CN113507792A - Method for adding activating liquid applied to circuit board hole metallization - Google Patents
Method for adding activating liquid applied to circuit board hole metallization Download PDFInfo
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- CN113507792A CN113507792A CN202110639012.9A CN202110639012A CN113507792A CN 113507792 A CN113507792 A CN 113507792A CN 202110639012 A CN202110639012 A CN 202110639012A CN 113507792 A CN113507792 A CN 113507792A
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- timing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for adding an activating liquid for circuit board hole metallization, which is used for checking a circuit board in an activation cylinder module by a circuit board detection module so as to judge whether the circuit board is in the activation cylinder module, vibrating when the circuit board is in the activation cylinder module, starting timing when vibrating, stopping pause time when the circuit board leaves the activation cylinder module, starting a metering pump to add palladium water into the activation cylinder when the time reaches a set value, automatically returning the accumulated time to zero and accumulating again, starting the timing of the adding time when an adding pump starts adding work, reaching the set value, stopping the adding pump, and closing an adding time table. Thereby increasing revenue.
Description
Technical Field
The invention relates to the technical field of cleaning equipment systems, in particular to a method for adding an activating solution applied to circuit board hole metallization.
Background
Circuit boards such as HDI and multilayer rigid-flex printed circuit boards need to be electrically connected between layers through hole metallization of through holes, blind holes or overlapped holes, and then the performance of high-density and high-layout efficiency of the circuit boards is achieved. The hole metallization is to drill holes on dielectric materials such as polyimide, epoxy resin impregnated glass cloth and the like between copper foils of a circuit board, and plate a layer of metal on the hole walls of the insulating materials to realize the conduction between two or more layers of copper foil circuits, so that the circuit board is required to be subjected to vertical copper wire deposition production.
The method is characterized in that activated palladium is automatically added according to the plate making amount in the production process of the vertical copper-plated wire of the circuit board, and the metal palladium is expensive, so that the waste is easily caused by the existing adding method.
Disclosure of Invention
The invention aims to provide a method for adding an activating solution for circuit board hole metallization, which is used for solving the problem that palladium water is wasted because a system still performs processing timing when the traditional equipment is in invalid timing or the equipment is in idle load.
In order to achieve the purpose, the invention provides the following technical scheme: the method for adding the activating liquid for circuit board hole metallization comprises a target flying module, an activating module, a timing module and an activated palladium adding module, wherein the target flying module is connected with the activating module in a one-way mode, the activating module is connected with the timing module in a one-way mode, the timing module is connected with the activated palladium adding module in a one-way mode, and the activated palladium adding module is connected with the activating module in a one-way mode;
the flying target module is used for hoisting the circuit board and sending the circuit board into and out of the activation module;
the activation module comprises an activation cylinder module, a circuit board detection module and a vibration module, the activation cylinder module is used for carrying out palladium activation on holes of circuit board holes, the circuit board detection module is used for detecting whether the circuit board enters the activation cylinder module, and the vibration module is used for vibration reminding;
the timing module comprises a circuit board detection timing module and an activation timing module, the circuit board detection timing module is used for timing the time when the circuit board enters the activation cylinder module, and the activation timing module is used for timing the activation time of the circuit board;
the activated palladium adding module is used for adding palladium water into the activated module;
the method for adding the activating solution comprises the following specific steps:
(1) starting the flying target module, hoisting the circuit board and sending the circuit board into an activation cylinder module of the activation module;
(2) at the moment, the circuit board detection module detects the circuit board, and the activation cylinder module activates the circuit board;
(3) when the circuit board is detected to be contained in the activation cylinder module, the circuit board detection module transmits a signal to the vibration module, and the vibration module is started and stopped after being started for a period of time;
(4) when the vibration module is started, the activation timing module performs timing, the activation timing module stops timing after starting for a period of time, and the flying target module lifts the circuit board and sends the circuit board into the next processing tank;
(5) when the circuit board is not detected to be contained in the activation cylinder module, the vibration module is not started, and the activation timing module is in a pause state;
(6) when the circuit board is detected to be contained in the activation cylinder module again, the vibration module is started again and is stopped after being started for a period of time;
(7) when the vibration module is restarted, the activation timing module is changed from pause to continuous timing, and the timing is paused after a period of time, and at the moment, the circuit board is hoisted by the target flying module and sent into the next processing tank;
(8) repeating the step (3) to the step (7), resetting the time of the activation timing module when the timing accumulation of the activation timing module reaches a set value, and starting the activated palladium adding module at the same time;
(9) the activated palladium adding module is started, and is stopped after certain palladium water is injected into the activation cylinder module;
(10) and (5) repeating the steps (1) to (9) until the equipment stops after all the circuit boards are processed.
Further, the detection mode in the step (2) is to detect the circuit board by an infrared probe, and the detection steps are as follows:
(1) when the infrared probe is shielded by the wireless circuit board, the infrared receiving end normally receives an infrared signal sent by the infrared transmitting end;
(2) when the circuit board enters the activation module, the circuit board can shield an infrared signal sent by the infrared emission end, and then whether the circuit board enters the activation module is judged;
(3) and when the circuit board is judged to enter the activation module, sending a vibration signal to the vibration module.
Further, the judging step is specifically as follows:
(1) when the signal received by the infrared receiving end is blocked, the circuit board detection timing module starts timing;
(2) when the infrared receiving end receives the signal again, the circuit board detection timing module temporarily stops timing at the moment, and marks the time as Jn and Cy:
1) when the signal received by the infrared receiving end is blocked for the first time, the time mark of receiving the signal for the first time after the signal is blocked for the first time is J1;
2) when the signal received by the infrared receiving end is blocked for the second time, the time mark of first receiving the signal after the signal is blocked for the second time is C1;
3) when the signal received by the infrared receiving end is blocked for the third time, the time mark of receiving the signal for the first time after the signal is blocked for the third time is J2;
4) when the signal received by the infrared receiving end is blocked for the fourth time, the time mark of first receiving the signal after the signal is blocked for the fourth time is C2;
5) when the nth time of the signal received by the infrared receiving end is blocked, the time mark of the first time of receiving the signal after the nth time of the signal is blocked is markedn is 1-infinity;
6) when the signal received by the infrared receiving end is blocked for the y time, the time mark of receiving the signal for the first time after the y time of the signal is blocked is markedy is 2- ∞;
(3) when Jn is larger than or equal to 10s, judging that no circuit board exists in the activation cylinder module;
(4) when Jn is more than or equal to 0.5s and less than 10s, judging that a circuit board is arranged in the activation cylinder module;
(5) when Jn is more than or equal to 0 and less than 0.5s, judging that no circuit board exists in the activation cylinder module;
(6) the circuit board detection timing module leads the data Jn and Cy into the activation timing module.
Further, the period of time in the step (3) is specifically 50-150 s.
Further, the period of time in the step (4) is specifically 150-.
Further, the period of time in the step (6) is specifically 50-150 s.
Further, the period of time in the step (7) is specifically 150-.
Further, the activation timing module specifically comprises the following working steps:
1) when the activation timing module receives Jn, the activation timing module starts timing;
2) when the activation timing module receives Cy and n is equal to y, the activation timing module pauses timing and records the time as Tx, and x is 1- ∞;
3) when the activation timing module receives Jn +1, the activation timing module continues to time;
4) when the activation timing module receives Cy +1 and n is y, the activation timing module pauses timing and records the time as Tx +1, and x is 1- ∞;
5) when Tx +1 is larger than or equal to the set value, the activation timing module resets time, and simultaneously the activation timing module sends an adding signal to the activated palladium adding module
6) After the time of the activation timing module is reset, when the activation timing module receives Jn again, the activation timing module starts to count again from zero;
7) repeating steps 1) -6).
Compared with the prior art, the invention has the beneficial effects that: the circuit board detection module is used for detecting the circuit board in the activation cylinder module, so that whether the circuit board is arranged in the activation cylinder module is judged, the circuit board is vibrated when the circuit board is arranged in the activation cylinder module, timing is started, the pause time is stopped when the circuit board leaves the activation cylinder module, when the time reaches a set value, the metering pump is started to work to add palladium water into the activation cylinder, meanwhile, the accumulated time is automatically reset to zero and is accumulated again, when the adding pump starts to add, the adding time is started to time, the adding pump stops working when the adding set value is reached, and the adding time table is closed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a system block diagram of an adding method of an activating solution for circuit board hole metallization.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a method for adding an activating solution applied to circuit board hole metallization comprises a target flying module, an activating module, a timing module and an activated palladium adding module, wherein the target flying module is connected with the activating module in a one-way mode;
the flying target module is used for hoisting the circuit board and sending the circuit board into and out of the activation module;
the activation module comprises an activation cylinder module, a circuit board detection module and a vibration module, the activation cylinder module is used for carrying out palladium activation on holes of the circuit board, the circuit board detection module is used for detecting whether the circuit board enters the activation cylinder module, and the vibration module is used for vibration reminding;
the timing module comprises a circuit board detection timing module and an activation timing module, the circuit board detection timing module is used for timing the time when the circuit board enters the activation cylinder module, and the activation timing module is used for timing the activation time of the circuit board;
the activated palladium adding module is used for adding palladium water into the activated module;
the adding method of the activating solution comprises the following specific steps:
(1) starting the flying target module, hoisting the circuit board and sending the circuit board into an activation cylinder module of the activation module;
(2) at the moment, the circuit board detection module detects the circuit board, and the activation cylinder module activates the circuit board;
(3) when the circuit board is detected to be contained in the activation cylinder module, the circuit board detection module transmits a signal to the vibration module, and the vibration module is started and stopped after being started for a period of time;
(4) when the vibration module is started, the activation timing module performs timing, the activation timing module stops timing after starting for a period of time, and the flying target module lifts the circuit board and sends the circuit board into the next processing tank;
(5) when the circuit board is not detected to be contained in the activation cylinder module, the vibration module is not started, and the activation timing module is in a pause state;
(6) when the circuit board is detected to be contained in the activation cylinder module again, the vibration module is started again and is stopped after being started for a period of time;
(7) when the vibration module is restarted, the activation timing module is changed from pause to continuous timing, and the timing is paused after a period of time, and at the moment, the circuit board is hoisted by the target flying module and sent into the next processing tank;
(8) repeating the step (3) to the step (7), resetting the time of the activation timing module when the timing accumulation of the activation timing module reaches a set value, and starting the activated palladium adding module at the same time;
(9) the activated palladium adding module is started, and is stopped after certain palladium water is injected into the activation cylinder module;
(10) and (5) repeating the steps (1) to (9) until the equipment stops after all the circuit boards are processed.
The detection mode in the step (2) is to detect the circuit board through an infrared probe, and the detection steps are as follows:
(1) when the infrared probe is shielded by the wireless circuit board, the infrared receiving end normally receives an infrared signal sent by the infrared transmitting end;
(2) when the circuit board enters the activation module, the circuit board can shield an infrared signal sent by the infrared emission end, and then whether the circuit board enters the activation module is judged;
(3) and when the circuit board is judged to enter the activation module, sending a vibration signal to the vibration module.
The judging steps are as follows:
(1) when the signal received by the infrared receiving end is blocked, the circuit board detection timing module starts timing;
(2) when the infrared receiving end receives the signal again, the circuit board detection timing module temporarily stops timing at the moment, and marks the time as Jn and Cy:
1) when the signal received by the infrared receiving end is blocked for the first time, the time mark of receiving the signal for the first time after the signal is blocked for the first time is J1;
2) when the signal received by the infrared receiving end is blocked for the second time, the time mark of first receiving the signal after the signal is blocked for the second time is C1;
3) when the signal received by the infrared receiving end is blocked for the third time, the time mark of receiving the signal for the first time after the signal is blocked for the third time is J2;
4) when the signal received by the infrared receiving end is blocked for the fourth time, the time mark of first receiving the signal after the signal is blocked for the fourth time is C2;
5) when the nth time of the signal received by the infrared receiving end is blocked, the time mark of the first time of receiving the signal after the nth time of the signal is blocked is markedn is 1-infinity;
6) when the signal received by the infrared receiving end is blocked for the y time, the time mark of receiving the signal for the first time after the y time of the signal is blocked is markedy is 2- ∞;
(3) when Jn is larger than or equal to 10s, judging that no circuit board exists in the activation cylinder module;
(4) when Jn is more than or equal to 0.5s and less than 10s, judging that a circuit board is arranged in the activation cylinder module;
(5) when Jn is more than or equal to 0 and less than 0.5s, judging that no circuit board exists in the activation cylinder module;
(6) the circuit board detection timing module leads the data Jn and Cy into the activation timing module.
The period of time in the step (3) is specifically 50-150 s.
The period of time in the step (4) is specifically 150-300 s.
The period of time in the step (6) is specifically 50-150 s.
The period of time in step (7) is specifically 150-300 s.
The working steps of the activation timing module are as follows:
1) when the activation timing module receives Jn, the activation timing module starts timing;
2) when the activation timing module receives Cy and n is equal to y, the activation timing module pauses timing and records the time as Tx, and x is 1- ∞;
3) when the activation timing module receives Jn +1, the activation timing module continues to time;
4) when the activation timing module receives Cy +1 and n is y, the activation timing module pauses timing and records the time as Tx +1, and x is 1- ∞;
5) when Tx +1 is larger than or equal to the set value, the activation timing module resets time, and simultaneously the activation timing module sends an adding signal to the activated palladium adding module
6) After the time of the activation timing module is reset, when the activation timing module receives Jn again, the activation timing module starts to count again from zero;
7) repeating steps 1) -6).
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The method for adding the activating solution applied to the hole metallization of the circuit board is characterized by comprising a target flying module, an activating module, a timing module and an activated palladium adding module, wherein the target flying module is connected with the activating module in a one-way mode, the activating module is connected with the timing module in a one-way mode, the timing module is connected with the activated palladium adding module in a one-way mode, and the activated palladium adding module is connected with the activating module in a one-way mode;
the flying target module is used for hoisting the circuit board and sending the circuit board into and out of the activation module;
the activation module comprises an activation cylinder module, a circuit board detection module and a vibration module, the activation cylinder module is used for carrying out palladium activation on holes of circuit board holes, the circuit board detection module is used for detecting whether the circuit board enters the activation cylinder module, and the vibration module is used for vibration reminding;
the timing module comprises a circuit board detection timing module and an activation timing module, the circuit board detection timing module is used for timing the time when the circuit board enters the activation cylinder module, and the activation timing module is used for timing the activation time of the circuit board;
the activated palladium adding module is used for adding palladium water into the activated module;
the method for adding the activating solution comprises the following specific steps:
(1) starting the flying target module, hoisting the circuit board and sending the circuit board into an activation cylinder module of the activation module;
(2) at the moment, the circuit board detection module detects the circuit board, and the activation cylinder module activates the circuit board;
(3) when the circuit board is detected to be contained in the activation cylinder module, the circuit board detection module transmits a signal to the vibration module, and the vibration module is started and stopped after being started for a period of time;
(4) when the vibration module is started, the activation timing module performs timing, the activation timing module stops timing after starting for a period of time, and the flying target module lifts the circuit board and sends the circuit board into the next processing tank;
(5) when the circuit board is not detected to be contained in the activation cylinder module, the vibration module is not started, and the activation timing module is in a pause state;
(6) when the circuit board is detected to be contained in the activation cylinder module again, the vibration module is started again and is stopped after being started for a period of time;
(7) when the vibration module is restarted, the activation timing module is changed from pause to continuous timing, and the timing is paused after a period of time, and at the moment, the circuit board is hoisted by the target flying module and sent into the next processing tank;
(8) repeating the step (3) to the step (7), resetting the time of the activation timing module when the timing accumulation of the activation timing module reaches a set value, and starting the activated palladium adding module at the same time;
(9) the activated palladium adding module is started, and is stopped after certain palladium water is injected into the activation cylinder module;
(10) and (5) repeating the steps (1) to (9) until the equipment stops after all the circuit boards are processed.
2. The method for adding the activating solution for metallization of the holes of the circuit board according to claim 1, wherein the detection mode in the step (2) is to detect the circuit board by an infrared probe, and the detection steps are as follows:
(1) when the infrared probe is shielded by the wireless circuit board, the infrared receiving end normally receives an infrared signal sent by the infrared transmitting end;
(2) when the circuit board enters the activation module, the circuit board can shield an infrared signal sent by the infrared emission end, and then whether the circuit board enters the activation module is judged;
(3) and when the circuit board is judged to enter the activation module, sending a vibration signal to the vibration module.
3. The method according to claim 2, wherein the judging step comprises the following steps:
(1) when the signal received by the infrared receiving end is blocked, the circuit board detection timing module starts timing;
(2) when the infrared receiving end receives the signal again, the circuit board detection timing module temporarily stops timing at the moment, and marks the time as Jn and Cy:
1) when the signal received by the infrared receiving end is blocked for the first time, the time mark of receiving the signal for the first time after the signal is blocked for the first time is J1;
2) when the signal received by the infrared receiving end is blocked for the second time, the time mark of first receiving the signal after the signal is blocked for the second time is C1;
3) when the signal received by the infrared receiving end is blocked for the third time, the time mark of receiving the signal for the first time after the signal is blocked for the third time is J2;
4) when the signal received by the infrared receiving end is blocked for the fourth time, the time mark of first receiving the signal after the signal is blocked for the fourth time is C2;
5) when the nth time of the signal received by the infrared receiving end is blocked, the time mark of the first time of receiving the signal after the nth time of the signal is blocked is markedn is 1-infinity;
6) when the signal received by the infrared receiving end is blocked for the y time, the time mark of receiving the signal for the first time after the y time of the signal is blocked is markedy is 2- ∞;
(3) when Jn is larger than or equal to 10s, judging that no circuit board exists in the activation cylinder module;
(4) when Jn is more than or equal to 0.5s and less than 10s, judging that a circuit board is arranged in the activation cylinder module;
(5) when Jn is more than or equal to 0 and less than 0.5s, judging that no circuit board exists in the activation cylinder module;
(6) the circuit board detection timing module leads the data Jn and Cy into the activation timing module.
4. The method for adding the activating solution for the hole metallization of the circuit board according to the claim 1, wherein the period of time in the step (3) is specifically 50-150 s.
5. The method as claimed in claim 1, wherein the period of time in step (4) is specifically 150-300 s.
6. The method for adding the activating solution for the hole metallization of the circuit board as claimed in claim 1, wherein the period of time in the step (6) is specifically 50-150 s.
7. The method as claimed in claim 1, wherein the period of time in step (7) is specifically 150-300 s.
8. The method for adding the activating solution for metallization of the holes of the circuit board according to claim 1, wherein the activating timing module specifically comprises the following steps:
(1) when the activation timing module receives Jn, the activation timing module starts timing;
(2) when the activation timing module receives Cy and n is equal to y, the activation timing module pauses timing and records the time as Tx, and x is 1- ∞;
(3) when the activation timing module receives Jn +1, the activation timing module continues to time;
(4) when the activation timing module receives Cy +1 and n is y, the activation timing module pauses timing and records the time as Tx +1, and x is 1- ∞;
(5) when Tx +1 is larger than or equal to the set value, the activation timing module resets time, and simultaneously the activation timing module sends an adding signal to the activated palladium adding module
(6) After the time of the activation timing module is reset, when the activation timing module receives Jn again, the activation timing module starts to count again from zero;
(7) and (5) repeating the steps (1) to (6).
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3163851A (en) * | 1959-10-02 | 1964-12-29 | Philips Corp | Circuit arrangement comprising a controlling cross-bar system |
JP2014517156A (en) * | 2011-06-24 | 2014-07-17 | アップル インコーポレイテッド | Reduction of appearance defects in anodized parts |
CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
CN211497855U (en) * | 2019-12-31 | 2020-09-15 | 阳江三威科技有限公司 | Plating bath with palladium activation automatic adding device |
-
2021
- 2021-06-08 CN CN202110639012.9A patent/CN113507792B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3163851A (en) * | 1959-10-02 | 1964-12-29 | Philips Corp | Circuit arrangement comprising a controlling cross-bar system |
JP2014517156A (en) * | 2011-06-24 | 2014-07-17 | アップル インコーポレイテッド | Reduction of appearance defects in anodized parts |
CN211497855U (en) * | 2019-12-31 | 2020-09-15 | 阳江三威科技有限公司 | Plating bath with palladium activation automatic adding device |
CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
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