CN113411991B - PCB pattern transfer alignment target method - Google Patents
PCB pattern transfer alignment target method Download PDFInfo
- Publication number
- CN113411991B CN113411991B CN202110474572.3A CN202110474572A CN113411991B CN 113411991 B CN113411991 B CN 113411991B CN 202110474572 A CN202110474572 A CN 202110474572A CN 113411991 B CN113411991 B CN 113411991B
- Authority
- CN
- China
- Prior art keywords
- alignment target
- hole
- pcb
- alignment
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000012546 transfer Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000005111 flow chemistry technique Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a PCB pattern transfer alignment target method, which comprises the following steps: drilling an alignment target hole on a PCB; continuously processing a diversion hole along the outer side edge of the alignment target hole; processing laser through holes on the PCB; copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted into the shunt hole; and performing pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB. In the copper plating process, design flow dividing holes are adopted to protect around the alignment target holes, the effects of dividing electroplating density and increasing electroplating area are achieved in the complex waveform pulse electroplating process, the diameter consistency of the alignment target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the alignment target holes is improved, the production problems of refusal exposure, pattern PAD, laser hole deviation and the like in the pattern transferring process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a PCB pattern transfer alignment target method.
Background
Currently, with the development of the PCB board towards light, thin, short and small directions, the design of laser perforation is smaller and smaller, which is very easy to cause hole collapse of the laser perforation, and recently the design of laser blind holes has been developed to the level of the design of laser drilled holes (i.e., X-via).
However, the existing pattern transfer alignment target method has the following defects:
In the copper plating process to the alignment target hole, copper thickness bulges are formed around the alignment target hole due to copper plating uniformity, so that the accuracy of the diameter of the alignment target hole is seriously affected, the problem of different diameters of the alignment target is frequently solved, the production efficiency is reduced, and the bad defect of offset of the graph PAD and the laser hole is caused.
Disclosure of Invention
In order to overcome the defects of the prior art, one of the purposes of the invention is to provide a PCB pattern transfer alignment target method, which can solve the problems of different diameters of alignment targets and reduced production efficiency.
One of the purposes of the invention is realized by adopting the following technical scheme:
a PCB pattern transfer alignment target method comprises the following steps:
hole site processing step: drilling an alignment target hole on a PCB;
and (3) split flow processing steps: continuously processing a diversion hole along the outer side edge of the alignment target hole;
and (3) laser steps: processing laser through holes on the PCB;
copper plating: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted into the shunt hole;
Aligning: and performing pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB.
Further, in the hole site processing step, the alignment target hole is processed into a circular shape.
Further, in the shunt processing step, a circle of shunt holes with the same diameter are processed around the circular alignment target hole.
Further, in the step of dividing, the diameter of the dividing aperture is defined to be between one tenth and one fifth of the diameter of the alignment target aperture.
Further, in the shunt processing step, the diameter of the shunt hole is defined to be 0.15 times the diameter of the alignment target hole.
Further, in the copper plating step, it is checked whether or not a copper thick bump appears and a mark is corresponded.
Further, in the copper plating step, whether the copper thick protrusions meet the requirements or not is checked, if yes, the next step is executed, and if not, the scrapping treatment is carried out.
Further, in the copper plating step, a pattern at the alignment target hole is identified, generating an alignment target pattern.
Further, in the copper plating step, the alignment target pattern is marked and corresponds to the corresponding alignment target hole.
Further, the method also comprises the step of replacing the plate: and replacing another PCB, and repeating the processing steps.
Compared with the prior art, the invention has the beneficial effects that:
In the copper plating process, design flow dividing holes are adopted to protect around the alignment target holes, the effects of dividing electroplating density and increasing electroplating area are achieved in the complex waveform pulse electroplating process, the diameter consistency of the alignment target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the alignment target holes is improved, the production problems of refusal exposure, pattern PAD, laser hole deviation and the like in the pattern transferring process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention, as well as the preferred embodiments thereof, together with the following detailed description of the invention, given by way of illustration only, together with the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a method for transferring alignment targets of a PCB pattern according to the present invention;
FIG. 2 is an image of the alignment targets after copper plating without design of the flow holes;
FIG. 3 is an image of the alignment targets after copper plating after the design of the flow holes.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, a method for transferring alignment targets of a PCB board pattern includes the following steps:
hole site processing step: drilling an alignment target hole on a PCB;
and (3) split flow processing steps: continuously processing a diversion hole along the outer side edge of the alignment target hole;
and (3) laser steps: processing laser through holes on the PCB;
copper plating: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted into the shunt hole;
Aligning: and performing pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB. In the copper plating process, design flow dividing holes are adopted to protect around the alignment target holes, the effects of dividing electroplating density and increasing electroplating area are achieved in the complex waveform pulse electroplating process, the diameter consistency of the alignment target holes can be effectively protected, the stability is improved, the influence of copper thickness protrusions is reduced, the uniformity of copper thickness in the holes of the alignment target holes is improved, the production problems of refusal exposure, pattern PAD, laser hole deviation and the like in the pattern transferring process are avoided, the production efficiency is improved, and the alignment degree of the pattern PAD and the laser holes is improved.
Specifically, in the actual operation process of the PCB pattern transfer alignment target method, a halogen lamp exposure device is used for pattern transfer of the PCB, and DI equipment is adopted for direct imaging.
Preferably, in the hole site processing step, the alignment target hole is processed into a circular shape. Specifically, in the shunt processing step, a circle of shunt holes with the same diameter are processed around the circular alignment target hole. In the diverting processing step, the diameter of the diverting aperture is defined to be between one tenth and one fifth of the diameter of the alignment target aperture. In this embodiment, in the shunt processing step, the diameter of the shunt hole is defined to be 0.15 times the diameter of the alignment target hole. For example, when the diameter of the alignment target hole is 4mm, a circle of distribution holes with the diameter of 0.55mm are designed around the alignment target hole with the diameter of 4.0 mm.
Preferably, in the copper plating step, it is checked whether or not a copper thick bump is present and a mark is corresponded. And (5) checking whether the copper thick bulge meets the requirement, if so, executing the next step, and if not, scrapping.
Preferably, in the copper plating step, a pattern at the alignment target hole is identified, and an alignment target pattern is generated. And marking the alignment target graph and corresponding to the corresponding alignment target hole. The alignment target graph of each circuit board can be identified, and management is convenient.
Preferably, the method further comprises the step of replacing the plate: and replacing another PCB, and repeating the processing steps.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (5)
1. The PCB pattern transfer alignment target method is characterized by comprising the following steps of:
hole site processing step: drilling an alignment target hole on a PCB;
and (3) split flow processing steps: continuously processing a diversion hole along the outer side edge of the alignment target hole;
and (3) laser steps: processing laser through holes on the PCB;
copper plating: copper is plated on the PCB, and redundant copper at the position of the alignment target hole is shunted into the shunt hole;
aligning: performing pattern transfer alignment by using the alignment target hole to generate a circuit conductive pattern of the PCB;
In the hole site processing step, the alignment target hole is processed into a round shape;
in the shunt processing step, a circle of shunt holes with the same diameter are processed around the round alignment target hole;
In the step of dividing, the diameter of the dividing aperture is limited to be between one tenth and one fifth of the diameter of the alignment target aperture;
in the copper plating step, identifying a pattern at the alignment target hole to generate an alignment target pattern;
In the copper plating step, the alignment target pattern is marked and corresponds to the corresponding alignment target hole.
2. The method for transferring alignment targets of a PCB pattern according to claim 1, wherein: in the copper plating step, it is checked whether or not a copper thick bump appears and a mark is corresponded.
3. The method for transferring alignment targets of a PCB pattern according to claim 1, wherein: in the copper plating step, whether the copper thick protrusions meet the requirements or not is checked, if yes, the next step is executed, and if not, the copper thick protrusions are scrapped.
4. The method for transferring alignment targets of a PCB pattern of claim 1, further comprising the step of changing the pattern: and replacing another PCB, and repeating the processing steps.
5. The method for transferring alignment targets of a PCB pattern according to claim 1, wherein: in the shunt processing step, the diameter of the shunt hole is defined to be 0.15 times the diameter of the alignment target hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110474572.3A CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110474572.3A CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113411991A CN113411991A (en) | 2021-09-17 |
| CN113411991B true CN113411991B (en) | 2024-06-21 |
Family
ID=77677771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110474572.3A Active CN113411991B (en) | 2021-04-29 | 2021-04-29 | PCB pattern transfer alignment target method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113411991B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930033A (en) * | 2021-01-22 | 2021-06-08 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02188989A (en) * | 1989-01-17 | 1990-07-25 | Hitachi Chem Co Ltd | Electrically plating method for printed circuit board |
| JP2002237679A (en) * | 1997-02-03 | 2002-08-23 | Ibiden Co Ltd | Printed circuit board and its manufacturing method |
| JP4134503B2 (en) * | 2000-10-11 | 2008-08-20 | 松下電器産業株式会社 | Method for manufacturing circuit-formed substrate |
| CN104470227A (en) * | 2014-12-05 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving high multilayer circuit board slice position and BGA position plated-through hole copper thickness unevenness |
| CN105555040B (en) * | 2016-02-03 | 2019-02-12 | 江门崇达电路技术有限公司 | A kind of production method for the PCB that outer graphics and bore position precision can be improved |
| CN105578734B (en) * | 2016-03-10 | 2019-03-29 | 广州美维电子有限公司 | A kind of circuit board outer layer aligning structure and generation method |
| CN106028682B (en) * | 2016-06-07 | 2019-04-02 | 江门崇达电路技术有限公司 | A kind of PCB plated hole method |
| CN107567198A (en) * | 2017-08-31 | 2018-01-09 | 惠州市永隆电路有限公司 | A kind of pcb board separate lines copper facing uniformity ameliorative way |
-
2021
- 2021-04-29 CN CN202110474572.3A patent/CN113411991B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930033A (en) * | 2021-01-22 | 2021-06-08 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113411991A (en) | 2021-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101695218B (en) | Method for manufacturing printed circuit board with half-edge hole | |
| CN103220889B (en) | Layer manufacturing method thereof in a kind of oversize PCB backboard | |
| CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| EP3030062A1 (en) | Manufacturing method for back drilling hole in pcb and pcb | |
| CN108513458A (en) | A kind of super thick 5G antennas PCB module processing methods | |
| CN105517350B (en) | A kind of production method of printed circuit board | |
| CN108541139A (en) | A kind of PCB via holes production method and PCB | |
| CN111787698B (en) | Z-shaped slot hole machining method | |
| CN113133226A (en) | Circuit board high-precision back drilling method and circuit board | |
| CN113411991B (en) | PCB pattern transfer alignment target method | |
| CN111867278B (en) | PCB semi-metallized hole processing technology | |
| CN105682363A (en) | Fabrication method of PCB with metalized plate edges | |
| CN105704947A (en) | Forming process of burr-free printed circuit board (PCB) | |
| CN111343800B (en) | Processing technology for local electroplating of blind buried hole | |
| CN112911791A (en) | Printed circuit board for detecting deviation of drilling hole | |
| CN110557886B (en) | Compensation method of Printed Circuit Board (PCB) cursor point, application of compensation method and PCB production process | |
| CN113163580A (en) | Novel compound counterpoint target of figure and HDI board | |
| CN113225921A (en) | Method for manufacturing PCB blind hole | |
| CN103917052A (en) | Method for processing circuit board by means of laser direct structuring technology | |
| CN112423477B (en) | High-precision stepped press connection hole machining method | |
| CN108449887B (en) | Manufacturing method for plating thick copper on local hole wall and PCB | |
| CN104968158A (en) | Thick copper foil fine line fine pitch circuit board outer line processing method | |
| CN108811336A (en) | Two sided pcb processing method | |
| CN105682365A (en) | Method of manufacturing semi-metallized platform on PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |