CN113518512B - Electronic device welding method and circuit board welding equipment - Google Patents

Abstract

The present application is applicable to the technical field of electronic devices, and provides a welding method for electronic devices and circuit board welding equipment. The method includes: brushing solder paste on a circuit board; attaching an electronic device to the circuit board on which the solder paste has been brushed; Fix the mounted circuit board on a heating platform; fix the electronic device so that the electronic device is stationary relative to the circuit board; use the heating platform to heat the circuit board to realize the welding of the electronic device on the circuit board. The embodiments of the present application can improve the positional accuracy of the electronic components of the circuit board, so that the offset of the electronic components of the circuit board is as small as possible, and can improve the yield of shipments.

Description

Welding method of electronic device and circuit board welding equipment

technical field

The present application belongs to the technical field of electronic devices, and more particularly, relates to a welding method for electronic devices and circuit board welding equipment.

Background technique

The traditional LED (Light-Emitting Diode, light-emitting diode) welding process is: brush solder paste on the pads of the circuit board; position and mount the LED on the circuit board through a placement machine; send the circuit board with the LED attached to the reflow The soldering furnace melts and solidifies the tin to complete the soldering of the LED and the circuit board.

The above-mentioned traditional process, due to uneven temperature, there is a difference in the melting time of tin, or the circuit board is not flat, or the tension is excessive or insufficient due to more tin and less tin, which often leads to serious or slight deviation of some LEDs. Backlight effect of small and medium size LED display. Due to the inability to overcome the above-mentioned defects, the deviation of no more than 0.1mm is regarded as an acceptable standard in the industry. However, in actual production, the proportion of LED offsets exceeding 0.1mm varies from 10% to 60% after the reflow oven for circuit products, which can be shipped after manual repair. Due to the difference in the experience and quality of the repair personnel, the defect rate of each factory varies greatly.

The disclosure of the above background technology content is only used to assist the understanding of the inventive concept and technical solution of the present application, and it does not necessarily belong to the prior art of the present application. In this case, the above background art should not be used to evaluate the novelty and inventive step of the present application.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a welding method for electronic devices and circuit board welding equipment, which can improve the positional accuracy of the electronic devices on the circuit board, make the deviation of the electronic devices on the circuit board as small as possible, and improve the shipment yield.

In a first aspect, embodiments of the present application provide a method for soldering an electronic device, the method comprising:

Brush solder paste on the circuit board;

Mount the electronic device on the circuit board that has been brushed with solder paste;

Fixing the printed circuit board on the heating platform;

Fixing the electronic device so that the electronic device is stationary relative to the circuit board;

The circuit board is heated by using the heating platform to realize the soldering of the electronic device to the circuit board.

Optionally, the use of the heating platform to heat the circuit board to realize the welding of the electronic device to the circuit board includes:

Raising the temperature of the heating platform to a preset upper limit temperature to melt the solder paste;

The temperature of the heating platform is lowered to a preset lower limit temperature, so that the melted solder paste is solidified, and the electronic device is soldered to the circuit board.

Optionally, the fixing of the electronic device so that the electronic device is stationary relative to the circuit board includes:

Use a mold capable of forming the first clamping space;

The electronic device is secured in the first clamping space.

Optionally, the method uses a mold comprising a bottom mold, a first mold half, and a second mold half;

The bottom mold includes a heating platform and a positioning part;

The first half-mould includes a first clamping portion and is adapted to be disposed on the bottom mold, the first clamping portion includes a first wall, and the first half-mould can move relative to the bottom mold so that the the first wall of the first clamping part is located at a designated position;

The second mold half includes a second clamping portion, the second clamping portion includes a second wall, and the second mold half is movable relative to the first mold half so that the second clamping portion is The second wall and the first wall of the first clamping portion form a first clamping space.

Optionally, the fixing of the electronic device so that the electronic device is stationary relative to the circuit board includes:

The first half-mould is placed on the circuit board, and the first half-mould is moved relative to the bottom mould along a first specified direction, so that the first wall of the first clamping part is connected to the electronic device part of the contact;

The second half-mould is placed on the bottom mould, and the second half-mould is moved relative to the first half-mould along a second specified direction, so that the second wall of the second clamping part is connected to the electronic device another part of the contact.

Optionally, the method further includes:

moving the first mold half relative to the bottom mold in a third designated direction so that the first wall of the first clamping portion is released from contact with a portion of the electronic device;

The second mold half is moved relative to the first mold half in a fourth designated direction so that the second wall of the second clamping portion is released from contact with another portion of the electronic device.

Optionally, the placing the first mold half on the circuit board includes:

Keep the first wall of the first clamping part at a distance greater than zero from the edge of the electronic device in the first direction, and lower the first half-mold to the circuit board perpendicular to the first direction .

Optionally, the placing the second mold half on the bottom mold includes:

keeping the second wall of the second clamping part at a distance greater than zero from the edge of the electronic device in the first direction, and lowering the second half-mold perpendicular to the first direction to the The first half.

Optionally, the placing the second mold half on the bottom mold includes: placing the second clamping part of the second mold half into the first clamping part of the first mold half .

In a second aspect, the embodiments of the present application provide a circuit board welding device, which is used to implement any of the methods described above.

In a third aspect, embodiments of the present application provide a mold for an electronic device, the mold comprising:

Bottom mold, including heating platform and positioning part;

A first mold half includes a first clamping portion and is adapted to be disposed on the bottom mold, the first clamping portion includes a first wall, and the first mold half can move relative to the bottom mold so that the the first wall of the first clamping part is located at the designated position;

The second mold half includes a second clamping portion, the second clamping portion includes a second wall, and the second mold half is movable relative to the first mold half so that the first mold half of the second clamping portion is The two walls and the first wall of the first clamping portion form a first clamping space.

Optionally, the bottom mold further includes a plurality of limiting portions; the plurality of limiting portions enclose an inner groove suitable for placing the first half-mold and the second half-mold.

Optionally, the first clamping portion is a limiting groove, and the second clamping portion is an insert; the insert can be inserted into the limiting groove.

Optionally, the top of the insert is provided with a step, and the wall of the step can form the first clamping space with the first wall of the first clamping part.

Optionally, the outer contour size of at least a part of the first mold half and the outer contour size of at least a part of the second mold half are both smaller than the inner contour size of at least a part of the inner groove, and the second mold half has an outer contour size. A mold half is adapted to be provided on the first mold half.

Optionally, a spacer adapted to be disposed in the first clamping space is also included.

Optionally, the number of the first clamping parts is multiple, and the first clamping parts are arranged in parallel to each other; the number of the second clamping parts is multiple, and the second clamping parts are each arranged in parallel. arranged parallel to each other.

Optionally, the first mold half further includes a first surface, and the thickness direction of the first clamping portion is perpendicular to the first surface;

The second mold half further includes a second surface, and the thickness direction of the second clamping portion is perpendicular to the second surface;

The bottom mold further includes a third surface; the plurality of limiting parts are arranged perpendicular to the third surface.

Optionally, the first half-mould is flat; the second half-mould is adapted to compress the first half-mould.

In a fourth aspect, the embodiments of the present application provide a circuit board welding device, which includes the mold described in any one of the above.

The beneficial effects that the embodiments of the present application have compared with the prior art are:

Fix the circuit board that has been brushed with solder paste and mounted on the heating platform, and then fix the electronic components of the circuit board so that the electronic components are stationary relative to the circuit board, and then heat the circuit board through the heating platform to melt the solder paste of the circuit board. During the process of melting the solder paste until the solder paste is cooled, the position of the fixed electronic device remains unchanged relative to the circuit board, which can improve the positional accuracy of the electronic device on the circuit board and make the deviation of the electronic device on the circuit board as small as possible. , can improve the shipment yield.

Some possible implementations of the embodiments of the present application have the following beneficial effects:

The first clamping space is formed by moving in the first direction and lowering the first half-mold and the second half-mold perpendicular to the first direction, which can fix multiple electronic devices at one time, avoid damage to the electronic devices, and ensure multiple electronic devices. linear accuracy.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present application. For some embodiments of the present invention, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

FIG. 1 is a schematic flowchart of a welding method for an electronic device provided by an embodiment of the present application;

FIG. 2 is a schematic flowchart of a modification of the welding method for electronic devices provided by the embodiments of the present application;

3 is a three-dimensional structural diagram of a mold for an electronic device provided by an embodiment of the present application;

Fig. 4 is an exploded exploded structural view of the mold of the electronic device provided by the embodiment of the application;

Fig. 5 is another exploded exploded structural diagram of the mold of the electronic device provided by the embodiment of the application;

6 is a three-dimensional structural diagram of a bottom mold provided by an embodiment of the application;

7 is a front view of a bottom mold provided by an embodiment of the application;

FIG. 8 is a front view of a first mold half provided by an embodiment of the present application;

Fig. 9 is the enlarged view of A area in Fig. 8;

Figure 10 is a bottom view of the first half-mould of Figure 8;

FIG. 11 is a three-dimensional structural diagram of a second mold half provided by an embodiment of the application;

FIG. 12 is a front view of the second mold half provided by the embodiment of the application;

Figure 13 is an enlarged view of region B in Figure 12;

FIG. 14 is a working state diagram of a mold for an electronic device provided by an embodiment of the present application.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings 1 to 14 and the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the application and simplifying the description, rather than indicating or implying the indicated A device or element must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

Embodiments of the present application provide a method for soldering an electronic device, which is used for soldering an electronic device such as an LED (Light-Emitting Diode, light-emitting diode) to a circuit board.

Referring to FIG. 1 , the welding method provided by the embodiments of the present application includes steps S1 to S5 .

Step S1, brushing solder paste on the circuit board.

Circuit boards usually have pads, and solder paste should be brushed on the pads before mounting electronic devices on the circuit board, so that the electronic devices can be soldered to the circuit board through the solder paste later.

In step S2, the electronic device is mounted on the circuit board that has been brushed with solder paste.

After brushing the solder paste on the circuit board, mount the electronic device on the circuit board after brushing the solder paste, such as positioning and mounting LEDs on the circuit board by a placement machine.

Step S3, fixing the mounted circuit board on the heating platform.

After the electronic components are mounted on the circuit board, the mounted circuit board is fixed on the heating platform. The heating platform is used to heat the circuit board to melt the solder paste of the circuit board.

Step S4, fixing the electronic device so that the electronic device is stationary relative to the circuit board.

After fixing the circuit board on the heating platform, fix electronic devices such as LEDs. Specifically, clamps or clamping devices can be used to clamp the electronic devices, so that when the circuit board is subsequently heated to melt the solder paste, the position of the electronic device remains unchanged relative to the circuit board. .

Step S5, using a heating platform to heat the circuit board to realize the soldering of the electronic device to the circuit board.

After fixing the electronic device, start the heating platform to heat the circuit board. In this process, the temperature of the heating platform rises to the preset upper limit temperature, the solder paste of the circuit board is melted, and then the temperature of the heating platform drops to the preset lower limit temperature, so that the melted solder paste solidifies, and the electronic device is soldered to the circuit board. . In this way, the soldering of the electronic device is completed after one heating and one cooling.

As can be seen from the above, the circuit board that has been brushed with solder paste and mounted is fixed on the heating platform, then the electronic components of the circuit board are fixed, so that the electronic components are stationary relative to the circuit board, and then the circuit board is heated through the heating platform to make the tin of the circuit board. The paste melts. During the process of melting the solder paste until the solder paste cools, the position of the fixed electronic device remains unchanged relative to the circuit board, which can improve the positional accuracy of the electronic device on the circuit board and make the electronic device on the circuit board biased. As small as possible, it can improve the yield of shipments, and has low requirements for placement accuracy, allowing the use of low-precision and low-cost placement machines, making the cost of expansion low. In addition, since the position of the electronic device remains unchanged relative to the circuit board during the entire soldering process, the heating platform only needs to be heated up and cooled down once. The number of times of cooling can greatly reduce the cost.

In some embodiments, the aforementioned step S4 (fixing the electronic device so that the electronic device is stationary relative to the circuit board) includes: using a mold capable of forming a first clamping space; and fixing the electronic device in the first clamping space.

The welding method provided by the embodiment of the present application uses the mold provided by the embodiment of the present application, and the mold is specifically a mold for an electronic device.

Embodiments of the present application provide a mold for an electronic device, and the mold is used for soldering a circuit board mounted with an electronic device. In this embodiment, the electronic device is an LED (Light-Emitting Diode, light-emitting diode) that can be mounted on a circuit board.

Referring to FIG. 3 , the mold provided by the embodiment of the present application includes a first mold half 1 , a second mold half 2 and a bottom mold 3 . Both the first mold half 1 and the second mold half 2 are set on the bottom mold 3, for example: the first mold half 1 is placed on the surface of the bottom mold 3, and the second mold half 2 is placed on the surface of the first mold half 1; or , the first half mold 1 and the second half mold 2 are both placed on the surface of the bottom mold 3 .

In some embodiments, referring to FIGS. 4 to 7 , the bottom mold 3 is made of high-hardness mold steel. The bottom mold 3 includes a heating platform 31 and a positioning portion 32 .

The heating platform 31 is used for carrying and heating the circuit board. Exemplarily, the heating platform 31 is an aluminum heating platform with a built-in heating tube and an external high-precision temperature controller, so as to realize temperature control when melting and cooling the solder paste.

Referring to FIG. 6 and FIG. 7 , the positioning portion 32 is designed to match the circuit board. In some embodiments, the positioning portion 32 is a positioning post. The positioning portion 32 (positioning column) is used to limit the displacement of the circuit board on the bottom mold 3 ; for example, each positioning column is provided around the heating platform 31 .

Referring to FIG. 8 to FIG. 10 , the material of the first half mold 1 is high-hardness mold steel or hardened porcelain. Referring to FIG. 8 , the first half-mould 1 includes a first clamping part 11 , specifically, a first clamping part 11 is provided in the middle of the first half-mould 1 . The first clamping portion 11 is a limit slot designed to match the position of an electronic device (such as an LED); wherein, referring to FIG. 8 and FIG. 10 , the first clamping portion 11 (ie, the limit slot) is hollow and penetrates through The thickness direction of the first half mold 1; the number of limit slots is determined by the number of rows of electronic devices (such as LEDs) on the circuit board. One limit slot corresponds to a row of electronic devices (such as LEDs), which can be one or more Limit slot, such as dozens of hollow limit slots; the size of the limit slot is larger than the size of the electronic device, so that the limit slot can accommodate the electronic device and leave room for movement. For example, the length and width of the limit slot exceed The overall size of a single row of LEDs is such that the first half-mould 1 will not damage the LEDs during vertical movement up and down. In some other embodiments, the number of the limiting slots is determined by the number of electronic devices (such as LEDs) on the circuit board, and one limiting slot corresponds to one electronic device (such as LEDs).

Referring to FIG. 9 , the first clamping portion 11 includes a first wall 111 ; for the aforementioned limiting groove, the first wall 111 is the inner wall of the limiting groove.

Referring to FIG. 4 , the first half mold 1 and the bottom mold 3 are separable. The circuit board mounted with electronic devices (such as LED) is placed on the bottom mold 3, and the first half mold 1 is suitable for being set on the bottom mold 3, so that a first clamping part 11 of the first half mold 1 (limiting slot) can cover a row of electronic devices (such as LEDs) located in the bottom mold 3 . The first half mold 1 can move relative to the bottom mold 3 so that the first wall 111 of the first clamping part 11 is located at a specified position, wherein the specified position is the position for clamping electronic devices (such as LEDs) subsequently.

Referring to FIGS. 11 to 13 , the second half-mold 2 includes a second clamping part 21 and a second outer frame 22 . The second clamping part 21 is an insert, such as a precision insert, which is made of die steel or hardened ceramic. The material of the second outer frame 22 is high-hardness die steel, which is the main body of the second half-die 2 .

Referring to FIG. 11 , the number of the second clamping parts 21 (such as inserts) is determined by the number of rows of electronic devices (such as LEDs) on the circuit board, and one insert corresponds to one row of electronic devices (such as LEDs) on the circuit board, which can be One or more, such as dozens of precision inserts. The size of the insert (ie the second clamping part 21 ) is smaller than the size of the limiting groove (ie the first clamping part 11 ), so that the insert can be placed in the limiting groove and can move in the limiting groove, such as The length and width of the insert is smaller than the length and width of the limit groove. In some other embodiments, the number of inserts is determined by the number of electronic devices (such as LEDs) on the circuit board, and one insert corresponds to one electronic device (such as LEDs).

Referring to FIG. 13 , the second clamping portion 21 includes a second wall 211 . For the aforementioned insert, the second wall 211 is the wall of the insert.

Referring to FIG. 4 and FIG. 5 , the second half mold 2 is provided on the bottom mold 3 . As mentioned above, the first half mold 1 is also set on the bottom mold 3. Referring to FIG. 14 , the second half mold 2 can move relative to the first half mold 1 so that the second wall 211 of the second clamping part 21 is connected to the first half mold 2 . The first wall 111 of a clamping portion 11 forms a first clamping space 100 , so that electronic devices (such as LEDs) of the circuit board are clamped in the first clamping space 100 .

During production, the bottom mold 3 of the mold is installed on a platform (such as a base) to be fixed and fixed. Referring to FIG. 4 to FIG. 6 , place the entire circuit board with electronic devices (such as LEDs) mounted on the bottom mold 3 , specifically, the positioning holes of the circuit board pass through the positioning posts of the bottom mold 3 (that is, the positioning portion 31 ) , to achieve the positioning of the circuit board, so that the circuit board will not be offset. At this time, the circuit board is located just above the heating platform 32 of the bottom mold 3 . The first half-mold 1 is placed on the bottom mold 3 so that the first half-mold 1 serves as the limiting groove of the first clamping part 11 to cover the electronic device of the circuit board, or in other words, the limiting groove surrounds the electronic device. The first half mold 1 moves horizontally relative to the bottom mold 3 along a first specified direction, such as the 12 o'clock direction, so that the first wall 111 of the first clamping portion 11 is located at a specified position. At the aforementioned designated position, the inner wall of the first wall body 111 bears against the electronic device (eg, LED). Then, the second mold half 2 is placed on the first mold half 1 , referring to FIG. 14 , so that the second clamping part 21 of the second mold half 2 is inserted into the first clamping part 11 of the first mold half 1 . Referring to FIG. 14 , the second half-mould 2 moves horizontally relative to the first half-mould 1 along a second specified direction, such as the 6 o’clock direction, until it cannot move, so that the second wall 211 of the second clamping part 21 is connected to the electronic device. (eg LED) contact, at this time, the second wall 211 of the second clamping part 21 and the first wall 111 of the first clamping part 11 form the first clamping space 100 . Referring to FIG. 14 , electronic devices (such as LEDs) of the circuit board are clamped in the first clamping space 100 . The first half mold 1 and the second half mold 2 are locked to the bottom mold 3, so that the electronic device (such as LED) is fixed relative to the circuit board. In this way, the first half-mold 1, the second half-mold 2 and the bottom mold 3 can be linked in sequence to realize the precise positioning of the LEDs, and the bottom of the mold is equipped with a heating structure (heating platform 32), which can realize tin melting and welding, and the solder paste During the process of melting until the solder paste is cooled, the position of the fixed electronic device remains unchanged relative to the circuit board, which can improve the positional accuracy of the electronic device on the circuit board and make the deviation of the electronic device on the circuit board as small as possible.

In some embodiments, referring to FIGS. 4 and 6 , the bottom mold 3 further includes a limiting portion 33 , such as a plurality of limiting portions 33 . Referring to FIG. 7 , each limiting portion 32 encloses an inner groove 300 for placing the first half-mold 1 and the second half-mold 2 . In this way, both the first half-mould 1 and the second half-mould 2 can be placed in the inner groove 300 . Correspondingly, referring to FIG. 8 , the first half mold 1 further includes a first limit contact portion 13 , and with reference to FIG. 11 , the second mold half further includes a second limit contact portion 23 , the first limit contact portion 13 and the second limit contact portion 13 . The number of limit contact parts 23 can be one or more; when the first half mold 1 moves horizontally with respect to the bottom mold 3 along a specified direction (such as the first specified direction) for a certain displacement, referring to FIG. The contact part 13 is in contact with the limit part 33 of the bottom mold 3, and the first half mold 1 can no longer move horizontally relative to the bottom mold 3 in the specified direction, so as to realize the limit of the first half mold 1; After the mold 2 moves horizontally relative to the bottom mold 3 in a specified direction (such as the second specified direction) for a certain displacement, at least one second limit contact portion 23 contacts the limit portion 33 of the bottom mold 3, and the second half mold 2 cannot be used at this time. Then move horizontally relative to the bottom mold 3 along the specified direction, so as to realize the limit of the second half mold 2 .

The inner groove 300 is used to limit the displacement of the circuit board in the inner groove 300 of the bottom mold 3 . The depth of the inner groove 300 is determined by the thicknesses of the first half-mould 1 and the second half-mould 2 , so as to limit the horizontal movement range of the first half-mould 1 and the second half-mould 2 .

In some embodiments, referring to FIG. 8 , the number of the first clamping parts 11 is multiple, and the first clamping parts 11 of the first half-mold 1 are arranged in parallel to each other; referring to FIG. 12 , the second clamping parts 21 The number is multiple, and the second clamping parts 21 of the second half-mould 2 are arranged in parallel with each other; with reference to FIG. 8 and FIG. perpendicular to the first surface 101; referring to FIG. 11 and FIG. 12, the second half mold 2 further includes a second surface 201, and the thickness direction of the second clamping part 21 is perpendicular to the second surface 201; referring to FIG. 7, the bottom mold 3 also includes The third surface 301 is included, and each limiting portion 33 is arranged perpendicular to the third surface 301 . In this way, the first clamping space 100 can be formed by vertically descending and horizontally moving the first half-mould 1 and the second half-mould 2 , which can fix multiple electronic devices at one time, avoid damage to the electronic devices, and ensure multiple electronic devices. linear accuracy.

Referring to FIG. 4 , the outer dimensions of the first half-mold 1 and the second half-mold 2 are both smaller than those of the inner groove 300 ; for example, the outer dimensions of at least a part of the first half-mold 1 and the second half-mold 2 The outer contour size of at least a part of the inner groove 300 is smaller than the inner contour size of at least a part of the inner groove 300; in this way, after the first half mold 1 and the second half mold 2 are placed in the inner groove 300 of the bottom mold 3, the first half mold 1 and the second half mold 2 have space for movement, and can move relative to the bottom mold 3 for a limited displacement.

Referring to FIG. 4 , the second half-mould 2 is adapted to be arranged on the first half-mould 1 . The first half mold 1 is placed on the bottom mold 3 to press the circuit board, and the second half mold 2 is placed on the first half mold 1 to press the first half mold 1 . Illustratively, the first half-mold 1 is flat, which facilitates the cooperation between the first half-mold 1 , the second half-mold 2 and the bottom mold 3 , for example, for the second half-mold 2 to press the first half-mold 1 .

In some embodiments, referring to FIGS. 12 and 13 , a step 212 is provided at the top of the insert 21 (ie, the second clamping part 21 ), and the insert 21 is inserted into the first clamping part 11 (ie, the limiting groove). 11), the wall of the step 212 and the first wall 111 of the first clamping portion 11 can form the first clamping space 100 .

The size of the step 212 of the insert 21 is designed to match the size of the electronic device (eg LED) used in the production. The step 212 protrudes beyond the second outer frame 22 , and the specific protruding height is close to the thickness of the first half-mold 1 .

In some embodiments, referring to FIG. 14 , the mold for the electronic device provided by the embodiments of the present application further includes a spacer 4 suitable for being disposed in the first clamping space 100 . The spacer 4 may be a micron-scale steel spacer. The spacer 4 is used to adjust the spacing of the inserts 21 to match the tolerance of the limiting groove 11 of the first half-mould 1, so that the deviation of the electronic device (such as a single row of LEDs) after the soldering is completed reaches a high precision standard that is infinitely close to zero .

Based on the molds provided by the embodiments of the present application, the welding methods provided by the embodiments of the present application are specifically implemented as follows.

Step S3 (fixing the mounted circuit board on the heating platform) specifically includes:

Referring to FIG. 4 to FIG. 6 , place the entire circuit board with the LED mounted in the inner groove 300 of the bottom mold 3, and the positioning holes on the circuit board pass through the positioning posts 32 of the inner groove 300 to realize the positioning of the circuit board. So that the position of the circuit board will not be offset.

Step S4 (fixing the electronic device so that the electronic device is stationary relative to the circuit board) includes steps S41 and S42.

Step S41 , placing the first half-mould 1 on the circuit board, and moving the first half-mould 1 relative to the bottom mould 3 along the first specified direction, so that the first wall 111 of the first clamping part 11 is in contact with a part of the electronic device.

Referring to FIG. 5 , after the circuit board is fixed on the heating platform, the first half mold 1 is lowered into the inner groove 300 of the bottom mold 3 to place the first half mold 1 on the circuit board. Wherein, placing the first mold half 1 on the circuit board specifically includes: keeping the first wall 111 of the first clamping portion 11 at a distance greater than zero from the edge of the electronic device in a first direction, such as a horizontal direction, and placing the first The mold half 1 is vertically lowered to the circuit board in the first direction; for example, the first mold half 1 is vertically lowered into the inner groove 300 of the bottom mold 3 with the horizontal center position of the LED as the center (or the reference), and the circuit board is pressed so that the The circuit board is in close contact with the heating platform 31 at the bottom of the bottom mold 3 . Then, the first half-mould 1 is moved horizontally in the direction of 12 o'clock until the side of the first half-mould 1 is unable to move against the inner wall of the inner groove 300, and the first half-mould 1 is locked, so that the first half-mould 1 is kept at this The position does not move, and at this time, the first wall body 111 is in contact with a part of the electronic device.

Step S42, placing the second mold half 2 on the bottom mold 3, and moving the second mold half 2 relative to the first mold half 1 along the second specified direction, so that the second wall 211 of the second clamping part 21 is connected to the electronic device. another part of the contact.

Referring to FIG. 5 , after fixing the first mold half 1 to the bottom mold 3, place the second mold half 2 on the bottom mold 3: the second wall 211 of the second clamping part 21 is aligned in a first direction such as a horizontal direction with The edge of the electronic device is kept at a distance greater than zero, and the second half-mould 2 is vertically lowered to the first half-mould 1, so that the second clamping part 21 of the second half-mould 2 is put into the first clamping part of the first half-mould 1 In part 11; for example, based on the edge of the limiting groove 11 of the first half-mould 1 away from the LED, the second half-mould 2 descends vertically and is closely attached to the first half-mould 1. At this time, the second half-mould 2 is The insert 21 penetrates into the limiting groove 11 of the first half-mold 1 . Then, the second half-mould 2 is moved horizontally in the direction of 6 o'clock until it cannot move, and it remains locked in this position. At this time, referring to FIG. 14 , the LED of the circuit board is clamped in the middle position by one side of the limiting groove 11 of the first half-mould 1 and the step 212 at the top of the insert 21 of the second half-mould 2, and the first half One side of the limiting groove 11 of the mold 1 and the wall of the step 212 at the top of the insert 21 of the second half-mold 2 form the first clamping space 100, and the second wall 211 is in contact with another part of the electronic device. Then, the heating platform 31 at the bottom of the bottom mold 3 is controlled by the temperature controller to start to heat up to the set temperature, and the solder paste of the circuit board is melted and connected to the solder pins of the LED. The temperature of the heating platform 31 starts to cool after the heating is completed, and the soldering of the LED and the circuit board can be completed after the solder paste is solidified.

Referring to FIG. 2 , the welding method provided by the embodiment of the present application further includes step S6 and step S7.

Step S6 , move the first half-mold 1 relative to the bottom mold 3 along the third specified direction, so that the first wall 111 of the first clamping portion 11 is released from contact with a part of the electronic device.

After the soldering of the circuit board is completed in the front, the pressing of the first half-mold 1 and the second half-mold 2 to the circuit board is released, and the first half-mold 1 is moved horizontally relative to the bottom mold 3 along the third specified direction, wherein the third specified The direction is the opposite direction to the first specified direction, so that the first wall 111 of the first clamping part 11 of the first half-mold 1 is separated from the electronic device.

Step S7, move the second half-mould 2 relative to the first half-mould 1 along the fourth specified direction, so that the second wall 211 of the second clamping part 21 is released from contact with another part of the electronic device.

After the first wall 111 is separated from the electronic device, the second half mold 2 is moved horizontally relative to the bottom mold 3 in a fourth specified direction, wherein the fourth specified direction is the opposite direction to the second specified direction, so that the second half The second wall 211 of the second clamping portion 21 of the mold 2 is separated from the electronic device.

That is to say, after the soldering of the circuit board is completed, the pressing of the first half-mould 1 and the second half-mould 2 to the circuit board is released, and the first half-mould 1 and the second half-mould 2 move in reverse and horizontally in sequence to release the Fixing of the LEDs, then the first half-mould 1 and the second half-mould 2 rise. In this way, the soldered circuit board can be taken out for subsequent processes such as inspection.

The embodiments of the present application also provide a circuit board welding device, which includes the above-mentioned mold and can implement the methods of the embodiments of the present application.

Compared with the current reflow soldering furnace process, the advantages of the soldering method provided by the embodiments of the present application are as follows.

1. The LED position offset is small, the offset can be infinitely close to 0, and the linear accuracy is high.

2. The circuit products can be welded and formed at one time, no manual repair is required, the delivery efficiency is higher, and the overall production cost can be reduced.

3. The current reflow oven process takes 2-3 minutes from the placement of the circuit board to the completion of the soldering outflow (this time is determined by the number of temperature zones equipped in the reflow oven and the moving speed of the conveyor belt). The time for the LED to pass through the peak temperature zone (melting tin welding temperature zone) is basically 15-30 seconds, plus the time of the previous high temperature preheating zone (lower than the peak temperature zone), the LED will experience a high temperature environment above 150 degrees. time is more than 1 minute.

The method provided by the embodiment of the present application adopts the method of platform heating, and the overall time from placing the circuit board to the completion of welding and taking out does not exceed 1 minute (this time is determined by the moving speed set by the equipment in use and the structural design of the heating platform) , the time of the peak temperature (the time for the heating platform to rise from the lower limit temperature to the upper limit temperature, and then cool down to the lower limit temperature) is not more than 10 seconds, which can effectively reduce the damage of high temperature to the LED.

4. The length of the mold provided by the embodiments of the present application is less than half of the reflow oven, and the footprint is small. The weight is only about 1/3, which is easy to install.

5. The starting power of the current reflow oven is generally 50-80KW, and the stable working power is also 3-5KW, and it cannot be shut down for 24 hours. The peak power of the mold provided by the embodiment of the present application does not exceed 5KW, and it works intermittently, and can be stopped at any time to transfer the line, and the comprehensive power consumption and cost are lower.

6. In order to reduce the deviation rate of LEDs in the current reflow soldering furnace process, high-priced and high-precision placement machines are generally used in the industry to control the placement accuracy.

The method provided by the embodiments of the present application has low requirements on the placement accuracy, and a placement machine with low precision and low cost can be used to mount the LED, and the cost of production expansion is low.

7. After the circuit products (such as circuit board products) manufactured by the current reflow soldering furnace process are released, the products with serious LED deviation must be manually picked out, and then corrected one by one by professional repair personnel on the constant temperature platform; this way Not only is the efficiency low, but it will also cause secondary high-temperature damage to the LED (because the constant temperature platform must be kept at the melting tin temperature before rework can be carried out), and the quality and experience of the rework personnel are also very high.

The method provided by the embodiment of the present application can realize one-button operation through equipment, the finished product does not need to be repaired, the quality and ability of personnel are low, and the high precision of LED offset of 100% less than 0.04mm can be realized (this precision is related to the adjustment of the mold). It can be infinitely approached to the 0) welding standard, especially suitable for electronic products such as smart terminals that require high welding accuracy.

The above descriptions are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection of the present application. within the range.

Claims (9)

1. a welding method of electronic device, is characterized in that, described method comprises: Brush solder paste on the circuit board; Mount the electronic device on the circuit board that has been brushed with solder paste; Fixing the printed circuit board on the heating platform; Fixing the electronic device so that the electronic device is stationary relative to the circuit board; using the heating platform to heat the circuit board to realize the soldering of the electronic device to the circuit board; The method uses a mold including a bottom mold, a first mold half, and a second mold half; The bottom mold includes a heating platform and a positioning part; The first half-mould includes a first clamping portion and is adapted to be disposed on the bottom mold, the first clamping portion includes a first wall, and the first half-mould can move relative to the bottom mold so that the the first wall of the first clamping part is located at a designated position; The second mold half includes a second clamping portion, the second clamping portion includes a second wall, and the second mold half is movable relative to the first mold half so that the second clamping portion is The second wall and the first wall of the first clamping portion form a first clamping space. 2 . The method of claim 1 , wherein: using the heating platform to heat the circuit board to solder the electronic device to the circuit board, comprising: 3 . Raising the temperature of the heating platform to a preset upper limit temperature to melt the solder paste; The temperature of the heating platform is lowered to a preset lower limit temperature, so that the melted solder paste is solidified, and the electronic device is soldered to the circuit board. 3. The method of claim 1, wherein the fixing the electronic device so that the electronic device is stationary relative to the circuit board comprises: Use a mold capable of forming the first clamping space; The electronic device is secured in the first clamping space. 4. The method of claim 1, wherein the fixing the electronic device so that the electronic device is stationary relative to the circuit board comprises: The first half-mould is placed on the circuit board, and the first half-mould is moved relative to the bottom mould along a first specified direction, so that the first wall of the first clamping part is connected to the electronic device part of the contact; The second half-mould is placed on the bottom mould, and the second half-mould is moved relative to the first half-mould along a second specified direction, so that the second wall of the second clamping part is connected to the electronic device another part of the contact. 5. The method of claim 4, wherein the method further comprises: moving the first mold half relative to the bottom mold in a third designated direction so that the first wall of the first clamping portion is released from contact with a portion of the electronic device; The second mold half is moved relative to the first mold half in a fourth designated direction so that the second wall of the second clamping portion is released from contact with another portion of the electronic device. 6. The method of claim 4, wherein the placing the first mold half on the circuit board comprises: Keep the first wall of the first clamping part at a distance greater than zero from the edge of the electronic device in the first direction, and lower the first half-mold to the circuit board perpendicular to the first direction . 7. The method of claim 6, wherein the placing the second mold half on the bottom mold comprises: keeping the second wall of the second clamping part at a distance greater than zero from the edge of the electronic device in the first direction, and lowering the second half-mold perpendicular to the first direction to the The first half. 8. The method of claim 4, wherein the placing the second mold half on the bottom mold comprises: placing the second clamping portion of the second mold half into the bottom mold in the first clamping portion of the first mold half. 9 . A circuit board welding equipment, characterized in that, it is used to implement the method according to any one of claims 1 to 8 .

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