CN113552555B - Light emitting module and electronic equipment - Google Patents
Light emitting module and electronic equipment Download PDFInfo
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- CN113552555B CN113552555B CN202110859938.9A CN202110859938A CN113552555B CN 113552555 B CN113552555 B CN 113552555B CN 202110859938 A CN202110859938 A CN 202110859938A CN 113552555 B CN113552555 B CN 113552555B
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- light source
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 63
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Led Device Packages (AREA)
Abstract
The application discloses a light emitting module, which comprises a base part, a heat dissipation plate, a light source plate and a light homogenizing plate, wherein the base part is provided with a light source plate; the base is provided with an inner cavity, a first cavity opening and a second cavity opening, the first cavity opening and the second cavity opening are respectively arranged at two opposite ends of the base, the inner cavity is respectively communicated with the first cavity opening and the second cavity opening, the light homogenizing plate is blocked and arranged at the first cavity opening, the heat radiating plate is blocked and arranged at the second cavity opening, the light source plate is arranged in the inner cavity, the heat radiating plate, the light source plate and the light homogenizing plate are sequentially arranged, at least part of the light source plate is overlapped on the heat radiating plate, the light emitting side of the light source plate faces the light homogenizing plate, and therefore heat generated by the light source plate in the working process can be conducted out of the light emitting module through the heat radiating plate, and therefore the heat radiating performance of the light emitting module is improved.
Description
Technical Field
The present application relates to the field of electronic devices, and in particular, to a light emitting module and an electronic device.
Background
With the continuous development of science and technology, 3D imaging technology has been widely used in the technical fields of smart phones, face recognition, etc. Among them, time of flight (TOF) is the main means for realizing 3D imaging, and the light emitting module is required to be included in the flight ranging device.
However, the light emitting module in the related art has a large heat productivity and poor heat dissipation performance.
Disclosure of Invention
The invention provides a light emitting module and electronic equipment, which are used for solving the problem of poor heat dissipation performance of the light emitting module.
In one aspect, the application discloses a light emitting module, which comprises a base, a heat dissipation plate, a light source plate and a light equalizing plate; the base is provided with an inner cavity, a first cavity opening and a second cavity opening, the first cavity opening and the second cavity opening are respectively arranged at two opposite ends of the base, the inner cavity is respectively communicated with the first cavity opening and the second cavity opening, the light homogenizing plate is blocked and arranged at the first cavity opening, the heat radiating plate is blocked and arranged at the second cavity opening, the light source plate is arranged in the inner cavity, the heat radiating plate, the light source plate and the light homogenizing plate are sequentially arranged, at least part of the light source plate is overlapped on the heat radiating plate, and the light emitting side of the light source plate faces the light homogenizing plate.
In another aspect, the application discloses an electronic device including a light emitting module.
The beneficial effects of the invention are as follows:
The application optimizes the structure of a light emitting module, in particular to an inner cavity is arranged in a base, a first cavity opening and a second cavity opening are respectively arranged at two opposite ends of the base, a light equalizing plate and a heat dissipation plate for blocking the first cavity opening and the second cavity opening are respectively arranged, a light source plate is arranged in the inner cavity, at least part of the light source plate is overlapped on the heat dissipation plate, and the light emitting side of the light source plate faces the light equalizing plate.
Therefore, in the working process, heat generated by the light source plate can be conducted out of the light emitting module through the heat dissipation plate, and therefore the heat dissipation performance of the light emitting module is improved.
Drawings
Fig. 1 is a diagram showing an internal structure of a light emitting module according to a first embodiment of the present invention;
FIG. 2 is an enlarged view of the area I of FIG. 1, as disclosed in the first embodiment of the present invention;
FIG. 3 is an enlarged view of the portion II of FIG. 1, as disclosed in the first embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 1 as disclosed in a first embodiment of the present invention;
FIG. 5 is a block diagram of a heat sink according to a first embodiment of the present invention;
Fig. 6 is an internal structural view of a light emitting module according to a second embodiment of the present invention;
Fig. 7 is a view from B of fig. 6 as disclosed in a second embodiment of the invention.
Reference numerals illustrate:
100-light homogenizing plate, 200-base part, 210-lap plate,
300-Heat dissipation plate, 310-cooling end, 320-heating end, 330-conductor portion,
400-Light source plate, 410-luminous hole area, 420-panel area,
500-Adhesive layer,
610-First electrode, 611-first lead, 620-second electrode,
710-Third electrode, 711-third lead, 720-fourth electrode, 721-fourth lead,
800-Heat dissipation layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
A first embodiment of the present application is shown in fig. 1-5. The application discloses a light emitting module which is mainly used for emitting light rays, such as the light emitting module applied to a flight ranging device in a 3D imaging technology.
The light emitting module may include a base 200, a heat dissipation plate 300, a light source plate 400, and a light equalizing plate 100. The base 200 is a mounting base of the device of the present application, and specifically, the base 200 may have an inner cavity, a first cavity port and a second cavity port, where the first cavity port and the second cavity port are respectively disposed at two opposite ends of the base 200, and the inner cavity is respectively connected to the first cavity port and the second cavity port.
The light equalizing plate 100 is plugged at the first cavity opening, for example, the first cavity opening is plugged by the light equalizing plate 100 through bonding, welding or other modes. The heat dissipation plate 300 is sealed and arranged at the second cavity opening, for example, the heat dissipation plate is embedded at the second cavity opening through interference fit, adhesion and the like. This arrangement allows the light-equalizing plate 100 to share the stacking height with the base 200 through the first cavity opening, and the heat dissipation plate 300 to share the stacking height with the base 200 through the second cavity opening, thereby reducing the overall thickness of the light-emitting module.
The light source plate 400 is disposed in the inner cavity, and the heat dissipation plate 300, the light source plate 400 and the light equalizing plate 100 are sequentially disposed. At least part of the light source plate 400 is overlapped with the heat dissipation plate 300 to achieve mutual adhesion of the light source plate 400 and the heat dissipation plate 300. The light source plate 400 and the light equalizing plate 100 may be disposed at intervals, and the light emitting side of the light source plate 400 faces the light equalizing plate 100.
The light source plate 400 can emit light through the light emitting side, and the light equalizing plate 100 is used for uniformly diffusing the light emitted by the light source plate 400. Taking the light emitting module in the flight ranging device as an example, the light source plate 400 may be Vcsel (vertical cavity surface laser), and the laser beam emitted by the vertical cavity surface laser towards the light-homogenizing plate 100 is uniformly diffused by the light-homogenizing plate 100 and then emitted, so that 3D scanning of the scanning object can be completed.
In the working process of the light emitting module, the heat emitted by the light source plate 400 can be emitted to the outside of the base 200 through the heat dissipation plate 300, so that the heat dissipation efficiency of the light source plate 400 is improved, the heat dissipation performance of the light emitting module is improved, and the working time and the service life of the light emitting module are further improved.
Alternatively, as shown in fig. 5, for the specific structure of the heat dissipation plate 300. The heat dissipation plate 300 may be a semiconductor refrigeration plate. The semiconductor refrigeration panel may include a refrigeration side 310, a semiconductor side 330, and a heating side 320 stacked in this order, the refrigeration side 310 being stacked on the light source board 400.
The semiconductor portion 330 is formed by connecting an N-type semiconductor material and a P-type semiconductor material, and the heat dissipation plate 300 may be provided with a plurality of semiconductor portions 330, and when the heat dissipation plate 300 is connected with a current, heat transfer occurs between two ends of the heat dissipation plate 300, namely, between the cooling end 310 and the heating end 320, specifically, the temperature of the cooling end 310 is reduced, and the temperature of the heating end 320 is increased. In this case, the heat dissipation plate 300 absorbs the heat generated by the light source plate 400 through the cooling end 310 and guides the heat out of the light emitting module through the heating end 320, so as to achieve the purpose of rapid cooling, thereby further improving the heat dissipation performance of the device of the present application.
Still further, the base 200, the cooling end 310, and the heating end 320 may all be provided as ceramic. The ceramic has good heat conduction performance, and the arrangement can ensure good appearance consistency of the device, and can enable the base 200 and the heat dissipation plate 300 to be matched with each other to dissipate heat, so that the heat dissipation performance of the device is further improved.
Alternatively, as shown in fig. 1 to 4, for a specific structure of the light source board 400, the light source board 400 may include a light emitting hole area 410 and a panel area 420 connected to each other. The light emitting hole region 410 may be provided with a plurality of light sources to achieve light emission, and the panel region 420 is used to achieve electric conduction.
The base 200 may have a bridge plate 210, with the second cavity opening provided in the bridge plate 210, and the bridge plate 210 disposed around the heat sink 300. The light emitting hole area 410 is overlapped with the heat radiating plate 300, and the panel area 420 is overlapped with the bonding plate 210. The light emitting hole area 410 is a main heat source of the light source board 400, and this arrangement is more beneficial to heat dissipation of the light source board 400.
Further, as shown in fig. 1 to 4, in order to facilitate the operation of the heat dissipation plate 300 and the light source plate 400. The light emitting module may further include a first electrode 610, a second electrode 620, a third electrode 710, and a fourth electrode 720.
The first electrode 610 and the second electrode 620 are respectively electrically connected to the light source plate 400, specifically, the positive electrode and the negative electrode of the light source plate 400 are respectively electrically connected to each other, the positive electrode and the negative electrode of the light source plate 400 can be both disposed on the panel area 420, for example, the positive electrode and the negative electrode of the light source plate 400 are both disposed on one side of the light source plate 400 away from the light-homogenizing plate 100, so that an external power source can be electrically conducted with the light source plate 400 through the first electrode 610 and the second electrode 620, and further, light emission of the light-emitting hole area 410 is realized.
For the heat dissipation plate 300 of the semiconductor refrigeration plate structure, the third electrode 710 and the fourth electrode 720 are respectively electrically connected to the heat dissipation plate 300, specifically, are respectively electrically connected to the positive electrode and the negative electrode of the heat dissipation plate 300, so that external electric energy is electrically connected to the heat dissipation plate 300 through the third electrode 710 and the fourth electrode 720, and heat conduction of the light source plate 400 through the heat dissipation plate 300 is further realized.
Furthermore, since the ceramic structure of the base 200 has insulating properties, to adapt to the structural characteristics of the light source board 400 and the base 200, the light emitting module may further include a first wire 611, and the second electrode 620 and the first electrode 610 may be disposed through the bonding board 210. The first wire 611 may be a gold wire, which has advantages of high conductivity, corrosion resistance, good toughness, etc., and is widely used in integrated circuits, and is suitable for the conductive requirements of the device of the present application. And the second electrode 620 and the first electrode 610 may be made of copper and welded in the bonding plate 210 to achieve better conductivity.
The positive and negative electrodes of the light source plate 400 may be located at the backlight side and the light emitting side thereof, respectively, such that the heat dissipation plate 300, the second electrode 620 and the first electrode 610 are sequentially disposed along the first direction, the second electrode 620 is electrically connected to a side (i.e., the backlight side) of the light source plate 400 facing the bonding plate 210, and the first electrode 610 is electrically connected to a side (i.e., the light emitting side) of the light source plate 400 facing away from the bonding plate 210 through the first conductive wire 611. Such an arrangement may isolate the second electrode 620 and the first electrode 610 from each other, thereby avoiding abnormalities such as short circuits.
At the same time, this arrangement also facilitates connection of the first electrode 610 and the second electrode 620 to an external power source. Specifically, one ends of the first electrode 610 and the second electrode 620 facing the cavity are respectively connected to the light source board 400, and one ends of the first electrode 610 and the second electrode 620 facing away from the cavity may extend out of the bridging board 210 for connecting to an external power source.
Similarly, the light emitting module may further include a third wire 711 and a fourth wire 721. The third electrode 710 and the fourth electrode 720 are both disposed through the bonding plate 210. For example, the third wire 711 and the fourth wire 721 may each be provided as a copper wire, which has good electrical conductivity and is inlaid in the side of the bonding plate 210 facing the inner cavity.
For the heat dissipation plate 300 of the semiconductor refrigeration plate structure, the positive electrode and the negative electrode may be disposed on the same side, so that the third electrode 710 and the fourth electrode 720 may be disposed sequentially along the second direction, and the first direction and the second direction are included angles, such as being perpendicular to each other.
The third electrode 710 and the fourth electrode 720 are disposed on the same side of the heat dissipation plate 300, the third electrode 710 is electrically connected to the heat dissipation plate 300 through a third wire 711, and the fourth electrode 720 is electrically connected to the heat dissipation plate 300 through a fourth wire 721. Such an arrangement can isolate the third electrode 710 and the fourth electrode 720 from each other to prevent an abnormality such as a short circuit.
Meanwhile, the third electrode 710 and the fourth electrode 720 are also convenient to connect with an external power supply, specifically, one ends of the third electrode 710 and the fourth electrode 720 facing the inner cavity are respectively connected with the heat dissipation plate 300, and one ends of the third electrode 710 and the fourth electrode 720 facing away from the inner cavity can extend out of the bridging plate 210 for connecting with the external power supply.
The first electrode 610 and the second electrode 620, the third electrode 710 and the fourth electrode 720 are all arranged in a penetrating manner on the bridging plate 210, so that the light emitting module is convenient to be connected with an external power supply of a circuit board structure, specifically, the light emitting module can be stacked on the circuit board through the bridging plate 210, electrode plates corresponding to the first electrode 610, the second electrode 620, the third electrode 710 and the fourth electrode 720 respectively can be arranged on the circuit board, and electric connection is realized in an SMT welding manner and the like, so that the light emitting module can be conveniently installed in electronic equipment such as a smart phone.
Optionally, the light emitting module may further include an adhesive layer 500. The adhesive layer 500 may include a first adhesive region and a second adhesive region, the light emitting hole region 410 is adhered to the heat dissipating plate 300 through the first adhesive region, and the panel region 420 is adhered to the bonding plate 210 through the second adhesive region, so that the light source plate 400 is more firmly disposed in the cavity.
More specifically, the adhesive layer 500 may be made of an electrically conductive silver paste having good electrical conductivity, thermal conductivity and adhesion properties, so that the panel region 420 may be electrically connected to the second electrode 620 through the second adhesive region. Such a structure can not only fix the light source plate 400, but also the light emitting hole region 410 can realize heat conduction with the heat dissipation plate 300 through the first bonding region of the bonding layer 500, and the panel region 420 can realize heat conduction with the bonding plate 210 and electric conduction with the second electrode 620 through the second bonding region of the bonding layer 500, thereby realizing functional multiplexing of the bonding layer 500.
In the second embodiment of the present application, as shown in fig. 6 to 7, the third electrode 710 and the fourth electrode 720 are both disposed on a side of the heat dissipation plate 300 away from the light source plate 400, for example, the third electrode 710 and the fourth electrode 720 are electrode plates disposed on the heat dissipation plate 300 in a paste manner, so as to be directly electrically connected with electrode plates of an external power source such as a circuit board, thereby realizing power supply to the heat dissipation plate 300, and the third electrode 710 and the fourth electrode 720 are disposed in a manner more convenient for power supply between the heat dissipation plate 300 and the external power source.
Further, the light emitting module may further include a heat dissipation layer 800. The heat dissipation layer 800 is disposed on a side of the heat dissipation plate 300 away from the light source plate 400, so as to improve heat dissipation performance of the heat dissipation plate 300. The heat dissipation layer 800 may be made of silica gel and disposed on the heat dissipation plate 300 in a coating manner, and positions of the third electrode 710 and the fourth electrode 720 are reserved to prevent interference to the conduction of the third electrode 710 and the fourth electrode 720.
The electronic device disclosed by the embodiment of the application can be a mobile phone, a tablet personal computer, an electronic book reader, a wearable device (such as a smart watch and smart glasses) and the like, and the embodiment of the application is not limited to the specific type of the electronic device.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (7)
1. A light emitting module, characterized in that: comprises a base (200), a heat dissipation plate (300), a light source plate (400) and a light equalizing plate (100);
The base (200) is provided with an inner cavity, a first cavity opening and a second cavity opening, the first cavity opening and the second cavity opening are respectively arranged at two opposite ends of the base (200), the inner cavity is respectively communicated with the first cavity opening and the second cavity opening, the light homogenizing plate (100) is blocked and arranged at the first cavity opening, the heat dissipating plate (300) is blocked and arranged at the second cavity opening, the light source plate (400) is arranged in the inner cavity,
The heat dissipation plate (300), the light source plate (400) and the light homogenizing plate (100) are sequentially arranged, at least part of the light source plate (400) is overlapped on the heat dissipation plate (300), and the light emitting side of the light source plate (400) faces the light homogenizing plate (100);
The light emitting module further comprises a first electrode (610), a second electrode (620), a third electrode (710) and a fourth electrode (720), wherein the first electrode (610) and the second electrode (620) are respectively and electrically connected with the light source plate (400), and the third electrode (710) and the fourth electrode (720) are respectively and electrically connected with the heat dissipation plate (300);
The light emitting module further comprises a first wire (611), the second electrode (620) and the first electrode (610) are all arranged on the lapping plate (210) of the base (200) in a penetrating mode, the heat dissipation plate (300), the second electrode (620) and the first electrode (610) are sequentially arranged along a first direction, the second electrode (620) is electrically connected with one side, facing the lapping plate (210), of the light source plate (400), and the first electrode (610) is electrically connected with one side, facing away from the lapping plate (210), of the light source plate (400) through the first wire (611);
One end of the first electrode (610) and one end of the second electrode (620) facing the inner cavity are respectively connected with the light source plate (400), and one end of the first electrode (610) and one end of the second electrode (620) facing away from the inner cavity are respectively extended out of the lapping plate (210) and are used for being connected with an external power supply;
the light emitting module further comprises a third wire (711) and a fourth wire (721), the third electrode (710) and the fourth electrode (720) are respectively arranged on the bridging plate (210) in a penetrating way,
The third electrode (710) and the fourth electrode (720) are sequentially arranged along the second direction, the third electrode (710) and the fourth electrode (720) are arranged on the same side of the heat dissipation plate (300), the third electrode (710) is electrically connected with the heat dissipation plate (300) through the third wire (711), and the fourth electrode (720) is electrically connected with the heat dissipation plate (300) through the fourth wire (721);
One ends of the third electrode (710) and the fourth electrode (720) which are away from the inner cavity extend out of the bonding plate (210) respectively and are used for connecting an external power supply.
2. The light emitting module of claim 1, wherein: the heat radiation plate (300) is a semiconductor refrigeration plate, the semiconductor refrigeration plate comprises a refrigeration end (310), a semiconductor part (330) and a heating end (320) which are sequentially overlapped,
The refrigerating end (310) is overlapped with the light source plate (400).
3. The light emitting module of claim 2, wherein: the light source panel (400) includes a light emitting hole region (410) and a panel region (420) connected to each other,
The bonding plate (210) surrounds the heat dissipation plate (300), the light-emitting hole area (410) is overlapped on the heat dissipation plate (300), and the panel area (420) is overlapped on the bonding plate (210).
4. A light emitting module as recited in claim 3, wherein: the light emitting module further comprises an adhesive layer (500),
The bonding layer (500) includes a first bonding region and a second bonding region, the light emitting hole region (410) bonds the heat dissipating plate (300) through the first bonding region, and the panel region (420) bonds the bonding plate (210) through the second bonding region.
5. The light emitting module of claim 4, wherein: the bonding layer (500) is conductive silver colloid.
6. The light emitting module of claim 1, wherein: the third electrode (710) and the fourth electrode (720) are both arranged on one side of the heat dissipation plate (300) away from the light source plate (400).
7. An electronic device, characterized in that: comprising a light emitting module according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110859938.9A CN113552555B (en) | 2021-07-28 | 2021-07-28 | Light emitting module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110859938.9A CN113552555B (en) | 2021-07-28 | 2021-07-28 | Light emitting module and electronic equipment |
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| Publication Number | Publication Date |
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| CN113552555A CN113552555A (en) | 2021-10-26 |
| CN113552555B true CN113552555B (en) | 2024-08-13 |
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| KR20110066801A (en) * | 2009-12-11 | 2011-06-17 | 엘지디스플레이 주식회사 | The light- |
| KR101055095B1 (en) * | 2010-03-09 | 2011-08-08 | 엘지이노텍 주식회사 | Light emitting device |
| CN102537781B (en) * | 2011-12-09 | 2013-07-31 | 东莞勤上光电股份有限公司 | Led lamp |
| KR101871374B1 (en) * | 2012-04-09 | 2018-06-27 | 엘지이노텍 주식회사 | A light emitting lamp |
| CN205909107U (en) * | 2016-08-25 | 2017-01-25 | 深圳市利思达光电科技有限公司 | Ultra -thin convection projecting lamp |
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| CN113552555A (en) | 2021-10-26 |
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