method can also directly store the first welding main board in the environment with the temperature range of 15-35 ℃ and the relative humidity range of 3-15% RH without carrying out the treatment of sticking the high temperature resistant adhesive tape without residue on the second welding site after forming the organic solderability protective film on the surfaces of the first welding site and the second welding site.
The method also provides another method for storing the first welded mainboard, and specifically, a drying agent can be added into the anti-static bag, then the first welded mainboard is placed into the anti-static bag, and the anti-static bag is vacuumized after being sealed, so that the first welded mainboard can be stored.
Similarly, if the time interval between the first welding and the second welding is less than 8 months, the method can also directly arrange the first welding main board in an antistatic bag filled with a drying agent without carrying out the treatment of sticking a high-temperature-resistant adhesive tape without residues on the second welding site after forming the organic weldable protective film on the surfaces of the first welding site and the second welding site, and carry out the vacuum-pumping treatment on the antistatic bag so as to store the first welding main board.
Fig. 4 is a schematic diagram of an implementation module of a welding system based on tape protection according to an embodiment of the present invention.
In another aspect, the present invention provides a tape protection based welding system, comprising: the determining module 401 is configured to determine a first welding point and a second welding point corresponding to a main board to be welded, where the first welding point is used for first welding, and the second welding point is used for second welding; an anti-oxidation module 402, configured to form an anti-oxidation protection layer on a surface of the second welding site, so as to obtain a second welding site including the anti-oxidation protection layer; a tin spreading module 403, configured to perform a first tin spreading process on the first soldering site to obtain a first tin spreading site; the thickness of the solder paste at the first tin spreading position is the target solder paste thickness required by the first welding; a welding module 404, configured to obtain a first target element, and weld the first target element on the first tin spreading site to obtain a first welded motherboard; and the welding module 404 is further configured to obtain a second target component, and weld the second target component on the second welding site to obtain a second welded main board.
In an implementation manner, the oxidation prevention module 402 is further configured to perform a tape protection process on the second welding site, so as to obtain a second welding site provided with a tape; correspondingly, the welding module 404 is further configured to remove the adhesive tape from the second welding site where the adhesive tape is disposed; and the welding submodule is used for welding the second target element on the second welding site to obtain a second welding main plate.
In one embodiment, the tin plating module 403 includes: the determining submodule 4031 is used for determining a corresponding printing steel mesh according to the first welding site; and the tin paving submodule 4032 is used for performing first tin paving treatment on the first welding site through a printing steel mesh to obtain a first tin paving site.
In an embodiment, the oxidation prevention module 402 is further configured to attach a residue-free high temperature resistant adhesive tape to the second welding site, so as to obtain a second welding site provided with the adhesive tape.
In one embodiment, the tape comprises a release liner, a silicone adhesive layer, and a polyimide film layer, wherein the release liner is attached to the second bonding site.
In one embodiment, the soldering module 404 is configured to solder the first target component to the first tin plating site by low temperature soldering to obtain a first soldered motherboard.
In an implementation manner, the soldering module 404 is further configured to perform a second tin spreading process on a second soldering site on the first soldering motherboard to obtain a second tin spreading site; and welding the second target element on the second welding site to obtain a second welding main plate.
In an implementation, the soldering module 404 is further configured to spray print a specified amount of solder paste onto the second soldering site by solder paste spray printing to obtain a second solder spreading site; and the thickness of the solder paste of the second tin spreading site is the target thickness of the solder paste corresponding to the second welding.
In one embodiment, the oxidation prevention module 402 is further configured to form an organic solderability preservative on the surfaces of the first and second soldering sites.
In one embodiment, the apparatus further comprises: the storage module 405 is configured to place the first welding motherboard in an environment with a temperature range of 15-35 ℃ and a relative humidity range of 3-15% RH to store the first welding motherboard; or the first welding main board is arranged in an anti-static bag filled with a drying agent, and the anti-static bag is vacuumized to store the first welding main board.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A welding process based on anti-oxidation protection is characterized in that the method comprises the following steps:
determining a first welding site and a second welding site corresponding to a main board to be welded, wherein the first welding site is used for first welding, and the second welding site is used for second welding;
forming an anti-oxidation protective layer on the surface of the second welding site to obtain a second welding site containing the anti-oxidation protective layer;
carrying out first tin spreading treatment on the first welding site to obtain a first tin spreading site; the thickness of the solder paste of the first tin spreading site is the target solder paste thickness required by the first welding;
obtaining a first target element, and welding the first target element on the first tin spreading site to obtain a first welding main board;
and obtaining a second target element, and welding the second target element on the second welding site to obtain a second welding main board.
2. The method of claim 1, wherein forming an oxidation protection layer on the surface of the second welding site to obtain a second welding site containing the oxidation protection layer comprises:
carrying out adhesive tape protection treatment on the second welding site to obtain a second welding site provided with an adhesive tape;
correspondingly, the welding the second target element on the second welding site to obtain a second welded main board includes:
and removing the adhesive tape on the second welding site provided with the adhesive tape, and welding the second target element on the second welding site to obtain a second welding main board.
3. The method of claim 1, wherein performing a first tin spreading process on the first soldering site to obtain a first tin spreading site comprises:
determining a corresponding printing steel mesh according to the first welding site;
and carrying out first tin paving treatment on the first welding site through the printing steel mesh to obtain a first tin paving site.
4. The method of claim 1, wherein tape protecting the second welding site to obtain a taped second welding site comprises:
and adhering the residue-free high-temperature-resistant adhesive tape to the second welding site to obtain the second welding site provided with the adhesive tape.
5. The method of claim 1, wherein the tape comprises a release liner, a silicone adhesive layer, and a polyimide film layer disposed in sequence, wherein the release liner is configured to be attached to the second bonding site.
6. The method of claim 1, wherein said soldering a first target element on said first tinning station, obtaining a first soldered motherboard, comprises:
and welding the first target element on the first tin spreading site through low-temperature welding to obtain a first welding main board.
7. The method of claim 1, wherein welding the second target component to the second welding site to obtain a second target component to obtain a second welded mother board comprises:
carrying out second tin spreading treatment on a second welding site on the first welding main board to obtain a second tin spreading site;
and welding the second target element on the second welding site to obtain a second welding main plate.
8. The method of claim 7, wherein performing a second tin plating process on a second soldering site on the first soldering mother board to obtain a second tin plating site comprises:
spraying and printing a specified amount of solder paste onto the second welding site through solder paste spraying and printing to obtain a second tin paving site; and the thickness of the solder paste of the second tin spreading site is the target thickness of the solder paste corresponding to the second welding.
9. The method as claimed in claim 1, wherein said forming an oxidation protection layer on the surface of said second welding site to obtain a second welding site containing an oxidation protection layer, further comprises:
and forming an organic solderability protection film on the surfaces of the first welding site and the second welding site.
10. The method of claim 1, wherein after said obtaining a first welded motherboard, the method further comprises:
placing the first welding main board in an environment with the temperature range of 15-35 ℃ and the relative humidity range of 3-15% RH to store the first welding main board;
or the like, or, alternatively,
and arranging the first welding main board in an antistatic bag filled with a drying agent, and vacuumizing the antistatic bag to store the first welding main board.
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