CN113539685A - Capacitor component packaging structure and manufacturing method thereof - Google Patents
Capacitor component packaging structure and manufacturing method thereof Download PDFInfo
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- CN113539685A CN113539685A CN202010294619.3A CN202010294619A CN113539685A CN 113539685 A CN113539685 A CN 113539685A CN 202010294619 A CN202010294619 A CN 202010294619A CN 113539685 A CN113539685 A CN 113539685A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 151
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 320
- 239000002131 composite material Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 36
- 229920001940 conductive polymer Polymers 0.000 claims description 24
- 239000002861 polymer material Substances 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 229910052804 chromium Inorganic materials 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims 2
- 239000011888 foil Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000008901 benefit Effects 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910034327 TiC Inorganic materials 0.000 description 2
- 229910008599 TiW Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/153—Skin fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
本发明公开一种电容器组件封装结构及其制作方法。电容器组件封装结构包括电容单元、绝缘封装体、导电连接层以及电极单元。电容单元包括多个电容器。每一电容器包括一正极部以及一负极部。绝缘封装体部分地包覆多个电容器。每一电容器的正极部的一正极侧面从绝缘封装体的一第一侧面裸露。导电连接层电性连接于电容器的负极部。电极单元包括一第一电极结构以及一第二电极结构。借此，当第一电极结构包覆绝缘封装体的一第一部分时，能电性连接于每一电容器的正极部；当第二电极结构包覆绝缘封装体的一第二部分时，能电性连接于导电连接层。
The invention discloses a capacitor component packaging structure and a manufacturing method thereof. The package structure of the capacitor assembly includes a capacitor unit, an insulating package body, a conductive connection layer and an electrode unit. The capacitance unit includes a plurality of capacitors. Each capacitor includes a positive electrode portion and a negative electrode portion. The insulating package partially encloses the plurality of capacitors. A positive side of the positive portion of each capacitor is exposed from a first side of the insulating package. The conductive connection layer is electrically connected to the negative electrode portion of the capacitor. The electrode unit includes a first electrode structure and a second electrode structure. Therefore, when the first electrode structure covers a first part of the insulating package, it can be electrically connected to the positive electrode of each capacitor; when the second electrode structure covers a second part of the insulating package, it can be electrically connected connected to the conductive connection layer.
Description
Technical Field
The present invention relates to a package structure and a method for fabricating the same, and more particularly, to a package structure of a capacitor module and a method for fabricating the same.
Background
Capacitors have been widely used in consumer appliances, computer boards and their peripherals, power supplies, communication products, and basic components of automobiles, and their main functions include: filtering, bypassing, rectifying, coupling, decoupling, inverting, etc. Is one of indispensable components in electronic products. The capacitor has different types according to different materials and applications. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, thin film capacitors, etc. In the prior art, the solid electrolytic capacitor has the advantages of small size, large capacitance, excellent frequency characteristics and the like, and can be used for decoupling of a power circuit of a central processing unit. In general, a stacked solid electrolytic capacitor with high capacitance can be formed by stacking a plurality of capacitor units, and the prior art stacked solid electrolytic capacitor includes a plurality of capacitor units and a lead frame, wherein each capacitor unit includes an anode portion, a cathode portion and an insulating portion electrically insulating the anode portion and the cathode portion from each other. In particular, the cathode portions of the capacitor cells are stacked one on another, and the plurality of capacitor cells are electrically connected to each other by providing a conductive layer between the adjacent capacitor cells. However, the stacked capacitor in the prior art still has room for improvement.
Disclosure of Invention
The present invention provides a capacitor module package structure and a method for manufacturing the same, which is directed to overcome the disadvantages of the prior art.
In order to solve the above technical problem, one of the technical solutions of the present invention is to provide a capacitor module package structure, which includes: the capacitor comprises a capacitor unit, an insulating packaging body, a conductive connecting layer and an electrode unit. The capacitor unit comprises a plurality of capacitors, and each capacitor comprises a positive electrode part and a negative electrode part. The insulating packaging body partially covers the plurality of capacitors, and one positive side surface of the positive electrode part of each capacitor is exposed from one first side surface of the insulating packaging body. The conductive connecting layer is electrically connected to the negative electrode part of the capacitor. The electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating packaging body and is electrically connected to the positive electrode part of each capacitor, and the second electrode structure covers a second part of the insulating packaging body and is electrically connected to the conductive connecting layer.
Further, the capacitor module package structure further includes: each positive electrode composite material layer is arranged on the first side surface of the insulating packaging body and the positive electrode side surface of the corresponding positive electrode part so as to be electrically connected to the positive electrode part of the corresponding capacitor; the first electrode structure is electrically contacted with the plurality of positive electrode composite material layers, each positive electrode composite material layer comprises at least two positive electrode conducting layers, and each positive electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the first side face of the insulating packaging body is flush with the positive side face of the positive electrode portion, and one plane of the positive electrode composite material layer is in contact with the first side face of the insulating packaging body and the positive side face of the positive electrode portion.
Further, the capacitor module package structure further includes: the negative electrode composite material layer is arranged on a second side surface of the insulating packaging body and one side surface of the conductive connecting layer so as to be electrically connected to the negative electrode part of the capacitor; the second electrode structure is electrically contacted with the plurality of negative electrode composite material layers, each negative electrode composite material layer comprises at least two negative electrode conducting layers, and each negative electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the second side surface of the insulating packaging body is flush with the side surface of the conductive connecting layer, and one plane of the negative electrode composite material layer is in contact with the second side surface of the insulating packaging body and the side surface of the conductive connecting layer.
Further, the first electrode structure comprises a first inner conductive layer coating the first part and electrically connected to the positive electrode part, a first middle conductive layer coating the first inner conductive layer, and a first outer conductive layer coating the first middle conductive layer; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first internal conductive layer and the second internal conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first external conductive layer and the second external conductive layer are Sn layers.
Furthermore, each capacitor comprises a substrate, a conductive polymer material layer covering a part of the substrate, a carbon adhesive layer completely covering the conductive polymer material layer, and a silver adhesive layer completely covering the carbon adhesive layer; each capacitor also comprises a surrounding insulating layer which is arranged on the outer surface of the substrate and surrounds the substrate, and the length of the conductive polymer material layer, the length of the carbon glue layer and the length of the silver glue layer of each capacitor are limited by the surrounding insulating layer; the first side surface of the insulating packaging body, the positive side surface of the positive electrode part and one side surface of the surrounding insulating layer are flush.
In order to solve the above technical problem, another technical solution of the present invention is to provide a capacitor module package structure, including: the capacitor comprises a capacitor unit, an insulating packaging body, a conductive connecting layer and an electrode unit. The capacitor comprises a positive electrode part, a negative electrode part and a surrounding insulating layer. The insulating package partially covers the capacitor, and a positive side surface of the positive electrode portion of the capacitor is exposed from a first side surface of the insulating package. The conductive connecting layer is electrically connected to the negative electrode part of the capacitor. The electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating packaging body and is electrically connected to the positive electrode part, and the second electrode structure covers a second part of the insulating packaging body and is electrically connected to the conductive connecting layer. The first side surface of the insulating packaging body, the positive side surface of the positive electrode part and one side surface of the surrounding insulating layer are flush.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a method for manufacturing a capacitor module package structure, including: providing a capacitor unit and a conductive connecting layer, wherein the capacitor unit comprises a plurality of capacitors, and each capacitor comprises a positive electrode part and a negative electrode part which is electrically connected with the conductive connecting layer; partially coating a plurality of capacitors by an insulating packaging body, wherein one positive side surface of the positive electrode part of each capacitor is exposed from one first side surface of the insulating packaging body; and, wrap a first part of the insulating packaging body and connect electrically to the positive pole portion of each capacitor with a first electrode structure, wrap a second part of the insulating packaging body and connect electrically to the conductive connecting layer with a second electrode structure; each capacitor comprises a surrounding insulating layer, and the first side surface of the insulating packaging body and the positive side surface of the positive electrode part are flush with each other.
Further, the manufacturing method of each capacitor comprises the following steps: providing an initial substrate; forming an initial surrounding insulation layer on and surrounding the initial substrate; forming a conductive polymer material to coat the initial substrate and the initial surrounding insulation layer; removing a part of the initial substrate and a part of the conductive polymer material to form a substrate, a surrounding insulating layer surrounding the substrate and a conductive polymer material layer covering a part of the substrate respectively; forming a carbon glue layer to completely coat the conductive polymer material layer; and forming a silver glue layer to completely cover the carbon glue layer.
Further, the manufacturing method of the capacitor component packaging structure further comprises the following steps: forming a plurality of positive electrode composite material layers, wherein each positive electrode composite material layer is arranged on the first side surface of the insulating packaging body and the positive electrode side surface of the corresponding positive electrode part so as to be electrically connected to the positive electrode part of the corresponding capacitor; the first electrode structure is electrically contacted with the plurality of positive electrode composite material layers, each positive electrode composite material layer comprises at least two positive electrode conducting layers, and each positive electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the first side surface of the insulating packaging body is flush with the positive side surface of the positive electrode part, and one plane of the positive electrode composite material layer is in contact with the first side surface of the insulating packaging body and the positive side surface of the positive electrode part; the first electrode structure comprises a first inner conducting layer, a first middle conducting layer and a first outer conducting layer, wherein the first inner conducting layer covers the first part and is electrically connected to the positive electrode part; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first internal conductive layer and the second internal conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first external conductive layer and the second external conductive layer are Sn layers.
Further, the manufacturing method of the capacitor component packaging structure further comprises the following steps: forming a negative electrode composite material layer, wherein the negative electrode composite material layer is arranged on a second side surface of the insulating packaging body and one side surface of the conductive connecting layer so as to be electrically connected to the negative electrode part of the capacitor; the second electrode structure is electrically contacted with the plurality of negative electrode composite material layers, and the negative electrode composite material layers comprise at least two negative electrode conducting layers, wherein the negative electrode conducting layers are Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the second side surface of the insulating packaging body is flush with the side surface of the conductive connecting layer, and one plane of the negative electrode composite material layer is in contact with the second side surface of the insulating packaging body and the side surface of the conductive connecting layer; the first electrode structure comprises a first inner conducting layer, a first middle conducting layer and a first outer conducting layer, wherein the first inner conducting layer covers the first part and is electrically connected to the positive electrode part; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first internal conductive layer and the second internal conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first external conductive layer and the second external conductive layer are Sn layers.
One of the benefits of the present invention is that, according to the capacitor module package structure and the manufacturing method thereof provided by the present invention, the first electrode structure can be electrically connected to the positive electrode portion when the first electrode structure covers a first portion of the insulating package body by using the technical scheme of "one positive electrode side surface of the positive electrode portion of the capacitor is exposed from a first side surface of the insulating package body". However, the benefits of the present invention are not so limited, and any benefits provided by the present invention should be included.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and not for purposes of limitation.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing a capacitor device package structure according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of steps S1000 and S1002 of a method for manufacturing a capacitor device package structure according to a first embodiment of the invention.
Fig. 3 is a schematic diagram of step S1004 of a method for manufacturing a capacitor device package structure according to a first embodiment of the present invention.
Fig. 4 is a schematic view after being cut along the cutting line of fig. 3.
Fig. 5 is a schematic view of step S1006 of a method for manufacturing a capacitor device package structure according to a first embodiment of the present invention.
Fig. 6 is a schematic diagram of step S1008 of a manufacturing method of a capacitor device package structure according to a first embodiment of the present invention.
Fig. 7 is a schematic view of step S1010 of a method for manufacturing a capacitor device package structure according to a first embodiment of the invention.
Fig. 8 is a schematic cross-sectional view illustrating a capacitor device package structure according to a first embodiment of the invention.
Fig. 9 is an enlarged schematic view of part IX of fig. 8.
Fig. 10 is a schematic cross-sectional view illustrating a capacitor device package structure according to a second embodiment of the invention.
Fig. 11 is an enlarged schematic view of a portion XI of fig. 10.
Fig. 12 is a schematic cross-sectional view illustrating a capacitor device package structure according to a third embodiment of the invention.
Fig. 13 is an enlarged schematic view of XIII part of fig. 12.
Detailed Description
The following description is provided for the embodiments of the capacitor device package structure and the method of fabricating the same, which are disclosed in the present application, and the advantages and effects of the present invention will be apparent to those skilled in the art from the disclosure of the present application. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It should be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used primarily to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
First embodiment
Referring to fig. 1 to 9, a first embodiment of the invention provides a method for manufacturing a capacitor device package structure Z, which includes: first, referring to fig. 1, 7 and 8, a capacitor unit 1 and a conductive connection layer 3 are provided, the capacitor unit 1 includes a plurality of capacitors 10, each capacitor 10 includes a positive electrode portion P and a negative electrode portion N electrically connected to the conductive connection layer 3 (step S100); then, as shown in fig. 1, 8 and 9, the plurality of capacitors 10 are partially covered by an insulating package 2, wherein a positive electrode side surface 1000 of the positive electrode portion P of each capacitor 10 is exposed from a first side surface 2001 of the insulating package 2 (step S102); next, as shown in fig. 1, 8 and 9, a first electrode structure 41 is used to cover a first portion 21 of the insulating package 2 and electrically connected to the positive electrode P of each capacitor 10, and a second electrode structure 42 is used to cover a second portion 22 of the insulating package 2 and electrically connected to the conductive connection layer 3 (step S104). It should be noted that, referring to fig. 6 and 7, each capacitor 10 includes a surrounding insulation layer 105, and the first side 2001 of the insulation package 2, the positive side 1000 of the positive electrode portion P, and a side 1050 of the surrounding insulation layer 105 are flush with each other.
For example, referring to fig. 1 to 7, the method for manufacturing each capacitor 10 includes: referring to fig. 1 and fig. 2, an initial substrate 101a is provided (S1000), and an initial surrounding insulation layer 105a is formed on the initial substrate 101a and surrounds the initial substrate 101a (S1002); next, as shown in fig. 1, 2 and 3, a conductive polymer material 102a is formed to cover the initial substrate 101a and the initial surrounding insulation layer 105a (S1004); then, as shown in fig. 1, 4 and 5, a portion of the initial substrate 101a, a portion of the initial surrounding insulating layer 105a and a portion of the conductive polymer material 102a are removed to form a substrate 101, a surrounding insulating layer 105 surrounding the substrate 101 and a conductive polymer material layer 102 covering a portion of the substrate 101, respectively (S1006); next, as shown in fig. 1, 5 and 6, a carbon glue layer 103 is formed to completely cover the conductive polymer material layer 102 (S1008); then, as shown in fig. 1, 6 and 7, a silver paste layer 104 is formed to completely cover the carbon paste layer 103 (S1010). It should be noted that, in step S1006, a portion of the initial surrounding insulation layer 105a may not be removed, but only a portion of the initial substrate 101a and a portion of the conductive polymer material 102a are removed, so that the surrounding insulation layer 105 is equal to the uncut initial surrounding insulation layer 105a, and the surrounding insulation layer 105 is still completely covered by the conductive polymer material layer 102 and is not exposed. Therefore, first side surface 2001 of insulating package 2 is flush with positive electrode side surface 1000 of positive electrode portion P, but not flush with one side surface 1050 of surrounding insulating layer 105.
Thus, with reference to fig. 7, 8 and 9, a first embodiment of the present invention provides a capacitor device package structure Z, which includes: a capacitor unit 1, an insulating package 2, a conductive connection layer 3 and an electrode unit 4. The capacitor unit 1 includes a plurality of capacitors 10, and each capacitor 10 includes a positive electrode portion P and a negative electrode portion N. The insulating package 2 partially covers the plurality of capacitors 10, and a positive side surface 1000 of the positive electrode portion P of each capacitor 10 is exposed from a first side surface 2001 of the insulating package 2. The conductive connection layer 3 is electrically connected to the negative electrode portion N of the capacitor 10. The electrode unit 4 includes a first electrode structure 41 and a second electrode structure 42, the first electrode structure 41 covers a first portion 21 of the insulating package 2 and is electrically connected to the positive electrode portion P of each capacitor 10, and the second electrode structure 42 covers a second portion 22 of the insulating package 2 and is electrically connected to the conductive connection layer 3. Further, as shown in fig. 8 and 9, the first side surface 2001 of the insulating package 2, the positive side surface 1000 of the positive electrode portion P, and the one side surface 1050 of the surrounding insulating layer 105 are flush with each other.
For example, as shown in fig. 7, each capacitor 10 includes a substrate 101, a conductive polymer material layer 102 covering a portion of the substrate 101, a carbon glue layer 103 completely covering the conductive polymer material layer 102, and a silver glue layer 104 completely covering the carbon glue layer 103. In addition, each capacitor 10 further includes a surrounding insulation layer 105 disposed on the outer surface of the substrate 101 and surrounding the substrate 101, and the length of the conductive polymer material layer 102, the length of the carbon glue layer 103, and the length of the silver glue layer 104 of the capacitor 10 are all limited by the surrounding insulation layer 105. It is noted that the substrate 101 further includes a metal foil and an oxide layer completely covering the metal foil. An oxide layer is formed on the outer surface of the metal foil to completely cover the metal foil, and the conductive polymer material layer 102 covers a portion of the oxide layer. In addition, the metal foil may be aluminum, copper or any metal material according to different use requirements, and the surface of the metal foil has a porous corrosion layer, so the metal foil may be a corrosion foil with a porous corrosion layer. When the metal foil is oxidized, an oxide layer is formed on the surface of the metal foil, and the metal foil with the oxide layer formed on the surface thereof may be referred to as a valve metal foil (valve metal foil). However, the capacitor 10 used in the present invention is not limited to the above-mentioned examples.
For example, as shown in fig. 8, the insulating package 2 may be made of any insulating material, such as epoxy (epoxy) or silicon (silicon). However, the insulating package 2 used in the present invention is not limited to the above-mentioned examples. Furthermore, the first electrode structure 41 includes a first inner conductive layer 411 covering the first portion 21 and electrically connected to the positive electrode portion P, a first middle conductive layer 412 covering the first inner conductive layer 411, and a first outer conductive layer 413 covering the first middle conductive layer 412. In addition, the second electrode structure 42 includes a second inner conductive layer 421 covering the second portion 22 and electrically connected to the conductive connection layer 3, a second middle conductive layer 422 covering the second inner conductive layer 421, and a second outer conductive layer 423 covering the second middle conductive layer 422. In addition, the first inner conductive layer 411 and the second inner conductive layer 421 may be Ag layers, the first intermediate conductive layer 412 and the second intermediate conductive layer 422 may be Ni layers, and the first outer conductive layer 413 and the second outer conductive layer 423 may be Sn layers. However, the first electrode structure 41 and the second electrode structure 42 used in the present invention are not limited to the above-mentioned examples.
Second embodiment
Referring to fig. 10 and 11, a second embodiment of the invention provides a capacitor device package structure Z, which includes: a capacitor unit 1, an insulating package 2, a conductive connection layer 3 and an electrode unit 4. As can be seen from the comparison between fig. 10 and fig. 8, and the comparison between fig. 11 and fig. 9, the greatest difference between the second embodiment and the first embodiment of the present invention is: in the second embodiment, the capacitor component package structure Z further includes: a plurality of positive electrode composite material layers 5. In addition, each positive electrode composite material layer 5 is disposed on the first side 2001 of the insulating package 2 and the positive electrode side 1000 of the corresponding positive electrode portion P to electrically connect to the corresponding positive electrode portion P of the capacitor 10, and the first electrode structure 41 electrically contacts the plurality of positive electrode composite material layers 5. For example, the positive electrode composite material layer 5 includes at least two positive electrode conductive layers 50, and the positive electrode conductive layer 50 may be Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr, or Sn, or may be an alloy (e.g., NiCr, TiW, TiN, TiC), but the positive electrode composite material layer 5 used in the present invention is not limited to the above-mentioned examples.
Note that, as shown in fig. 11, the first side 2001 of the insulating package 2 may be flush with the positive side 1000 of the positive electrode portion P, and a plane 5000 of the positive electrode composite material layer 5 may contact the first side 2001 of the insulating package 2 and the positive side 1000 of the positive electrode portion P. In addition, the plane 5000 of the positive electrode composite material layer 5 contacts the first side 2001 of the insulating package 2, the positive electrode side 1000 of the positive electrode portion P, and the side 1050 of the surrounding insulating layer 105, thereby blocking the external moisture from entering the capacitor 10 from the positive electrode portion P.
It is to be noted that the method for manufacturing the capacitor device package structure Z according to the second embodiment of the present invention further includes: a plurality of positive electrode composite material layers 5 are formed.
Third embodiment
Referring to fig. 12 and 13, a third embodiment of the invention provides a capacitor device package structure Z, which includes: a capacitor unit 1, an insulating package 2, a conductive connection layer 3 and an electrode unit 4. As can be seen from the comparison between fig. 12 and fig. 10 and the comparison between fig. 13 and fig. 11, the greatest difference between the third embodiment and the second embodiment of the present invention is: in a third embodiment, the capacitor assembly package structure Z further comprises: a negative electrode composite material layer 6. In addition, the negative electrode composite material layer 6 is disposed on a second side 2002 of the insulating package 2 and a side 3000 of the conductive connection layer 3 to be electrically connected to the negative electrode portion N of the capacitor 10, and the second electrode structure 42 is electrically contacted with the plurality of negative electrode composite material layers 6. For example, the negative electrode composite material layer 6 includes at least two negative electrode conductive layers 60, and the negative electrode conductive layer 60 may be Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr, or Sn, or may be an alloy (e.g., NiCr, TiW, TiN, TiC), but the negative electrode composite material layer 6 used in the present invention is not limited to the above-mentioned examples.
It is noted that, as shown in fig. 13, the second side 2002 of the insulating package 2 is flush with both sides 3000 of the conductive connection layer 3, and a plane 6000 of the negative electrode composite material layer 6 contacts the second side 2002 of the insulating package 2 and the sides 3000 of the conductive connection layer 3, thereby blocking the external moisture from entering the capacitor 10 from the conductive connection layer 3.
It is to be noted that, the method for manufacturing the capacitor device package structure Z according to the third embodiment of the present invention further includes: forming a negative electrode composite material layer 6.
Advantageous effects of the embodiments
One of the advantages of the present invention is that the capacitor module package structure and the manufacturing method thereof provided by the present invention can utilize the technical scheme of "one positive side surface 1000 of the positive electrode portion P of the capacitor 10 is exposed from one first side surface 2001 of the insulating package 2", so that when the first electrode structure 41 covers one first portion 21 of the insulating package 2, the first electrode structure 41 can be electrically connected to the positive electrode portion P. However, the benefits of the present invention are not so limited, and any benefits provided by the present invention should be included. It is noted that the first side 2001 of the insulating package 2, the positive side 1000 of the positive electrode portion P, and the side 1050 of the surrounding insulating layer 105 are all flush, and the second side 2002 of the insulating package 2 is flush with both sides 3000 of the conductive connection layer 3.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (10)
1. A capacitor assembly package structure, comprising:
the capacitor unit comprises a plurality of capacitors, and each capacitor comprises a positive electrode part and a negative electrode part;
an insulating package partially covering the plurality of capacitors, a positive side surface of the positive electrode portion of each capacitor being exposed from a first side surface of the insulating package;
a conductive connection layer electrically connected to the negative electrode portion of the capacitor; and
an electrode unit, the electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure cladding a first part of the insulating packaging body and electric connection in each the positive pole portion of condenser, the second electrode structure cladding a second part of the insulating packaging body and electric connection in the electrically conductive connecting layer.
2. The capacitor component package according to claim 1, further comprising: a plurality of positive electrode composite material layers, each of the positive electrode composite material layers being disposed on the first side surface of the insulating package and the positive electrode side surface of the corresponding positive electrode portion to be electrically connected to the positive electrode portion of the corresponding capacitor; the first electrode structure is electrically contacted with the plurality of positive electrode composite material layers, each positive electrode composite material layer comprises at least two positive electrode conducting layers, and each positive electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the first side face of the insulating packaging body is flush with the positive side face of the positive electrode portion, and a plane of the positive electrode composite material layer is in contact with the first side face of the insulating packaging body and the positive side face of the positive electrode portion.
3. The capacitor component package according to claim 1, further comprising: the negative electrode composite material layer is arranged on a second side surface of the insulating packaging body and one side surface of the conductive connecting layer so as to be electrically connected to the negative electrode part of the capacitor; the second electrode structure is electrically contacted with the plurality of negative electrode composite material layers, each negative electrode composite material layer comprises at least two negative electrode conducting layers, and each negative electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; the second side face of the insulating packaging body is flush with the side face of the conductive connecting layer, and a plane of the negative electrode composite material layer contacts the second side face of the insulating packaging body and the side face of the conductive connecting layer.
4. The capacitor package assembly of claim 1, wherein the first electrode structure includes a first inner conductive layer covering the first portion and electrically connected to the positive electrode portion, a first intermediate conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first intermediate conductive layer; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first inner conductive layer and the second inner conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first outer conductive layer and the second outer conductive layer are Sn layers.
5. The package structure of claim 1, wherein each of the capacitors comprises a substrate, a conductive polymer material layer covering a portion of the substrate, a carbon glue layer completely covering the conductive polymer material layer, and a silver glue layer completely covering the carbon glue layer; each capacitor further comprises a surrounding insulating layer which is arranged on the outer surface of the substrate and surrounds the substrate, and the length of the conductive polymer material layer, the length of the carbon glue layer and the length of the silver glue layer of each capacitor are limited by the surrounding insulating layer; the first side face of the insulating packaging body, the positive side face of the positive electrode part and one side face of the surrounding insulating layer are flush with each other.
6. A capacitor assembly package structure, comprising:
a capacitor, said capacitor comprising a positive electrode portion, a negative electrode portion and a surrounding insulating layer;
an insulating package partially covering the capacitor, a positive side surface of the positive electrode portion of the capacitor being exposed from a first side surface of the insulating package;
a conductive connection layer electrically connected to the negative electrode portion of the capacitor; and
the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating packaging body and is electrically connected to the positive electrode part, and the second electrode structure covers a second part of the insulating packaging body and is electrically connected to the conductive connecting layer;
the first side face of the insulating packaging body, the positive side face of the positive electrode part and one side face of the surrounding insulating layer are flush with each other.
7. A manufacturing method of a capacitor component packaging structure is characterized by comprising the following steps:
providing a capacitor unit and a conductive connecting layer, wherein the capacitor unit comprises a plurality of capacitors, and each capacitor comprises a positive electrode part and a negative electrode part which is electrically connected with the conductive connecting layer;
partially coating a plurality of the capacitors by an insulating packaging body, wherein one positive side surface of the positive part of each capacitor is exposed from one first side surface of the insulating packaging body; and
a first electrode structure is used for coating a first part of the insulating packaging body and is electrically connected with the positive electrode part of each capacitor, and a second electrode structure is used for coating a second part of the insulating packaging body and is electrically connected with the conductive connecting layer;
wherein each of the capacitors includes a surrounding insulating layer, and the first side surface of the insulating package and the positive side surface of the positive electrode portion are flush with each other.
8. The method of manufacturing a capacitor package assembly of claim 7, wherein each of the capacitors comprises:
providing an initial substrate;
forming an initial surrounding insulation layer on and surrounding the initial substrate;
forming a conductive polymer material to coat the initial substrate and the initial surrounding-shaped insulating layer;
removing a part of the initial substrate and a part of the conductive polymer material to form a substrate, the surrounding insulating layer surrounding the substrate and a conductive polymer material layer covering a part of the substrate respectively;
forming a carbon adhesive layer to completely coat the conductive polymer material layer; and
and forming a silver adhesive layer to completely coat the carbon adhesive layer.
9. The method of manufacturing a capacitor component package according to claim 7, further comprising: forming a plurality of positive electrode composite material layers, each of the positive electrode composite material layers being disposed on the first side surface of the insulating package and the positive electrode side surface of the corresponding positive electrode portion to be electrically connected to the positive electrode portion of the corresponding capacitor; the first electrode structure is electrically contacted with the plurality of positive electrode composite material layers, each positive electrode composite material layer comprises at least two positive electrode conducting layers, and each positive electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; wherein the first side surface of the insulating package body is flush with the positive side surface of the positive electrode part, and a plane of the positive electrode composite material layer contacts the first side surface of the insulating package body and the positive side surface of the positive electrode part; the first electrode structure comprises a first inner conducting layer, a first middle conducting layer and a first outer conducting layer, wherein the first inner conducting layer covers the first part and is electrically connected to the positive electrode part; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first inner conductive layer and the second inner conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first outer conductive layer and the second outer conductive layer are Sn layers.
10. The method of manufacturing a capacitor component package according to claim 7, further comprising: forming a negative electrode composite material layer, wherein the negative electrode composite material layer is arranged on a second side surface of the insulating packaging body and one side surface of the conductive connecting layer so as to be electrically connected to the negative electrode part of the capacitor; the second electrode structure is electrically contacted with the plurality of negative electrode composite material layers, each negative electrode composite material layer comprises at least two negative electrode conducting layers, and each negative electrode conducting layer is Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn; wherein the second side of the insulating package is flush with the side of the conductive connection layer, and a plane of the negative electrode composite material layer contacts the second side of the insulating package and the side of the conductive connection layer; the first electrode structure comprises a first inner conducting layer, a first middle conducting layer and a first outer conducting layer, wherein the first inner conducting layer covers the first part and is electrically connected to the positive electrode part; the second electrode structure comprises a second inner conducting layer, a second middle conducting layer and a second outer conducting layer, wherein the second inner conducting layer covers the second part and is electrically connected with the conducting connecting layer; the first inner conductive layer and the second inner conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first outer conductive layer and the second outer conductive layer are Sn layers.
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| CN107026019A (en) * | 2015-11-18 | 2017-08-08 | 株式会社村田制作所 | Solid electrolytic capacitor |
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| CN1327246A (en) * | 2000-05-26 | 2001-12-19 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| JP2005045007A (en) * | 2003-07-22 | 2005-02-17 | Matsushita Electric Ind Co Ltd | Solid-state electrolytic capacitor and method of manufacturing the same |
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