CN113555274B - Chip Cleaning Method - Google Patents

Abstract

The invention provides a chip cleaning method, which comprises the following steps: after the chip is subjected to the first baking treatment, cleaning the chip by adopting the first mixed liquid, the second mixed liquid and the two fluids in sequence, and drying the cleaned chip and then carrying out the second baking treatment; the first mixed liquid comprises cold degreasing agent and water, the second mixed liquid comprises cold degreasing agent and water, and the volume concentration of the cold degreasing agent in the second mixed liquid is lower than that of the cold degreasing agent in the first mixed liquid. The chip cleaning method provided by the invention has good cleaning effect, and particularly the core particles after cleaning are not easy to drop and lose, and the surface of the chip has no residual liquid.

Description

Chip Cleaning Method

technical field

The invention relates to the technical field of semiconductors, in particular to a chip cleaning method.

Background technique

Light Emitting Diode (LED for short) is a semiconductor electronic device that converts electrical energy into light energy. LED chips are the core components of LED lighting. The second half of the production of LED chips includes grinding, scribing, and splitting. , Inverting film, film expansion, point measurement, sorting and other steps. At this stage, LED chips are developing in the direction of refinement and differentiation. How to improve the performance indicators of LED chips has always been the goal pursued by technicians in the field.

In the second half of the production of LED chips, it is very easy to pollute the chips. The main pollutants come from the following aspects: First, the fine particle pollutants that appear when the substrate of the chip breaks during the scribing process; The second is the organic pollutants that appear when the blue film on the blue film chip falls off during the process of pouring and expanding the film; the third is the metal particle pollution that occurs when the probe used for point measurement oxidizes and falls off during the point measurement process; Fourth, in the sorting process, the particulate pollutants and organic pollutants brought by the suction nozzles used for sorting; fifth, in the process of chip storage and transfer, the chip adsorbs suspended particulate pollutants and oil pollutants in the environment . It can be seen that during the preparation of LED chips, pollutants will be brought to cause chip pollution. If the pollutants are not disposed of in time, the reliability and durability of LED chips will be greatly affected, such as leakage failure of the chip and low light extraction rate. and other phenomena, especially when the negative electrode (N) and positive electrode (P) of the chip have organic pollution or residues, problems such as poor bonding wires will occur in the subsequent LED chip packaging, thus bringing great quality to the chip manufacturing factory. hazards and economic losses.

Up to now, the industry has gradually realized the harm caused by chip pollution, but as the size of LED chips becomes smaller and smaller, and the chips are fixed on the carrier (such as blue film, UV film) after sorting, the cleaning of the chips Difficulty increases, and the traditional manual chip cleaning method uses a second fluid or a high-pressure pump cleaning machine to clean the chip, which is often not cleaned thoroughly, resulting in chip loss. In order to improve chip cleaning efficiency, an automatic chip cleaning device has been gradually developed in the prior art. For example, patent document CN109962028A discloses a fully automatic cleaning device and cleaning process for chips. Although this automatic cleaning device improves chip cleaning efficiency, However, during the chip cleaning process, a large number of core particles are often dropped and lost. In addition, the chemical solution is often not cleaned during the chip cleaning process, and the residual chemical solution brings secondary pollution to the chip, making the chip cleaning effect poor. .

Contents of the invention

Aiming at the deficiencies of the prior art, the present invention provides a chip cleaning method to at least solve the problems existing in the prior art that the core particles are easy to drop and lose after cleaning, and the chip is secondary polluted by the residue of the chemical solution.

The invention provides a chip cleaning method, comprising the following steps: after the chip is subjected to the first baking treatment, the first mixed liquid, the second mixed liquid, and the second fluid are sequentially used for cleaning treatment, and the cleaned chip is dried Afterwards, carry out the second baking treatment again; Wherein, the first mixed liquid comprises cold degreasing agent and water, the second mixed liquid comprises cold degreasing agent and water, and the volume concentration of cold degreasing agent in the second mixed liquid is lower than the first mixed liquid The volume concentration of the cold degreasing agent in the liquid.

According to an embodiment of the present invention, the conditions of the first baking treatment are: the baking temperature is 25-65°C, and the baking time is 300-1800 seconds; and/or, the conditions of the second baking treatment are: the baking temperature 25-65℃, the baking time is 200-1800 seconds.

According to an embodiment of the present invention, the cold degreasing agent includes at least one of LF-106 cold degreasing agent and HWJ-109 cold degreasing agent.

According to an embodiment of the present invention, in the first mixed liquid, the volume ratio of the cold degreasing agent and water is 1:1-1:15; and/or, the volume ratio of the cold degreasing agent and water in the second mixed liquid The ratio is 1:5-1:25.

According to an embodiment of the present invention, it further includes: after using the first mixed liquid for cleaning treatment, firstly using the second fluid for cleaning treatment, and then using the second mixed solution for cleaning treatment.

According to an embodiment of the present invention, the process of using the first mixed solution for cleaning treatment includes: immersing the chip in the first mixed solution for 5-80 seconds, and then brushing the chip; and/or, using the second mixed solution The cleaning process includes: immersing the chip in the second mixed solution for 5-80 seconds, and then brushing the chip.

According to one embodiment of the present invention, an automatic chip cleaning machine is used for scrubbing. The automatic chip cleaning machine includes a cleaning table and a brush for scrubbing. During the scrubbing process, the chip is placed on the cleaning table and brushed by the brush. For scrubbing, the rotation speed of the cleaning table is 0-500RPM, and the scrubbing time is 1-80 seconds.

According to an embodiment of the present invention, the two fluids include gas and liquid; and/or, the time for cleaning with the two fluids is 1-600 seconds.

According to one embodiment of the present invention, an automatic chip cleaning machine is used for cleaning treatment. The automatic chip cleaning machine includes a cleaning table and a first nozzle. The chip is placed on the cleaning table, and the nozzle is used to spray two fluids on the cleaning table. During the cleaning process of the fluid, the rotation speed of the cleaning table is 10-1500RPM, the two fluids include gas and liquid, the pressure of the liquid is 0.1-0.8MPa, and the flow rate of the liquid is 0.1-0.8L/min.

According to one embodiment of the present invention, compressed gas is used for drying, the pressure of the compressed gas is 0.08-0.9 MPa, the drying time is 1-600 seconds, and the rotation speed of the control chip is 100-2500 RPM.

Implementation of the present invention has at least the following beneficial effects:

The chip cleaning method provided by the present invention, through the first baking treatment, can enhance the adhesion strength between the chip and the carrier, prevent the core particles from falling during the subsequent cleaning process, and ensure the integrity and quality of the chip. After the baking process, the chip is cleaned with a high-proportion cleaning solution, which can remove the pollutants on the chip surface to the greatest extent. However, after the chip is cleaned with a high-proportion cleaning agent, there will be cold degreasing agents on the chip surface Therefore, the chip is cleaned with a low-proportion cleaning agent, which can dissolve the residues such as cold degreasing agent on the surface of the chip, and then the chip is cleaned with the second fluid, and the chip after cleaning is dried, and then the second The baking process further removes the moisture of the chip and enhances the adhesion strength between the chip and the carrier. Using the above chip cleaning method can not only effectively remove the pollutants on the chip surface, but also there will be no residual cleaning solution on the chip surface after cleaning, avoiding secondary pollution, and the cleaning effect is good. In addition, the cleaning method is also simple and convenient to operate. Advantages, especially suitable for batch cleaning of LED chips.

Description of drawings

Fig. 1 is the flowchart of the chip cleaning method in one embodiment of the present invention;

Fig. 2 is the overall appearance diagram of the chip after cleaning in the embodiment 1 of the present invention;

Fig. 3 is the energy spectrometer (EDS) elemental analysis diagram of the cleaned chip in the present invention implementation 2;

Fig. 4 is the overall appearance diagram of the cleaned chip in Comparative Example 1 of the present invention;

5 is an energy dispersive spectrometer (EDS) elemental analysis diagram of the cleaned chip surface in Comparative Example 2 of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below.

The chip cleaning method provided by the present invention comprises the following steps: after the chip is subjected to the first baking treatment, the first mixed solution, the second mixed solution, and the second fluid are used for cleaning treatment in sequence, and the cleaned chip is dried. , and then carry out the second baking treatment; wherein, the first mixed liquid includes cold degreasing agent and water, the second mixed liquid includes cold degreasing agent and water, and the volume concentration of cold degreasing agent in the second mixed liquid is lower than that of the first mixed liquid The volume concentration of intercooler degreaser.

Specifically, the purpose of the first baking treatment is to enhance the adhesion strength between the chip and the carrier, and prevent the core particles from loosening and falling off during the cleaning process. In order to remove pollutants on the chip surface to the greatest extent, such as metal, dust and other particle pollutants on the chip surface, grease pollutants, etc., the surface of the chip after cleaning with a high proportion of mixed reagents will have cleaning solutions such as cold degreasing agents. Therefore, a low-proportion cold degreasing agent and water mixed reagent is used to dissolve the cold degreasing agent and other residues on the surface of the chip, and then the chip is cleaned with the second fluid. The above cleaning treatment can not only effectively remove the pollution on the chip surface substances, and the surface of the cleaned chip does not remain on the surface of the first mixed solution, the second mixed solution and other cleaning solutions, and there will be no secondary pollution; after the cleaned chip is dried, the chip is then subjected to the second baking process, The purpose of the second baking treatment is to dry the small amount of moisture (water vapor) remaining on the chip and further enhance the adhesion strength between the chip and the carrier.

Specifically, the chip cleaning method provided by the present invention is suitable for cleaning the surface of chips, especially for the cleaning of sorted light-emitting diode chips (LED chips). , Reverse leakage yield and working voltage and other parameter standards are distinguished and classified. As a result, the LED chips are divided into many bins and categories, and then the LED chips are divided into different bins according to the set test standards by the sorting machine. Inside the material box (Bin box).

The chip has a core particle and a film for fixing or carrying the core particle, such as a blue film, a UV film, etc. The chip of the present invention can be a conventional chip in the field, such as a chip whose carrier is a blue film or a UV film.

In the present invention, the chips can be cleaned in batches. In the specific implementation process, the sorted chips can be packed in different material boxes, wherein each material box can be loaded with 1-50 chips, and the material boxes can be put into the oven. Bake in a baking device (such as an oven or an oven, etc.) to achieve the first baking process on the chip, and then clean the chip after the baking process, and dry the chip after the cleaning process, you can put The dried chips are packed in different magazines, and the magazines are put into a baking device (such as an oven or an oven) for baking, so as to implement the second baking process on the chips.

Through the first baking process, the strength of the chip can be enhanced, for example, the adhesion between the core particle and the film used to fix or carry the core particle can be strengthened, so as to facilitate the subsequent cleaning process, prevent the core particle from loosening and falling off during the cleaning process, and ensure cleaning. The quality of the post chip. Specifically, in some preferred embodiments, the temperature of the first baking treatment may be 25-65°C, such as 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C ℃ or any combination thereof, the time of the first baking treatment is 300-1800 seconds, such as 300 seconds, 400 seconds, 800 seconds, 1000 seconds, 1500 seconds, 1800 seconds or any combination thereof scope.

After drying, a small amount of water vapor will generally remain on the chip. The second baking process can remove the residual water vapor on the chip surface, further ensure the strength of the chip, prevent the core particles from loosening and falling off, and ensure the quality of the chip after cleaning. After further research, the temperature of the second baking treatment can be 25-65°C, such as 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C or any two of them. The range of the composition, the time of the second baking treatment is 200-1800 seconds, such as 200 seconds, 400 seconds, 800 seconds, 1000 seconds, 1500 seconds, 1800 seconds or any combination thereof.

Generally, the cold degreasing agent is in a liquid state, including at least one of an alkaline degreasing agent, an emulsion degreasing agent, and a solvent degreasing agent. In some embodiments, the cold degreasing agent includes at least one of LF-106 cold degreasing agent and HWJ-109 cold degreasing agent, specifically, it can be a cold degreasing agent selected from Longfei Environmental Protection Technology Co., Ltd. model LF-106, It can also be selected from the cold degreasing agent of Huiweijia Metal Technology Co., Ltd. model HWJ-109.

In some embodiments, in the first mixed liquid, the volume ratio of the cold degreasing agent to water is 1:1-1:15, such as 1:1, 1:3, 1:5, 1:7, 1:8 , 1:11, 1:13, 1:15 or any two of them. In practice, the first mixed liquid may be composed of cold degreasing agent and water.

In some embodiments, the volume ratio of the cold degreasing agent and water in the second mixed liquid is 1:5-1:25, such as 1:5, 1:7, 1:10, 1:12, 1:15 .

In some embodiments, the method further includes: after using the first mixed solution for cleaning treatment, first using the second fluid for cleaning treatment, and then using the second mixed solution for cleaning treatment. Specifically, as shown in FIG. 1, after the chip is subjected to the first baking treatment, the first mixed solution, the second fluid (referred to as the first and second fluid), the second mixed solution, and the second fluid (referred to as the second fluid) are sequentially used. Second fluid) for cleaning treatment to further remove cleaning solution residues such as the first mixed solution and the second mixed solution on the surface of the chip.

In some embodiments, the two fluids include gas and liquid, that is, the above-mentioned first and second fluids may include gas and liquid, and the second and second fluids may include gas and liquid, and the first and second fluids and the second and second fluids may be the same or different. Optionally, the liquid in the two fluids may include water, such as deionized water, and the gas may include high-purity nitrogen.

In some embodiments, the cleaning process using the first mixed solution includes: immersing the chip in the first mixed solution for 5-80 seconds, and then brushing the chip.

In the specific implementation of the present invention, an automatic chip cleaning machine is used to clean the chips, wherein the automatic chip cleaning machine includes a cleaning room, a cleaning table, and at least one spray head, and the cleaning table is arranged in the cleaning room for feeding the cleaning room of the cleaning machine. A first spray head for spraying the first mixed liquid, the first spray head is provided with a pipeline connected with the first mixed liquid. When using an automatic chip cleaning machine for cleaning, the chip is placed on the cleaning table, the first nozzle faces the chip, and the first mixed solution is sprayed on the chip through the first nozzle so that the first mixed solution is immersed in the chip. The chip is brushed and cleaned, wherein the spraying time is 3-50 seconds, such as 3 seconds, 8 seconds, 12 seconds, 24 seconds, 48 seconds, 50 seconds or any two of them, and the soaking time is 5-80 seconds. Seconds, such as 5 seconds, 10 seconds, 20 seconds, 30 seconds, 40 seconds, 50 seconds, 60 seconds, 70 seconds, 80 seconds or any two of them.

In some embodiments, the cleaning process using the second mixed solution includes: immersing the chip in the second mixed solution for 5-80 seconds, and then brushing the chip.

In the specific implementation of the present invention, an automatic chip cleaning machine is used to clean the chips, wherein the automatic chip cleaning machine includes a cleaning room, a cleaning table, and at least one spray head, and the cleaning table is arranged in the cleaning room for feeding the cleaning room of the cleaning machine. The second spray head is sprayed into the second mixed liquid, and the second spray head is provided with a pipeline connected with the second mixed liquid. When using an automatic chip cleaning machine for cleaning, the chip to be cleaned is placed on the cleaning table, the second nozzle faces the chip to be cleaned, and the second mixed solution is sprayed on the chip to be cleaned through the second nozzle, so that The chip is submerged in the second mixture, and the chip is brushed after soaking, wherein the spraying time is 3-50 seconds, such as 3 seconds, 8 seconds, 12 seconds, 24 seconds, 48 seconds, 50 seconds or any combination thereof The range of soaking time is 5-80 seconds, such as 5 seconds, 10 seconds, 20 seconds, 30 seconds, 40 seconds, 50 seconds, 60 seconds, 70 seconds, 80 seconds or any two of them.

In some embodiments, an automatic chip cleaning machine is used for scrubbing. The automatic chip cleaning machine includes a cleaning table and a brush for scrubbing. During the scrubbing process, the chip is placed on the cleaning table and brushed by the brush. The rotation speed of the cleaning table is 0-500RPM, and the time for scrubbing is 1-80 seconds.

Specifically, the chip automatic cleaning machine includes a cleaning room, a cleaning table (or called a carrier), and a brush, wherein the cleaning table is set in the cleaning room, the chip is placed on the carrier, and the brush is used to scrub the surface of the chip. When the rotation speed of the stage is zero, the stage and the chip on the stage do not rotate, and the brush oscillates on the surface of the chip for 1-80 seconds, such as 1 second, 5 seconds, 10 seconds, 20 seconds, 30 seconds, 40 seconds seconds, 50 seconds, 60 seconds, 70 seconds, 80 seconds or any two of them. When the rotation speed of the stage is not zero, the stage drives the chips on the stage to rotate, and the rotation speed of the stage is 0-500RPM, such as 0, 20RPM, 50RPM, 100RPM, 150RPM, 200RPM, 300RPM, 400RPM, 500RPM or any two of them, RPM refers to revolutions per minute, the number of rotations per minute, for example, 150RPM refers to 150 Rotation per minute, that is, the stage rotates 150 revolutions per minute, and the rotation speed of the stage is equal to the rotation speed of the chip. The chip automatic cleaning machine can adopt a conventional chip automatic cleaning machine, for example, it can be a chip automatic cleaning machine modeled as C1502BS.

Specifically, a two-fluid cleaning device is used for two-fluid cleaning treatment. The two-fluid cleaning device includes a two-fluid nozzle, an air inlet pipe, a liquid inlet pipe, and a connecting pipe. The tube is connected to the two-fluid spray head. During the two-fluid cleaning process, gas is passed into the inlet pipe, and liquid is passed into the liquid inlet pipe. The gas inlet pipe passes the gas into the second-fluid nozzle through the connecting pipe, and the liquid inlet pipe passes the liquid into the The fluid nozzle, the gas in the intake pipe and the liquid in the liquid inlet pipe are mixed in the connecting pipe to form a two-fluid water-air mixture, and the two-fluid water-air mixture passes through the two-fluid nozzle to produce a two-fluid spray, and the two-fluid spray flushes the chip. The two-fluid spray enters the pores on the surface of the chip, and uses the power of the gas to blow off the moisture on the surface of the chip to improve the cleaning effect and realize the cleaning treatment of the chip by the two-fluid spray, wherein the gas includes nitrogen.

In some embodiments, the time for cleaning with two fluids is 1-600 seconds, such as 1 second, 15 seconds, 25 seconds, 35 seconds, 45 seconds, 60 seconds, 100 seconds, 200 seconds, 300 seconds, 400 seconds , 500 seconds, 600 seconds, or any two of them.

In some embodiments, an automatic chip cleaning machine is used for cleaning. The automatic chip cleaning machine includes a cleaning table and a first nozzle. The chip is placed on the cleaning table, and the nozzle is used to spray two fluids on the cleaning table. During the cleaning process, the rotation speed of the cleaning table is 10-1500RPM, such as 10RPM, 50RPM, 100RPM, 500RPM, 1000RPM, 1500RPM or any two of them. The two fluids include gas and liquid, and the pressure of the liquid is 0.1- 0.8MPa, such as 0.1Mpa, 0.12Mpa, 0.2Mpa, 0.4Mpa, 0.5Mpa, 0.6Mpa, 0.7Mpa, 0.8Mpa or any two of them, the flow rate of the liquid is 0.1-0.8L/min, such as 0.1 L/min, 0.12L/min, 0.13L/min, 0.2L/min, 0.4L/min, 0.6L/min, 0.8L/min or any two of them. For example, in some embodiments, the liquid in the second fluid is water, and the water pressure of the water can be controlled to be 0.1-0.8 MPa during the cleaning process using the second fluid.

Specifically, the chip automatic cleaning machine includes a cleaning chamber, a cleaning table arranged in the cleaning chamber, a first nozzle for spraying the first mixed liquid into the cleaning chamber of the cleaning machine, and a first nozzle for spraying the second mixed liquid into the cleaning chamber of the cleaning machine. The second nozzle for mixed liquid, the two-fluid nozzle for spraying two fluids into the cleaning chamber of the cleaning machine. When using the above-mentioned chip automatic cleaning machine to clean the chips, place the chips on the cleaning table, spray the first mixed liquid to the chips on the cleaning table through the first nozzle, and spray the first mixed liquid to the chips on the cleaning table through the second nozzle. The second mixed liquid is sprayed, and the second fluid is sprayed to the chip on the cleaning table through the two-fluid nozzle. Specifically, during the cleaning process using the two fluids, the chip is placed on the cleaning table, and rotates with the cleaning table, and the rotation speed of the chip is basically equal to the rotation speed of the cleaning table.

In some embodiments, compressed gas is used for drying, the compressed gas is compressed air, such as compressed nitrogen, and the pressure of the compressed gas is 0.08-0.9MPa, such as 0.08MPa, 0.1MPa, 0.2MPa, 0.4MPa, 0.6MPa, The range of 0.8MPa, 0.9MPa or any two of them, the drying time is 1-600 seconds, such as 1 second, 20 seconds, 30 seconds, 40 seconds, 80 seconds, 120 seconds, 200 seconds, 400 seconds, 600 seconds Or the range composed of any two of them, the control chip rotation speed is 100-2500RPM, such as 100RPM, 150RPM, 200RPM, 500RPM, 1000RPM, 1500RPM, 1800RPM, 2000RPM, 2500RPM or any two of them.

Specifically, an automatic chip cleaning machine is used for drying treatment. The automatic chip cleaning machine includes a cleaning room, a cleaning table arranged in the cleaning room, and a third nozzle for spraying compressed air into the cleaning room of the cleaning machine. The specific process includes: Place the chip on the cleaning table and rotate with the cleaning table. The speed of the chip is basically equal to the speed of the cleaning table. The compressed air is sprayed towards the chip through the third nozzle for drying treatment, and the moisture remaining on the chip is blown off by the power of compressed air. The centrifugal force of the stage is used to remove the water on the chip, so as to achieve drying. Specifically, the chip is placed on the cleaning stage during the cleaning process using the two fluids.

Generally, after the chip is cleaned by the above-mentioned chip cleaning method, a release paper can be pasted on the surface of the cleaned chip to protect the cleaned chip from contamination, which is more conducive to preservation of the cleaned chip.

The present invention will be further described below by specific examples and comparative examples.

Example 1

Carry out chip cleaning on the automatic chip cleaning machine model of C1502BS, wherein the above-mentioned automatic chip cleaning machine includes a cleaning chamber, a cleaning table (or loading table), and a first nozzle for spraying the first mixed liquid into the cleaning chamber of the cleaning machine , the second nozzle for spraying the second mixed liquid into the cleaning chamber of the cleaning machine, the two-fluid nozzle for spraying the second fluid into the cleaning chamber of the cleaning machine, and the nozzle for spraying compressed gas into the cleaning chamber of the cleaning machine The third nozzle, in which the chips are sorted LED chips, the carrier is a blue film, and the cold degreasing agent is the cold degreasing agent of Longfei Environmental Protection Technology Co., Ltd. model LF-106. The following steps are used to clean the chips:

S1. Put the chip into an oven for the first baking treatment, wherein the oven temperature is 35°C, and the baking time is 1200 seconds;

S2. Place the chip on the stage, spray the first mixed solution towards the chip for 12 seconds, then immerse the chip, soak for 5 seconds, and use a brush to brush the surface of the chip in a fan shape for 30 seconds, wherein the first mixed solution The volume ratio of cold degreasing agent and deionized water is cold degreasing agent: deionized water=1:5, and the rotation speed of the stage is 150RPM;

S3. Flush the chip with two fluids, wherein the stage rotation speed is 1000RPM, the flushing time is 35 seconds, the second fluid is nitrogen and water, the water pressure of the second fluid is 0.12Mpa, and the water flow rate is 0.13L/min;

S4. Place the chip on the weighing platform, spray the second mixed solution towards the chip for 15 seconds, immerse the chip, soak for 8 seconds, and use a brush to brush the surface of the chip in a fan shape for 30 seconds, wherein the second mixed solution The volume ratio of intercooling degreasing agent and deionized water is cold degreasing agent: deionized water = 1:12, and the rotation speed of the stage is 150RPM;

S5. Rinse the chip with two fluids, wherein the rotation speed of the stage is 1000RPM, the flushing time is 45 seconds, the second fluid is nitrogen and water, the water pressure of the second fluid is 0.1Mpa, and the water flow rate is 0.12L/Min;

S6. Using compressed gas to dry the surface of the chip, wherein the pressure of the compressed gas is 0.1Mpa, the rotation speed of the stage is 1800RPM, and the drying time is 40 seconds;

S7. Putting the chip into an oven for a second baking process to obtain a cleaned chip, denoted as sample 1, wherein the oven temperature is 45° C., and the baking time is 1500 seconds.

Example 2

The difference from Example 1 is that in step S2, the volume ratio of cold degreasing agent and deionized water in the first mixed liquid is cold degreasing agent: deionized water=1:5 replaced by cold degreasing agent: deionized water =1:7, all the other conditions are identical with embodiment 1.

Example 3

The difference from Example 1 is that in step S1, the oven temperature is 35°C and the baking time is 1200 seconds instead of the oven temperature is 40°C and the baking time is 900 seconds, and the rest of the conditions are the same as in Example 1.

Comparative example 1

The difference with embodiment 1 is that step S1 is canceled, and other conditions are the same as embodiment 1.

Comparative example 2

The difference from embodiment 1 is that step S4 and step S5 are cancelled, and other conditions are the same as embodiment 1.

FIG. 1 is a flowchart of a chip cleaning method according to an embodiment of the present invention.

FIG. 2 is an overall appearance diagram of the chip after cleaning in Example 1. According to FIG. 2, it can be seen that the chip cleaning method provided by the present invention is used to obtain chips that are arranged neatly, the chips are complete, and there is no shedding loss.

Fig. 3 is the EDS elemental analysis diagram of the electrode region of the chip after cleaning in embodiment 2, and table 1 is the element composition table of the electrode region of the chip after cleaning calculated according to Fig. In addition to traces of carbon (C) and oxygen (O) elements, the electrode area of the chip is mainly gold (Au) elements on the electrode surface, indicating that the chip surface is cleaned without residue.

Figure 4 is the overall appearance of the chip after cleaning in Comparative Example 1. According to Figure 4, the core particles fell during the cleaning process, indicating that the adhesion between the core particles and the blue film is poor. Caused the shedding loss of core particles.

Fig. 5 is the EDS elemental analysis diagram of the electrode region of the chip after cleaning in Comparative Example 2, and Table 2 is the element composition table of the electrode region of the chip after cleaning calculated according to Fig. 5, according to Fig. 5 and Table 2, The increase in the content of elements such as C and O was detected in the electrode area of the chip, indicating that the organic lipid pollutants on the chip increased, and the lack of the second mixed liquid cleaning treatment made the cold degreasing agent not completely dissolved and removed; in addition, the chip’s Other trace elements detected in the electrode area, such as aluminum (Al), chlorine (Cl), titanium (Ti), silver (Ag) and other trace elements, indicate that the cleaning effect of the chip is not good.

Table 1

Table 2

In summary, the chip cleaning method provided by the present invention can not only effectively remove particle pollutants such as metal and dust on the surface of the chip, and grease pollutants, ensure that there is no secondary pollutants such as cleaning agents on the surface of the chip, but also ensure that the core particle No falling off ensures the integrity and quality of the chips. In addition, the cleaning method is simple and convenient to operate, and is especially suitable for batch cleaning of LED chips.

The embodiments of the present invention have been described above. However, the present invention is not limited to the above-mentioned embodiments. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (7)

1. A chip cleaning method is characterized in that: the method comprises the following steps:

after the chip is subjected to the first baking treatment, cleaning the chip by adopting the first mixed liquid, the second mixed liquid and the two fluids in sequence, and drying the cleaned chip and then carrying out the second baking treatment; the first mixed liquid comprises a cold degreasing agent and water, and the second mixed liquid comprises a cold degreasing agent and water, wherein the volume concentration of the cold degreasing agent in the second mixed liquid is lower than that of the cold degreasing agent in the first mixed liquid;

the cold degreasing agent comprises at least one of LF-106 cold degreasing agent and HWJ-109 cold degreasing agent;

after the first mixed solution is adopted for cleaning treatment, the second fluid is adopted for cleaning treatment, and then the second mixed solution is adopted for cleaning treatment;

the cleaning treatment process by adopting the first mixed solution comprises the following steps: after the chip is soaked in the first mixed solution for 5-80 seconds, brushing the chip; and/or the number of the groups of groups,

the process of adopting the second mixed solution for cleaning treatment comprises the following steps: and (3) soaking the chip in the second mixed solution for 5-80 seconds, and then brushing the chip.

2. The method for cleaning a chip according to claim 1, wherein: the conditions of the first baking treatment are as follows: the baking temperature is 25-65 ℃, and the baking time is 300-1800 seconds; and/or the number of the groups of groups,

the conditions of the second baking treatment are as follows: the baking temperature is 25-65 ℃, and the baking time is 200-1800 seconds.

3. The method for cleaning a chip according to claim 1, wherein: in the first mixed solution, the volume ratio of the cold degreasing agent to the water is 1:1-1:15; and/or the number of the groups of groups,

the volume ratio of the cold degreasing agent to the water in the second mixed solution is 1:5-1:25.

4. The method for cleaning a chip according to claim 1, wherein: the chip automatic cleaning machine is adopted to carry out the brushing treatment, the chip automatic cleaning machine comprises a cleaning table and a brush used for the brushing treatment, the chip is placed on the cleaning table and is brushed by the brush in the brushing treatment process, the rotating speed of the cleaning table is 0-500RPM, and the brushing treatment time is 1-80 seconds.

5. The method for cleaning a chip according to claim 1, wherein: the two fluids include a gas and a liquid; and/or the time for the cleaning treatment with the two fluids is 1-600 seconds.

6. The method for cleaning a chip according to claim 1, wherein: the chip automatic cleaning machine is adopted to carry out the cleaning treatment, the chip automatic cleaning machine comprises a cleaning table and a first nozzle, the chip is arranged on the cleaning table, the nozzle is used for spraying two fluids on the cleaning table, the rotating speed of the cleaning table is 10-1500RPM in the cleaning treatment process by adopting the two fluids, the two fluids comprise gas and liquid, the pressure of the liquid is 0.1-0.8MPa, and the flow rate of the liquid is 0.1-0.8L/min.

7. The method for cleaning a chip according to claim 1, wherein: and (3) drying by adopting compressed gas, wherein the pressure of the compressed gas is 0.08-0.9MPa, the drying time is 1-600 seconds, and the rotating speed of the chip is controlled to be 100-2500RPM.

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