CN113437242A - Packaging structure and photoelectric device - Google Patents
Packaging structure and photoelectric device Download PDFInfo
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- CN113437242A CN113437242A CN202110730033.1A CN202110730033A CN113437242A CN 113437242 A CN113437242 A CN 113437242A CN 202110730033 A CN202110730033 A CN 202110730033A CN 113437242 A CN113437242 A CN 113437242A
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention discloses a packaging structure and a photoelectric device. The packaging structure comprises: the packaging device comprises a packaging shell, a first packaging component and a second packaging component, wherein a cavity is arranged in the packaging shell, and a device to be packaged is placed in the cavity; the package housing includes a metal foil or a water-blocking film layer. The technical scheme provided by the embodiment of the invention prolongs the storage life of the device to be packaged and reduces the packaging cost.
Description
Technical Field
The embodiment of the invention relates to the technical field of packaging, in particular to a packaging structure and a photoelectric device.
Background
An Organic Light Emitting Diode (OLED) is a photoelectric device that emits light by carrier injection and recombination, and is widely used in the fields of display, illumination, photomedical, and the like because of its advantages of being light and thin, bendable, good in light emission uniformity, flexible, and the like. The flexible organic light emitting diode, which is particularly suitable for application in the field of photomedical, can be used as an optical patch for wound care or skin care.
Since the organic light emitting diode device is extremely sensitive to water and oxygen, it is required to hermetically encapsulate it. However, the packaging structure of the flexible screen body of the organic light emitting diode has high cost at present and cannot meet the market demand.
Disclosure of Invention
In view of the above, the present invention provides a package structure and an optoelectronic device, so as to reduce the package cost on the basis of increasing the storage life of the device to be packaged.
An embodiment of the present invention provides a package structure, including: the packaging structure comprises a packaging shell, a plurality of semiconductor chips and a plurality of semiconductor chips, wherein a cavity is arranged in the packaging shell, and a device to be packaged is placed in the cavity;
the package housing includes a metal foil or a water blocking film layer.
Optionally, the package housing includes a first package layer and a second package layer, where the first package layer includes a metal foil or a water blocking film layer; the second packaging layer comprises a metal foil or a water blocking film layer;
the thickness of the metal foil is greater than or equal to 20 micrometers and less than or equal to 2000 micrometers;
the thickness of the water blocking film layer is more than or equal to 20 micrometers and less than or equal to 2000 micrometers;
the packaging shell has a water vapor transmission rate of 10 or less-4g/(m2·d)。
Optionally, still include vapor detection unit, vapor detection unit is located in the cavity is used for detecting whether treat that the encapsulation device receives water oxygen invasion.
Optionally, the water vapor detection unit includes a water absorption color-changing adhesive layer, and the water absorption color-changing adhesive layer is located on one side of the package housing, which is adjacent to the cavity.
Optionally, the package housing is provided with an opening structure and a transparent water-blocking film layer;
the opening structure exposes part or all of the water absorption color-changing bonding layer;
the transparent water-blocking film layer covers the opening structure.
Optionally, the package further comprises a water-blocking adhesive layer, and the water-blocking adhesive layer is located at the joint of the package housing.
Optionally, the water vapor detection unit includes a detection device, and the detection device is configured to detect a water vapor content and/or an air pressure parameter in the cavity;
the packaging structure further comprises a display, the display is positioned on one side, far away from the cavity, of the packaging shell, a signal input end of the display is connected with a signal output end of the detection device, and the display is used for displaying the water vapor content and/or the air pressure parameter in the cavity;
the detection means comprise a vapour sensor and/or a barometric pressure sensor;
the water vapor sensor is used for detecting the water vapor content in the cavity, and the air pressure sensor is used for detecting air pressure parameters in the cavity.
Optionally, the water vapor content in the cavity is less than 10-5g/(m2D), and/or the gas pressure parameter in the cavity is less than 10-3When Pa is needed, the device to be packaged is not invaded by water and oxygen;
the water vapor content in the cavity satisfies the following relational expression:
wherein, T1For the design life of the device to be packaged, T0For the actual life of the device to be packaged, WVTR is the permeability of the packaging structure to water vapor, S is the surface area of the device to be packaged, and rhoXIs the density of the gas in the cavity, and V is the volume of the gas in the cavity;
the air pressure parameter in the cavity satisfies the following relational expression:
wherein P is the air pressure parameter in the cavity, T1For the design life of the device to be packaged, T0For the actual life of the device to be packaged, WVTR is the permeability of the packaging structure to water vapor, S is the surface area of the device to be packaged, V is the volume of the cavity, and m (H)2O) is the molar mass of water molecules, eta is the pressure fraction of water vapor in the air, R is the universal gas constant, and T is the temperature.
Optionally, a cutting line is arranged on the surface of the package shell away from the cavity; the packaging shell is provided with a notch structure, the depth of the notch structure is smaller than the thickness of the packaging shell, and the notch structure is located at the edge of the packaging shell.
The embodiment of the invention also provides a photoelectric device, which comprises the packaging structure in any technical scheme, and also comprises one of an organic light-emitting diode flexible screen body, a perovskite LED screen body, an organic solar cell screen body and a quantum dot photoelectric screen body, wherein the screen body is positioned in a cavity of the packaging structure.
According to the technical scheme provided by the embodiment of the invention, the device to be packaged is placed in the packaging shell formed by the metal foil or the water-blocking film layer, and the packaging shell has good water and oxygen blocking capacity, so that the device to be packaged has good storage life before use. The packaging structure has good water and oxygen blocking capability, so that the difficulty of the packaging process can be properly reduced in the production process of the device to be packaged, and the packaging cost of the device to be packaged is reduced. And because the packaging structure and the device to be packaged are two independent structures, the size of the device to be packaged is not limited when the packaging structure is prepared, and the preparation cost of the whole packaging structure is further reduced.
Drawings
Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another package structure according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another package structure according to an embodiment of the invention;
fig. 8 is a schematic structural diagram of another package structure according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another package structure according to an embodiment of the invention;
fig. 10 is a top view of another package structure according to an embodiment of the invention;
fig. 11 is a top view of another package structure according to an embodiment of the invention;
fig. 12 is a schematic structural diagram of another package structure according to an embodiment of the invention.
10-a packaging shell, 11-a cavity, 12-an opening structure, 13-a transparent water-blocking film layer, 14-water-blocking glue, 15-a water-blocking adhesive layer, 16-a notch structure, 17A-a sterilizing layer, 17B-a heat-insulating layer, 17C-an ultraviolet-resistant layer, 20-a device to be packaged, 30-a water vapor detection unit, 31-a water-absorbing color-changing adhesive layer, 32-a detection device, 40-a display, 50-a supporting structure, 100-a packaging structure and 101-a cutting line.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The inventor carefully researches and discovers that the current packaging of the flexible organic light emitting diode screen body is concentrated on the packaging structure of the screen body so as to prolong the service life of the screen body, but the market demand for the flexible organic light emitting diode screen body with short service life, long storage life and low cost is very large, so that the packaging cost of the high-reliability screen body of the packaging structure concentrated on the screen body is very high and cannot meet the market demand.
In view of the above technical problems, an embodiment of the present invention provides the following technical solutions: fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention. Referring to fig. 1, the package structure 100 includes: the packaging structure comprises a packaging shell 10, wherein a cavity 11 is arranged in the packaging shell 10, and a device 20 to be packaged is placed in the cavity 11; the package housing 10 includes a metal foil or a water-blocking film layer.
Specifically, the metal foil and the water blocking film layer have very low water oxygen permeability, which can ensure that the water vapor permeability of the package case 10 is less than or equal to 10-4g/(m2·d)。
The device 20 to be packaged is arranged in the packaging structure 100 provided by the embodiment of the invention, the device 20 to be packaged can be an organic light emitting diode flexible screen body as an example, and compared with a traditional optical medical device, the organic light emitting diode flexible screen body can be made into any shape more fitting the skin by virtue of the characteristics of flexibility, thinness and the like, so that the comfort level and the experience feeling are better. Meanwhile, the light-emitting wavelength of the flexible screen body of the organic light-emitting diode can be adjusted by adjusting the structure of the organic light-emitting material, so that near-infrared light, deep blue light and the like can be realized, and the requirements of optical medical treatment on light with different wave bands can be met. In the technical solution provided by the embodiment of the present invention, the device 20 to be packaged is located inside the package structure 100, so that the device 20 to be packaged, such as an organic light emitting diode flexible screen, has a good storage life before use. And because the flexible screen body of the organic light emitting diode is positioned in the cavity 11 arranged in the packaging structure 100, the packaging structure 100 and the device 20 to be packaged are two independent structures, and the size of the device 20 to be packaged is not limited when the packaging structure 100 is prepared, thereby reducing the preparation cost of the whole packaging structure 100. It should be noted that the device to be packaged 20 may also include other devices requiring packaging besides the flexible screen body of the organic light emitting diode, such as a quantum dot light emitting device.
In the technical scheme provided by the embodiment of the invention, the device 20 to be packaged is placed in the packaging shell 10 formed by the metal foil or the water-blocking film layer, and the packaging shell 10 has good water and oxygen blocking capability, so that the device 20 to be packaged has good storage life before use. Because the packaging structure 100 has good water and oxygen blocking capability, the difficulty of the packaging process can be properly reduced in the production process of the device 20 to be packaged, thereby reducing the packaging cost of the device 20 to be packaged. And because the packaging structure 100 and the device 20 to be packaged are two independent structures, the size of the device 20 to be packaged is not limited when the packaging structure 100 is prepared, and the preparation cost of the whole packaging structure 100 is further reduced.
It should be noted that the shape of the cavity 11 can be set according to the space required by the device 20 to be packaged, and is not limited to the shape shown in the drawings according to the embodiment of the present invention.
Fig. 2 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Optionally, on the basis of the above technical solution, referring to fig. 2, the package housing 10 includes a first package layer 10A and a second package layer 10B, where the first package layer 10A includes a metal foil or a water blocking film layer; the second packaging layer 10B includes a metal foil or a water blocking film layer; the thickness of the metal foil is greater than or equal to 20 micrometers and less than or equal to 2000 micrometers; the thickness of the water-blocking film layer is more than or equal to 20 micrometers and less than or equal to 2000 micrometers.
In order to facilitate the encapsulation of the device 20 to be encapsulated, the encapsulation housing 10 comprises a first encapsulation layer 10A and a second encapsulation layer 10B, which after being sealed together form a cavity 11 for placing the device 20 to be encapsulated.
Alternatively, the metal foil may be made of aluminum or tin. Preferably, the thickness of the metal foil is greater than or equal to 20 micrometers and less than or equal to 500 micrometers, the metal foil has certain mechanical strength compared with the metal foil with the thickness of less than 20 micrometers, and the metal foil with the thickness of more than 500 micrometers has good bending performance. The water blocking film layer comprises a substrate and a water blocking layer positioned on the surface of the substrate, so that the packaging structure 100 has low permeability to water and oxygen and has good water and oxygen blocking capability. Illustratively, the substrate comprises at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and Polyimide (PI). The water resistant layer comprises at least one of silicon nitride, silicon oxide, aluminum oxide and titanium oxide. The thickness of the water blocking film layer is greater than or equal to 20 micrometers and less than or equal to 200 micrometers, and the water blocking film layer has certain mechanical strength compared with the water blocking film layer with the thickness of less than 20 micrometers, and has good bending performance compared with the water blocking film layer with the thickness of more than 200 micrometers.
Fig. 3 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Optionally, on the basis of the above technical solution, referring to fig. 3, the package structure 100 further includes a water vapor detection unit 30, and the water vapor detection unit 30 is located in the cavity 11 and is used for detecting whether the device 20 to be packaged is invaded by water and oxygen.
Specifically, when water and oxygen enter the cavity 11 from the package housing 10, the water vapor detection unit 30 is located in the cavity 11 and is used for detecting whether the device 20 to be packaged is invaded by water and oxygen, so that the package structure 100 provided by the embodiment of the invention realizes detection of the package effect. It should be noted that, if the water vapor transmission rate of the package structure 100 is too large, it is proved that water vapor easily penetrates through the package structure 100, and oxygen also invades along with the water vapor penetrating through the package structure 100, so that the technical solution of the embodiment of the present invention completes the detection of water vapor invasion and the detection of oxygen invasion by arranging the water vapor detection unit 30.
Fig. 4 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Referring to fig. 4, the water vapor detection unit 30 includes a water absorbing color-changing adhesive layer 31, and the water absorbing color-changing adhesive layer 31 is located on a side of the package housing 10 adjacent to the cavity 11.
Specifically, when water oxygen gets into cavity 11 inside from encapsulation shell 10, absorb vapor at the layer 31 that discolours that absorbs water that one side that encapsulation shell 10 is close to cavity 11 set up, can take place the colour change, according to the current colour that the layer 31 that discolours absorbs water, alright in order to judge whether packaging structure 100 has the vapor invasion, packaging structure 100 has realized the detection to the encapsulation effect. For example, when the package housing 10 includes the first package layer 10A and the second package layer 10B, the hygroscopic discoloration adhesive layer 31 covers a joint of the first package layer 10A and the second package layer 10B where water and oxygen are likely to occur, or the hygroscopic discoloration adhesive layer 31 extends from the joint of the first package layer 10A and the second package layer 10B to a part or all of the surface of the package housing 10 adjacent to the cavity 11, so that the accuracy of detecting the package effect of the package structure 100 can be improved.
Optionally, the water absorbing color-changing adhesive layer 31 includes color-changing silicone. The allochroic silica gel is an indicating adsorbent which is prepared by deep processing of fine-pore silica gel serving as a basic raw material and has a high-activity adsorbing material, high added value and high technical content, and belongs to a high-grade adsorption drying agent. The general production method of said product is characterized by that it uses fine pore silica gel (pore diameter is 2-3nm, specific surface area is above 600 square meters/g) as carrier, and uses cobalt chloride (molecular formula: CoCl)2) Is combined on the surface of the inner pores of the silica gel through certain process steps. It has a very strong adsorption of water vapour in a medium (such as air or industrial gas) by a fine-pored silica gel. And the color-changing silica gel can change color after absorbing water, and whether the packaging structure 100 is invaded by water vapor can be judged according to the current color of the color-changing silica gel.
Optionally, on the basis of the above technical solution, the water absorbing discoloring bonding layer 31 may further include desiccant particles, and the desiccant particles are uniformly dispersed in the discoloring silica gel. For example, the desiccant particles may include at least one of calcium oxide, barium oxide, and iron powder, so that the hygroscopic discoloration adhesive layer 31 may determine whether the package structure 100 is invaded by water vapor, and also have a certain water absorbability, when the hygroscopic discoloration adhesive layer 31 covers the joint of the package housing 10 where water and oxygen are likely to appear, or the hygroscopic discoloration adhesive layer 31 extends from the joint of the package housing 10 to a part or all of the surface of the package housing 10 adjacent to the cavity 11, the water and oxygen blocking capability of the package structure 100 is further improved.
Fig. 5 is a schematic structural diagram of another package structure according to an embodiment of the invention. Referring to fig. 5, the package housing 10 is provided with an opening structure 12 and a transparent water blocking film layer 13; the opening structure 12 exposes part or all of the water absorbing color changing bonding layer 31; a transparent water-blocking film layer 13 covers the open structure 12.
Specifically, the structural arrangement of the opening structure 12 and the transparent water-blocking film layer 13 facilitates to know the packaging effect of the packaging structure 100 on the to-be-packaged device 20 in advance before the package housing 10 is disassembled.
Optionally, the water vapor transmission rate between the transparent water-blocking film layer 13 and the package housing 10 is less than or equal to 30 g/(m)2D) the water-blocking glue 14 is hermetically bonded to achieve a good water-oxygen barrier capability of the package structure 100.
Fig. 6 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Optionally, on the basis of the above technical solution, the package structure 100 further includes a water-blocking adhesive layer 15, and the water-blocking adhesive layer 15 is located at the connection position of the package housing 10.
A water-blocking adhesive layer 15 is located at the joint of the package cover 10, and as an example, when the package cover 10 includes the first and second package layers 10A and 10B, the water-blocking adhesive layer 15 is located between the first and second package layers 10A and 10B. On the first hand, the water-blocking adhesive layer 15 has a water-blocking effect, so that the device 20 to be packaged inside the packaging structure 100 can be prevented from being corroded by water and oxygen; in the second aspect, the water-blocking adhesive layer 15 has an adhesive function, and can adhere to the joint of the package housing 10, so that the package housing 10 has a sealed cavity 11; in the third aspect, when the water-blocking adhesive layer 15 is a transparent water-blocking adhesive layer, the water-absorbing color-changing condition of the water-absorbing color-changing adhesive layer 31 can be conveniently obtained before the package housing 10 is disassembled, so that the packaging effect of the packaging structure 100 on the device 20 to be packaged can be obtained in advance.
Optionally, the water-blocking adhesive layer 15 has a water vapor transmission rate of 30 g/(m) or less2D) and/or the width W of the water-blocking adhesive layer 15 is greater than or equal to 1 mm and less than or equal to 10 mm. The water vapor permeability of the water-blocking adhesive layer 15 is 30 g/(m) or less2D) to ensure that the package housing 10 has a good barrier to water and oxygen. Referring to fig. 6, the width W of the water-blocking adhesive layer 15 is greater than or equal to 1 mm and less than or equal to 10 mm, so that the package housing 10 has a predetermined adhesive strength and a good sealing effect, and at the same time, the minimum amount of materials used for the water-blocking adhesive layer 15 is used, thereby reducing the packaging cost of the package structure 100.
Fig. 7 is a schematic structural diagram of another package structure according to an embodiment of the invention. Optionally, on the basis of the above technical solution, referring to fig. 7, the water vapor detection unit 30 includes a detection device 32, and the detection device 32 is used for detecting the water vapor content and/or the air pressure parameter in the cavity 11; the package structure 100 further includes a display 40, the display 40 is located on a side of the package housing 10 away from the cavity 11, a signal input end of the display 40 is connected to a signal output end of the detection device 32, and the display 40 is used for displaying the water vapor content and/or the air pressure parameter in the cavity 11; the detection means 32 comprise a water vapour sensor and/or a barometric pressure sensor; the water vapor sensor is used for detecting the water vapor content in the cavity 11, and the air pressure sensor is used for detecting the air pressure parameter in the cavity 21.
Specifically, the detecting device 32 includes a water vapor sensor and/or an air pressure sensor, and can detect the water vapor content and/or the air pressure parameter in the cavity 11, and the display 40 can display the water vapor content and/or the air pressure parameter in the cavity 11, so that before the package housing 10 is disassembled, the packaging effect of the package structure 100 on the device 20 to be packaged can be known in advance from the display 40, and the technical effect of monitoring the water vapor content and/or the air pressure parameter in the cavity 11 at any time can be achieved.
It should be noted that the signal output end of the detection device 32 and the signal input end of the display may be connected by wireless communication, so as to avoid setting a conductive through hole structure in the package housing 10, thereby reducing the packaging difficulty of the package structure 100. Optionally, the encapsulation structure 100 may further include a power supply and a support structure 50, and the support structure 50 includes at least one of polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polyethylene naphthalate (PEN) for supporting the device 20 to be encapsulated. The display 40 is also provided with a power supply (not shown).
Optionally, on the basis of the above technical solution, the water vapor content in the cavity 11 is less than 10-5g/(m2D) and/or the gas pressure parameter in the chamber 11 is less than 10-3When Pa, the device 20 to be packaged is not invaded by water and oxygen;
the water vapor content in the cavity 11 satisfies the following relation:
wherein, T1For the design life of the device 20 to be packaged, T0For the practical lifetime of the device 20 to be packaged, WVTR is the water vapor transmission rate of the packaging structure 100, S is the surface area of the device 20 to be packaged, ρXIs the density of the gas in the cavity 11, and V is the volume of the gas in the cavity 11;
the air pressure parameter in the cavity 11 satisfies the following relational expression:
wherein P is the air pressure parameter in the cavity 11, T1For the design life of the device 20 to be packaged, T0For the practical life of the device 20 to be packaged, WVTR is the permeability of the package structure 100 to water vapor, S is the surface area of the device 20 to be packaged, V is the volume of the cavity 11, and m (H)2O) is the molar mass of water molecules, eta is the pressure fraction of water vapor in the air, R is the universal gas constant, and T is the temperature.
Specifically, the detecting device 32 detects that the content of water vapor in the cavity 11 is less than 10-5g/(m2D) and/or the gas pressure parameter is less than 10-3Pa, indicating that the package structure 100 has a good packaging effect on the device to be packaged 20.
Where ρ isXAs the density of the gas in the cavity 11, the gas in the cavity 11 may be pure nitrogen, for example, and the device 20 to be packaged may be isolated from oxygen.
From the formula (1) and the formula (2), it can be found that both the water vapor content and the air pressure parameter can establish a quantitative relation with the actual life of the device 20 to be packaged, and therefore, in the embodiment of the present invention, the water vapor content and/or the air pressure parameter are detected by the detection device 32, and further, the packaging effect of the packaging structure 100 on the device 20 to be packaged can be accurately judged from the water vapor content and/or the air pressure parameter in the cavity 11.
Fig. 8 is a schematic structural diagram of another package structure according to an embodiment of the present invention. Fig. 4 to 6 show schematic structural diagrams of the water vapor detection unit 30 including the water-absorbing color-changing adhesive layer 31. Fig. 7 shows a schematic structural view of the water vapor detection unit 30 including the detection device 32. Referring to fig. 8, the embodiment of the present invention further includes a technical solution that the water vapor detection unit 30 includes both the water absorbing color-changing adhesive layer 31 and the detection device 32.
Fig. 9 is a schematic structural diagram of another package structure according to an embodiment of the invention. Fig. 10 is a top view of another package structure according to an embodiment of the invention. Fig. 11 is a top view of another package structure according to an embodiment of the invention. Optionally, on the basis of the above technical solution, referring to fig. 9-11, a cutting line 101 is disposed on a surface of the package housing 10 away from the cavity 11; the package housing 10 is provided with a notch structure 16, the depth of the notch structure 16 is smaller than the thickness of the package housing 10, and the notch structure 16 is located at the edge of the package housing 10.
Specifically, the user can disassemble the package housing 10 along the cutting line 101 to quickly remove the device 20 to be packaged. The length of the cutting line 101 may be set by a person skilled in the art according to circumstances. Compared with the technical scheme without the notch structure 16, the technical scheme provided by the embodiment of the invention reduces the difficulty of disassembling the packaging shell 10, improves the disassembling efficiency and further improves the speed of taking out the device 20 to be packaged. The embodiment of the present invention may include the technical scheme that the notch structure 16 shown in fig. 10 is separated from the cutting line 101, and may also include the notch structure 16 shown in fig. 11 disposed at one end of the cutting line 101, so as to reduce the difficulty of disassembling the package housing 10 along the cutting line 101, and further increase the speed of taking out the device 20 to be packaged. The specific shape and number of the notch structures 16 are not limited in the embodiments of the present invention.
Fig. 12 is a schematic structural diagram of another package structure according to an embodiment of the invention. Optionally, on the basis of the above technical solution, referring to fig. 12, the package structure 100 further includes at least one of a sterilization layer 17A, a thermal insulation layer 17B, and an ultraviolet-resistant layer 17C, and at least one of the sterilization layer 17A, the thermal insulation layer 17B, and the ultraviolet-resistant layer 17C is located on one side of the package housing 10 adjacent to the cavity 11.
Specifically, the bactericidal layer 17A may include nanoparticles of metallic silver or a mixture of nanowires of metallic silver and an organic substance. The nano particles or nano wires of the metal silver have a sterilization effect, and are dispersed in the carrier of the organic matter to form a sterilization layer 17A having the sterilization effect, so that the device 20 to be packaged, which is packaged inside the packaging structure 100, is prevented from being corroded by bacteria. Illustratively, the organics include: at least one of a polyalkene alkyne, a polyurethane, a polypropylene, a polyethylene terephthalate, and a nylon.
The arrangement of the thermal insulation layer 17B can prevent the temperature of the device 20 to be packaged from changing obviously with the ambient temperature, and ensure the stability of the electrical performance of the device 20 to be packaged. Illustratively, the thermal insulation layer 17B includes indium tin oxide paint and/or aerogel.
The anti-ultraviolet layer 17C is arranged to block ultraviolet rays by the package structure 100, and prevent the device 20 to be packaged from being irradiated by ultraviolet rays, so that the electrical performance is affected. Wherein, the ultraviolet resistant layer 17C comprises at least one of titanium dioxide, zinc oxide, talcum powder, pottery clay and calcium carbonate.
It is noted that the sterilization layer 17A, the thermal insulation layer 17B, and the ultraviolet-resistant layer 17C can also be applied to the package structure 100 shown in fig. 1 to 11.
It should be noted that, with reference to fig. 5 and 12, when the opening structure 12 shown in fig. 5 is applied to the package structure 100 shown in fig. 12, the opening structure 12 extends to at least one of the sterilization layer 17A, the thermal insulation layer 17B and the ultraviolet-resistant layer 17C, and exposes a part or all of the photochromic adhesive layer 31; the transparent water-blocking film layer 13 covers the opening structure 12, so that the packaging effect of the packaging structure 100 on the device 20 to be packaged can be known in advance before the packaging case 10 is disassembled.
Optionally, referring to fig. 5, at least one of a sterilization layer, a thermal insulation layer, and an ultraviolet-resistant layer is disposed on one side of the transparent water-blocking film layer 13 adjacent to the cavity, where the sterilization layer, the thermal insulation layer, and the ultraviolet-resistant layer may be made of a material with good light transmittance, so as to obtain the packaging effect of the packaging structure 100 on the device 20 to be packaged in advance before the package housing 10 is disassembled, so that the device 20 to be packaged inside the packaging structure 100 is prevented from being corroded by bacteria, the device 20 to be packaged is prevented from being irradiated by ultraviolet light, and the electrical performance of the device 20 to be packaged is prevented from changing significantly with the ambient temperature.
Optionally, with continued reference to fig. 2, the package housing 10 includes a first package layer 10A and a second package layer 10B, when the first package layer 10A includes a metal foil, the second package layer 10B includes a metal foil, the first package layer 10A and the second package layer 10B are connected by ultrasonic welding or laser welding, a bonding layer is not required between the first package layer 10A and the second package layer 10B, the first package layer 10A and the second package layer 10B can be sealed directly by ultrasonic welding or laser welding, and the first package layer 10A and the second package layer 10B are simple in process and low in cost. It should be noted that, when the first packaging layer 10A includes a metal foil and the second packaging layer 10B includes a metal foil, the adhesion may also be achieved by a water-blocking adhesive layer.
With continued reference to fig. 6, the first encapsulation layer 10A includes a metal foil, and the second encapsulation layer 10B includes a water-blocking film layer; or, the first packaging layer 10A includes a water blocking film layer, and the second packaging layer 10B includes a water blocking film layer or a metal foil; the package structure 100 further includes a water-blocking adhesive layer 15, and the water-blocking adhesive layer 15 is located between the first package layer 10A and the second package layer 10B. The water-blocking adhesive layer 15 includes a water-blocking adhesive, or a mixture of a water-blocking adhesive and a color-changing silicone.
The embodiment of the invention also provides a photoelectric device. The photoelectric device comprises the packaging structure in the technical scheme, and further comprises an organic light-emitting diode flexible screen body, a perovskite LED screen body, an organic solar cell screen body, a quantum dot photoelectric screen body and the like, wherein the screen body is positioned in a cavity of the packaging structure.
The photoelectric device provided by the embodiment of the invention comprises a packaging structure and one of an organic light-emitting diode flexible screen body, a perovskite LED screen body, an organic solar cell screen body and a quantum dot photoelectric screen body, wherein the organic light-emitting diode flexible screen body, the perovskite LED screen body, the organic solar cell screen body and the quantum dot photoelectric screen body are arranged in the packaging structure. Meanwhile, the light-emitting wavelength of the flexible screen body of the organic light-emitting diode can be adjusted by adjusting the structure of the organic light-emitting material, so that near-infrared light emission, deep blue light emission and the like can be realized, and the requirements of optical medical treatment on light with different wave bands can be met. The packaging structure provided by the embodiment of the invention has good water and oxygen blocking capability, so that the flexible screen body of the organic light-emitting diode has good storage life before use. And because the organic light-emitting diode flexible screen body is positioned in the cavity arranged in the packaging structure, the packaging structure and the organic light-emitting diode flexible screen body are two independent structures, the size of the organic light-emitting diode flexible screen body is not limited when the packaging structure is prepared, and the preparation cost of the whole photoelectric device is further reduced.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A package structure, comprising: the packaging structure comprises a packaging shell, a plurality of semiconductor chips and a plurality of semiconductor chips, wherein a cavity is arranged in the packaging shell, and a device to be packaged is placed in the cavity;
the package housing includes a metal foil or a water blocking film layer.
2. The package structure of claim 1, wherein the package housing comprises a first package layer and a second package layer, the first package layer comprising a metal foil or a water blocking film layer; the second packaging layer comprises a metal foil or a water blocking film layer;
the thickness of the metal foil is greater than or equal to 20 micrometers and less than or equal to 2000 micrometers;
the thickness of the water blocking film layer is more than or equal to 20 micrometers and less than or equal to 2000 micrometers;
the packaging shell has a water vapor transmission rate of 10 or less-4g/(m2·d)。
3. The package structure according to claim 1, further comprising a water vapor detection unit, located in the cavity, for detecting whether the device to be packaged is invaded by water and oxygen.
4. The package structure of claim 3, wherein the water vapor detection unit comprises a water-absorbing color-changing adhesive layer on a side of the package housing adjacent to the cavity.
5. The package structure according to claim 4, wherein the package housing is provided with an opening structure and a transparent water blocking film layer;
the opening structure exposes part or all of the water absorption color-changing bonding layer;
the transparent water-blocking film layer covers the opening structure.
6. The package structure of claim 4, further comprising a water-blocking adhesive layer at the connection of the package housings.
7. The package structure according to claim 3, wherein the water vapor detection unit comprises a detection device for detecting a water vapor content and/or a gas pressure parameter within the cavity;
the packaging structure further comprises a display, the display is positioned on one side, far away from the cavity, of the packaging shell, a signal input end of the display is connected with a signal output end of the detection device, and the display is used for displaying the water vapor content and/or the air pressure parameter in the cavity;
the detection device comprises a water vapor sensor and/or an air pressure sensor;
the water vapor sensor is used for detecting the water vapor content in the cavity, and the air pressure sensor is used for detecting air pressure parameters in the cavity.
8. The package structure of claim 7, wherein the water vapor content in the cavity is less than 10-5g/(m2D), and/or the gas pressure parameter in the cavity is less than 10-3When Pa is needed, the device to be packaged is not invaded by water and oxygen;
the water vapor content in the cavity satisfies the following relational expression:
wherein, T1For the design life of the device to be packaged, T0For the actual life of the device to be packaged, WVTR is the permeability of the packaging structure to water vapor, S is the surface area of the device to be packaged, and rhoXIs the density of the gas in the cavity, and V is the volume of the gas in the cavity;
the air pressure parameter in the cavity satisfies the following relational expression:
wherein P is the air pressure parameter in the cavity, T1For the design life of the device to be packaged, T0For the actual life of the device to be packaged, WVTR is the permeability of the packaging structure to water vapor, S is the surface area of the device to be packaged, V is the volume of the cavity, and m (H)2O) is the molar mass of water molecules, eta is the pressure fraction of water vapor in the air, R is the universal gas constant, and T is the temperature.
9. The package structure of claim 1, wherein a surface of the package housing away from the cavity is provided with a cutting line; the packaging shell is provided with a notch structure, the depth of the notch structure is smaller than the thickness of the packaging shell, and the notch structure is located at the edge of the packaging shell.
10. An optoelectronic device comprising the package structure of any one of claims 1-9, and further comprising one of an organic light emitting diode flexible screen, a perovskite LED screen, an organic solar cell screen, and a quantum dot optoelectronic screen, wherein the one of the organic light emitting diode flexible screen, the perovskite LED screen, the organic solar cell screen, and the quantum dot optoelectronic screen is located within a cavity of the package structure.
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