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CN113552219B - A method for ultrasonic self-focusing detection of hole defects in multilayer structures - Google Patents

A method for ultrasonic self-focusing detection of hole defects in multilayer structures Download PDF

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CN113552219B
CN113552219B CN202110858599.2A CN202110858599A CN113552219B CN 113552219 B CN113552219 B CN 113552219B CN 202110858599 A CN202110858599 A CN 202110858599A CN 113552219 B CN113552219 B CN 113552219B
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赵朋
纪凯鹏
颉俊
卓超杰
陈剑
叶盛
周宏伟
傅建中
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    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract

The invention provides an ultrasonic self-focusing detection method for a hole defect of a multilayer structure, which comprises the following steps: (1) determining an initial value of the sound velocity of any non-traversed layer in the multilayer structure, taking the initial value of the sound velocity as a current sound velocity value, and entering the next step; (2) taking the current sound velocity value and the full matrix data as input, adopting a phase shift method to carry out focusing imaging on the current layer, evaluating the current focusing imaging result, and outputting the current focusing imaging result and the current sound velocity value if the evaluation value meets the requirement; if the evaluation value does not meet the requirement, the next step is carried out; (3) optimizing the current sound velocity value by taking the obtained evaluation value as a reference, and returning to the step (2); (4) and (4) repeating the steps (2) to (3) until all layers are traversed, and obtaining the optimal sound velocity value and the optimal image of each layer. The method realizes the automatic focusing of hole defect imaging and improves the robustness of a phase shift method to the sound velocity.

Description

一种多层结构孔洞缺陷超声自聚焦检测方法A method for ultrasonic self-focusing detection of hole defects in multilayer structures

技术领域technical field

本发明属于检测方法技术领域,具体涉及一种多层结构孔洞缺陷超声自聚焦检测方法。The invention belongs to the technical field of detection methods, and in particular relates to an ultrasonic self-focusing detection method for hole defects in a multilayer structure.

背景技术Background technique

为了综合不同材料的高强度、轻质、耐腐蚀、耐久性和柔韧性等优点,多层结构(多层聚合物)复合结构被广泛应用于汽车、电子、能源和航空航天等领域。聚醚醚酮(PEEK)和聚苯硫醚(PPS)等高性能特种工程聚合物,具有高比强度和自润滑性能,越来越多地用于承重部件的多层复合结构中。但是,由于制造工艺复杂,这些产品的内部孔洞缺陷非常普遍,在很多情况下是不允许的。因此,高精度自动定位孔洞缺陷是一个热点问题。一般来说,聚合物复合产品内部孔洞的主要无损检测方法是红外(IR)热成像和X射线计算机断层扫描。红外热像利用红外热像仪捕捉孔洞缺陷处产生的局部高温,但不能确定孔洞的深度,分辨率有限。对于X射线断层扫描,收集各种设定角度的射线照片,用于高精度重建产品中的孔洞缺陷。然而,繁琐复杂的计算限制了其在工程实践中的应用。In order to integrate the advantages of high strength, light weight, corrosion resistance, durability and flexibility of different materials, multi-layer (multi-layer polymer) composite structures are widely used in the fields of automobile, electronics, energy, and aerospace. High-performance specialty engineering polymers such as polyetheretherketone (PEEK) and polyphenylene sulfide (PPS), with their high specific strength and self-lubricating properties, are increasingly used in multi-layer composite structures for load-bearing components. However, due to the complex manufacturing process, internal void defects in these products are very common and are not allowed in many cases. Therefore, high-precision automatic positioning of hole defects is a hot issue. In general, the main nondestructive testing methods for internal voids in polymer composite products are infrared (IR) thermal imaging and X-ray computed tomography. Infrared thermal imaging uses an infrared thermal imaging camera to capture the local high temperature generated at the hole defect, but the depth of the hole cannot be determined, and the resolution is limited. For X-ray tomography, radiographs at various set angles are collected for high-precision reconstruction of hole defects in products. However, the tedious and complex calculations limit its application in engineering practice.

超声扫描已被广泛用于检测复合薄板中的缺陷,其中缺陷区域是通过一段C扫描数据在时域上的叠加得到的。然而,扫描数据采集费时,缺陷成像精度有限,不适合检测多层结构中的孔洞缺陷。超声相控阵缺陷成像在无损检测领域具有很高的检测效率和精度,已被广泛用于混凝土或金属结构和产品的检测。迄今为止,针对聚合物复合材料产品的超声孔洞缺陷成像研究还很有限,主要采用全聚焦法(TFM)。多层结构复合结构的超声成像存在两个难点。一方面,涂层和层压结构导致超声传播变得非常复杂。另一方面,多层复合结构中每个聚合物层的声速通常是未知的,因为它与材料的形成过程和测量环境高度相关。换句话说,聚合物层由于不可避免的工艺差异而始终不具有相同的声速,其变化范围可以超过500m/s。Ultrasonic scanning has been widely used to detect defects in composite sheets, where the defect region is obtained by superimposing a piece of C-scan data in the time domain. However, the scanning data acquisition is time-consuming and the defect imaging accuracy is limited, which is not suitable for detecting hole defects in multilayer structures. Ultrasonic phased array defect imaging has high detection efficiency and precision in the field of non-destructive testing, and has been widely used in the detection of concrete or metal structures and products. So far, the research on ultrasonic hole defect imaging of polymer composite products is still limited, mainly using the total focusing method (TFM). There are two difficulties in the ultrasound imaging of multi-layered composite structures. On the one hand, coatings and laminate structures make the propagation of ultrasound very complicated. On the other hand, the sound velocity of each polymer layer in a multilayer composite structure is usually unknown because it is highly dependent on the material formation process and the measurement environment. In other words, the polymer layers do not always have the same speed of sound due to inevitable process differences, which can vary over 500 m/s.

全聚焦法是一种典型的时域成像方法,并逐渐成为无损检测的标准。然而,全聚焦法最初仅适用于在恒定声速假设下的单层结构。将射线追踪引入使全聚焦法可以使它适用于多层结构检测,但需要迭代计算射线追踪,降低了检测效率。相位偏移方法(PSM)是一种角谱方法,它描述了波在频率-波数域中的传播。它可将产品表面波场外推到任意深度然后构建聚焦图像,它适应于多层结构。Total focus method is a typical time domain imaging method, and gradually become the standard of non-destructive testing. However, the all-focal method was initially only applicable to single-layer structures under the assumption of constant sound velocity. The introduction of ray tracing makes the all-focusing method suitable for multi-layer structure inspection, but it requires iterative calculation of ray tracing, which reduces the inspection efficiency. The Phase Shift Method (PSM) is an angular spectral method that describes the propagation of waves in the frequency-wavenumber domain. It can extrapolate the product surface wavefield to any depth and then build a focused image, and it is suitable for multilayer structures.

然而,大多数超声成像重建需要以每一层的声速作为输入,输入声速与真实声速的偏差会导致重建图像的劣化。因此,声速的计算和估计是重建成功的关键因素。可以使用透传技术或射线理论的均质化方法来计算声速,但这些方法实施很困难,并且只适应于单层结构。此外,由于制造过程的波动,批次产品的声速变化是不可避免的。因此,具有预设固定声速的算法在多层结构产品的孔洞缺陷检测中不够稳健。多层复合材料结构中每层声速的变化阻碍了相位偏移在在线检测中的应用,因此,迫切需要能够自动确定声速参数的超声自动聚焦成像方法。However, most ultrasound imaging reconstructions require the sound velocity of each slice as an input, and the deviation of the input sound velocity from the true sound velocity will lead to the deterioration of the reconstructed image. Therefore, the calculation and estimation of the speed of sound is a key factor for the success of the reconstruction. The speed of sound can be calculated using transmission techniques or ray-theoretic homogenization methods, but these methods are difficult to implement and are only suitable for single-layer structures. In addition, due to fluctuations in the manufacturing process, variations in the speed of sound in batches are unavoidable. Therefore, the algorithm with preset fixed sound velocity is not robust enough in hole defect detection of multilayer structure products. The variation of the sound velocity of each layer in the multilayer composite structure hinders the application of phase shift in on-line detection. Therefore, an ultrasonic autofocus imaging method that can automatically determine the sound velocity parameters is urgently needed.

发明内容SUMMARY OF THE INVENTION

为解决上述现有技术中存在的问题,本发明提供一种利用超声相控阵对多层结构结构内部孔洞缺陷进行自聚焦成像的方法,该方法不需要预先设置各层声速值,可以自动处理超声数据并聚焦多层结构中的所有孔洞缺陷。In order to solve the above-mentioned problems in the prior art, the present invention provides a method for self-focusing imaging of internal hole defects in a multi-layer structure by using an ultrasonic phased array. Ultrasound data and focus all hole defects in the multilayer structure.

一种多层结构孔洞缺陷超声自聚焦检测方法,包括以下步骤:A method for ultrasonic self-focusing detection of hole defects in a multilayer structure, comprising the following steps:

(1)采集多层结构的全矩阵数据,确定每层声速范围;(1) Collect the full matrix data of the multi-layer structure, and determine the sound speed range of each layer;

(2)针对该多层结构中任一未遍历层,确定该层声速初始值,并以该声速初始值作为当前声速值,进入步骤(3);(2) for any untraversed layer in the multilayer structure, determine the initial value of the sound speed of this layer, and use the initial value of the sound speed as the current sound speed value, enter step (3);

(3)将当前声速值与全矩阵数据作为输入,采用相位偏移法,对当前层进行聚焦成像,得到当前孔洞缺陷图像;(3) Taking the current sound velocity value and the full matrix data as input, adopting the phase shift method to focus and image the current layer to obtain the current hole defect image;

(4)对当前孔洞缺陷图像进行评估,若评估值满足要求,将当前孔洞缺陷图像和当前声速值分别作为最优图像和最优声速值输出;若评估值不满足要求,则进入步骤(5);(4) Evaluate the current hole defect image, if the evaluation value meets the requirements, output the current hole defect image and the current sound speed value as the optimal image and the optimal sound speed value respectively; if the evaluation value does not meet the requirements, go to step (5) );

(5)将所得评估值作为参考,对当前声速进行优化,返回步骤(3);(5) take the obtained evaluation value as a reference, optimize the current speed of sound, and return to step (3);

(6)重复步骤(2)~(4),直至所有层遍历完毕,得到各层的最优声速值和最优图像。(6) Repeat steps (2) to (4) until all layers are traversed, and obtain the optimal sound velocity value and optimal image of each layer.

上述步骤(1)中,对每层声速范围进行确定时,可以根据材料的性能设置。如非金属材料可以设置为0~4000m/s,金属材料可以设置为0~8000m/s;当然也可以将所有层的声速范围确定为同一个较大的范围,如0~10000m/s。In the above step (1), when determining the sound velocity range of each layer, it can be set according to the performance of the material. For example, non-metallic materials can be set to 0 to 4000 m/s, and metal materials can be set to 0 to 8000 m/s; of course, the sound velocity range of all layers can also be determined to be the same larger range, such as 0 to 10000 m/s.

本发明提出的一种多层结构孔洞缺陷超声自聚焦检测方法,以提高相位偏移对声速的鲁棒性,并在孔洞缺陷成像时确定聚合物各层的声速值。总的来说,如果在成像算法(相位偏移法)中使用正确的声速值,其输出图像(孔洞缺陷图像)将聚焦在孔洞位置,相应的聚焦准则值(评估值)将达到最大。相反,错误的声速值导致的不良图像对应较低的聚焦准则值。因此,利用聚焦评估准则来评价孔洞缺陷成像结果和估计声速参数。The invention proposes an ultrasonic self-focusing detection method for hole defects in a multi-layer structure, so as to improve the robustness of the phase shift to the sound speed, and determine the sound speed value of each layer of the polymer when the hole defect is imaged. In general, if the correct sound velocity value is used in the imaging algorithm (phase shift method), its output image (hole defect image) will be focused on the hole position, and the corresponding focusing criterion value (evaluated value) will be maximized. Conversely, bad images resulting from wrong sound velocity values correspond to lower focus criterion values. Therefore, the focus evaluation criterion is used to evaluate the hole defect imaging results and estimate the sound velocity parameters.

作为优选,步骤(1)中,所述全矩阵数据由相控阵列传感器对多层结构测量得到。其中,相控阵列传感器的检测参数(如探头频率、振元数目、阵元间距、有效孔径及阵元长度)根据待检测多层结构的材料、几何尺寸和检测范围进行确定。测量时,直接将相控阵列传感器的探头放置在多层结构上即可。Preferably, in step (1), the full-matrix data is obtained by measuring the multilayer structure by a phased array sensor. Among them, the detection parameters of the phased array sensor (such as the frequency of the probe, the number of vibration elements, the spacing of the array elements, the effective aperture and the length of the array elements) are determined according to the material, geometric size and detection range of the multilayer structure to be detected. When measuring, the probe of the phased array sensor can be directly placed on the multi-layer structure.

步骤(2)中,根据确定的每层的声速范围采用随机采样的方式选择出该层声速的初始值。In step (2), the initial value of the sound speed of the layer is selected by random sampling according to the determined sound speed range of each layer.

作为优选,步骤(2)中,按照由上至下的顺序对多层结构进行遍历。Preferably, in step (2), the multi-layer structure is traversed in a top-to-bottom order.

作为优选,步骤(3)中,对当前层进行聚焦成像时,相位偏移量Φ(kx,z,ω)由下述公式得到:Preferably, in step (3), when focusing and imaging the current layer, the phase offset Φ(k x , z, ω) is obtained by the following formula:

Φ(kx,z,ω)=Φ1(kx,zm-1,ω)·Φ2(kx,z,ω)Φ(k x , z, ω)=Φ 1 (k x , z m-1 , ω)·Φ 2 (k x , z, ω)

Figure BDA0003185037590000031
Figure BDA0003185037590000031

Figure BDA0003185037590000032
Figure BDA0003185037590000032

其中,m表示当前层,m∈[1,M],M为多层结构的层数,i表示虚数单位,kz,j表示第j层在深度方向上的偏移波数,dj表示第j层的厚度,kz,m为第m层在深度方向上的偏移波数,z表示第m层中任一成像点的深度,zm-1表示第m-1层的界面深度;Among them, m represents the current layer, m∈[1, M], M is the number of layers of the multi-layer structure, i represents the imaginary unit, k z, j represents the offset wave number of the j-th layer in the depth direction, and d j represents the Thickness of layer j, k z, m is the offset wavenumber of layer m in the depth direction, z represents the depth of any imaging point in layer m, z m-1 represents the interface depth of layer m-1;

Φ1表示第1~m-1层的最优声速对应的相位偏移量的乘积,Φ2表示第m层的当前声速对应的相位偏移量。Φ 1 represents the product of the phase shift amounts corresponding to the optimal sound velocity of the 1st to m-1 layers, and Φ 2 represents the phase offset amount corresponding to the current sound velocity of the m th layer.

为了提高成像方法的稳定性,根据当前层的相位偏移量逐层估计声速。对于第m层,Φ1(kx,zm-1,ω)是固定的,Φ(kx,z,ω)由Φ2(kx,z,ω)调整(Φ(kx,z,ω)=Φ1(kx,zm-1,ω)·Φ2(kx,z,ω)),得到z在[zm-1,zm]范围内的孔洞缺陷图像Im(x,z),即第m层的聚焦成像结果。然后,用聚焦评估准则评价Im(x,z)的质量,并以该评估值作为参考,以优化参数cm。在得到第m层的最优声速后,Φ1(kx,zm-1,ω)被更新并且m被设置为(m+1)以准备下一层中的孔洞缺陷成像。当计算层数达到M+1时(m>M),输出每层的最优声速和孔洞缺陷的最优聚焦图像。In order to improve the stability of the imaging method, the sound velocity is estimated layer by layer according to the phase offset of the current layer. For the mth layer, Φ 1 (k x , z m-1 , ω) is fixed, Φ(k x , z, ω) is adjusted by Φ 2 (k x , z, ω) (Φ(k x , z , ω) , ω)=Φ 1 (k x , z m-1 , ω)·Φ 2 (k x , z, ω)), obtain the hole defect image I m with z in the range of [z m-1 , z m ] (x, z), namely the focused imaging result of the mth layer. Then, the quality of Im (x, z) is evaluated with the focus evaluation criterion, and this evaluation value is used as a reference to optimize the parameter cm . After obtaining the optimal sound velocity for the mth layer, Φ 1 (k x , z m-1 , ω) is updated and m is set to (m+1) in preparation for hole defect imaging in the next layer. When the number of calculated layers reaches M+1 (m>M), the optimal sound velocity of each layer and the optimal focus image of hole defects are output.

作为优选,步骤(3)中,全矩阵数据输入至相位偏移法前,对全矩阵数据进行二维傅里叶变换预处理。Preferably, in step (3), before the full matrix data is input to the phase shift method, two-dimensional Fourier transform preprocessing is performed on the full matrix data.

聚焦成像结果可以清晰地描述材料界面和构件的孔洞缺陷。孔洞附近图像的灰度值要求足够大,以使其与背景形成良好的对比,并具有清晰的边界,这意味着图像应该是锐利的。因此,可以通过图像清晰度来量化聚焦程度。The focused imaging results can clearly describe the void defects of material interfaces and components. The grayscale value of the image near the hole is required to be large enough for it to form a good contrast with the background and have clear boundaries, which means that the image should be sharp. Therefore, the degree of focus can be quantified by image sharpness.

作为优选,步骤(4)中,采用最大化聚焦评估准则对当前层的孔洞缺陷图像进行评估。Preferably, in step (4), the maximum focus evaluation criterion is used to evaluate the hole defect image of the current layer.

图像ROI中的聚焦效果越好,得到的当前孔洞缺陷图像越清晰,聚焦评估准则的输出值(评估值)越高。当评估值最大(满足要求)时,当前孔洞缺陷图像最为清晰,成像结果最准确,为最优图像,对应的当前声速为最优声速。The better the focusing effect in the image ROI, the clearer the current hole defect image obtained, and the higher the output value (evaluation value) of the focusing evaluation criterion. When the evaluation value is the largest (satisfying the requirements), the current hole defect image is the clearest and the imaging result is the most accurate, which is the optimal image, and the corresponding current sound speed is the optimal sound speed.

聚焦评估准则有很多,每个都有自己的特点,适用于不同的条件,作为进一步优选,所述聚焦评估准则为Brenner梯度准则、Tenenbaum梯度准则或归一化方差准则。There are many focusing evaluation criteria, each of which has its own characteristics and is suitable for different conditions. As a further preference, the focusing evaluation criteria is the Brenner gradient criterion, the Tenenbaum gradient criterion or the normalized variance criterion.

作为优选,步骤(2)中确定当前层声速初始值和步骤(5)中对当前声速值进行优化时,均采用不基于梯度的全局优化算法进行处理。Preferably, when the initial value of the sound velocity of the current layer is determined in step (2) and the current sound velocity value is optimized in step (5), a global optimization algorithm not based on gradient is used for processing.

将对当前孔洞缺陷图像的评估值反馈至全局优化算法中,全局优化算法以该评估值为参考,对当前声速值进行优化。The evaluation value of the current hole defect image is fed back to the global optimization algorithm, and the global optimization algorithm uses the evaluation value as a reference to optimize the current sound velocity value.

作为进一步优选,所述全局优化方法为粒子群算法、遗传算法或差分进化算法。As a further preference, the global optimization method is particle swarm optimization, genetic algorithm or differential evolution algorithm.

更进一步优选为差分进化算法对当前层声速初始值进行确定及对当前声速进行优化。通过本发明,可以采用相位偏移算法来对各层结构的缺陷进行成像,利用最大化聚焦评估准则对各层成像质量进行评估,采用全局优化算法以该评估值作为参考对成像声速值进行优化得到最佳的声速,声速值也是材料性能的关键参数,随后可实现对孔洞缺陷的聚焦成像,并得到多层结构中准确的缺陷位置。More preferably, the differential evolution algorithm is used to determine the initial value of the sound velocity of the current layer and to optimize the current sound velocity. Through the present invention, the phase shift algorithm can be used to image the defects of each layer structure, the imaging quality of each layer can be evaluated by the maximum focusing evaluation criterion, and the imaging sound velocity value can be optimized by using the evaluation value as a reference by the global optimization algorithm. The optimal sound speed is obtained, and the sound speed value is also a key parameter of material properties, and then focused imaging of hole defects can be achieved, and accurate defect locations in the multilayer structure can be obtained.

本发明的自动聚焦成像方法,采用从上到下的顺序对多层结构的孔洞缺陷和层间界面进行逐层的成像评估和声速优化的方式实现自动聚焦,并将上一层确定的最优声速应用到下一层相位偏移法成像中,提高了相位偏移法对声速的鲁棒性和孔洞缺陷位置测量的准确度。The automatic focusing imaging method of the present invention realizes automatic focusing by performing layer-by-layer imaging evaluation and sound speed optimization on the hole defects and interlayer interfaces of the multi-layer structure in the order from top to bottom, and optimizes the optimal value determined by the previous layer. The sound velocity is applied to the next-layer phase migration method imaging, which improves the robustness of the phase migration method to the sound speed and the accuracy of the hole defect position measurement.

与现有技术相比,本发明的有益效果为:Compared with the prior art, the beneficial effects of the present invention are:

本发明采用相位偏移法来对多层结构的各层结构的缺陷进行成像,并对成像结果进行评估,以评估值作为参考对声速值不优化,以获得每层的最优声速和最优图像,实现了孔洞缺陷成像的自动聚焦,提高了相位偏移法对声速的鲁棒性。最后对最优图像进行缺点识别和定位,即可确定多层结构结构中各缺陷的位置,准确度高。The invention adopts the phase shift method to image the defects of each layer structure of the multi-layer structure, and evaluates the imaging results, and uses the evaluation value as a reference to not optimize the sound speed value, so as to obtain the optimal sound speed and optimal sound speed of each layer. image, realizes the automatic focusing of hole defect imaging, and improves the robustness of the phase shift method to the speed of sound. Finally, by identifying and locating the defects in the optimal image, the position of each defect in the multi-layer structure can be determined with high accuracy.

附图说明Description of drawings

图1为相控阵列传感器对多层结构的测量过程示意图;Fig. 1 is a schematic diagram of the measurement process of a multi-layer structure by a phased array sensor;

图2为本发明实施例的流程图;2 is a flowchart of an embodiment of the present invention;

图3中:(a)为相控阵列传感器对单层聚合物的测量示意图及单层聚合物的真实结构示意图;(b)为相控阵列传感器对双层聚合物的测量示意图及双层聚合物的真实结构示意图;(c)为相控阵列传感器对三层聚合物的测量示意图及三层聚合物的真实结构示意图;In Figure 3: (a) is a schematic diagram of the measurement of a single-layer polymer by a phased array sensor and a schematic diagram of the real structure of the single-layer polymer; (b) is a schematic diagram of the measurement of a double-layer polymer by a phased array sensor and the double-layer polymerization. The schematic diagram of the real structure of the polymer; (c) is the schematic diagram of the measurement of the three-layer polymer by the phased array sensor and the real structure of the three-layer polymer;

图4中:(a)为采用Brenner梯度准则得到的单层聚合物的最优孔洞缺陷图像;(b)为采用Tenenbaum梯度准则得到的单层聚合物的最优孔洞缺陷图像;(c)为采用归一化方程准则得到的单层聚合物的最优孔洞缺陷图像;In Fig. 4: (a) is the optimal hole defect image of the monolayer polymer obtained by the Brenner gradient criterion; (b) is the optimal hole defect image of the monolayer polymer obtained by the Tenenbaum gradient criterion; (c) is The optimal hole defect image of the monolayer polymer obtained using the normalized equation criterion;

图5中,(a)为采用Brenner梯度准则得到的双层聚合物的最优孔洞缺陷图像;(b)为采用Tenenbaum梯度准则得到的双层聚合物的最优孔洞缺陷图像;(c)为采用归一化方程准则得到的双层聚合物的最优孔洞缺陷图像;In Fig. 5, (a) is the optimal hole defect image of the bilayer polymer obtained by the Brenner gradient criterion; (b) is the optimal hole defect image of the bilayer polymer obtained by the Tenenbaum gradient criterion; (c) is The optimal hole defect image of the bilayer polymer obtained using the normalized equation criterion;

图6中,(a)为采用Brenner梯度准则得到的三层聚合物的最优孔洞缺陷图像;(b)为采用Tenenbaum梯度准则得到的三层聚合物的最优孔洞缺陷图像;(c)为采用归一化方程准则得到的三层聚合物的最优孔洞缺陷图像。In Fig. 6, (a) is the optimal hole defect image of the three-layer polymer obtained by using the Brenner gradient criterion; (b) is the optimal hole defect image of the three-layer polymer obtained by using the Tenenbaum gradient criterion; (c) is Optimal void defect image of the three-layer polymer obtained using the normalized equation criterion.

具体实施方式Detailed ways

下面将结合说明书附图对本发明的技术方案作进一步说明。The technical solutions of the present invention will be further described below with reference to the accompanying drawings.

如图2所示,一种多层结构孔洞缺陷超声自聚焦检测方法,包括以下步骤:As shown in Figure 2, a method for ultrasonic self-focusing detection of hole defects in a multilayer structure includes the following steps:

(1)利用相控阵列传感器采集多层结构的全矩阵数据,并根据各层材料确定每层的声速值范围为0~10000m/s;(1) Use the phased array sensor to collect the full matrix data of the multi-layer structure, and determine the sound velocity value of each layer in the range of 0-10000m/s according to the material of each layer;

(2)针对该多层结构中任一未遍历层,利用差分进化算法确定该层声速初始值,并以该声速初始值作为当前声速值,进入步骤(3);(2) for any untraversed layer in this multilayer structure, utilize differential evolution algorithm to determine the initial value of sound speed of this layer, and take this initial value of sound speed as current sound speed value, enter step (3);

(3)对全矩阵数据进行二维傅里叶变换预处理,并将当前声速值与预处理后的全矩阵数据作为输入,采用相位偏移法,对当前层进行聚焦成像,得到当前孔洞缺陷图像;(3) Perform two-dimensional Fourier transform preprocessing on the full matrix data, take the current sound velocity value and the preprocessed full matrix data as input, and use the phase shift method to focus and image the current layer to obtain the current hole defect image;

(4)采用最大化聚焦评估准则对当前孔洞缺陷图像进行评估,若评估值满足要求(为最大值时),将当前孔洞缺陷图像和当前声速值分别作为最优图像和最优声速值输出;若评估值不满足要求,则进入步骤(5);(4) The current hole defect image is evaluated using the maximum focus evaluation criterion. If the evaluation value meets the requirements (when it is the maximum value), the current hole defect image and the current sound speed value are output as the optimal image and the optimal sound speed value respectively; If the evaluation value does not meet the requirements, then enter step (5);

(5)将所得评估值反馈至差分进化算法中作为参考,对当前声速进行优化,返回步骤(3);(5) feedback the obtained evaluation value to the differential evolution algorithm as a reference, optimize the current speed of sound, and return to step (3);

(6)重复步骤(2)~(4),直至所有层遍历完毕,得到各层的最优声速值和最优图像。(6) Repeat steps (2) to (4) until all layers are traversed, and obtain the optimal sound velocity value and optimal image of each layer.

相位偏移法:Phase shift method:

相位偏移法一开始是针对一致介质中孔洞缺陷的成像。基本原理是从表面波场向下外推得到整个测量区域的波场以实现孔洞缺陷的聚焦。二维各向同性介质中的声场传播模型如式(1):The phase-shift method started out for the imaging of hole defects in uniform media. The basic principle is to extrapolate downward from the surface wave field to obtain the wave field of the entire measurement area to achieve the focusing of hole defects. The sound field propagation model in a two-dimensional isotropic medium is shown in formula (1):

Figure BDA0003185037590000071
Figure BDA0003185037590000071

设定相控阵列传感器的阵列排布方向为x轴正向,多层结构的深度方向为z轴正向;其中,c为声速,p为声压,它是空间(x,z)和时间(t)的函数。Set the array arrangement direction of the phased array sensor as the positive x-axis, and the depth direction of the multilayer structure as the positive z-axis; where c is the speed of sound, p is the sound pressure, which is the space (x, z) and time (t) function.

超声相控阵对于多层结构的测量如图1所示,图中,M表示多层结构的层数,dm表示第m层的厚度,cm表示第m层的当前声速值,其中m∈[1,M]。The measurement of the multi-layer structure by the ultrasonic phased array is shown in Figure 1. In the figure, M represents the number of layers of the multi-layer structure, d m represents the thickness of the m-th layer, and cm represents the current sound velocity value of the m-th layer, where m ∈ [1, M].

相控阵列传感器的探头放在z=0位置处(多层结构上表面),孔洞缺陷位于多层结构内部z>0。The probe of the phased array sensor is placed at the position of z=0 (the upper surface of the multilayer structure), and the hole defect is located in the interior of the multilayer structure with z>0.

如果材料是各向同性的,通过对x和t方向进行傅里叶变换得到Helmholtz方程:If the material is isotropic, the Helmholtz equation is obtained by Fourier transforming the x and t directions:

Figure BDA0003185037590000072
Figure BDA0003185037590000072

其中,ω和kx分别为频率和x方向的波数。where ω and k x are the frequency and the wavenumber in the x-direction, respectively.

方程(2)可以得到如式(3)所示的解析解:Equation (2) can be obtained analytically as shown in equation (3):

Figure BDA0003185037590000073
Figure BDA0003185037590000073

其中,U(kx,ω)和D(kx,ω)分别为上行波和下行波,二者可以通过边界约束条件得到。Among them, U(k x , ω) and D(k x , ω) are up-going waves and down-going waves, respectively, which can be obtained through boundary constraints.

kz为z方向的波数,它由式(4)定义:k z is the wave number in the z direction, which is defined by equation (4):

Figure BDA0003185037590000074
Figure BDA0003185037590000074

sgn为符号函数,它保证kz与ω的方向相同;kx为x方向的波数。sgn is a sign function, which ensures that k z and ω are in the same direction; k x is the wave number in the x direction.

上行波由孔洞缺陷反射产生,所以缺陷可以看作是上行波的声源。检测表面的波场为pU(x,0,t),它可以由相控阵列传感器的探头采集到,并当作上行波的约束条件。因此,用公式(5)将pU(x,0,t)变换到ω-kx空间后可以得到U(kx,ω):Upgoing waves are generated by reflections from hole defects, so defects can be regarded as sound sources of upgoing waves. The wave field of the detection surface is p U (x, 0, t), which can be collected by the probe of the phased array sensor and used as the constraint condition of the upgoing wave. Therefore, U(k x , ω) can be obtained by transforming p U (x, 0, t) into the ω-k x space using formula (5):

Figure BDA0003185037590000081
Figure BDA0003185037590000081

i为虚数单位,测量区域的波场可以通过相位偏移因子

Figure BDA0003185037590000087
得到,如式(6):i is an imaginary unit, the wave field in the measurement area can be determined by the phase shift factor
Figure BDA0003185037590000087
get, as formula (6):

Figure BDA0003185037590000082
Figure BDA0003185037590000082

同时,声源信号s(x,0,t)也是由相控阵传感器在表面激发的,它可以作为下行波的边界条件,所以下行波场可以通过相位偏移因子

Figure BDA0003185037590000088
外推得到,如式(7):At the same time, the sound source signal s(x, 0, t) is also excited on the surface by the phased array sensor, which can be used as the boundary condition of the downgoing wave, so the downgoing wave field can pass the phase shift factor
Figure BDA0003185037590000088
It can be extrapolated, such as formula (7):

Figure BDA0003185037590000083
Figure BDA0003185037590000083

PU(x,z,ω)和PD(x,z,ω)由PU(kx,z,ω)和PD(kx,z,ω)在kx方向上的傅里叶变换得到。也就是说在特定频率和位置上的下行(入射)波和上行(反射)波同时得到。Fourier transform of P U (x, z, ω) and P D (x, z, ω) by P U (k x , z, ω) and P D (k x , z, ω) in the k x direction converted. That is, down-going (incident) waves and up-going (reflected) waves at a specific frequency and location are obtained simultaneously.

因此,在测量区域的反射率可以通过式(8)得到:Therefore, the reflectivity in the measurement area can be obtained by formula (8):

Figure BDA0003185037590000084
Figure BDA0003185037590000084

由于上行波会在孔洞缺陷处聚焦,孔洞缺陷处的反射率远远大于其他位置,所以它可以反映缺陷的位置。Since the upward wave will focus at the hole defect, the reflectivity at the hole defect is much larger than other positions, so it can reflect the position of the defect.

为了加强成像的稳定性,采用式(9)的成像条件:In order to enhance the stability of imaging, the imaging conditions of formula (9) are used:

Figure BDA0003185037590000085
Figure BDA0003185037590000085

其中,

Figure BDA0003185037590000086
是PD(x,z,ωj)的共轭,它使得分母为实数,N是采用的离散的频率数目,ε是一个较小的常数,它避免分母过小,随着下行波外推深度的增加而增加,如式(10)所示in,
Figure BDA0003185037590000086
is the conjugate of P D (x, z, ω j ), which makes the denominator a real number, N is the number of discrete frequencies used, and ε is a small constant that prevents the denominator from being too small and extrapolated with the downgoing wave increases as the depth increases, as shown in Eq. (10)

ε=ε(ω,z)=λ[max(|PD(x,z,ω)|2)] (10)ε=ε(ω, z)=λ[max(|P D (x, z, ω)| 2 )] (10)

其中,λ是一个0到1之间的系数。where λ is a coefficient between 0 and 1.

在实际应用中,多层的检测情况比较常见,它可以简化为图1所示的模型。在此,超声波穿过M层材料到达孔洞缺陷,然后由相控阵列传感器反射和接收。In practical applications, multi-layer detection is common, and it can be simplified to the model shown in Figure 1. Here, ultrasonic waves pass through the M-layer material to the hole defect, and are then reflected and received by the phased array sensor.

通过界面的波的振幅变化可以用透射系数来模拟,透射系数是材料阻抗和波入射角的函数。在窄波束假设下,透射系数随入射角的变化可以忽略。The change in amplitude of the wave passing through the interface can be modeled by the transmission coefficient, which is a function of the impedance of the material and the angle of incidence of the wave. Under the narrow beam assumption, the variation of the transmission coefficient with the angle of incidence is negligible.

因此,如式(11)所示,界面上方和下方的波场振幅之间存在比例关系。Therefore, as shown in equation (11), there is a proportional relationship between the wavefield amplitudes above and below the interface.

Figure BDA0003185037590000091
Figure BDA0003185037590000091

其中,

Figure BDA0003185037590000092
Figure BDA0003185037590000093
分别表示第n层界面的上侧和下侧。因此在z处的相位偏移;量修正为式(12):in,
Figure BDA0003185037590000092
and
Figure BDA0003185037590000093
represent the upper and lower sides of the n-th layer interface, respectively. Hence the phase shift at z; the amount is corrected to equation (12):

Figure BDA0003185037590000094
Figure BDA0003185037590000094

其中,Φ(kx,z,ω)是修正的相位偏移量,第m层在z方向上的当前波数kz,m通过式(13)给出:where Φ(k x , z, ω) is the corrected phase offset, and the current wavenumber k z, m of the mth layer in the z direction is given by equation (13):

Figure BDA0003185037590000095
Figure BDA0003185037590000095

其中,cm为第m层的当前声速值。Among them, cm is the current sound velocity value of the mth layer.

同理,多层情况下PD的波场外推可以直接由对式(12)中的Φ(kx,z,ω)取共轭得到。Similarly, the wave field extrapolation of PD in the case of multiple layers can be directly obtained by taking the conjugate of Φ(k x , z, ω) in Eq. (12).

在实际应用中,由于界面引入的振幅缩放效应对图像结构的影响很小,可以忽略,因此反映孔洞缺陷的是各层内的相对振幅。因此,多层结构的相位偏移量符合式(12)。In practical applications, since the amplitude scaling effect introduced by the interface has little influence on the image structure and can be ignored, it is the relative amplitudes in each layer that reflect the hole defects. Therefore, the phase shift amount of the multilayer structure conforms to equation (12).

聚焦准则有很多,每个都有自己的特点,适用于不同的条件,上述技术方案中对当前孔洞缺陷图像进行评估的聚焦评估准则可以采用Brenner梯度准则、Tenenbaum梯度准则或归一化方差准则。There are many focusing criteria, each of which has its own characteristics and is suitable for different conditions. The focusing evaluation criteria for evaluating the current hole defect image in the above technical solution can use the Brenner gradient criterion, the Tenenbaum gradient criterion or the normalized variance criterion.

Brenner梯度准则计算每个像素和它周围两个像素间隔的有限差分,写为式(14):The Brenner gradient criterion computes the finite difference between each pixel and its surrounding two-pixel interval, written as (14):

Figure BDA0003185037590000096
Figure BDA0003185037590000096

其中,Ix,z=I(x,z)是图像在(x,z)处的像素强度;where I x, z =I(x, z) is the pixel intensity of the image at (x, z);

Tenenbaum梯度用Sobel算子与图像I(x,z)卷积来提取边界信息,并将梯度成分的平方和相加得到,如式(15):The Tenenbaum gradient is convolved with the image I(x, z) by the Sobel operator to extract boundary information, and the sum of the squares of the gradient components is added to obtain, as shown in formula (15):

Figure BDA0003185037590000097
Figure BDA0003185037590000097

其中Sobel算子定义为式(16):The Sobel operator is defined as formula (16):

Figure BDA0003185037590000101
Figure BDA0003185037590000101

归一化方差计算图像像素间的方差并采用平均强度进行归一化,写为(17):Normalized variance computes the variance between image pixels and normalizes with the mean intensity, written as (17):

Figure BDA0003185037590000102
Figure BDA0003185037590000102

其中,μ表示I(x,z)的期望值。where μ represents the expected value of I(x, z).

本实施例采用64振元相控阵列传感器(Olympus.Ltd,USA),中心频率为5MHz,阵元间距为0.6mm,用作超声波收发器。全矩阵数据由采集由64/64OEM-PA(AOS.Ltd,America)实现。In this embodiment, a 64-element phased array sensor (Olympus. Ltd, USA), with a center frequency of 5 MHz and an array element spacing of 0.6 mm, is used as an ultrasonic transceiver. The full matrix data was acquired by 64/64 OEM-PA (AOS. Ltd, America).

利用上述自动聚焦成像方法对单层、双层、三层聚合物分别进行测量,测量时,将相控阵列传感器的探头直接放在三种不同结构的聚合物上,测量每种结构的聚合物的全矩阵数据,如图3所示。The single-layer, double-layer, and three-layer polymers were measured by the above autofocus imaging method. During the measurement, the probe of the phased array sensor was directly placed on the polymers of three different structures, and the polymers of each structure were measured. The full matrix data of , as shown in Figure 3.

检测例1.单层聚合物的测量Test Example 1. Measurement of Monolayer Polymer

单层聚合物为含有三个孔洞缺陷的丙烯腈-丁二烯-苯乙烯(ABS)层(层厚为40mm),其中三个孔洞缺陷由人工制作完成,其真实结构如图3(a)。The single-layer polymer is an acrylonitrile-butadiene-styrene (ABS) layer with three hole defects (layer thickness is 40mm), and the three hole defects are artificially fabricated, and its real structure is shown in Figure 3(a) .

采用Brenner梯度准则、Tenenbaum准则和归一化方差准则分别进行自动对焦,得到的ABS层的聚焦声速(最优声速值)分别为2194m/s、2194m/s和2219m/s,输出的孔洞缺陷图像(最优图像)如图4所示。The Brenner gradient criterion, the Tenenbaum criterion and the normalized variance criterion were used for auto-focusing, respectively, and the focused sound velocities (optimal sound velocity values) of the ABS layer were 2194m/s, 2194m/s and 2219m/s, respectively. The output hole defect image (Optimal image) is shown in Figure 4.

由图4可知,三种准则的自聚焦方法输出的最优图像中孔洞缺陷的深度及孔洞缺陷之间的相对位置比较接近,并与图3(a)中ABS层的真实结构一致。因为在实验过程中,测试组件和传感器之间没有特定的安装位置,所以孔洞缺陷的实际横向位置未知,但孔洞缺陷的深度和孔洞缺陷之间的相对位置可以反映该方法的定位精度。It can be seen from Figure 4 that the depth of hole defects and the relative positions of the hole defects in the optimal images output by the three-criteria self-focusing methods are relatively close, and are consistent with the real structure of the ABS layer in Figure 3(a). Because there is no specific installation position between the test component and the sensor during the experiment, the actual lateral position of the hole defect is unknown, but the depth of the hole defect and the relative position between the hole defects can reflect the localization accuracy of the method.

检测例2.双层聚合物Test example 2. Double layer polymer

双层聚合物为由楔块(SB26-N0L,Doppler.Ltd,China)(层厚为20mm)连接到反转过的上述ABS层上形成,其真实结构如图3(b)所示。The double-layer polymer was formed by connecting a wedge (SB26-N0L, Doppler. Ltd, China) (layer thickness 20mm) to the above-mentioned inverted ABS layer, and its actual structure is shown in Fig. 3(b).

自动对焦方法分别采用Brenner梯度准则、Tenenbaum梯度准则和归一化方差准则,得到的每一层的最优声速值如表1所示,每一层的孔洞缺陷成像结果如图5所示。The autofocus method adopts Brenner gradient criterion, Tenenbaum gradient criterion and normalized variance criterion respectively.

表1采用三种聚焦评估准则分别得到的每一层的最优声速值Table 1 The optimal sound velocity values of each layer obtained by three focusing evaluation criteria

Figure BDA0003185037590000111
Figure BDA0003185037590000111

图5中三张最优图像中ABS层的孔洞缺陷深度和孔洞缺陷之间的相对位置相近,且与图3(b)中双层聚合物的真实结构一致。另外,本实验计算的ABS层的最优声速值与实验1中得到的最优声速值基本一致。说明本发明实施例的自动聚焦成像方法鲁棒性高。The depths of hole defects in the ABS layer and the relative positions between the hole defects in the three optimal images in Fig. 5 are similar, and are consistent with the real structure of the bilayer polymer in Fig. 3(b). In addition, the optimal sound velocity value of the ABS layer calculated in this experiment is basically consistent with the optimal sound velocity value obtained in Experiment 1. It shows that the autofocus imaging method of the embodiment of the present invention has high robustness.

检测例3.三层聚合物Test Example 3. Three-layer polymer

在上述ABS层上覆盖一层薄薄(层厚为5.7mm)的聚醚醚酮(PEEK)层,上述楔块覆盖在聚醚醚酮层上得到,其真实结构如图3(c)所示。A thin (layer thickness of 5.7mm) polyetheretherketone (PEEK) layer is covered on the ABS layer, and the wedge is covered on the polyetheretherketone layer. The real structure is shown in Figure 3(c). Show.

自动对焦方法分别采用Brenner梯度准则、Tenenbaum梯度准则和归一化方差准则,得到的每一层的最优声速值如表2所示,每一层的孔洞缺陷成像结果如图6所示。The autofocus method adopts the Brenner gradient criterion, the Tenenbaum gradient criterion and the normalized variance criterion, respectively. The optimal sound velocity values of each layer are shown in Table 2, and the imaging results of hole defects in each layer are shown in Figure 6.

表2采用三种聚焦评估准则分别得到的每一层的最优声速值Table 2 The optimal sound velocity values of each layer obtained by three focusing evaluation criteria

Figure BDA0003185037590000112
Figure BDA0003185037590000112

由表2可知,Brenner梯度准则和归一化方差准则估计的声速参数非常接近,输出图像更好地聚焦于孔洞缺陷处。对于Tenenbaum梯度准则,在第三层中间的空隙处的聚焦效果不如其它层的聚焦效果。估算的楔块和ABS层的最优声速值分别与实验1和2的结果接近。至于定位精度,图6中的孔洞缺陷深度和孔洞缺陷之间的相对位置与图3(c)中的真实结构一致。随着孔洞深度的增加,成像振幅明显减小,第三界面完全消失。这是因为聚合物的声衰减系数较大,不同层间的界面对声波也有明显的衰减作用。为了进一步提高成像质量,可以引入衰减补偿方法。It can be seen from Table 2 that the sound velocity parameters estimated by the Brenner gradient criterion and the normalized variance criterion are very close, and the output image is better focused on the hole defect. For the Tenenbaum gradient criterion, the focusing effect at the gap in the middle of the third layer is not as good as that of the other layers. The estimated optimal sound velocity values for the wedge and ABS layer are close to the results of experiments 1 and 2, respectively. As for the localization accuracy, the hole defect depths and the relative positions between the hole defects in Fig. 6 agree with the real structure in Fig. 3(c). As the depth of the hole increases, the imaging amplitude decreases significantly, and the third interface completely disappears. This is because the sound attenuation coefficient of the polymer is large, and the interface between the different layers also has a significant attenuation effect on the sound wave. In order to further improve the imaging quality, an attenuation compensation method can be introduced.

Claims (2)

1.一种多层结构孔洞缺陷超声自聚焦检测方法,其特征在于,包括以下步骤:1. a multi-layer structure hole defect ultrasonic self-focusing detection method, is characterized in that, comprises the following steps: (1)采集多层结构的全矩阵数据,确定每层声速范围;(1) Collect the full matrix data of the multi-layer structure, and determine the sound speed range of each layer; (2)针对该多层结构中任一未遍历层,确定该层声速初始值,并以该声速初始值作为当前声速值,进入步骤(3);(2) for any untraversed layer in this multi-layer structure, determine the initial value of sound speed of this layer, and take this initial value of sound speed as the current speed of sound value, enter step (3); (3)将当前声速值与全矩阵数据作为输入,采用相位偏移法,对当前层进行聚焦成像,得到当前孔洞缺陷图像;(3) The current sound velocity value and the full matrix data are used as input, and the phase shift method is used to focus and image the current layer to obtain the current hole defect image; (4)对当前孔洞缺陷图像进行评估,若评估值满足要求,将当前孔洞缺陷图像和当前声速分别作为最优图像和最优声速值输出;若评估值不满足要求,则进入步骤(5);(4) Evaluate the current hole defect image. If the evaluation value meets the requirements, output the current hole defect image and the current sound speed as the optimal image and the optimal sound speed value respectively; if the evaluation value does not meet the requirements, go to step (5) ; (5)将所得评估值作为参考,对当前声速值进行优化,返回步骤(3);(5) take the gained evaluation value as a reference, optimize the current speed of sound value, and return to step (3); (6)重复步骤(2)~(5),直至所有层遍历完毕,得到各层的最优声速值和最优图像;(6) Repeat steps (2) to (5) until all layers are traversed, and obtain the optimal sound velocity value and optimal image of each layer; 步骤(2)中,按照由上至下的顺序对多层结构进行遍历;In step (2), the multi-layer structure is traversed according to the order from top to bottom; 步骤(3)中,全矩阵数据输入至相位偏移法前,对全矩阵数据进行二维傅里叶变换预处理;In step (3), before the full matrix data is input to the phase shift method, the full matrix data is subjected to two-dimensional Fourier transform preprocessing; 对当前层进行聚焦成像时,相位偏移量Φ(kx,z,ω)由下述公式得到:When focusing and imaging the current layer, the phase offset Φ(k x , z, ω) is obtained by the following formula: Φ(kx,z,ω)=Φ1(kx,zm-1,ω)·Φ2(kx,z,ω)Φ(k x , z, ω)=Φ 1 (k x , z m-1 , ω)·Φ 2 (k x , z, ω)
Figure FDA0003584093160000011
Figure FDA0003584093160000011
Figure FDA0003584093160000012
Figure FDA0003584093160000012
其中,m表示当前层,m∈[1,M],M为多层结构的层数,i表示虚数单位,kz,j表示第j层在深度方向上的偏移波数,dj表示第j层的厚度,kz,m为第m层在深度方向上的偏移波数,z表示第m层中任一成像点的深度,zm-1表示第m-1层的界面深度;Among them, m represents the current layer, m∈[1, M], M is the number of layers of the multi-layer structure, i represents the imaginary unit, k z, j represents the offset wave number of the j-th layer in the depth direction, and d j represents the Thickness of layer j, k z, m is the offset wavenumber of layer m in the depth direction, z represents the depth of any imaging point in layer m, z m-1 represents the interface depth of layer m-1; Φ1表示第1~m-1层的最优声速对应的相位偏移量的乘积,Φ2表示第m层的当前声速对应的相位偏移量;Φ 1 represents the product of the phase offsets corresponding to the optimal sound speed of the 1st to m-1 layers, and Φ 2 represents the phase offset corresponding to the current sound speed of the mth layer; 步骤(4)中,采用最大化聚焦评估准则对当前孔洞缺陷图像进行评估;当评估值最大时认为评估值满足要求;所述聚焦评估准则为Brenner梯度准则、Tenenbaum梯度准则或归一化方差准则;In step (4), the current hole defect image is evaluated using the maximum focus evaluation criterion; when the evaluation value is the largest, it is considered that the evaluation value meets the requirements; the focus evaluation criterion is the Brenner gradient criterion, the Tenenbaum gradient criterion or the normalized variance criterion. ; 步骤(2)中确定当前层声速初始值和步骤(5)中对当前声速值进行优化时,均采用全局优化算法进行处理;When determining the initial value of the sound velocity of the current layer in the step (2) and optimizing the current sound velocity value in the step (5), the global optimization algorithm is used for processing; 将对当前孔洞缺陷图像的评估值反馈至全局优化算法中,全局优化算法以该评估值为参考,对当前声速值进行优化;The evaluation value of the current hole defect image is fed back to the global optimization algorithm, and the global optimization algorithm uses the evaluation value as a reference to optimize the current sound velocity value; 所述全局优化方法为粒子群算法、遗传算法或差分进化算法。The global optimization method is particle swarm algorithm, genetic algorithm or differential evolution algorithm.
2.根据权利要求1所述的多层结构孔洞缺陷超声自聚焦检测方法,其特征在于,步骤(1)中,所述全矩阵数据由相控阵列传感器对多层结构测量得到。2 . The ultrasonic self-focusing detection method for hole defects in a multilayer structure according to claim 1 , wherein in step (1), the full-matrix data is obtained by measuring the multilayer structure by a phased array sensor. 3 .
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