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CN113466646A - Conversion device for testing breakdown voltage of metal substrate - Google Patents

Conversion device for testing breakdown voltage of metal substrate Download PDF

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Publication number
CN113466646A
CN113466646A CN202110840610.2A CN202110840610A CN113466646A CN 113466646 A CN113466646 A CN 113466646A CN 202110840610 A CN202110840610 A CN 202110840610A CN 113466646 A CN113466646 A CN 113466646A
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China
Prior art keywords
breakdown voltage
metal substrate
conversion device
pcb board
input interface
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Pending
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CN202110840610.2A
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Chinese (zh)
Inventor
张于均
张晓辉
张强
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Zhejiang Dejia Electronic Technology Co ltd
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Zhejiang Dejia Electronic Technology Co ltd
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Priority to CN202110840610.2A priority Critical patent/CN113466646A/en
Publication of CN113466646A publication Critical patent/CN113466646A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Relating To Insulation (AREA)

Abstract

本发明涉及一种用于金属基板击穿电压测试的转换装置,其特征在于,包括:PCB板,设有总线焊盘;牛角排插,与所述PCB板固定连接;输入线,所述输入线一端与所述总线焊盘固定连接,所述输入线另一端设有输入接口,所述输入接口内部设有导体,所述导体同所述输入线固定连接,所述输入接口外部设有绝缘体。采用输入接口,将耐压仪正极电笔同转换器接入口相连,实现电流传输,可随时拔插,使用方便灵活;采用PCB板,可以将耐压测试仪和测试治具相连,可根据产品测试点需求,焊接多个牛角排插;采用转换器保护箱,可防止耐压测试时,操作员触电风险。

Figure 202110840610

The invention relates to a conversion device for the breakdown voltage test of a metal substrate, which is characterized by comprising: a PCB board, which is provided with a bus pad; a horn socket is fixedly connected to the PCB board; an input line, the input One end of the line is fixedly connected to the bus pad, the other end of the input line is provided with an input interface, the input interface is provided with a conductor inside, the conductor is fixedly connected with the input line, and an insulator is provided outside the input interface . The input interface is used to connect the positive electrode of the withstand voltage tester with the converter access port to realize current transmission, which can be unplugged and inserted at any time. Weld multiple horn sockets to meet the requirements; adopt the converter protection box to prevent the operator from the risk of electric shock during the withstand voltage test.

Figure 202110840610

Description

Conversion device for testing breakdown voltage of metal substrate
Technical Field
The invention relates to the technical field of voltage testing, in particular to a conversion device for testing breakdown voltage of a metal substrate.
Background
With the rapid development of the PCB industry, metal-based printed circuit boards (aluminum substrates, copper substrates, etc.) are increasingly widely applied in the market, and products such as home lighting, backlight televisions, new energy vehicles, power devices, etc. are all using aluminum-based circuit boards or copper-based circuit boards. Due to the particularity of the metal-based circuit board structure, the breakdown voltage resistance of the dielectric layer between the conductive copper foil layer and the metal substrate layer directly affects the durability, stability and safety of these products. How the metal-based printed circuit board can meet the breakdown voltage requirement of a product before the PCB factory leaves the factory, defective products which do not conform to the breakdown voltage of the product are effectively removed before SMT welding at a client, mass operation can be achieved, efficiency is improved, and cost is saved.
The test pencil of the existing voltage-withstanding test instrument can only test the breakdown voltage of a certain network of a PCB generally, and a manual point test mode is generally adopted, so that the risk of missing the test network exists, the test efficiency is low, and the hidden danger that the high voltage-withstanding requirement cannot be met exists. The existing voltage-withstanding test instrument is suitable for testing the current input end and the current output end after SMT welding, operation difficulty exists in 100% testing before the PCB factory shipment is met, and batch voltage-withstanding testing cannot be achieved by the existing voltage-withstanding test instrument.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a conversion apparatus for testing a breakdown voltage of a metal substrate, including:
the PCB board is provided with a bus pad;
the horn row is inserted and fixedly connected with the PCB;
the input line, input line one end with bus pad fixed connection, the input line other end is equipped with input interface, the inside conductor that is equipped with of input interface, the conductor with input line fixed connection, the input interface outside is equipped with the insulator.
Preferably, the PCB board is an FR-4 substrate or a ceramic substrate.
Preferably, the PCB board thickness is greater than 1.6 mm.
Preferably, the ox horn socket is a 32-core or 64-core ox horn socket.
Preferably, the width of the copper foil of the PCB is more than 2mm, and the thickness of the copper foil is more than 10Z.
Preferably, the input interface is in the shape of a pen cap.
Preferably, the device further comprises a PVC insulation protection box.
Preferably, the ox horn socket is welded with the PCB board.
The conversion device for testing the breakdown voltage of the metal substrate has the following beneficial effects: an input interface is adopted to connect the positive electrode test pencil of the voltage-withstanding instrument with the switch-in port of the converter, so that current transmission is realized, the test pencil can be pulled out and plugged at any time, and the use is convenient and flexible; the PCB is adopted, the withstand voltage tester can be connected with the test jig, and a plurality of ox horn extension sockets can be welded according to the requirements of product test points; adopt the converter guard box, can prevent when withstand voltage tests, the operator electrocutes the risk.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural diagram of a conversion device for metal substrate breakdown voltage testing according to the present invention;
fig. 2 is an embodiment of an application of the conversion apparatus for metal substrate breakdown voltage test according to the present invention.
In the figure, 1-PCB, 2-ox horn row socket, 3-welding bus, 4-input line end, 5-input line other end, 6-input interface, 7-withstand voltage tester, 8-test pen, 9-conversion head, 10-ox horn row socket, 11-insulation protection box, 12-test jig, 13-metal aluminum plate, 14-test press bed.
Detailed Description
Fig. 1 is a schematic structural diagram of a conversion device for testing a breakdown voltage of a metal substrate according to the present invention. As shown in fig. 1, the conversion apparatus for metal substrate breakdown voltage test according to the first embodiment of the present invention at least includes a PCB board 1 having bus pads;
the horn socket 2 is fixedly connected with the PCB 1;
the input line, input line one end 4 and bus pad fixed connection, the input line other end 5 is equipped with input interface 6, and input interface 6 is inside to be equipped with the conductor, and the conductor is with input line fixed connection, and the input interface outside is equipped with the insulator.
A plurality of ox horn row inserts 2 can be welded on the PCB board 1. The number of the ox horn socket 2 can be determined according to the number of the network points of the product. The ox horn row insert 2 is connected with the PCB board 1 through welding. The PCB board 1 is an FR-4 substrate or a ceramic substrate. The PCB board 1 is selected to be an FR-4 substrate or a ceramic substrate because of its high dielectric strength. The PCB board thickness is preferably greater than 1.6 mm. The size, hole site, hole number of PCB board row jack can be according to the ox horn row of conveniently purchasing and insert and design. Generally, the test fixture is compatible with a flat cable and a test fixture used for an open/short circuit on/off test in a factory, and is usually a 32-core or 64-core ox horn socket. The width of the copper foil of the PCB is more than 2mm, and the thickness of the copper foil is more than 10Z. The larger the width of the conductor and the thickness of the copper foil is, the better the conductor is, so that the phenomenon of PCB explosion caused by overload of the current of the copper foil during high-voltage transmission is prevented. One end of the input line is welded on the bus bonding pad, and the other end of the input line is provided with a pen-cap-shaped input interface. The interface has an inner conductor connected to the input line and an outer insulator. The interface is convenient for the withstand voltage tester test electrography to insert at any time and extract. The device still includes the insulating guard box of PVC, has the risk of electrocuting during the operation of preventing.
Fig. 2 shows an embodiment of a conversion device for testing a breakdown voltage of a metal substrate according to the present invention. As shown in fig. 2, the positive electrode test pencil of the withstand voltage tester 7 is connected to the converter interface. The insulating protection box 11 is provided with a ox horn socket 10. The negative pole of the withstand voltage tester 7 is connected to a metal aluminum plate 13 of the test press 14, and the metal aluminum plate 13 is insulated and isolated from the test press 14 to prevent the test press 14 from being electrified. The test jig 12 is loaded on the test press 14, and the ox horn socket on the test jig 12 and the ox horn socket on the converter are connected together with a flat cable. The withstand voltage tester 7 sets test conditions: test voltage, leakage current range, test time. The test press 14 presses down, the metal aluminum plate 13 presses on the back of the metal substrate, and the metal test needle of the test fixture 12 presses on the pad of the metal substrate, so that the withstand voltage test is realized. When testing different product models, only the test fixture needs to be replaced. The PCB on-off test fixture can be compatible.
Through the design of the above embodiment, the invention has the beneficial effects that: an input interface is adopted to connect the positive electrode test pencil of the voltage-withstanding instrument with the switch-in port of the converter, so that current transmission is realized, the test pencil can be pulled out and plugged at any time, and the use is convenient and flexible; the PCB is adopted, the withstand voltage tester can be connected with the test jig, and a plurality of ox horn extension sockets can be welded according to the requirements of product test points; adopt the converter guard box, can prevent when withstand voltage tests, the operator electrocutes the risk.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (8)

1.一种用于金属基板击穿电压测试的转换装置,其特征在于,包括:1. A conversion device for metal substrate breakdown voltage testing, characterized in that, comprising: PCB板,设有总线焊盘;PCB board with bus pads; 牛角排插,与所述PCB板固定连接;The horn socket is fixedly connected with the PCB board; 输入线,所述输入线一端与所述总线焊盘固定连接,所述输入线另一端设有输入接口,所述输入接口内部设有导体,所述导体同所述输入线固定连接,所述输入接口外部设有绝缘体。Input line, one end of the input line is fixedly connected to the bus pad, the other end of the input line is provided with an input interface, the input interface is provided with a conductor inside, and the conductor is fixedly connected with the input line, the An insulator is provided outside the input interface. 2.根据权利要求1所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述PCB板为FR-4基板或者陶瓷基板。2 . The conversion device for a breakdown voltage test of a metal substrate according to claim 1 , wherein the PCB board is an FR-4 substrate or a ceramic substrate. 3 . 3.根据权利要求1所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述PCB板厚度大于1.6mm。3 . The conversion device for metal substrate breakdown voltage testing according to claim 1 , wherein the thickness of the PCB board is greater than 1.6 mm. 4 . 4.根据权利要求1所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述牛角排插为32芯或64芯牛角排插。4 . The conversion device for a breakdown voltage test of a metal substrate according to claim 1 , wherein the horn plug is a 32-core or 64-core horn plug. 5 . 5.根据权利要求1所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述PCB板铜箔宽度大于2mm,铜箔厚度大于10Z。5 . The conversion device for metal substrate breakdown voltage test according to claim 1 , wherein the width of the copper foil of the PCB board is greater than 2 mm, and the thickness of the copper foil is greater than 10Z. 6 . 6.根据权利要求1所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述输入接口呈笔帽状。6 . The conversion device for metal substrate breakdown voltage testing according to claim 1 , wherein the input interface is in the shape of a pen cap. 7 . 7.根据权利要求1至6任意一项所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述装置还包括PVC绝缘保护箱。7. The conversion device for metal substrate breakdown voltage test according to any one of claims 1 to 6, characterized in that, the device further comprises a PVC insulation protection box. 8.根据权利要求7所述的用于金属基板击穿电压测试的转换装置,其特征在于,所述牛角排插与所述PCB板焊接。8 . The conversion device for a breakdown voltage test of a metal substrate according to claim 7 , wherein the horn sockets are welded to the PCB board. 9 .
CN202110840610.2A 2021-07-25 2021-07-25 Conversion device for testing breakdown voltage of metal substrate Pending CN113466646A (en)

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Application publication date: 20211001