CN113534560B - Electronic paper packaging structure - Google Patents

Abstract

An electronic paper packaging structure comprises a substrate, an electronic ink layer, a cover plate, at least one water-air block and a sealing adhesive. The electronic ink layer is arranged on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined by the lower surface of the cover plate, one side surface of the electronic ink layer and one upper surface of the substrate. At least one water-gas barrier block is arranged in the groove. The sealing compound is filled in the groove and coats at least one water-air barrier block.

Description

Electronic paper packaging structure

Technical Field

The invention relates to an electronic component packaging structure, and in particular to an electronic paper packaging structure.

Background technique

With the advancement of flat panel display technology, more and more electronic products are equipped with display devices, especially portable electronic products such as mobile phones, e-books, digital cameras, etc. As portable electronic products are developing towards light weight, small size and thin thickness, the display devices used in portable electronic products must also have the advantages of light weight, small size and thin thickness.

In order to promote paperless display, electronic signage such as electrophoretic display (EPD) or electronic paper display (EPD) can replace traditional printed signage. Electronic signage is not only light and thin, but can also be designed to be flexible.

However, the packaging structure of the current electrophoretic display device or electronic paper display device has a weak water vapor barrier capability in a specific area or a corner area, resulting in a decrease in packaging quality.

Summary of the invention

The invention relates to an electronic paper packaging structure, which can improve the water vapor barrier capability.

According to one aspect of the present invention, an electronic paper packaging structure is provided, comprising a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier block and a sealing glue. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate define a groove. At least one water vapor barrier block is disposed in the groove. The sealing glue is filled in the groove and covers the at least one water vapor barrier block.

According to one aspect of the present invention, an electronic paper packaging structure is provided, comprising a substrate, an electronic ink layer, a cover plate, at least one cover plate extension component and a sealing glue. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate define a groove. At least one cover plate extension component is disposed on an outer side of the cover plate to extend the size of the groove. The sealing glue is filled in the groove.

According to one aspect of the present invention, an electronic paper packaging structure is provided, comprising a substrate, an electronic ink layer, a cover plate, a sealing glue and at least one water vapor barrier film. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The sealing glue is filled in the groove. At least one water vapor barrier film covers the sealing glue.

The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

1A and 1B are respectively a top view of an electronic paper packaging structure according to an embodiment of the present invention and a partial schematic view corresponding to the A-A cross section;

2A and 2B are respectively a top view of an electronic paper packaging structure according to an embodiment of the present invention and a partial schematic view corresponding to a B-B cross section; and

3A and 3B are respectively a top view schematic diagram and a partial schematic diagram corresponding to the D-D cross section of an electronic paper packaging structure according to an embodiment of the present invention.

Wherein, the reference numerals are:

100,101,102: Electronic paper packaging structure

110: Substrate

1101: Side surface

1102: Upper surface

111: Groove

111a: First Area

111b: Second area

112: Electronic ink layer

1121: Side surface

113: Transparent electrode layer

114: Cover

114a: Transparent substrate

114b: Translucent water vapor barrier layer

1141: Side surface

1142: Lower surface

115: Cover extension part

116: Water vapor barrier block

118: Sealing

118a: First Area

118b: Second area

119: Water vapor barrier film

S1: First size

S2: Second size

S2’: Second size

C: Corner

E: Edge

Detailed ways

The structural principle and working principle of the present invention are described in detail below in conjunction with the accompanying drawings:

The following embodiments are presented for detailed description. The embodiments are only used as examples and are not intended to limit the scope of the invention. The following uses the same/similar symbols to represent the same/similar elements for illustration. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are used to illustrate and are not intended to limit the invention.

According to one embodiment of the present invention, an electronic paper packaging structure is proposed to improve the water vapor barrier capability, especially when the water vapor barrier capability in a specific area or corner area is weak, the water vapor barrier capability of the electronic paper packaging structure is increased or the water vapor barrier distance is extended by using a high water vapor barrier material such as a water vapor barrier block, a cover extension component and/or a water vapor barrier film, thereby improving the packaging quality. In one embodiment, the water vapor barrier capability is distinguished by the numerical value of the water vapor transmission rate (WVTR). Under the conditions of temperature 60°C and humidity 90%, the WVTR is preferably less than 2 to 5 g/m2/day, or less than 1 g/m2/day, or less than 0.5 g/m2/day, or less than 0.1 g/m2/day, or even less than 0.01 g/m2/day.

First embodiment

1A and 1B are respectively a top view of an electronic paper packaging structure 100 and a partial view corresponding to the A-A cross section according to an embodiment of the present invention. Referring to FIG1A and FIG1B , the electronic paper packaging structure 100 includes a substrate 110, an electronic ink layer 112, a cover plate 114, at least one water vapor barrier block 116, and a sealing adhesive 118.

The substrate 110 is, for example, a transparent glass substrate or an opaque substrate. A thin film transistor array (TFT array) is disposed on the upper surface 1102 of the substrate 110 to serve as a lower electrode plate. The cover plate 114 may include a transparent substrate 114a and a light-transmitting water vapor barrier layer 114b. The transparent substrate 114a is, for example, plastic or glass, and its material may include polymeric plastic materials such as polyethylene terephthalate (PET), polystyrene (PS), and polycarbonate (PC). The material of the light-transmitting water vapor barrier layer 114b may be at least one of aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon. The water vapor barrier capacity of the light-transmitting water vapor barrier layer 114b is greater than that of the transparent substrate 114a. In addition, a transparent electrode layer 113, such as indium tin oxide (ITO), is disposed on the lower surface 1142 of the cover plate 114 to serve as an upper electrode plate.

The electronic ink layer 112 is disposed on the substrate 110, and the electronic ink layer 112 is located between the substrate 110 and the cover plate 114. The electronic ink layer 112 includes millions of microcapsules, each of which contains electrophoretic particles, wherein the electrophoretic particles are white particles with negative charges and black particles with positive charges, suspended in a transparent liquid. When the electric field between the substrate 110 and the cover plate 114 is connected, the electrophoretic particles use the principle of attraction between positive and negative charges to move to the top of the microcapsule, and the user can see the white or black particles on the corresponding block, thereby displaying a pixel pattern. In addition, the electronic ink layer 112 can also be a three-color or multi-color electronic ink layer to achieve a full color gamut display effect, but the present invention is not limited to this.

Referring to FIG. 1B , in one embodiment, the lower surface 1142 of the cover plate 114, the side surface 1121 of the electronic ink layer 112, and the upper surface 1102 of the substrate 110 define a groove 111 for accommodating at least one water vapor barrier block 116, and the sealant 118 can be filled into the groove 111 and cover the water vapor barrier block 116. In this embodiment, the number of the water vapor barrier blocks 116 can be one or more, but the number can be adjusted according to actual conditions. In one embodiment, part of the upper surface and part of the side surface of the water vapor barrier block 116 can be exposed outside the cover plate 114; or, only the side surface of the water vapor barrier block 116 is exposed outside the cover plate 114, and the rest is covered by the sealant 118; or, the water vapor barrier block 116 is not exposed outside the cover plate 114 and is completely covered by the sealant 118.

In addition, the lower surface 1142 of the cover plate 114 and the upper surface 1102 of the substrate 110 are opposite to each other, and the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1141 of the cover plate 114 by a first dimension S1 (i.e., the depth of the groove 111), and the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1101 of the substrate 110 by a second dimension S2 (i.e., the width of the non-display area), wherein the first dimension S1 is smaller than the second dimension S2, the dimension of the water vapor barrier block 116 can be between the first dimension S1 and the second dimension S2 or smaller than the first dimension S1, and the electronic ink layer 112 is hidden between the substrate 110 and the cover plate 114 to increase the water vapor barrier distance to prevent the electronic ink layer 112 from being affected by the penetration of water vapor from the external environment.

In one embodiment, the water vapor barrier block 116 may surround the entire surrounding area of the electronic ink layer 112, or the segmented water vapor barrier block 116 may partially surround the surrounding area of the electronic ink layer 112, that is, only a specific area or corner area of the electronic ink layer 112 is reinforced to increase or extend the water vapor barrier capability of the electronic paper packaging structure 100.

In addition, the water vapor barrier capacity of the water vapor barrier block 116 may be greater than the water vapor barrier capacity of the sealant 118, but it is not limited thereto. The water vapor barrier capacity of the water vapor barrier block 116 may also be less than the water vapor barrier capacity of the sealant 118. The sealant 118 may be a thermoplastic, thermosetting, ultraviolet curing or room temperature curing polymer hardening glue, but the present invention is not limited thereto. When the sealant 118 is in a liquid viscous state, it can be filled in the groove 111, the gap between the water vapor barrier block 116 and the cover plate 114, and the gap between the water vapor barrier block 116 and the electronic ink layer 112, and formed by curing the sealant 118, so that water vapor from the external environment cannot enter through the tiny gaps, thereby reducing water vapor penetration.

In one embodiment, the material of the water vapor barrier block 116 includes high molecular polymers such as epoxy resin, polyurethane (PU), metal or ceramic. Under the conditions of temperature 60° C. and humidity 90%, the water vapor permeability of the water vapor barrier block 116 is, for example, less than 2-5 g/m2/day, or less than 1 g/m2/day, or less than 0.5 g/m2/day, or less than 0.1 g/m2/day, or even less than 0.01 g/m2/day, so as to meet the requirements of high water vapor barrier capacity.

Referring to FIG. 1A , in one embodiment, the groove 111 includes a first area 111a and a second area 111b. The first area 111a is, for example, an L-shaped area or an arc-shaped area (i.e., four corner areas), and the second area 111b is, for example, a strip-shaped area (i.e., a short side area or a long side area). The water vapor barrier block 116 is disposed in the first area 111a of the groove 111, and its shape is, for example, an L-shape, corresponding to the shape of the first area 111a. The first area 111a corresponds to a corner C of the electronic ink layer 112, and the second area 111b corresponds to an edge E of the electronic ink layer 112. That is, relative to the edge E of the electronic ink layer 112, water vapor is more likely to penetrate through the corner C of the electronic ink layer 112. Therefore, adding the water vapor barrier block 116 to the corner C of the electronic ink layer 112 can increase the water vapor barrier capability of the sealant 118 to the corner C of the electronic ink layer 112.

Second embodiment

FIG2A and FIG2B are respectively a schematic top view of an electronic paper packaging structure 101 according to an embodiment of the present invention and a partial schematic view corresponding to the B-B cross section. Referring to FIG2A and FIG2B , the electronic paper packaging structure 101 includes a substrate 110, an electronic ink layer 112, a cover plate 114, at least one cover plate extension component 115 and a sealing glue 118. In this embodiment, the lower surface 1142 of the cover plate 114, the side surface 1121 of the electronic ink layer 112 and the upper surface 1102 of the substrate 110 define a groove 111 for filling the sealing glue 118. The details of the substrate 110, the electronic ink layer 112, the cover plate 114 and the sealing glue 118 have been described in the first embodiment and will not be repeated here. The difference is that in this embodiment, the water vapor barrier block 116 is replaced by the cover plate extension component 115.

The cover extension component 115 is disposed on an outer side of the cover 114 to extend the size of the groove 111, thereby increasing the filling amount of the sealant 118 to extend the water vapor barrier distance of the sealant 118. That is, when the water vapor barrier distance of the sealant 118 is increased, water vapor will not easily enter the electronic paper packaging structure 101.

In one embodiment, the cover plate extension member 115 and the cover plate 114 may be integrally formed, or the cover plate extension member 115 may be fixed to the outer side of the cover plate 114 in other ways.

Please refer to Figure 2B, the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1141 of the cover plate 114 by a first dimension S1 (i.e., the depth dimension of the original groove 111), and the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1151 of the cover plate extension component 115 by a second dimension S2' (i.e., the depth dimension of the extended groove 111), wherein the second dimension S2' is larger than the first dimension S1, and the second dimension S2' is slightly shorter than or equal to the second dimension S2 (i.e., the width of the non-display area) in the first embodiment, that is, the cover plate extension component 115 can extend the water vapor barrier distance of the sealing glue 118 to prevent the electronic ink layer 112 from being affected by the penetration of water vapor from the external environment.

Referring to FIG. 2A , in one embodiment, the groove 111 includes a first area 111a and a second area 111b. The first area 111a is, for example, an L-shaped area or an arc-shaped area (i.e., four corner areas), and the second area 111b is, for example, an elongated area (i.e., a short side or long side area). The cover extension component 115 is located in the first area 111a of the groove 111, and its shape is, for example, an L-shaped or arc-shaped area, corresponding to the shape of the first area 111a. The first area 111a corresponds to a corner C of the electronic ink layer 112, and the second area 111b corresponds to an edge E of the electronic ink layer 112. That is, relative to the edge E of the electronic ink layer 112, water vapor is more likely to penetrate through the corner C of the electronic ink layer 112. Therefore, adding the cover extension component 115 to the corner C of the electronic ink layer 112 can increase the water vapor barrier capability of the sealant 118 to the corner C of the electronic ink layer 112.

Third embodiment

FIG3A and FIG3B are respectively a schematic top view of an electronic paper packaging structure 102 according to an embodiment of the present invention and a partial schematic view corresponding to the D-D cross section. Referring to FIG3A and FIG3B , the electronic paper packaging structure 102 includes a substrate 110, an electronic ink layer 112, a cover plate 114, a sealing glue 118 and at least one water vapor barrier film 119. In this embodiment, the lower surface 1142 of the cover plate 114, the side surface 1121 of the electronic ink layer 112 and the upper surface 1102 of the substrate 110 define a groove 111 for filling the sealing glue 118. In addition, the water vapor barrier film 119 is used to cover the sealing glue 118. The details of the substrate 110, the electronic ink layer 112, the cover plate 114 and the sealing glue 118 have been described in the first embodiment and will not be repeated here. The difference is that in this embodiment, the water vapor barrier film 119 replaces the above-mentioned cover extension component 115 and the water vapor barrier block 116.

In one embodiment, the water vapor barrier film 119 includes a polymer such as epoxy resin, polyurethane (PU), metal oxide, ceramic powder or ceramic coating, for example, at least one material selected from aluminum oxide (AlOx), silicon oxide, silicon nitride, titanium oxide, zirconium oxide, aluminum oxynitride, silicon oxynitride, and amorphous carbon, which is sprayed on the outer surface of the sealant 118 to increase the water vapor barrier ability of the sealant 118. In this embodiment, the number of water vapor barrier films 119 can be one or more, and the number can be adjusted according to actual conditions. The water vapor barrier film 119 can completely cover the outer surface of the sealant 118, but can also partially cover the outer surface of the sealant 118, and the present invention is not limited to this.

In addition, the lower surface 1142 of the cover plate 114 and the upper surface 1102 of the substrate 110 are opposite to each other, and the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1141 of the cover plate 114 by a first dimension S1 (i.e., the depth of the groove 111), and the side surface 1121 of the electronic ink layer 112 is separated from the side surface 1101 of the substrate 110 by a second dimension S2 (i.e., the width of the non-display area), wherein the first dimension S1 is smaller than the second dimension S2, the distribution range of the water vapor barrier film 119 can be between the first dimension S1 and the second dimension S2, and the electronic ink layer 112 is hidden between the substrate 110 and the cover plate 114 to increase the water vapor barrier distance to prevent the electronic ink layer 112 from being affected by the penetration of water vapor from the external environment.

In one embodiment, the water vapor barrier film 119 may surround the entire surrounding area of the electronic ink layer 112 (or the cover plate 114), or the segmented water vapor barrier film 119 may partially surround the surrounding area of the electronic ink layer 112 (or the cover plate 114), that is, only specific areas or corner areas of the electronic ink layer 112 are reinforced to increase the water vapor barrier capability of the electronic paper packaging structure 102.

In addition, the water vapor barrier capacity of the water vapor barrier film 119 may be greater than the water vapor barrier capacity of the sealant 118. Under the conditions of a temperature of 60°C and a humidity of 90%, the water vapor permeability of the water vapor barrier film 119 is, for example, less than 1 g/m2/day, or less than 0.5 g/m2/day, or less than 0.1 g/m2/day, or even less than 0.01 g/m2/day, so as to meet the requirements of high water vapor barrier capacity.

Referring to FIG. 3A , in one embodiment, the sealant 118 includes a first area 118a and a second area 118b. The first area 118a is, for example, an L-shaped area or an arc-shaped area (i.e., four corner areas), and the second area 111b is, for example, an elongated area (i.e., a short side or long side area). The water vapor barrier film 119 covers the first area 118a of the sealant 118, and its shape is, for example, an L-shaped or arc-shaped area, corresponding to the shape of the first area 118a. The first area 118a corresponds to a corner C of the electronic ink layer 112, and the second area 118b corresponds to an edge E of the electronic ink layer 112. That is, relative to the edge E of the electronic ink layer 112, water vapor is more likely to penetrate through the corner C of the electronic ink layer 112. Therefore, adding the water vapor barrier film 119 to the corner C of the electronic ink layer 112 can increase the water vapor barrier capability of the sealant 118 to the corner C of the electronic ink layer 112.

According to the electronic paper packaging structure of the above embodiment of the present invention, the water vapor barrier capacity of the electronic paper packaging structure can be increased or the water vapor barrier distance can be extended by using high water vapor barrier materials such as water vapor barrier blocks, cover extension components and/or water vapor barrier films, thereby improving the packaging quality of the electronic paper packaging structure. Of course, the above-mentioned first embodiment, second embodiment and third embodiment can be implemented separately or in combination with each other. For example, the first embodiment is combined with the second embodiment, and the water vapor barrier capacity can be increased by a water vapor barrier block, and the water vapor barrier distance can be extended by a cover extension component. The second embodiment is combined with the third embodiment, and the water vapor barrier distance can be extended by a cover extension component, and the water vapor barrier capacity can be increased by a water vapor barrier film. The first embodiment, the second embodiment and the third embodiment are combined, and the water vapor barrier capacity can be increased by a water vapor barrier block and a water vapor barrier film, and the water vapor barrier distance can be extended by a cover extension component.

Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims (16)

1. An electronic paper packaging structure, characterized by comprising:

A substrate;

An electronic ink layer arranged on the substrate;

A cover plate covering the electronic ink layer, wherein the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate;

at least one water-air blocking block arranged in the groove and protruding out of the side surface of the cover plate, wherein the water-air blocking block is only positioned at one corner of the electronic ink layer; and

And the sealing glue is filled in the groove and coats the at least one water-air barrier block.

2. The electronic paper package according to claim 1, wherein the moisture barrier capability of the moisture barrier block is greater than the moisture barrier capability of the encapsulant.

3. The electronic paper package according to claim 1, wherein the water vapor barrier block is made of a polymer, a metal or a ceramic.

4. The electronic paper package of claim 1, wherein the side surface of the electronic ink layer is separated from the side surface of the cover by a first dimension, the side surface of the electronic ink layer is separated from the side surface of the substrate by a second dimension, wherein the first dimension is smaller than the second dimension, and the dimension of the moisture barrier block is between the first dimension and the second dimension or smaller than the first dimension.

5. The electronic paper package according to claim 1, wherein the recess includes a first region and a second region, the moisture barrier is disposed in the first region of the recess, the first region corresponds to the corner of the electronic ink layer, and the second region corresponds to an edge of the electronic ink layer.

6. An electronic paper packaging structure, characterized by comprising:

A substrate;

An electronic ink layer arranged on the substrate;

A cover plate covering the electronic ink layer, wherein the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate;

At least one cover plate extending part arranged on one outer side of the cover plate to extend the size of the groove, wherein the cover plate extending part is only correspondingly positioned at one corner of the electronic ink layer; and

And the sealing glue is filled in the groove and protrudes out of the side surface of the cover plate.

7. The electronic paper package according to claim 6, wherein the cover extension member is configured to extend a moisture blocking distance of the sealing compound.

8. The electronic paper package according to claim 6, wherein the cover extension and the cover comprise a transparent substrate and a transparent moisture barrier layer.

9. The electronic paper package of claim 6, wherein the side surface of the electronic ink layer is separated from the side surface of the cover plate by a first dimension, and the side surface of the electronic ink layer is separated from the side surface of the cover plate extension member by a second dimension, the second dimension being greater than the first dimension.

10. The electronic paper package of claim 6, wherein the recess includes a first region and a second region, the cover extension member extends to the first region of the recess, the first region corresponds to the corner of the electronic ink layer, and the second region corresponds to an edge of the electronic ink layer.

11. The electronic paper package of claim 6, wherein the cover extension is located at four corners of the cover.

12. An electronic paper packaging structure, characterized by comprising:

A substrate;

An electronic ink layer arranged on the substrate;

A cover plate covering the electronic ink layer, wherein the electronic ink layer is positioned between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate;

a sealing glue filled in the groove and protruding out of the side surface of the cover plate; and

At least one moisture barrier film covering the sealing compound, wherein the moisture barrier film is located at one corner of the electronic ink layer only.

13. The electronic paper package according to claim 12, wherein the moisture barrier capability of the moisture barrier film is greater than the moisture barrier capability of the encapsulant.

14. The electronic paper package according to claim 12, wherein the moisture barrier film comprises a polymer, a metal oxide, a ceramic powder, or a ceramic coating.

15. The electronic paper package of claim 12, wherein the side surface of the electronic ink layer is separated from the side surface of the cover by a first dimension, the side surface of the electronic ink layer is separated from the side surface of the substrate by a second dimension, wherein the first dimension is smaller than the second dimension, and the moisture barrier film is distributed in a region between the first dimension and the second dimension.

16. The electronic paper package according to claim 12, wherein the encapsulant comprises a first region and a second region, the moisture barrier film covers the first region of the encapsulant, the first region corresponds to the corner of the electronic ink layer, and the second region corresponds to an edge of the electronic ink layer.