CN113523303A - A method for eliminating residual stress of aluminum alloy components formed by selective laser melting - Google Patents
A method for eliminating residual stress of aluminum alloy components formed by selective laser melting Download PDFInfo
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- CN113523303A CN113523303A CN202110579594.6A CN202110579594A CN113523303A CN 113523303 A CN113523303 A CN 113523303A CN 202110579594 A CN202110579594 A CN 202110579594A CN 113523303 A CN113523303 A CN 113523303A
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 36
- 238000002844 melting Methods 0.000 title claims abstract description 36
- 230000008018 melting Effects 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 11
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 229920002545 silicone oil Polymers 0.000 claims description 5
- 229910021364 Al-Si alloy Inorganic materials 0.000 claims description 3
- 229910018134 Al-Mg Inorganic materials 0.000 claims description 2
- 229910018182 Al—Cu Inorganic materials 0.000 claims description 2
- 229910018467 Al—Mg Inorganic materials 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 239000011208 reinforced composite material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 8
- 239000002344 surface layer Substances 0.000 description 18
- 229910003407 AlSi10Mg Inorganic materials 0.000 description 16
- 239000010410 layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004321 preservation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229940083037 simethicone Drugs 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/64—Treatment of workpieces or articles after build-up by thermal means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for eliminating residual stress of a selective laser melting formed aluminum alloy component, which specifically comprises the following steps: (S1) immersing the selected-area laser-melted and formed aluminum alloy structural member in a low-temperature medium to sufficiently cool it; (S2) rapidly transferring the member to a high temperature medium, rapidly heating the member, and maintaining the temperature for a period of time; (S3) cooling the taken-out member in air to room temperature; (S4) repeating the operations S1-S3 cyclically. The method is suitable for the aluminum alloy member with a complex shape formed by selective laser melting, and the treated member has lower residual stress and can improve the dimensional stability of the member.
Description
Technical Field
The invention belongs to the technical field of material processing, and relates to a method for eliminating residual stress of a selective laser melting formed aluminum alloy component.
Background
With the development of modern science and technology, the demand of high-end equipment fields represented by large airplanes such as C919 and the like on large, precise and complex metal components is more and more urgent, and more rigorous requirements are provided for the performance, reliability and preparation technology of materials. The additive manufacturing forming aluminum alloy can solve the technical problem of quick manufacturing of metal components with complex shapes and high performance, wherein Selective Laser Melting (SLM) forming aluminum alloy is developed most mature and applied most widely, is becoming an effective way for solving key technical problems in the aerospace manufacturing field, and has wide application prospect.
In the SLM forming process of aluminum alloy, aluminum alloy powder is rapidly melted under the action of a high-energy laser beam, and rapidly solidified after the laser beam leaves, and due to the fact that the cooling speed difference of the upper layer, the lower layer, the inner layer and the outer layer is large, shrinkage is not coordinated due to uneven cooling, so that strain is participated in the alloy, and residual stress is formed. Because the SLM forming technology is used for rapidly melting and rapidly solidifying materials in micro-areas and the remelting phenomenon is accompanied, the distribution of the integral residual stress of the component is more complicated, but at present, the unified recognition is that the surface area of the SLM forming component has obvious residual tensile stress. Firstly, in the process of separating the SLM forming component from the substrate, the component is warped and deformed or even cracked due to the large residual tensile stress of the surface layer; secondly, the residual tensile stress of the surface layer can also obviously damage the mechanical properties of the aluminum alloy material, especially the fatigue property and plasticity of the material. The aerospace field places stringent requirements on the dimensional accuracy, stability and fatigue properties of the structure, and therefore residual stresses in SLM formed structures must be eliminated.
Currently, methods for eliminating residual stress can be roughly classified into two categories. The first is the release of residual stresses by plastic deformation, such as mechanical stretching, cold compression, vibratory deformation, surface peening, rolling, etc., which is not suitable for SLM-formed parts with complex structures; the second method is to reduce the residual stress through high-temperature heat treatment, such as preheating (200 ℃), stress-relief annealing (300 ℃) and the like, which can reduce the residual stress to a certain extent, but after the high-temperature heat treatment, the fine structure inside the SLM forming aluminum alloy is completely destroyed, the strength of the material is obviously reduced, and the material cannot play a bearing role of the structural member. Therefore, there is an urgent need to design and develop a lower temperature technology for SLM forming of aluminum alloy components to eliminate residual stress in the components, thereby meeting the needs of the aerospace field.
Disclosure of Invention
The invention aims to provide a method for eliminating the residual stress of a selective laser melting formed aluminum alloy component, and the processed component has lower residual stress, can improve the dimensional stability and better meets the application requirements in the aerospace field.
In order to achieve the purpose, the invention can be realized by the following technical scheme:
the invention relates to a method for eliminating residual stress of a selective laser melting formed aluminum alloy component, which comprises the following steps:
s1, immersing the aluminum alloy member formed by selective laser melting into a low-temperature medium, and fully cooling the aluminum alloy member;
s2, quickly transferring the component into a high-temperature medium, quickly heating the component, and keeping the temperature for a period of time;
s3, taking out the component and cooling the component to room temperature in air;
s4, repeating the operations S1-S3 circularly.
According to some embodiments of the present invention, the cryogenic medium used in step S1 is liquid nitrogen, and the member immersion time is 0.5 to 24 hours, so as to make the member inner and outer layer temperature uniform.
According to some embodiments of the present invention, the high temperature medium used in the step S2 is a liquid high temperature medium, and the temperature is 120 ℃ to 180 ℃. Specifically, the high-temperature medium used in step S2 is simethicone, and the oil temperature is 120 ℃ to 180 ℃. The invention selects the liquid heating medium, so that the heating rate of the component is greatly improved compared with that of a gaseous medium, and the local plastic deformation of the component is caused by the thermal expansion mismatching caused by the temperature difference between the inner layer and the outer layer in the rapid heating process, so as to offset the residual tensile stress formed in the selective laser melting forming process. When the oil temperature is too high, fine microstructures formed in SLM forming can be damaged, and the service performance of the component is influenced; the temperature is too low, the heat preservation temperature is not enough, and the residual stress reduction effect is weakened; therefore, the temperature is controlled to be 120-180 ℃.
According to some embodiments of the invention, the heat preservation time in the step S2 is 10min to 30 min. The heat preservation time is too short, and the residual stress is not reduced enough; too much will destroy the fine microstructure formed in the SLM forming, affecting the component performance.
According to some embodiments of the invention, the component is rapidly transferred into a high temperature medium in step S2, the transfer time not exceeding 5S. If the transfer is too slow, this corresponds to a partial temperature increase in the air, which reduces the rate of temperature increase of the component and ultimately the residual stress.
According to some embodiments of the invention, the member is rapidly heated in step S2, and the average heating rate is not lower than 30 ℃/min. The faster the temperature rise, the better, but the fastest temperature rise rate is the liquid medium at present; the residual stress is eliminated due to too slow temperature rise. Therefore, the average temperature rise rate is selected to be in the range of 30-60 deg.C/min.
According to some embodiments of the invention, the loop in step S4 is repeated 0-2 times.
The selected laser fusion-formed aluminum alloys described herein include 2xxx series Al-Cu alloys, 4xxx series Al-Si alloys, 5xxx series Al-Mg alloys, 7xxx series Al-Zn- (Mg) - (Cu) alloys, and corresponding particle-reinforced composites. Preferred are 4 xxx-series Al-Si alloys and corresponding particle-reinforced composites.
Compared with the prior art, the invention has the beneficial effects that:
1) the aluminum alloy component formed by selective laser melting is quickly transferred into a high-temperature medium after being fully soaked at low temperature, and the component is locally subjected to plastic deformation by utilizing thermal expansion mismatching caused by the temperature difference between the inner layer and the outer layer in the quick heating process, so that the residual tensile stress formed in the selective laser melting forming process is offset; during the subsequent holding time, the residual stress is released by the restoring action, so that the residual stress in the component is finally greatly reduced.
2) In the whole process, the heating temperature of the component is not more than 180 ℃, a fine organization structure in the aluminum alloy formed by selective laser melting can be retained to the greatest extent, and the mechanical property of the material is ensured, so that the application requirement in the aerospace field is met.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic view showing the temperature change of a member with time in a method for eliminating the residual stress of a selected laser melting formed aluminum alloy member according to the present invention.
Detailed Description
The present invention will be described in detail with reference to examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be apparent to those skilled in the art that several modifications and improvements can be made without departing from the inventive concept. All falling within the scope of the present invention.
Example 1
The embodiment provides a method for eliminating residual stress of a selected area laser melting formed aluminum alloy component, wherein the schematic diagram of the temperature change of the component along with time in the method is shown in FIG. 1; the method comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) rapidly transferring the member into dimethyl silicone oil at 180 ℃, rapidly heating the member, and keeping the temperature for 30 min;
(S3) the taking-out member is cooled to room temperature in air.
In step S2, the transfer time is 3S, and the average temperature rise rate is 52 ℃/min.
The residual stress before and after the treatment of the AlSi10Mg alloy component formed by selective laser melting was measured by an X-ray stress analyzer (equipment model: iXRD), and the results showed that the residual tensile stress of the surface layer of the component before the treatment reached 189 + -6 MPa and the residual tensile stress of the surface layer after the treatment was reduced to 36 + -4 MPa.
Example 2
The embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting, which comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) rapidly transferring the member into dimethyl silicone oil at 150 ℃, rapidly heating the member, and keeping the temperature for 30 min;
(S3) cooling the taken-out member in air to room temperature;
(S4) repeating the operations S1-S3 1 time.
In step S2, the transfer time is 3S, and the average temperature rise rate is 38 ℃/min.
The residual stress of the AlSi10Mg alloy component formed by selective laser melting was measured by an X-ray stress analyzer (equipment model: iXRD), and the results showed that the residual tensile stress of the surface layer of the component before treatment was 205 + -5 MPa, and the residual tensile stress of the surface layer after treatment was reduced to 10 + -3 MPa.
Example 3
The embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting, which comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) rapidly transferring the component into dimethyl silicone oil at 150 ℃, rapidly heating the component, and keeping the temperature for 10 min;
(S3) cooling the taken-out member in air to room temperature;
(S4) repeating the operations S1-S3 2 times.
In step S2, the transfer time is 3S, and the average temperature rise rate is 36 ℃/min.
The residual stress of the AlSi10Mg alloy component formed by selective laser melting was measured by an X-ray stress analyzer (equipment model: iXRD), and the results show that the residual tensile stress of the surface layer of the component before treatment reaches 208 +/-9 MPa, and the residual tensile stress of the surface layer after treatment is reduced to 26 +/-4 MPa.
Example 4
The embodiment provides a method for eliminating residual stress of an aluminum alloy component formed by selective laser melting, which comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 2 hours;
(S2) rapidly transferring the member into dimethyl silicone oil at 120 ℃, rapidly heating the member, and keeping the temperature for 30 min;
(S3) cooling the taken-out member in air to room temperature;
(S4) repeating the operations S1-S3 2 times.
In step S2, the transfer time is 3S, and the average temperature rise rate is 31 ℃/min.
The residual stress of the AlSi10Mg alloy component formed by selective laser melting was measured by an X-ray stress analyzer (equipment model: iXRD), and the results show that the residual tensile stress of the surface layer of the component before treatment reaches 194 +/-7 MPa, and the residual tensile stress of the surface layer after treatment is reduced to 32 +/-2 MPa.
For comparison with the examples, the following comparative examples are provided to highlight the beneficial effects of the method for eliminating residual stress of a selected-area laser-melted formed aluminum alloy component provided by the present invention.
Comparative example 1
The method comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) the taking-out member is returned to room temperature in the air.
An X-ray stress analyzer (equipment model: iXRD) is used for testing the residual stress of the AlSi10Mg alloy member formed by selective laser melting before and after treatment, and the result shows that the residual tensile stress of the surface layer of the member before treatment reaches 182 +/-3 MPa, and the residual tensile stress of the surface layer after treatment is 179 +/-10 MPa, and the residual stress is basically unchanged. Indicating that cryogenic treatment in liquid nitrogen alone does not reduce residual stress.
Comparative example 2
The method comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) the member was quickly transferred to 180 ℃ dimethylsilicone oil to be quickly heated, but the member was immediately taken out after leaving for only 5min and returned to room temperature in the air.
In step S2, the transfer time is 3S, and the average temperature rise rate is 52 ℃/min.
An X-ray stress analyzer (equipment model: iXRD) is used for testing the residual stress of the AlSi10Mg alloy member formed by selective laser melting before and after treatment, and the result shows that the residual tensile stress of the surface layer of the member before treatment reaches 204 +/-8 MPa, and the residual tensile stress of the surface layer after treatment is 116 +/-5 MPa, so that the residual stress is reduced, but the elimination effect is not ideal. It is explained that the residual stress can be reduced to some extent by performing only the rapid temperature rise treatment, but the effect is not significant.
Comparative example 3
The method comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 30 min;
(S2) transferring the member to an air heating furnace at 180 ℃ to slowly raise the temperature and keep the temperature for 30 min;
(S3) the taking-out member is cooled to room temperature in air.
In step S2, the transfer time is 3S, and the average temperature rise rate is 15 ℃/min.
An X-ray stress analyzer (equipment model: iXRD) is used for testing the residual stress of the AlSi10Mg alloy member formed by selective laser melting before and after treatment, and the result shows that the residual tensile stress of the surface layer of the member before treatment reaches 184 +/-5 MPa, and the residual tensile stress of the surface layer after treatment is 124 +/-3 MPa, so that the residual stress is reduced, but the elimination effect is not ideal. The slow heating and heat preservation treatment can reduce the residual stress to a certain extent, but the effect is not obvious.
Comparative example 4
The method comprises the following specific steps:
(S1) immersing the selected area laser-melted and formed AlSi10Mg alloy structural member in liquid nitrogen for 12 hours;
(S2) rapidly transferring the member to a steam box at 150 ℃ to rapidly heat the member and keep the temperature for 3 hours;
(S3) the taking-out member is cooled to room temperature in air.
In step S2, the transfer time is 2min, and the average temperature rise rate is 12 ℃/min.
The residual stress of the AlSi10Mg alloy component formed by selective laser melting was measured by an X-ray stress analyzer (equipment model: iXRD), and the results showed that the residual tensile stress of the surface layer of the component before treatment reached 211 + -5 MPa, and the residual tensile stress of the surface layer after treatment was reduced to 130 + -6 MPa.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (8)
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| CN116532666A (en) * | 2023-04-13 | 2023-08-04 | 成都飞机工业（集团）有限责任公司 | Post-treatment method for improving quality of laser selective melting forming high-strength aluminum alloy |
| DE102023119757A1 (en) * | 2023-07-26 | 2024-06-06 | Bundesrepublik Deutschland, vertr. durch das Bundesministerium der Verteidigung, vertr. durch das Bundesamt für Ausrüstung, Informationstechnik und Nutzung der Bundeswehr | Process for reducing residual stresses in a 3D metal component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115141989A (en) * | 2022-06-17 | 2022-10-04 | 中国航发北京航空材料研究院 | A method for improving the strength of laser selective melting of AlSi10Mg alloy |
| CN115141989B (en) * | 2022-06-17 | 2024-12-17 | 中国航发北京航空材料研究院 | Method for improving strength of AlSi10Mg alloy melted by laser selective area |
| CN116532666A (en) * | 2023-04-13 | 2023-08-04 | 成都飞机工业（集团）有限责任公司 | Post-treatment method for improving quality of laser selective melting forming high-strength aluminum alloy |
| DE102023119757A1 (en) * | 2023-07-26 | 2024-06-06 | Bundesrepublik Deutschland, vertr. durch das Bundesministerium der Verteidigung, vertr. durch das Bundesamt für Ausrüstung, Informationstechnik und Nutzung der Bundeswehr | Process for reducing residual stresses in a 3D metal component |
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Application publication date: 20211022 |