CN113437550B - Electronic device - Google Patents
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- CN113437550B CN113437550B CN202110701555.9A CN202110701555A CN113437550B CN 113437550 B CN113437550 B CN 113437550B CN 202110701555 A CN202110701555 A CN 202110701555A CN 113437550 B CN113437550 B CN 113437550B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
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Abstract
本申请公开了一种电子设备,其包括:壳体,电路板,舌片以及连接器件,所述壳体具有通孔和与所述通孔连通的腔体;所述电路板设置于所述腔体内;所述舌片设置于所述通孔内并封堵所述通孔;所述连接器件设置于所述腔体内,所述连接器件的一端设置有连接部,所述连接部与所述舌片接触连接,所述连接器件的另一端与所述电路板连接;外部设备可通过所述舌片与所述电子设备连接,所述舌片用于在所述电子设备与所述外部设备之间传输数据。本申请的实施例为电子设备上数据接口内的舌片提供了一种新型的装配方案,其有助于使数据接口能够保持在电子设备框架的居中位置,还可以使数据接口的厚度减小,以降低整机的厚度,同时能提升数据接口的防水性能。
The application discloses an electronic device, which includes: a housing, a circuit board, a tongue and a connecting device, the housing has a through hole and a cavity communicating with the through hole; the circuit board is arranged on the In the cavity; the tongue is arranged in the through hole and blocks the through hole; the connecting device is arranged in the cavity, and one end of the connecting device is provided with a connecting part, and the connecting part is connected to the connecting part. The tongue is contacted and connected, and the other end of the connecting device is connected to the circuit board; the external device can be connected to the electronic device through the tongue, and the tongue is used to connect the electronic device with the external Transfer data between devices. The embodiment of the present application provides a new type of assembly scheme for the tongue in the data interface on the electronic device, which helps to keep the data interface in the center of the electronic device frame, and also reduces the thickness of the data interface , to reduce the thickness of the whole machine, and at the same time improve the waterproof performance of the data interface.
Description
技术领域technical field
本申请属于移动终端设备技术领域,具体涉及一种电子设备。The present application belongs to the technical field of mobile terminal equipment, and specifically relates to an electronic equipment.
背景技术Background technique
电子设备上通常设置有数据接口,电子设备可以通过设置在数据接口内的舌片与其他外部设备进行连接。通过数据接口内的舌片不仅可以实现为电子设备充电,还可以实现电子设备与PC(个人计算机)等其他外部设备之间的数据互传功能。电子设备上的数据接口,以目前较为常用的Type-C接口为例,其通常设置在设备的框架上。而实际上,数据接口在设备框架上的位置主要受到舌片装配位置的影响。The electronic device is usually provided with a data interface, and the electronic device can be connected with other external devices through the tongue provided in the data interface. The tongue in the data interface can not only charge the electronic device, but also realize the data mutual transmission function between the electronic device and other external devices such as PC (personal computer). The data interface on the electronic device, taking the currently more commonly used Type-C interface as an example, is usually arranged on the frame of the device. In fact, the position of the data interface on the device frame is mainly affected by the assembly position of the tongue.
相关技术中,数据接口中的舌片多为焊板式结构,其是通过焊接的方式固定在电子设备的电路板上,因此,数据接口在框架上的布设位置可由电路板在电子设备内部的高度决定,而现有的数据接口在设备框架的其中一侧上通常表现出位置偏心的情况,可参见图4所示。并且,舌片外通常需要用机壳包裹,以起到支撑和保护舌片以及辅助定位数据接口的作用。但是,舌片外的机壳与舌片之间具有一定的间隙,此位置的厚度通常决定了整机的厚度;而且,此间隙的存在以及数据接口外露,容易导致外部的水分经数据接口和此间隙流入而损伤电路板及电路板上的电子元器件,这就需要使用额外的防水物料(例如硅胶圈)与机壳配合。In the related art, the tongues in the data interface are mostly welded plate structures, which are fixed on the circuit board of the electronic device by welding. Therefore, the layout position of the data interface on the frame can be determined by the height of the circuit board inside the electronic device. decision, and the existing data interface usually exhibits an off-center position on one side of the device frame, as shown in FIG. 4 . In addition, the outside of the tongue usually needs to be wrapped with a casing to support and protect the tongue and assist in positioning the data interface. However, there is a certain gap between the shell outside the tongue and the tongue, and the thickness of this position usually determines the thickness of the whole machine; moreover, the existence of this gap and the exposure of the data interface may easily cause external moisture to pass through the data interface and This gap flows into and damages the circuit board and the electronic components on the circuit board, which requires the use of additional waterproof materials (such as silicone rings) to cooperate with the casing.
发明内容Contents of the invention
本申请旨在提供一种电子设备,至少解决现有数据接口内舌片的装配方案易导致整机的厚度尺寸较大,以及数据接口在设备的框架上容易出现位置偏心、不能居中的问题。The purpose of this application is to provide an electronic device that at least solves the problem that the assembly scheme of the inner tongue of the existing data interface tends to cause the thickness of the whole machine to be relatively large, and the position of the data interface on the frame of the device tends to be eccentric and cannot be centered.
为了解决上述技术问题,本申请是这样实现的:In order to solve the above-mentioned technical problems, the application is implemented as follows:
本申请实施例提出了一种电子设备,其包括:An embodiment of the present application proposes an electronic device, which includes:
壳体,所述壳体具有通孔和与所述通孔连通的腔体;a casing, the casing has a through hole and a cavity communicating with the through hole;
电路板,所述电路板设置于所述腔体内;a circuit board, the circuit board is arranged in the cavity;
舌片,所述舌片设置于所述腔体内并封堵所述通孔;a tongue piece, the tongue piece is arranged in the cavity and blocks the through hole;
连接器件,所述连接器件设置于腔体内,所述连接器件的一端设置有连接部,所述连接部与所述舌片接触连接,所述连接器件的另一端与所述电路板连接;A connecting device, the connecting device is arranged in the cavity, one end of the connecting device is provided with a connecting part, the connecting part is connected to the tongue, and the other end of the connecting device is connected to the circuit board;
外部设备可通过所述舌片与所述电子设备连接,所述舌片用于在所述电子设备与所述外部设备之间传输数据。An external device can be connected to the electronic device through the tongue, and the tongue is used for transmitting data between the electronic device and the external device.
在本申请的实施例中,为数据接口内的舌片提供了一种新型的装配方案,通过将舌片与壳体相连,改变了传统的将舌片与电路板焊接的方案,这使得电路板的位置不再影响所述舌片的位置,有利于数据接口在外壳其中一侧部上处于居中位置,同时取消了在舌片外设置机壳,这有助于降低数据接口的厚度,进而可降低电子设备整机厚度方向的尺寸;并且,取消舌片外的机壳,也就不涉及舌片与机壳之间存在的间隙,使得形成的数据接口相当于盲孔结构,这样外部的水分就不能通过此处进入到电子设备内部,也就无需使用额外的防水辅料对数据接口位置进行防水密封。In the embodiment of this application, a new assembly scheme is provided for the tongue in the data interface. By connecting the tongue with the housing, the traditional scheme of welding the tongue with the circuit board is changed, which makes the circuit The position of the plate no longer affects the position of the tongue, which is conducive to the data interface being in the center on one side of the housing, and cancels the housing outside the tongue, which helps to reduce the thickness of the data interface, and then The size of the electronic device in the thickness direction can be reduced; and, if the casing outside the tongue is canceled, the gap between the tongue and the casing is not involved, so that the formed data interface is equivalent to a blind hole structure, so that the external Moisture cannot enter the interior of the electronic device through this, and there is no need to use additional waterproof auxiliary materials to waterproof and seal the position of the data interface.
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
附图说明Description of drawings
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, wherein:
图1是根据本申请实施例的电子设备的结构示意图之一;FIG. 1 is one of the structural schematic diagrams of an electronic device according to an embodiment of the present application;
图2是现有电子设备的数据接口的组装方式示意图;Fig. 2 is a schematic diagram of an assembly method of a data interface of an existing electronic device;
图3是图2中沿A-A的剖视图;Fig. 3 is a sectional view along A-A in Fig. 2;
图4是现有电子设备的数据接口的位置示意图;Fig. 4 is a schematic diagram of the position of the data interface of the existing electronic equipment;
图5是根据本申请实施例的电子设备的结构示意图之二;FIG. 5 is a second structural schematic diagram of an electronic device according to an embodiment of the present application;
图6是根据本申请实施例的电子设备的局部结构示意图;FIG. 6 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;
图7是根据本申请实施例的电子设备的连接器件的结构示意图之一;Fig. 7 is one of the structural schematic diagrams of the connecting device of the electronic device according to the embodiment of the present application;
图8是根据本申请实施例的电子设备的连接器件的结构示意图之二。FIG. 8 is a second structural schematic diagram of a connecting device of an electronic device according to an embodiment of the present application.
附图标记:Reference signs:
1-壳体,101-通孔,102-腔体,103-装配孔,2-舌片,3-连接器件,301-连接触头,302-弹片触点区域,303-连接孔,4-安装座,401-第一卡接部,5-焊脚,6-PCB板,7-机壳。1-shell, 101-through hole, 102-cavity, 103-assembly hole, 2-tongue, 3-connection device, 301-connection contact, 302-shrapnel contact area, 303-connection hole, 4- Mounting seat, 401-the first clamping part, 5-soldering feet, 6-PCB board, 7-casing.
具体实施方式Detailed ways
下面将详细描述本申请的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。此外,说明书以及权利要求中“和/或”表示所连接对象的至少其中之一,字符“/”,一般表示前后关联对象是一种“或”的关系。The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present application, unless otherwise specified, "plurality" means two or more. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, constructed, and operate in a particular orientation, and thus should not be construed as limiting of the application.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
下面结合图1至图8描述根据本申请实施例提供的电子设备。An electronic device provided according to an embodiment of the present application is described below with reference to FIG. 1 to FIG. 8 .
本申请实施例涉及的电子设备可以是但并不限于为智能手机,还可以为平板电脑、笔记本电脑、电子书阅读器及智能可穿戴设备等电子类产品,本申请实施例不限制电子设备的具体种类。The electronic device involved in the embodiment of the present application may be, but is not limited to, a smart phone, and may also be electronic products such as a tablet computer, a notebook computer, an e-book reader, and a smart wearable device. The embodiment of the present application does not limit the electronic device Specific types.
本申请实施例提供的电子设备,参见图1、图5和图6所示,其包括有:壳体1,电路板,舌片2以及连接器件3;所述壳体1具有通孔101和与所述通孔101连通的腔体102;所述电路板设置于所述腔体102内;所述舌片2设置于所述腔体102内并封堵所述通孔101;所述连接器件3的一端设置有连接部,所述连接部与所述舌片2接触连接,所述连接器件3的另一端与所述电路板连接;外部设备可通过所述舌片2与所述电子设备连接,所述舌片2用于在所述电子设备与所述外部设备之间传输数据。The electronic equipment provided by the embodiment of the present application, as shown in FIG. 1 , FIG. 5 and FIG. 6 , includes: a
其中,所述电路板(例如,PCB板)是电子设备中重要的电子部件,是电子元器件的支撑体,也是电子元器件之间电气相互连接的载体。Wherein, the circuit board (for example, PCB board) is an important electronic component in electronic equipment, a support body for electronic components, and a carrier for electrical interconnection between electronic components.
在本申请的实施例中,所述电路板例如可以是电子设备内的主板,当然也可以是副板,本申请中对此不作限制。In the embodiment of the present application, the circuit board may be, for example, a main board in the electronic device, and of course it may also be a sub-board, which is not limited in the present application.
本申请实施例的方案,为电子设备上数据接口内的舌片提供了一种新型的组装方案,通过将舌片2与壳体1直接连接,改变了传统的将舌片与电路板焊接的方案,这使得电路板的位置不再影响舌片的位置,有利于数据接口在设备外壳其中一侧部上处于居中位置,同时取消了在所述舌片2外设置机壳的传统设计,这有助于降低数据接口的厚度,进而可降低电子设备整机厚度方向的尺寸;并且,通过取消所述舌片2外包裹的机壳,也就不涉及所述舌片2与机壳1之间的间隙,使得形成的数据接口相当于为盲孔结构,这样外部的水分就不能通过此处进入到电子设备的内部,也就无需使用额外的防水辅料(例如,防水胶圈)对数据接口位置进行防水密封。The scheme of the embodiment of the present application provides a new type of assembly scheme for the tongue in the data interface on the electronic device. By directly connecting the
并且,本申请的实施例中还设计所述舌片2通过所述连接器件3与电子设备内的电路板进行电性连接,其中,所述舌片2与所述连接器件3为接触式连接,这改变了以往插接的连接方式,该连接方式更为灵活、方便,无需插拔操作。Moreover, in the embodiment of the present application, it is also designed that the
现有电子设备的数据接口,以最为常用的Type-C接口为例,其是通过焊接的方式固定在电子设备的PCB板6上,可参见图2中示出的四个焊脚5,基于此,Type-C接口在设备框架上的位置可由其中的PCB板6在电子设备内部的高度决定。并且,参见图2和图3所示,Type-C接口的舌片2外通常需要用机壳7进行包裹,而机壳7与舌片2之间具有间隙,此位置的厚度通常决定了整机的厚度;而且由于此间隙的存在,以及Type-C接口外露的原因,容易导致外部的水分经Type-C接口和此间隙流入而损伤PCB板6及PCB板6上的电子元器件,这就需要使用额外的防水物料(例如,硅胶圈)与机壳7配合才能提升防水性。由于电路板的位置以及Type-C接口的厚度,难以保证Type-C接口在设备框架的其中一侧上处于居中的位置,从而出现外观上位置偏心的情况。The data interface of the existing electronic equipment, taking the most commonly used Type-C interface as an example, it is fixed on the
参见图4所示,其上的虚线表示Type-C接口的中心线,实线表示框架的中心线,二者并未重合,而是有一定差值D,这说明Type-C接口的位置在外观上呈现出偏心的情况。而本申请的方案能改善该情况,使数据接口的位置居中,可参见图1所示。As shown in Figure 4, the dotted line on it indicates the center line of the Type-C interface, and the solid line indicates the center line of the frame. The two do not coincide, but there is a certain difference D, which shows that the position of the Type-C interface is in Appears to be eccentric. However, the solution of the present application can improve this situation by making the position of the data interface center, as shown in FIG. 1 .
在本申请的实施例中,参见图1和图5所示,所述壳体1包括框架,所述通孔101设置在所述框架的其中一侧上,且所述通孔101可位于居中的位置。In the embodiment of the present application, as shown in FIG. 1 and FIG. 5 , the
其中,本领域技术人员可以根据具体需要灵活调整所述通孔101的具体形状,以适应于不同的连接插头,例如:USB插头或者Type-C插头等,此外,也可以是耳机插头等,本申请中对此不作限制。Wherein, those skilled in the art can flexibly adjust the specific shape of the through
在本申请的实施例中设计,所述舌片2与所述壳体1(例如框架)直接相连,可取消在所述舌片2外包裹机壳的设计。一方面,其可以降低数据接口的厚度,进而降低电子设备的厚度。另一方面,其中不涉及所述舌片2与机壳之间的间隙,使得形成的数据接口相当于为盲孔结构,外部的水就不能通过此处进入到电子设备的内部,从而无需使用额外的防水辅料(例如,防水胶圈)对数据接口位置进行防水密封。也就是说,本申请中采用的结构设计密封性好,可提升防水性能。In the embodiment of the present application, it is designed that the
本申请实施例的电子设备,参见图6所示,其还包括安装座4,所述安装座4设置于所述腔体102内,所述舌片2与所述安装座4连接;所述安装座4上设置有第一卡接部401,所述壳体1上设置有第二卡接部,所述安装座4与所述壳体1以卡合方式相连接,可封堵所述通孔101。The electronic device according to the embodiment of the present application, as shown in FIG. 6 , further includes a mount 4, the mount 4 is disposed in the
也就是说,所述舌片2可通过一个所述安装座4与所述壳体1相连,以使所述舌片2与所述壳体1能够连接在一起。并且,所述安装座4与所述壳体1之间为卡合连接,该连接方式较为简单,且组装和拆卸都比较方便。所述安装座4可以封堵住所述通孔101,以防止外部水分进入到电子设备内部。That is to say, the
其中,所述第一卡接部401和所述第二卡接部其中的一个为截面呈梯形的凸起结构,所述第一卡接部401和所述第二卡接部其中的另一个为与所述凸起结构形状相匹配的限位凹槽。这样,所述第一卡接部401可以与所述第二卡接部形成可靠、稳定的卡合连接。Wherein, one of the first engaging
需要说明的是,所述凸起结构并不限于为上述的截面呈梯形,也可以是其他形状,例如,半圆形、三角形、矩形等,本申请对此不作限制。It should be noted that the protruding structure is not limited to the above-mentioned trapezoidal cross-section, and may also be in other shapes, such as semicircle, triangle, rectangle, etc., which is not limited in the present application.
在本申请一个可选的例子中,所述舌片2的一端设置有连接结构;所述安装座4上设置有贯通孔,所述舌片2设置于所述安装座4背离所述腔体102的一侧,所述连接结构穿过所述贯通孔,且所述连接结构与所述连接器件3上的所述连接部接触连接。In an optional example of the present application, a connection structure is provided at one end of the
也就是说,所述舌片2上设置有用于与所述连接器件3连接的连接结构,而该连接结构从所述安装座4上的贯通孔穿出,以方便与所述连接器件3上的连接部进行接触连接。从而可实现所述舌片2通过所述连接器件3与电子设备内的电路板电性导通。That is to say, the
在本申请一个可选的例子中,参见图6所示,所述安装座4靠近所述腔体102的一侧面与所述壳体1靠近所述腔体102的面为共面设置。该设计可以在保证所述安装座4与所述壳体1连接可靠性的同时,给所述腔体102提供更多的空间。其中,所述安装座4例如为塑胶件。In an optional example of the present application, as shown in FIG. 6 , a side of the mounting base 4 close to the
例如,所述舌片2可通过注塑方式与所述安装座4连接,以使所述舌片2与所述安装座4连为一体化结构这样,所述舌片2与所述安装座4连接的稳定性更好。For example, the
例如,所述安装座4也可通过注塑方式与所述壳体1(例如框架)形成一体化的结构。即可形成带有舌片的壳体,其可用于例如智能手机等电子设备。For example, the mounting seat 4 can also form an integrated structure with the housing 1 (eg frame) by injection molding. A housing with tongues can be formed, which can be used in electronic devices such as smartphones.
其中,注塑的方式例如可以采用嵌件注塑的方式。Wherein, the way of injection molding can adopt the way of insert injection molding, for example.
壳体1,特别是其中的框架为智能手机等电子设备的主要承重结构件,可用于支撑屏幕,提供强度。本申请的实施例中,所述舌片2可以是在加工框架的时候通过嵌件注塑的方式将其与框架做成一体化结构。The
例如,所述舌片2还可以通过点胶方式与所述安装座4粘结固定。For example, the
需要说明的是,本申请的实施例中对所述舌片2与所述安装座4的连接方式不作限定,其并不限于上述的注塑或者点胶的连接方式,还可以为其他固定连接方式,只要使所述舌片2与所述安装座1能牢固连接即可。此外,所述安装座4与所述壳体1之间也不限于上述卡合连接的方式和注塑的方式。It should be noted that, in the embodiment of the present application, there is no limitation on the connection method between the
在本申请一个可选的例子中,参见图6、图7和图8所示,所述连接器件3的一端设置有连接部,所述连接部与所述舌片2为接触式连接,其中,所述连接部包括多个连接触头301,所述舌片2上设置有与多个所述连接触头301相匹配的多个连接触点。In an optional example of the present application, as shown in FIG. 6 , FIG. 7 and FIG. 8 , one end of the connecting
所述连接器件3的一端设置有多个所述连接触头301,多个所述连接触头301可与所述舌片2上的多个所述连接触点形成接触连接并电性导通。也就是说,本申请的方案中设计通过点接触的方式将所述舌片2与所述连接器件3连接。这种接触连接方式更为灵活,其与传统的插拔连接相比,连接方式更为简单,也易于拆装。One end of the
其中,所述连接触头301可以具有伸缩功能,以便于工程装配。Wherein, the connecting
在本申请的一个可选的例子中,电子设备还包括伸缩驱动件,所述连接部通过所述伸缩驱动件与所述舌片连接,所述伸缩驱动件用以驱动所述舌片在第一位置和第二位置之间切换,在所述第一位置,所述舌片与所述连接部相接触,在所述第二位置,所述舌片与所述连接部分离。In an optional example of the present application, the electronic device further includes a telescopic driver, the connecting portion is connected to the tongue through the telescopic driver, and the telescopic driver is used to drive the tongue Switching between a position in which the tongue is in contact with the connecting portion and a second position in which the tongue is separated from the connecting portion.
在本申请一个可选的例子中,参见图8所示,多个所述连接触头301呈矩阵排列且相互之间设置有间隔。以便于各所述连接触头301可与所述舌片2上相应的所述连接触点形成接触连接。In an optional example of the present application, as shown in FIG. 8 , a plurality of connecting
在本申请一个可选的例子中,参见图6、图7和图8所示,所述连接器件3的另一端上设置有弹片触点区域302,所述电路板可通过弹片与所述有弹片触点区域302接触连接,以实现电性导通。In an optional example of the present application, as shown in Fig. 6, Fig. 7 and Fig. 8, the other end of the connecting
其中,所述弹片例如预先设置在所述电路板的指定位置上。Wherein, the elastic piece is, for example, pre-set at a designated position on the circuit board.
其中,所述弹片例如为金属材质。Wherein, the elastic piece is, for example, made of metal.
所述弹片触点区域302用于与所述电路板实现电性导通。所述弹片触点区域302例如为金属材质。The
在本申请一个可选的例子中,所述连接器件3的另一端还可通过电连接器与所述电路板连接。其中,所述电连接器例如为板对板连接器(BTB连接器)。当然,也可以为其它的电连接器件,本申请对此不作限制。In an optional example of the present application, the other end of the
在本申请的实施例中,所述连接器件3负责联通所述舌片2与所述电路板,所述电路板可以为电子设备的主板,也可以为副板。In the embodiment of the present application, the connecting
也就是说,所述舌片2是通过所述连接器件3转接至所述电路板上的。相比于传统的方式,所述舌片2无需与电路板直接连接,在进行电子设备的堆叠设计时,无需考虑舌片所在的位置,有助于使数据接口能始终保证外观居中。有助于提升电子设备的外观表现力,又能提高堆叠设计的自由度。That is to say, the
在本申请一个可选的例子中,所述连接器件3的两侧分别通过紧固件与所述壳体1连接。用以将所述连接器件3固定在所述壳体1上。In an optional example of the present application, both sides of the connecting
例如,所述连接器件3的两侧通过螺钉与所述框架固定连接。For example, both sides of the connecting
参见图7所示,在所述连接器件3的两侧分别设置有连接孔303。参见图5所示,在所述腔体102内设置有连接器件安装位,并在其上设置有装配孔103,装配孔103可用于与所述连接器件3上的连接孔配合,再通过螺钉或螺栓等紧固件即可将所述连接器件3与所述框架连接在一起。Referring to FIG. 7 , connecting
在本申请一个可选的例子中,所述舌片2的表面上设置有电路区域,所述电路区域通过刻蚀的方式形成导电线路图案。In an optional example of the present application, a circuit area is provided on the surface of the
也就是说,所述舌片2上刻有导电线路图案,其可用于实现连接外部数据线。That is to say, the conductive circuit pattern is engraved on the
根据本申请实施例的电子设备的其他构成例如显示模组等,以及操作对于本领域普通技术人员而言都是已知的,这里不再详细描述。Other components of the electronic device according to the embodiment of the present application, such as a display module, and operations are known to those skilled in the art, and will not be described in detail here.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本申请的实施例,本领域的普通技术人员可以理解:在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the application is defined by the claims and their equivalents.
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