Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the gist of the technical idea thereof, and is not limited to the description of the embodiments illustrated below.
In the drawings, the width, thickness, shape, and the like of each part may be schematically shown as compared with the actual form in order to make the description clearer, but the shape shown is merely an example, and the shape itself is not intended to limit the explanation of the present invention. In the drawings, elements having the same functions as those described in the description of the drawings are denoted by the same reference numerals in different drawings, and redundant description thereof may be omitted.
When a plurality of structures are formed by processing a certain film, the structures may have different functions and actions, and the substrates formed by the structures may be different from each other. However, these plural structures are derived from films formed as the same layer in the same step, and the same material is used. Thus, these multiple films are defined as being present in the same layer.
When the expression "at … …" indicates that another structure is arranged on a certain structure, unless otherwise specified, the expression includes both a case where another structure is arranged immediately above a certain structure in contact with the certain structure and a case where another structure is arranged above a certain structure with another structure interposed therebetween.
< first embodiment >
The structure of a light-emitting device 100 according to an embodiment of the present invention will be described with reference to fig. 1 to 3.
[1. Structure of light-emitting device ]
Fig. 1 is a schematic plan view of a light-emitting device 100 according to an embodiment of the present invention.
As shown in fig. 1, the light emitting apparatus 100 includes a plurality of light emitting units 110, a driver 120, and a controller 130. The plurality of light emitting cells 110 are arranged in a matrix in the plane of the light emitting device 100. The plurality of light emitting units 110 are each electrically connected to the driver 120 and driven by the driver 120. In addition, the driver 120 is controlled by the controller 130.
The light emitting unit 110 includes a light emitting element. In the present embodiment, the light-emitting element includes an LED chip. The details of the structure of the light emitting unit 110 will be described later.
The driver 120 is a driving circuit that outputs a control signal for controlling the light emitting unit 110 and controls light emission of the LED chip included in the light emitting unit 110. One light emitting unit 110 may be controlled by one driver 120 (that is, one driver 120 may be provided for each light emitting unit 110), or a plurality of light emitting units 110 may be controlled by one driver 120.
The driver 120 may be provided outside the support of the light emitting device 100 or may be provided on the support of the light emitting unit 110. In addition, when the driver 120 is provided for each light emitting unit 110, the driver 120 may be provided on a support of the light emitting unit 110.
The controller 130 is a control circuit that outputs a control signal for controlling the driver 120 and controls the gray scale of the light emitting unit 110 connected to the driver 120. Accordingly, the controller 130 can generate the gradation data of the light emitting unit 110 and output the generated gradation data to the driver 120. The controller 130 may also include a ROM or RAM in which programs are stored, a processor that executes the programs, or an input-output port.
The driver 120 and the controller 130 may also be integrated.
The light emitting apparatus 100 is controlled by the driver 120 and the controller 130, so that the lighting state can be adjusted for each of the plurality of light emitting units 110. For example, 1 light-emitting unit 110 can be turned on (e.g., the power of the light-emitting unit 110 is turned on), and the adjacent light-emitting unit 110 can be turned off (e.g., the power of the light-emitting unit 110 is turned off). The power consumption of the light emitting device 100 can be reduced by partially extinguishing the light emitting unit 110 in advance.
[2. light-emitting Unit ]
Fig. 2 is a schematic plan view of the light emitting unit 110 included in the light emitting device 100 according to the embodiment of the present invention.
As shown in fig. 2, the light emitting unit 110 includes a first LED unit 210 and a second LED unit 220. The first LED units 210 and the 2LED units 220 are alternately arranged in a first direction and a second direction orthogonal to the first direction as shown in fig. 2.
The first LED unit 210 and the second LED unit 220 can be distinguished by different configurations included in the first LED unit 210 and the second LED unit 220. In addition, the first LED unit 210 and the second LED unit 220 may be distinguished by the first LED unit 210 and the second LED unit 220 being controlled by different control signals. Therefore, the boundary between the first LED unit 210 and the second LED unit may not be clear, and hereinafter, for convenience of description, the first LED unit 210 and the second LED unit 220 may be described as regions where the light emitting unit 110 is uniformly divided.
When the light emitting unit 110 has a length of 3mm in each of the first direction and the second direction, the first LED unit 210 and the second LED unit 220 may be arranged such that the length of the first direction is 0.25mm and the length of the second direction is 0.75mm, for example, in each of the first LED unit 210 and the second LED unit 220. However, the sizes of the first LED unit 210 and the second LED unit 220 are not limited thereto. The size of each of the first LED unit 210 and the second LED unit 220 may be determined in consideration of the number of LED chips included in each of the first LED unit 210 and the second LED unit 220 and the degree of luminance unevenness.
The first LED unit 210 and the second LED unit 220 are each shaped, for example, as a rectangle having a short side in the first direction and a long side in the second direction, but are not limited thereto. The first LED unit 210 and the second LED unit 220 may have a triangular shape or a square shape. In addition, the first LED unit 210 and the second LED unit 220 may also be different in size or shape.
Fig. 3 is a partially enlarged plan view of the light emitting unit 110 included in the light emitting device 100 according to the embodiment of the present invention. Specifically, fig. 3 is a partially enlarged view of the region a shown in fig. 2.
As shown in fig. 3, the light emitting unit 110 includes a first high potential power line 230, a second high potential power line 240, and a low potential power line 250 in addition to the first LED unit 210 and the second LED unit 220. The first high potential power line 230, the second high potential power line 240, and the low potential power line 250 extend in a first direction. In addition, in the second direction, the first high potential power line 230, the second high potential power line 240, and the low potential power line 250, which branch off, are disposed between the first LED unit 210 and the second LED unit 220. The 1 first high-potential power line 230, the 1 second high-potential power line 240, and the 1 low-potential power line 250 may be disposed near the end of the light emitting unit 110, but due to routing of wiring, there may be a difference in applied voltage between the first LED unit 210 and the second LED unit 220 in the central portion of the light emitting unit 110 and the first LED unit 210 and the second LED unit 220 at the end of the light emitting unit 110. Therefore, it is preferable that the first high potential power line 230, the second high potential power line 240, and the low potential power line 250, which are branched, are provided at the central portion of the light emitting unit 110.
Each of the first LED unit 210 and the second LED unit 220 includes a plurality of LED chips 260. The plurality of LED chips 260 included in each of the first LED unit 210 and the second LED unit 220 are electrically connected in series via an electrode 270 formed on the support. In each of the first LED unit 210 and the second LED unit 220, the plurality of LED chips 260 are linearly arranged in the second direction.
The number of the LED chips 260 included in each of the first LED unit 210 and the second LED unit 220 is not limited to 3. The number of the LED chips 260 may be 2, 3, or 4 or more. The number of the first LED units 210 and the number of the second LED units 220 may be different. Further, the plurality of LED chips 260 may also be electrically connected in parallel. The first LED unit 210 may have the same or different configuration as the second LED unit 220.
The LED chip 260 is, for example, a white LED chip. The white LED chip is composed of a blue LED chip and a yellow phosphor. The white LED chip may be composed of an ultraviolet LED, a red phosphor, a green phosphor, and a blue phosphor. The white LED chip may be composed of a red LED, a green LED, and a blue LED.
The LED chip 260 shown in fig. 3 is flip-chip mounted on the cathode and anode of the electrode 270. That is, the LED chip 260 has a horizontal LED structure (horizontal electrode structure). However, the configuration of the LED chip 260 is not limited thereto. The LED chip 260 may have a vertical LED structure (vertical electrode structure).
When the LED chip 260 is flip-chip mounted on the electrode 270, solder, silver paste, A Conductive Film (ACF), or the like may be provided between the electrode 270 and the LED chip 260.
The first high potential power line 230 and the second high potential power line 240 have higher potentials than the low potential power line 250. The potential of the first high-potential power supply line 230 and the potential of the second high-potential power supply line 240 may be the same potential or different potentials. When the potential of the first high potential power supply line 230 is different from the potential of the second high potential power supply line 240, different controls or functions can be provided to the first LED unit 210 and the second LED unit 220.
The first LED unit 210 is electrically connected to the first high potential power line 230 and the low potential power line 250. In addition, the second LED unit 220 is electrically connected to the second high potential power line 240 and the low potential power line 250. Therefore, the first LED unit 210 can control light emission through the first high potential power line 230, and the second LED unit 220 can control light emission through the second high potential power line 240.
According to the light emitting device 100 of the present embodiment, the first LED units 210 and the second LED units 220 are alternately arranged in each of the first direction and the second direction of the light emitting unit 110. Therefore, even when the first LED unit 210 is in a light-emitting state and the second LED unit 220 is in a non-light-emitting state, the first LED unit 210 and the second LED unit 220 have high arrangement symmetry, and therefore light emission from the light-emitting unit 110 is uniform. Therefore, the brightness unevenness of the light emitting unit 110 can be reduced. In addition, the luminance unevenness of the light-emitting device 100 in which the plurality of light-emitting units 110 are arranged can also be reduced.
< second embodiment >
The structure of the light-emitting device 100A according to the embodiment of the present invention will be described with reference to fig. 4 and 5. Hereinafter, for convenience of explanation, the same configuration as that of the light-emitting device 100 will be omitted in some cases.
Fig. 4 is a partially enlarged plan view of the light emitting unit 110A included in the light emitting device 100A according to the embodiment of the present invention.
As shown in fig. 4, the light emitting unit 110A includes a first LED unit 210A, a second LED unit 220A, a first high potential power line 230, a second high potential power line 240, and a low potential power line 250. The first LED unit 210A is electrically connected to the first high potential power line 230 and the low potential power line 250. In addition, the second LED unit 220A is electrically connected to the second high potential power line 240 and the low potential power line 250. Accordingly, the first LED unit 210A may control light emission through the first high potential power line 230, and the second LED unit 220A may control light emission through the second high potential power line 240.
Each of the first LED unit 210A and the second LED unit 220A includes a plurality of LED chips 260. In each of the first LED unit 210A and the second LED unit 220A, the plurality of LED chips 260 are arranged in a zigzag shape in the second direction. That is, the LED chips 260 of the first LED unit 210A and the LED chips 260 of the second LED unit 220A are alternately arranged in each of the first direction and the second direction.
The plurality of LED chips 260 included in the first LED unit 210A are electrically connected in series via a first electrode 270A-1 formed on the support. The plurality of LED chips 260 included in the second LED unit 220A are electrically connected in series via a second electrode 270A-2 formed on the support.
The first electrode 270A-1 crosses the second electrode 270A-2 in such a manner that the first LED unit 210A crosses the second LED unit 220A as shown in fig. 4. However, at the intersection, the first electrode 270A-1 is not in electrical communication with the second electrode 270A-2. The first electrode 270A-1 is divided into a plurality of regions, and the plurality of divided regions are electrically connected via a wiring formed on the support. That is, the second electrode 270A-2 overlaps with the wiring formed on the support at the intersection with the first electrode 270A-1.
The support may have only the wiring, but may also have a transistor formed together with the wiring. For example, the driver 120 including a transistor may be formed on the support. A transistor 300 formed on the support 290 will be described with reference to fig. 5.
Fig. 5 is a cross-sectional view of a transistor 300 included in the light-emitting device 200 according to the embodiment of the present invention.
As shown in fig. 5, support 290 includes a substrate 310, and a transistor 300 is formed on substrate 310. The transistor 300 includes a semiconductor layer 300a, a gate insulating layer 300b, a gate electrode layer 300c, an interlayer insulating layer 300d, a source electrode layer 300e, and a drain electrode layer 300 f. The gate insulating layer 300b is disposed to cover the semiconductor layer 300 a. The interlayer insulating layer 300d is disposed to cover the gate electrode layer 300 c. An opening is provided in the gate insulating layer 300b and the interlayer insulating layer 300d, and the source electrode layer 300e and the drain electrode layer 300f are electrically connected to the semiconductor layer 300a through the opening.
The transistor 300 shown in fig. 5 is a top gate type transistor. Note that a bottom-gate transistor may be used as the transistor 300.
As the substrate 310, for example, a rigid substrate such as a glass substrate, a quartz substrate, or a sapphire substrate can be used. As the substrate 310, for example, a flexible substrate such as a polyimide substrate, an acrylic substrate, a siloxane substrate, or a fluorine resin substrate can be used. In order to improve the heat resistance of the flexible substrate, impurities may be introduced into the flexible substrate. When the substrate 310 does not necessarily have to have light-transmitting properties, the substrate 310 may be, for example, a semiconductor substrate such as a silicon substrate, a silicon carbide substrate, or a compound semiconductor substrate, or a conductive substrate such as a stainless substrate.
As a material of the semiconductor layer 300a, for example, silicon such as amorphous silicon or polycrystalline silicon, zinc oxide (ZnO), gallium oxide (Ga), or the like can be used2O3) Or oxides such as Indium Gallium Zinc Oxide (IGZO)A semiconductor. The semiconductor layer 300a may include not only a channel formation region but also a source region or a drain region (high-concentration impurity region). In addition, a low-concentration impurity region may be included between the channel formation region and the source region or the drain region.
As a material of the gate insulating layer 300b, for example, silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, or the like can be used. The gate insulating layer 300b may be a single layer or a stack.
As a material of the gate electrode layer 300c, for example, a metal such as aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), or tungsten (W), or an alloy thereof can be used. The gate electrode layer 300c may be a single layer or a stacked layer.
As a material of the interlayer insulating layer 300d, for example, silicon oxide, silicon nitride, aluminum oxide, or aluminum nitride can be used. The interlayer insulating layer 300d may be a single layer or a stack.
As the material of the source electrode layer 300e and the drain electrode layer 300f, for example, a metal such as aluminum (Al), titanium (Ti), molybdenum (Mo), copper (Cu), or tungsten (W), or an alloy thereof can be used. The source electrode layer 300e and the drain electrode layer 300f may be formed in a single layer or stacked layers. The gate insulating layer 300b and the interlayer insulating layer 300d have openings. The source electrode layer 300e and the drain electrode layer 300f are electrically connected to the semiconductor layer 300a through openings provided in the gate insulating layer 300b and the interlayer insulating layer 300 d.
The transistor 300 includes a conductive layer including a gate electrode layer 300c, a source electrode layer 300e, and a drain electrode layer 300 f. Therefore, the same layer as any one of the gate electrode layer 300c, the source electrode layer 300e, and the drain electrode layer 300f of the transistor 300 included in the support 290 can be used as a wiring of the first electrode 270A-1.
According to the light emitting device 100A of the present embodiment, the LED chips 260 included in the first LED unit 210A and the LED chips 260 included in the second LED unit 220A are alternately arranged in each of the first direction and the second direction of the light emitting unit 110A. Therefore, even when the first LED unit 210A is in a light-emitting state and the second LED unit 220A is in a non-light-emitting state, the LED chips 260 of the first LED unit 210A and the LED chips 260 of the second LED unit 220A are highly symmetrical in arrangement, and therefore light emission from the light-emitting unit 110A is made uniform. Therefore, the luminance unevenness of the light emitting unit 110A can be reduced. In addition, the luminance unevenness of the light-emitting device 100A in which the plurality of light-emitting units 110A are arranged can also be reduced.
< modification example >
A configuration of a light-emitting unit 100B as a modification of the light-emitting device 100A according to the embodiment of the present invention will be described with reference to fig. 6. Hereinafter, for convenience of explanation, the same configuration as that of the light-emitting device 100A may be omitted.
Fig. 6 is a partially enlarged plan view of the light emitting unit 110B included in the light emitting device 100B according to the embodiment of the present invention.
As shown in fig. 6, the light emitting unit 110B includes a first LED unit 210A, a second LED unit 220A, a first high potential power line 230B, a second high potential power line 240, and a low potential power line 250B. The first LED unit 210A is electrically connected to the first high potential power line 230B and the low potential power line 250B. In addition, the second LED unit 220A is electrically connected to the second high potential power supply line 240 and the low potential power supply line 250B. Therefore, the first LED unit 210A can control light emission through the first high potential power line 230B, and the second LED unit 220A can control light emission through the second high potential power line 240.
In the light emitting unit 110B, the low potential power line 230B and the first high potential 250B are commonly used. Specifically, the low-potential power supply line 250B is shared between the adjacent first LED units 210A (or second LED units 220A). In addition, the first high potential power supply line 230B between the adjacent first LED units 210A is also shared. In the light emitting unit 110B, the common low-potential power supply line 250B and the first high-potential power supply line 230B are alternately arranged in the second direction.
According to the light-emitting device 100B of the present modification, the common low-potential power supply line 250B and the common first high-potential power supply line 230 are shared, and therefore, more first LED units 210A and more second LED units 220A can be arranged. Therefore, the light emitting device 100B has high fineness and can perform control with higher fineness.
< embodiment 3 >
The configuration of a lighting fixture 400 according to an embodiment of the present invention will be described with reference to fig. 7.
Fig. 7 is an exploded perspective view of a lighting fixture 400 according to an embodiment of the present invention. Specifically, (a) of fig. 7 is a perspective view seen from the side of the light-emitting device 100 included in the lighting fixture 400, and (B) of fig. 7 is a perspective view seen from the opposite side of the light-emitting device 100.
As shown in fig. 7, the lighting apparatus 400 includes the light-emitting device 100 and a cover 410. When the lighting fixture 400 is installed on a ceiling or a wall, the light-emitting device 100 side is installed on the ceiling or the wall.
The cover 410 can house and protect the light emitting device 100. The cover 410 is preferably removably attached to the light emitting device 100. If the cover 410 can be removed, the light emitting unit 110 included in the light emitting device 100 can be easily replaced when the light emitting unit 110 fails. In addition, a milky-white resin material having light transmittance and diffusibility may be used for the cover 410. Since the light-emitting device 100 in the lighting fixture 400 is hidden from view by the cover 410, the aesthetic appearance of the lighting fixture 400 can be improved. Further, the cover 410 may have not only a flat portion but also a bent portion.
The light emitting unit 110 of the light emitting device 100 may be detachable from the light emitting device 100. As described above, when the light emitting unit 110 has a failure, the light emitting unit 110 may be replaced without replacing the light emitting device 100.
In the lighting fixture 400, various illuminations can be performed by controlling the light emitting unit 110 of the light emitting device 100.
For example, in the lighting fixture 400, the lighting state and the lighting-off state of the plurality of light-emitting units 110 may be controlled, and only the area that needs to be illuminated may be selectively illuminated. In this case, the first LED unit 210 and the second LED unit 220 included in the light emitting unit 110 may be controlled to adjust the gray scale of illumination. In the lighting fixture 400, since the first LED unit 210 and the second LED unit 220, which are arranged more symmetrically, are used to adjust the gradation of illumination in the illuminated block, uniform illumination (or illumination with reduced luminance unevenness) can be performed.
For example, the LED chip 260 included in the first LED unit 210 may be a white LED chip, and the LED chip 260 included in the second LED unit 220 may be a yellow LED chip. In this case, by controlling the first LED unit 210 and the second LED unit 220, it is possible to switch the illumination colors such as a cool white color, a daylight color, and an incandescent lamp color.
The cold white illumination is a blue intense illumination, and is controlled such that the luminance of the white LED chip of the first LED unit 210 is higher than the luminance of the yellow LED chip of the second LED unit 220. The illumination of daylight color is illumination close to external light, and is controlled such that the luminance of the white LED chip of the first LED unit 210 and the luminance of the yellow LED chip of the second LED unit 220 are at the same level. For the illumination of the incandescent lamp color, the brightness of the yellow LED chip of the second LED unit 220 is controlled to be larger than the brightness of the white LED chip of the first LED unit 210.
In the lighting fixture 400, the first LED unit 210 and the second LED unit 220 are highly symmetrical in arrangement, and thus uniform lighting can be performed.
In the lighting fixture 400 shown in fig. 7, the light-emitting device 100 is disposed directly below the fixture, but the light-emitting device 100 may be disposed on the edge.
According to the lighting fixture 400 of the present embodiment, the light emitting unit 110, the first LED unit 210, and the second LED unit 220 are controlled using the light emitting device 100, so that various lighting can be performed. In addition, since the first LED unit 210 and the second LED unit 220 have high arrangement symmetry, the lighting fixture 400 can perform uniform lighting.
< embodiment 4 >
The structure of the liquid crystal display device 500 according to an embodiment of the present invention will be described with reference to fig. 8.
Fig. 8 is an exploded perspective view of a liquid crystal display device 500 according to an embodiment of the present invention.
As shown in fig. 8, the liquid crystal display device 500 includes the light emitting device 100, an optical sheet 510, and a liquid crystal display panel 520. The optical sheet 510 is disposed between the light emitting device 100 and the liquid crystal display panel 520. The liquid crystal display panel 520 includes a display surface 522 on which an image or video is displayed.
The optical sheet 510 is a light-collecting sheet (prism sheet), a light-diffusing sheet, or the like, and collects or diffuses light irradiated from the light-emitting device 100, thereby uniformizing the light in the optical sheet 510. Since the light homogenized by the optical sheet 510 is incident on the liquid crystal display panel 520, the luminance unevenness of the liquid crystal display device 500 can be reduced.
The liquid crystal display panel 520 includes liquid crystal and electrodes for applying a voltage to the liquid crystal. In addition, the liquid crystal display panel 520 includes a transistor for driving liquid crystal (controlling a voltage applied to an electrode). In the liquid crystal display panel 520, the liquid crystal is controlled to transmit or block light from the light emitting device 100, whereby an image or video can be displayed on the display surface 522. In addition, the liquid crystal display panel 520 includes a color filter, thereby enabling color display of the liquid crystal display device 500. Further, the liquid crystal display panel 520 may include a polarizing plate. By sandwiching the liquid crystal between 2 polarizing plates, the light emitted from the light-emitting device 100 can be polarized in a certain direction. The 2-sheet polarizing plates may be disposed in a so-called crossed nicols in which transmission axes are orthogonal.
In the liquid crystal display device 500, the light emitting unit 110 of the light emitting device 100 can be driven for local dimming as 1 segment. That is, on the display surface 522, the light-emitting unit 110 corresponding to the area where the display of the image or video is necessary may be turned on, and the light-emitting unit 110 corresponding to the area where the display of the image or video is not necessary may be turned off. By performing local dimming driving, the contrast of display can be improved.
In the light emitting unit 110, the first LED units 210 and the second LED units 220 are alternately arranged, and the arrangement symmetry is high. In addition, since the first LED units 210 and the second LED units 220 are alternately arranged not only in the first direction but also in the second direction, light emission from the light emitting unit 110 is uniform, and unevenness in luminance of the light emitting unit 110 can be reduced. In addition, the luminance unevenness of the light-emitting device 100 in which the plurality of light-emitting units 110 are arranged can also be reduced.
According to the liquid crystal display device of the present embodiment, since the first LED unit 210 and the second LED unit 220 of the light emitting device 100 have high arrangement symmetry, the luminance unevenness of the light emitting device 100 can be reduced even when local dimming driving is performed. Therefore, the display quality of the liquid crystal display device is improved. Further, the degree of freedom in controlling the light-emitting device 100 is high, and the liquid crystal display device 500 can further reduce power consumption.
As an embodiment of the present invention, the above-described embodiments may be combined and implemented as appropriate as long as they do not contradict each other. In addition, in the embodiments, a person skilled in the art can add, reduce, or modify components or steps or conditions as appropriate, and the scope of the present invention is also included as long as the gist of the present invention is achieved.
Even if the operation and effect is different from those of the embodiments described above, the operation and effect that can be clearly understood from the description of the present specification or can be easily predicted by a person skilled in the art can be naturally interpreted as being brought about by the present invention.