CN113423216A - Electronic device and assembling method thereof - Google Patents

Abstract

The invention discloses an electronic device and an assembling method thereof, wherein the electronic device comprises: the power supply assembly is fixed in the case; the first isolation plate is fixed in the case, and the first end of the first isolation plate is attached and sealed with the lower surface of the first end of the power supply assembly; the first end of the second isolation plate is attached and sealed with the upper surface of the first end of the power supply assembly; the first isolation plate, the first end of the power supply assembly and the second isolation plate isolate the case into a system air duct and a power supply air duct which are independent of each other, and the system air duct is positioned above the power supply air duct. The first isolation plate and the second isolation plate are fixed on the case, the case is isolated into a system air channel and a power supply air channel which are arranged up and down, the two air channels are mutually independent and do not influence each other, and the first isolation plate and the second isolation plate are simple and convenient to assemble. The electronic equipment is favorably upgraded and the modular design of the electronic equipment is facilitated.

Description

Electronic device and assembling method thereof

Technical Field

The invention relates to an electronic device and an assembling method thereof.

Background

In electronic equipment, the wind pressure of a power supply fan and a system fan is greatly different, and the air duct of the power supply fan and the air duct of the system heat dissipation fan are generally required to be isolated. The power supply is switched to supply power to the system through the PCB, and the current isolation air channel technology is to assemble an additional structural part on the PCB, but the isolation is not thorough in the method; and the structural member and the PCB board of keeping apart the wind channel are structurally strong relatively, and constitute by the polylith PCB board usually in the system, therefore independent wind channel baffle equipment is loaded down with trivial details in the current scheme, is unfavorable for the modular design of system. In the process of upgrading the electronic equipment, the PCB needs to be disassembled and replaced, the structural member associated with the PCB also needs to be adjusted, the adjusting steps are complicated, and the upgrading and upgrading efficiency of the electronic equipment is affected.

Disclosure of Invention

The invention provides electronic equipment and an assembling method thereof, aiming at overcoming the defects that in the prior art, air duct isolation is not thorough, air duct partition plates are complicated to assemble, the system is not beneficial to modular design, and the upgrading efficiency of the electronic equipment is influenced.

The invention solves the technical problems through the following technical scheme:

an electronic device, comprising: the power supply assembly is fixed in the case; the first isolation plate is fixed in the case, the first end of the first isolation plate is in fit sealing with the lower surface of the first end of the power supply assembly, and the first end of the first isolation plate is the end close to the power supply assembly; the first end of the second isolation plate is in fit sealing with the upper surface of the first end of the power supply assembly, and the first end of the second isolation plate is close to the first isolation plate; the first isolation plate, the first end of the power supply assembly and the second isolation plate isolate the case into an independent system air duct and a power supply air duct, and the system air duct is positioned above the power supply air duct.

In this scheme, adopt above-mentioned structural style, first division board and second division board are fixed on quick-witted case, keep apart into the system wind channel and the power wind channel that set up from top to bottom with quick-witted case, and two wind channels mutually independent do not influence each other, and first division board and second division board equipment are simple and convenient. The second PCB is installed in the system air duct, the first isolation plate and the second isolation plate are arranged without affecting the disassembly and assembly of the second PCB, the second PCB is favorably upgraded, the power supply assembly, the first isolation plate and the second isolation plate are not required to be greatly changed, and the modular design of the electronic equipment is facilitated.

Preferably, the first isolation plate comprises a first isolation portion, a second isolation portion and a third isolation portion which are connected in sequence, the first isolation portion is lower than the third isolation portion, and the third isolation portion is attached to and sealed with the first end of the power supply assembly.

In this scheme, adopt above-mentioned structural style, the space that the one end of keeping away from power supply module on the quick-witted case was left for the system wind channel is big, does benefit to the dismouting of second PCB board in the system wind channel, has improved the independence and the radiating efficiency in system wind channel and power wind channel.

Preferably, the first end face, the second end face and the third end face of the first isolation plate respectively abut against the inner wall of the chassis.

In this scheme, adopt above-mentioned structural style, improve the independence in system's wind channel and power wind channel greatly, improved the wind channel and kept apart the effect. When the first isolation plate is produced in a sheet metal factory, the first isolation plate and the case are assembled together, so that the assembly of electronic equipment is facilitated, and the strength of the case is also enhanced.

Preferably, the second division board includes lower isolation part, connecting portion and the last isolation part that connects in order, lower isolation part with the laminating of the first end of power supply module is sealed, go up the isolation part with the upper surface laminating of power supply module.

In this scheme, adopt above-mentioned structural style for the second division board encloses to close in the power supply module outside, simple structure, and the wind channel is kept apart effectually.

Preferably, the power supply assembly includes a power supply cover plate fixed to the chassis, and a first end of the power supply cover plate is fixedly connected to a second end of the second isolation plate.

In this scheme, adopt above-mentioned structural style, the first end of power apron and last isolation part fixed connection and laminating are sealed, strengthen the isolation effect in wind channel.

Preferably, the power supply assembly includes a first PCB, and the first and second isolation plates are respectively attached to the first PCB.

In this scheme, adopt above-mentioned structural style, improved the independence in system wind channel and power wind channel greatly, the wind channel is kept apart thoroughly.

Preferably, the power supply assembly further includes a power supply and a first connector, the power supply is electrically connected to the first PCB through the first connector, and a first fan is built in the power supply.

Preferably, the electronic device further includes a system cooling fan, and the system cooling fan is disposed at the first end of the system air duct.

In this scheme, adopt above-mentioned structural style, can install the second PCB board in the system's wind channel for the installation of first division board, second division board is irrelevant in the structure with the second PCB board, is favorable to carrying out the dismouting to the second PCB board.

An electronic device assembling method for assembling an electronic device, the electronic device assembling method comprising:

s10, fixing the first isolation plate in the case;

s20, mounting the second isolation plate and the power supply assembly together, and enabling the first end of the second isolation plate to be in fit sealing with the upper surface of the first end of the power supply assembly;

s30, fixing the power supply assembly provided with the second partition board in the case, and controlling the lower surface of the first end of the power supply assembly to be attached and sealed with the first end of the first partition board, so that the case is separated into an independent system air duct and a power supply air duct by the first partition board, the first end of the power supply assembly and the second partition board, and the system air duct is located above the power supply air duct.

In the scheme, by adopting the method, the first isolation plate and the second isolation plate are fixed on the case, the case is isolated into the system air channel and the power supply air channel which are arranged up and down, the two air channels are independent from each other and do not influence each other, and the first isolation plate and the second isolation plate are simple and convenient to assemble. The second PCB is installed in the system air duct, the first isolation plate and the second isolation plate are arranged without affecting the disassembly and assembly of the second PCB, the second PCB is favorably upgraded, large changes of the power supply assembly, the first isolation plate and the second isolation plate are not needed, and the modular design of the electronic equipment is favorably realized.

The positive progress effects of the invention are as follows: the first isolation plate and the second isolation plate are fixed on the case, the case is isolated into a system air channel and a power supply air channel which are arranged up and down, the two air channels are mutually independent and do not influence each other, and the first isolation plate and the second isolation plate are simple and convenient to assemble. The electronic equipment is favorably upgraded and the modular design of the electronic equipment is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of an electronic device assembling method according to an embodiment of the invention.

Description of reference numerals:

case 1

Power supply module 2

Power supply cover plate 21

First PCB board 22

Power supply 23

First fan 231

First connector 24

First partition plate 3

First separator 31

Second isolation portion 32

Third isolation part 33

Second partition plate 4

Lower spacer 41

Connecting part 42

Upper isolation part 43

System air duct 5

System cooling fan 51

Power supply air duct 6

Detailed Description

The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.

As shown in fig. 1, in the electronic device provided in the embodiment of the present invention, the electronic device may be a server, a network communication device, or other computer room devices. The electronic device comprises a case 1, a power supply assembly 2, a first partition plate 3 and a second partition plate 4. The power module 2 is fixed in the housing 1 at the left end of the housing 1 shown in fig. 1. The first isolation plate 3 is fixed in the case 1, the first end of the first isolation plate 3 is in fit sealing with the lower surface of the first end of the power supply assembly 2, namely, the sealing is realized by surface-to-surface fit, the first end of the first isolation plate 3 is the end close to the power supply assembly 2, and the first isolation plate 3 extends to the side wall of the case 1 from the first end to the direction far away from the power supply assembly 2; the second division board 4 is fixed in quick-witted case 1, and the first end of second division board 4 and the upper surface laminating of the first end of power supply module 2 are sealed, realize sealedly through the laminating of face with the face promptly, and the first end of second division board 4 is the one end that is close to first division board 3, and second division board 4 extends to power supply module 2 place side from its first end promptly. The first isolation plate 3, the first end of the power supply assembly 2 and the second isolation plate 4 isolate the case 1 into an independent system air duct 5 and a power supply air duct 6, and the system air duct 5 is located above the power supply air duct 6. The system air duct 5 is used in system heat dissipation, and the power supply air duct 6 is used in power supply heat dissipation.

In this embodiment, in a first aspect, the first isolation plate 3 and the second isolation plate 4 are fixed on the case 1, and the two are attached to the first end of the power supply module 2 and sealed, so as to isolate the case 1 into the system air duct 5 and the power supply air duct 6 which are vertically arranged, the air duct isolation effect is good, and the two air ducts are independent from each other. In the second aspect, the first partition plate 3 may be previously built in the housing 1, and the second partition plate 4 and the power supply module 2 may be fixed together and then assembled in the housing 1, and in both stages of assembling and maintaining the electronic device, the first partition plate 3 does not need to be disassembled, and the second partition plate 4 and the power supply module 2 may be disassembled together, so that the disassembly and the assembly are easy. In the third aspect, the second PCB is installed in the system air duct 5, and the first isolation board 3 and the second isolation board 4 are arranged without affecting the assembly and disassembly of the second PCB, so that the second PCB can be upgraded, the power supply module 2, the first isolation board 3 and the second isolation board 4 do not need to be changed greatly, and the modular design of the electronic equipment is facilitated.

As a preferred embodiment, the first isolation plate 3 includes a first isolation portion 31, a second isolation portion 32 and a third isolation portion 33, which are connected in sequence, the first isolation portion 31 is lower than the third isolation portion 33, and a space left for the system air duct 5 by an end of the chassis 1 away from the power supply module 2 is large, which is beneficial to dismounting the second PCB board in the system air duct 5, and improves the heat dissipation efficiency of the system air duct 5. The third partition 33 is in close contact with the first end of the power module 2, and improves the independence between the system air duct 5 and the power supply air duct 6.

In a preferred embodiment, a first end surface, a second end surface and a third end surface of the first isolation plate 3 respectively abut against an inner wall of the chassis 1, wherein the first end surface is an end surface of the first isolation plate 3 away from the power supply module 2, and the second end surface and the third end surface are two side surfaces adjacent to the first end surface. The first end face of the first isolation plate 3 abuts against the inner wall of one end of the case 1 far away from the power supply module 2, and the second end face and the third end face abut against two side walls of the case 1. The embodiment greatly improves the independence of the system air duct 5 and the power supply air duct 6, and improves the air duct isolation effect.

In a preferred embodiment, the second partition plate 4 includes a lower partition portion 41, a connecting portion 42, and an upper partition portion 43, which are connected in this order, the lower partition portion 41 is attached to and sealed with the first end of the power module 2, and the upper partition portion 43 is attached to the upper surface of the power module 2. In this embodiment, the structure of the lower partition 41, the connecting portion 42, and the upper partition 43 allows the second partition 4 to surround the power module 2, and thus the structure is simple and the air duct isolation effect is good.

In a preferred embodiment, the power module 2 includes a power cover 21 fixed to the housing 1, and a first end of the power cover 21 is fixedly connected to a second end of the second isolation plate 4. The second end of the power cover plate 21 is fixed on the rear wall of the case 1, and the first end of the power cover plate 21 is fixedly connected and attached to the upper isolation part 43 for sealing, so that the isolation effect of the air duct is enhanced.

In a preferred embodiment, the power module 2 includes a first PCB 22, and the first and second partition plates 3 and 4 are attached to the first PCB 22, respectively. First PCB board 22 is located the first end of power supply module 2, and the laminating of third division 33 and first PCB board 22 lower surface in the first division board 3 is sealed, and the laminating of the lower division 41 of second division board 4 and first PCB board 22 upper surface is sealed, has improved the independence of system wind channel 5 and power wind channel 6 greatly, and the wind channel is kept apart thoroughly.

In a preferred embodiment, the power module 2 further includes a power source 23 and a first connector 24, the power source 23 is electrically connected to the first PCB 22 through the first connector 24, and the power source 23 has a first fan 231 built therein.

In a preferred embodiment, the electronic device further includes a system heat dissipation fan 51, and the system heat dissipation fan 51 is disposed at the first end of the system air duct 5, i.e. the system heat dissipation fan 51 and the power module 2 are located at the same end of the chassis 1. The second PCB can be arranged in the system air duct 5, so that the arrangement of the first isolation board 3 and the second isolation board 4 is irrelevant to the structure of the second PCB, and the second PCB can be disassembled and assembled conveniently.

As shown in fig. 2, an embodiment of the present invention further provides an electronic device assembling method, for assembling the electronic device according to any of the above embodiments, including the following steps:

s10, the first isolation plate 3 is fixed in the case 1, and the step can be completed before production in a sheet metal factory, namely, the first isolation plate 3 and the case 1 are assembled in advance before delivery, so that later-stage assembly of electronic equipment is facilitated, and the strength of the case 1 is enhanced;

s20, the second isolation plate 4 and the power supply assembly 2 are installed together, and the first end of the second isolation plate 4 is sealed with the upper surface of the first end of the power supply assembly 2 in a fitting mode;

s30, fixing the power supply assembly 2 provided with the second isolation plate 4 in the case 1 provided with the first isolation plate 3, and controlling the lower surface of the first end of the power supply assembly 2 to be attached and sealed with the first end of the first isolation plate 3, so that the case 1 is isolated into a relatively independent system air duct 5 and a relatively independent power supply air duct 6 by the first isolation plate 3, the first end of the power supply assembly 2 and the second isolation plate 4, and the system air duct 5 is positioned above the power supply air duct 6.

By adopting the method, the first isolation plate 3 and the second isolation plate 4 are fixed on the case 1, the case 1 is isolated into the system air channel 5 and the power supply air channel 6 which are arranged up and down, the air channel isolation effect is good, the two air channels are independent from each other and do not influence each other, and the first isolation plate 3 and the second isolation plate 4 are simple and convenient to assemble. The second PCB is installed in the system air duct 5, and the first isolation board 3 and the second isolation board 4 are arranged without affecting the disassembly and assembly of the second PCB, so that the second PCB can be replaced and upgraded conveniently, and the modular design of the electronic equipment is facilitated.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.

Claims (9)

1. An electronic device, comprising:

the power supply assembly is fixed in the case;

the first isolation plate is fixed in the case, the first end of the first isolation plate is in fit sealing with the lower surface of the first end of the power supply assembly, and the first end of the first isolation plate is the end close to the power supply assembly; and

the first end of the second isolation plate is in fit sealing with the upper surface of the first end of the power supply assembly, and the first end of the second isolation plate is close to the first isolation plate;

the first isolation plate, the first end of the power supply assembly and the second isolation plate isolate the case into an independent system air duct and a power supply air duct, and the system air duct is positioned above the power supply air duct.

2. The electronic device of claim 1, wherein the first spacer includes a first spacer, a second spacer, and a third spacer connected in sequence, the first spacer being lower than the third spacer, the third spacer being in close contact with the first end of the power module.

3. The electronic device of claim 1, wherein the first end face, the second end face, and the third end face of the first partition plate respectively abut against an inner wall of the chassis.

4. The electronic device of claim 1, wherein the second spacer comprises a lower spacer, a connecting portion, and an upper spacer connected in series, the lower spacer being in sealing engagement with the first end of the power supply assembly, the upper spacer being in engagement with the upper surface of the power supply assembly.

5. The electronic device of claim 1, wherein the power assembly comprises a power cover plate secured to the chassis, a first end of the power cover plate being fixedly coupled to a second end of the second spacer plate.

6. The electronic device of claim 1, wherein the power supply assembly comprises a first PCB, and the first and second separators are attached to the first PCB, respectively.

7. The electronic device of claim 6, wherein the power supply assembly further comprises a power supply and a first connector, the power supply electrically connected to the first PCB board through the first connector, the power supply having a first fan built therein.

8. The electronic device of claim 1, further comprising a system heat dissipation fan disposed at the first end of the system air duct.

9. An electronic device assembling method for assembling the electronic device according to any one of claims 1 to 8, the electronic device assembling method comprising:

s10, fixing the first isolation plate in the case;

s20, mounting the second isolation plate and the power supply assembly together, and enabling the first end of the second isolation plate to be in fit sealing with the upper surface of the first end of the power supply assembly;

s30, fixing the power supply assembly provided with the second partition board in the case, and controlling the lower surface of the first end of the power supply assembly to be attached and sealed with the first end of the first partition board, so that the case is separated into an independent system air duct and a power supply air duct by the first partition board, the first end of the power supply assembly and the second partition board, and the system air duct is located above the power supply air duct.

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