CN113406482B - Integrated circuit test equipment - Google Patents
Integrated circuit test equipment Download PDFInfo
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- CN113406482B CN113406482B CN202110882719.2A CN202110882719A CN113406482B CN 113406482 B CN113406482 B CN 113406482B CN 202110882719 A CN202110882719 A CN 202110882719A CN 113406482 B CN113406482 B CN 113406482B
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- 238000012360 testing method Methods 0.000 title claims abstract description 105
- 230000005540 biological transmission Effects 0.000 claims abstract description 59
- 239000000523 sample Substances 0.000 claims description 207
- 238000007789 sealing Methods 0.000 claims description 31
- 239000004744 fabric Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 43
- 238000001514 detection method Methods 0.000 abstract description 30
- 238000004140 cleaning Methods 0.000 abstract description 17
- 239000013618 particulate matter Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 50
- 230000000694 effects Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
本发明属于测试设备技术领域，具体的说是一种集成电路测试设备，包括控制器、测试箱、移动平台、卡盘、传送孔、传送杆、传送块、转动杆、连接杆、滑动块和滑动槽；所述测试箱一侧与卡盘相对应的位置处开设有传送孔；所述传送孔的前后两端均滑动连接有传送杆；所述卡盘与传送杆相对应的位置处固定连接有传送块；所述传送杆与传送块卡合，每个传送杆远离卡盘的一侧均铰接有转动杆；每个所述转动杆靠近卡盘的一侧固定连接有滑动块，两个转动杆之间固定连接有连接杆；所述传送块下端与滑动块相对应的位置开设有滑动槽；本发明解决了为防止空气中的颗粒物对检测过程的影响，检测过程在面积较大的清洁室内进行，从而清洁控制难度较大的问题。
The present invention belongs to the technical field of testing equipment, and specifically is an integrated circuit testing equipment, including a controller, a testing box, a mobile platform, a chuck, a transmission hole, a transmission rod, a transmission block, a rotating rod, a connecting rod, a sliding block and a sliding groove; a transmission hole is provided at a position corresponding to the chuck on one side of the testing box; transmission rods are slidably connected to the front and rear ends of the transmission hole; a transmission block is fixedly connected to the position corresponding to the chuck and the transmission rod; the transmission rods are engaged with the transmission blocks, and each transmission rod is hingedly connected to a rotating rod on the side away from the chuck; a sliding block is fixedly connected to the side of each rotating rod close to the chuck, and a connecting rod is fixedly connected between the two rotating rods; a sliding groove is provided at the lower end of the transmission block corresponding to the sliding block; the present invention solves the problem that in order to prevent the influence of particulate matter in the air on the detection process, the detection process is carried out in a clean room with a large area, thereby making cleaning control more difficult.
Description
Technical Field
The invention belongs to the technical field of test equipment, and particularly relates to integrated circuit test equipment.
Background
An integrated circuit is a type of microelectronic device or component. The method comprises the steps of adopting a certain process to interconnect elements such as transistors, resistors, capacitors, inductors and the like required by a circuit and wiring, manufacturing the elements on a small semiconductor wafer or a medium substrate or a plurality of small semiconductor wafers or medium substrates, then packaging the elements in a tube shell to form a microstructure with the required circuit function, and marking unqualified samples in the process of detecting an integrated circuit so as to avoid the waste of packaging cost.
If a chinese patent with application number CN201520817357.9 discloses a probe station, during the parameter test of the sample, the driving component drives the supporting member to move up and down, so as to realize the adjustment of the relative positions of the probe on the supporting member and the mounting table, so that the probe is quickly separated from or contacted with the test point of the sample.
The technical scheme is that the supporting piece is driven by the driving component to move up and down so that the probe and the sample to be detected are quickly separated, but in the detection process, in order to prevent the influence of particles in the air on the detection process, the detection process is carried out in a clean room with a large area, so that the cleaning control difficulty is high.
Disclosure of Invention
In order to overcome the defects of the prior art and solve the problems that the cleaning control difficulty is high because the detection process is carried out in a clean room with a large area in order to prevent the influence of particulate matters in the air on the detection process in the prior art, the invention provides integrated circuit testing equipment.
The integrated circuit testing equipment comprises a controller, a testing box, a moving platform, chucks, a sealing module and a conveying module, wherein the moving platform is fixedly connected to the lower end inside the testing box, the chucks are clamped at the upper end of the moving platform, the conveying module comprises conveying holes, conveying rods, conveying blocks, rotating rods, connecting rods, sliding blocks and sliding grooves, the conveying holes are formed in the position, corresponding to the chucks, of one side of the testing box, the conveying rods are connected to the front end and the rear end of each conveying hole in a sliding mode, the conveying blocks are fixedly connected to the position, corresponding to the conveying rods, of each chuck, the conveying rods are clamped with the conveying blocks, the rotating rods are hinged to one side, close to the chucks, of each rotating rod, the sliding blocks are fixedly connected between the two rotating rods, the connecting rods are fixedly connected to the positions, corresponding to the sliding blocks, of the lower ends of the conveying holes are provided with the sliding grooves;
During operation, in the existing wafer detection process, in order to prevent the influence of particulate matters in the air on the detection process, the detection process is performed in a six-level clean room, but the control and maintenance of the clean room with larger space are difficult;
Therefore, the invention firstly lifts the connecting rod upwards to drive the rotating rod to rotate from a vertical state to a horizontal state by arranging the transmission module, so that the sliding block on the rotating rod is in sliding connection with the sliding groove, then the connecting rod is pushed towards the direction of the chuck, the connecting rod drives the rotating rod and the transmission rod to move, and the clamping groove is arranged at the position, corresponding to the chuck, on the transmission rod, so that the transmission rod is clamped with the transmission block on the chuck; the upper end of the moving platform is clamped with the lower end of the chuck, the moving platform can move in the horizontal direction and the vertical direction, the moving platform moves downwards to be separated from the chuck, the connecting rod is pulled out to drive the chuck to move out, and the connecting rod is put down to drive the rotating rod to restore to an initial state; then taking out the wafer from the storage position, placing the wafer on a chuck, and adsorbing the wafer by the chuck through vacuum; then lifting the connecting rod, continuously pushing the connecting rod to drive the chuck to return to the initial position, and enabling the moving platform to move upwards to be clamped with the chuck, wherein the moving platform drives the chuck to move upwards to enable a welding pad area on the wafer to be in contact with a needle point of the probe card, then electrifying to detect whether the chip can work normally, and then driving the chuck to move horizontally to adjust the position of the wafer, so that a detection device on the sealing module is in contact with the welding pad areas at different positions to finish the testing process;
the invention sets the transmission module, so that the test can be carried out in the test box which can reach the cleaning degree of the six-stage clean room, meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, the time of contacting with the external air after the wafer is taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of testing the bonding pad area on the wafer with dirt, and the reliability of the integrated circuit test equipment is further improved.
Preferably, the sealing module comprises an electric telescopic rod, a sealing plate, a visual identification device, a driving block, a moving chute, a probe head and a probe card; electric telescopic rods are fixedly connected in four corners of the upper end of the test box; the upper end of the electric telescopic rod is fixedly connected with a sealing plate; the invention relates to a probe card cleaning device, which comprises a sealing plate, a probe card, a controller, a probe card connector, a controller, a probe card connector, a probe connector, a controller. The test box forms a closed working environment; then, the wafer to be tested is placed on a chuck through a transmission module, a moving platform drives the chuck to move upwards, so that a welding pad area on the wafer is contacted with the needle point of the probe card, whether the chip can work normally or not is detected through electrifying, and then the moving platform drives the chuck to move horizontally to adjust the position of the wafer, so that the probe card is contacted with the welding pad areas at different positions, and the testing process is completed; because the sealing module is arranged, the probe card is detected, wiped and replaced before the wafer is detected, the pollution in the air is prevented from being adhered to the needle point of the probe card or the welding pad area of the wafer, the middle insulating layer of the chip is prevented from being damaged, and the reliability of the test of the integrated circuit test equipment is improved.
Preferably, the surface of the test box at the upper end of the conveying hole is fixedly connected with an elastic dustproof cloth; the lower end of the elastic dustproof cloth is fixedly connected with a dustproof block; the invention is characterized in that the rotating rod is provided with a dustproof groove at the position corresponding to the dustproof block, the dustproof block is clamped with the dustproof groove, when the wafer is placed into the chuck, the dustproof block on the elastic dustproof cloth is inserted into the dustproof groove of the rotating rod, so that the elastic dustproof cloth stretches to cover the transmission hole, the test box keeps tightness, the cleaning of the internal environment of the test is further ensured, when the chuck is required to be taken out, the rotating rod is turned to a horizontal state, the dustproof block is separated from the dustproof groove under the elastic action of the elastic dustproof cloth, the contact between the probe head and the chip is prevented from being influenced by dirt stuck on the wafer, and the safety of the detection of the integrated circuit test equipment is improved.
Preferably, a fixing hole is formed in one end, close to the probe head, of the probe card; the other end of the probe head is connected with a fixed block in a sliding way; the probe card is characterized in that a fixing block is arranged on the upper end of the probe head, a fixing hole is formed in the fixing block, a reset spring is fixedly connected to the other end of the fixing block, the other end of the reset spring is fixedly connected with the driving block, when the probe card is required to be detached for cleaning or replacement, one end of the fixing block is manually moved to the direction of the driving block, so that the fixing block is separated from the fixing hole, the reset spring is compressed and then the probe card is taken down, when the probe card is required to be inserted again, one end of the probe card is inserted from a through hole at the lower end of the probe head, when one end of the probe card is moved to the upper end of the probe head, the probe card pushes the fixing block to move to the direction of the driving block, when the probe card moves to the position of the fixing hole corresponding to the fixing block, the fixing block enters the fixing hole, the fixing block is enabled to conveniently replace the probe head, the fixing block slides along an inverted T-shaped chute on the probe head, the fixing block is prevented from being separated from the probe head, the fixing block is prevented from being inserted into the fixing hole, the probe card is prevented from moving along the through hole due to the stress, the probe head is prevented from being contacted stably between the probe head and a chip of the probe head and a wafer, and the integrated circuit testing device is improved in convenience in use.
The invention can observe the probe card by moving the inspection column to the corresponding position of the probe card after the electric telescopic rod is extended, thereby being capable of observing whether the tip of the probe card is dirty or not or whether the probe card is deformed more clearly, avoiding that the contact effect between the probe card and a chip is influenced by the dirty on the probe card, and further ensuring the stability of the testing process of the integrated circuit testing equipment.
The invention is characterized in that the probe heads are fixedly connected with laser sensors at the positions corresponding to the probe heads horizontally, the optical ports of the two laser sensors are oppositely arranged, and when the probe head is in operation, the laser sensors are used for sensing the positions of the probe tips of the probe cards before testing, the laser sensors transmit detection signals to the controller, the controller processes the signals detected by the laser sensors through built-in programs, when the built-in programs receive the signals sensed by the two laser sensors and are not in a horizontal plane, an alarm program is started, the testing process is suspended, staff adjusts the positions of the probe cards, and the problem that the probe tips of the two probe cards are not in a plane to cause one probe card to puncture a chip bonding pad layer and the probe tips of the other probe card are in poor contact is avoided, the contact surface between the probe card and the chip is not coplanar, the contact effect of the probe card and the chip is influenced, and the safety of an integrated circuit in the testing process of integrated circuit testing equipment is further ensured.
The beneficial effects of the invention are as follows:
1. compared with the traditional technical scheme, the integrated circuit testing equipment provided by the invention has the advantages that the transmission module is arranged, so that the test can be performed in the testing box which can reach the cleaning degree of a six-stage clean room, meanwhile, the cleaning control difficulty of the testing box is smaller than that of the six-stage clean room, the time for contacting with external air after the wafer is taken out from the storage position is shortened, the bonding pad area on the wafer is prevented from damaging the middle insulating layer in the pollution testing process, and the reliability of the integrated circuit testing equipment is further improved.
2. According to the integrated circuit testing equipment, the fixing hole and the fixing block are arranged, one end of the fixing block is manually moved towards the direction of the driving block, so that the fixing block is separated from the fixing hole, the reset spring is compressed, the probe card is taken down, when the probe card is to be inserted again, one end of the probe card is inserted from the through hole at the lower end of the probe head, when one end of the probe card is moved to the upper end of the probe head, the probe card pushes the fixing block to move towards the direction of the driving block, and when the probe card is moved to the position corresponding to the fixing block, the fixing block enters the fixing hole, so that the use convenience of the integrated circuit testing equipment is improved.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a partial enlarged view at B in FIG. 1;
The device comprises a test box 1, a movable platform 2, a chuck 3, a 41, an electric telescopic rod 42, a sealing plate 43, a visual identification device 44, a driving block 45, a movable chute 46, a probe head 47, a probe card 51, a conveying hole 52, a conveying rod 53, a conveying block 54, a rotating rod 55, a connecting rod 56, a sliding block 57, a sliding groove 6, an elastic dustproof cloth 7, a dustproof block 8, a dustproof groove 9, a fixing hole 10, a fixing block 11, a return spring 12, a checking column 13, a magnifying glass 14 and a laser sensor.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 3, the integrated circuit testing device of the invention comprises a controller, a testing box 1, a moving platform 2, a chuck 3, a sealing module and a transmission module, wherein the moving platform 2 is fixedly connected to the lower end inside the testing box 1, the chuck 3 is clamped at the upper end of the moving platform 2, the transmission module comprises a transmission hole 51, a transmission rod 52, a transmission block 53, a rotation rod 54, a connecting rod 55, a sliding block 56 and a sliding groove 57, the transmission hole 51 is formed in the position, corresponding to the chuck 3, of one side of the testing box 1, the transmission rods 52 are connected at the front end and the rear end of the transmission hole 51 in a sliding manner, the transmission block 53 is fixedly connected at the position, corresponding to the transmission rod 52, of the chuck 3, the transmission rods 52 are clamped with the transmission blocks 53, the rotation rods 54 are hinged to one side, close to the chuck 3, of each rotation rod 54 is fixedly connected with the sliding block 56, a connecting rod 55 is fixedly connected between the two rotation rods 54, and the sliding groove 57 is formed in the position, corresponding to the lower end of the transmission hole 51, corresponding to the sliding block 56;
During operation, in the existing wafer detection process, in order to prevent the influence of particulate matters in the air on the detection process, the detection process is performed in a six-level clean room, but the control and maintenance of the clean room with larger space are difficult;
Therefore, the invention firstly lifts the connecting rod 55 upwards to drive the rotating rod 54 to rotate from a vertical state to a horizontal state by arranging the transmission module, so that the sliding block 56 on the rotating rod 54 is in sliding connection with the sliding groove 57, then the connecting rod 55 is pushed towards the direction of the chuck 3, the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move, and the clamping groove is arranged at the position, corresponding to the chuck 3, on the transmission rod 52, so that the transmission rod 52 is clamped with the transmission block 53 on the chuck 3; the upper end of the moving platform 2 is clamped with the lower end of the chuck 3, the moving platform 2 can move in the horizontal direction and the vertical direction, the moving platform 2 moves downwards to be separated from the chuck 3, the connecting rod 55 is pulled out to drive the chuck 3 to move out, and the connecting rod 55 is put down to drive the rotating rod 54 to restore to the initial state; then the wafer is taken out from the storage position, the wafer is placed on the chuck 3, the chuck 3 adsorbs the wafer through vacuum, then the connecting rod 55 is lifted, the connecting rod 55 is pushed continuously to drive the chuck 3 to return to the initial position, the moving platform 2 also moves upwards to be clamped with the chuck 3, the moving platform 2 drives the chuck 3 to move upwards, the welding pad area on the wafer is contacted with the needle point of the probe card 47, whether the chip can normally work is detected through electrifying, the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, and the detection device on the sealing module is contacted with the welding pad areas at different positions to finish the test process;
the invention sets the transmission module, so that the test can be carried out in the test box which can reach the cleaning degree of the six-stage clean room, meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, the time of contacting with the external air after the wafer is taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of testing the bonding pad area on the wafer with dirt, and the reliability of the integrated circuit test equipment is further improved.
As one embodiment of the present invention, the sealing module includes an electric telescopic rod 41, a sealing plate 42, a visual recognition device 43, a driving block 44, a moving chute 45, a probe head 46 and a probe card 47; the invention discloses a test box, which is characterized in that an electric telescopic rod 41 is fixedly connected in four corners of the upper end of the test box 1, a sealing plate 42 is fixedly connected to the upper end of the electric telescopic rod 41, a visual recognition device 43 is fixedly connected to the center of the lower end of the sealing plate 42, driving blocks 44 are fixedly connected to the two sides of the lower end of the sealing plate 42, a probe head 46 is fixedly connected to the lower end of the driving blocks 44, moving sliding grooves 45 are formed in the two sides of the upper end of the test box 1, one end of the probe head 46 is in sliding connection with the moving sliding grooves 45, the other end of the probe head 46 is clamped with a probe card 47, and when the probe head 47 is in operation, if the probe head 47 is not required to be deformed by bending and stretching the probe card 47 by a control device, the probe head 46 is required to be cleaned, and the probe head 47 is firstly pulled up by bending the probe head is required to be deformed, if the probe head 47 is not required to be cleaned, and the probe head 47 is firstly pulled up by bending the probe head 45, and the probe card 47 is required to be deformed, if the probe head 47 is required to be cleaned by bending the probe head 45, and the probe is not required to be deformed, and the probe 47 is deformed, and the probe card 47 is continuously contacted with the chip to reach an electrical contact state, so that the chip is broken by the chip, and the middle insulation layer is easily, and the chip is broken, and the chip is broken, and the metal is subjected to and the metal. The invention relates to a probe card 47 test device, which comprises a probe card 47, a controller, a movable platform 2, a visual recognition device 43, a sealing module, a probe card 47 detection wiping and replacement module, a probe card module and a test module, wherein the controller is used for controlling the electric telescopic rod 41 to shrink and drive the sealing plate 42 to move downwards so that a sealed working environment is formed by the test box 1, the movable platform 2 is used for driving the chuck 3 to move horizontally so as to adjust the positions of wafers, so that the probe card 47 contacts with bonding pad areas at different positions to complete the test process, and a worker can watch a record of real-time monitoring feedback of the test process on a computer screen in real time.
As one implementation mode of the invention, the surface of the test box 1 at the upper end of the conveying hole 51 is fixedly connected with an elastic dustproof cloth 6, the lower end of the elastic dustproof cloth 6 is fixedly connected with a dustproof block 7, a dustproof groove 8 is formed in a position, corresponding to the dustproof block 7, of the rotary rod 54, the dustproof block 7 is clamped with the dustproof groove 8, when the wafer is placed into the chuck 3, the elastic dustproof cloth 6 is arranged, the dustproof block 7 on the elastic dustproof cloth 6 is inserted into the dustproof groove 8 of the rotary rod 54, so that the conveying hole 51 is covered by stretching the elastic dustproof cloth 6, the test box 1 is kept airtight, the test internal environment is further ensured to be clean, when the chuck 3 is required to be taken out, the rotary rod 54 is turned to be in a horizontal state, the dustproof block 7 is separated from the dustproof groove 8 under the elastic action of the elastic dustproof cloth 6, the contact between the probe head 47 and a chip is prevented from being influenced by dirt on the wafer, and the safety of the detection of the integrated circuit test equipment is improved.
According to the invention, when the probe card 47 needs to be detached for cleaning or replacement, one end of the fixed block 10 is manually moved towards the direction of the driving block 44, so that the fixed block 10 is separated from the fixed hole 9, the reset spring 11 is compressed, the probe card 47 is removed again, when the probe card 47 is to be inserted again, one end of the probe card 47 is inserted from a through hole at the lower end of the probe head 46, when one end of the probe card 47 is moved to the upper end of the probe head 46, the probe card 47 pushes the fixed block 10 towards the direction of the driving block 44, when the probe card 47 is moved to the position of the fixed hole 9 corresponding to the fixed block 10, the fixed block 10 enters the fixed hole 9, the probe head 47 is replaced conveniently, the probe card 10 is prevented from being inserted into the integrated circuit 10 along the reverse T-shaped probe head 46, and the integrated circuit is prevented from being contacted with the probe head 10 conveniently and stably after the probe card is inserted into the probe head 46.
As one implementation mode of the invention, the front end and the rear end of the sealing plate 42 are slidably connected with the checking post 12, the lower end of the checking post 12 is hinged with the magnifying glass 13, and when the integrated circuit testing device works, the magnifying glass 13 is arranged, after the electric telescopic rod 41 stretches, the checking post 12 can be moved to the corresponding position of the probe card 47, and the magnifying glass 13 is used for observing the probe card 47, so that whether the needle tip of the probe card 47 is dirty or not or whether the probe card 47 is deformed can be more clearly observed, the contact effect between the probe card 47 and a chip is prevented from being influenced by the dirty on the probe card 47, and the stability of the testing process of the integrated circuit testing device is further ensured.
As one implementation mode of the invention, the two probe heads 46 are fixedly connected with the laser sensors 14 at positions corresponding to the probe heads of the probe cards 47 in a horizontal mode, the light ports of the two laser sensors 14 are arranged in a way of opposite to each other, when the integrated circuit testing device works, the laser sensors 14 sense the positions of the probe heads of the probe cards 47 before testing, the laser sensors 14 transmit detection signals to the controller, the controller processes the signals detected by the laser sensors 14 through built-in programs, when the built-in programs receive the positions sensed by the two laser sensors 14 are not in the same horizontal plane, an alarm program is started, the testing process is suspended, workers adjust the positions of the probe cards 47, the fact that the probe heads of the two probe cards 47 are not in the same plane causes that one probe card 47 pierces a chip pad layer, and the other probe heads of the probe cards 47 are in poor contact, the fact that the contact surfaces between the probe cards 47 and chips are not coplanar is avoided, the contact effect between the probe cards 47 and the chips is affected, and safety of an integrated circuit in the testing process of the integrated circuit testing device is further guaranteed.
The specific working procedure is as follows:
Because in the existing wafer detection process, in order to prevent the influence of particulate matters in the air on the detection process, the detection process is carried out in a six-level clean room, but the control and maintenance of the clean room with larger space are difficult; therefore, the invention firstly lifts the connecting rod 55 upwards to drive the rotating rod 54 to rotate from a vertical state to a horizontal state by arranging the transmission module, so that the sliding block 56 on the rotating rod 54 is in sliding connection with the sliding groove 57, then the connecting rod 55 is pushed towards the direction of the chuck 3, the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move, and the clamping groove is arranged at the position, corresponding to the chuck 3, on the transmission rod 52, so that the transmission rod 52 is clamped with the transmission block 53 on the chuck 3; the upper end of the moving platform 2 is clamped with the lower end of the chuck 3, the moving platform 2 can move in the horizontal direction and the vertical direction, the moving platform 2 moves downwards to be separated from the chuck 3, the connecting rod 55 is pulled out to drive the chuck 3 to move outwards, the connecting rod 55 is put down to drive the rotating rod 54 to restore the initial state, the wafer is taken out from the storage position, the wafer is placed on the chuck 3, the chuck 3 adsorbs the wafer by vacuum, then the connecting rod 55 is lifted, the connecting rod 55 is pushed continuously to drive the chuck 3 to return to the initial position, the moving platform 2 also moves upwards to be clamped with the chuck 3, the moving platform 2 drives the chuck 3 to move upwards to enable the bonding pad area on the wafer to be contacted with the needle tip of the probe card 47, then the power-on detection chip can work normally, the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, and the detection device on the sealing module is contacted with the bonding pad areas at different positions to complete the test process, the test is carried out in the test box which can reach the cleaning degree of the six-stage clean room, meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, the time of contacting with external air after the wafer is taken out from the storage position is reduced, the bonding pad area on the wafer is prevented from damaging the middle insulating layer in the process of dirt test, and the reliability of the integrated circuit test equipment is further improved; because in the wafer detection process, if the tip of the probe card 47 or the bonding pad area of the wafer is adhered with impurities, the contact effect between the tip of the probe card 47 and the chip is affected, in order to meet the electrical connection between the probe card 47 and the chip, the probe card 47 is continuously abutted against the chip to achieve an electrical contact state, so that the middle insulating layer of the chip is easily damaged, the stability of the chip is affected, and the phenomenon of short circuit or open circuit of a lower metal circuit is also generated in severe cases; the invention comprises a sealing module, a controller, a transmission module, a chuck 3, a wafer to be tested, a moving platform 2, a power-on detection chip, a test box 1 and a power-on detection chip, wherein the transmission module is used for controlling the electric telescopic rod 41 to extend to drive the sealing plate 42 to move upwards, the sealing plate 42 is used for lifting the driving block 44 to drive the probe head 46 and the probe card 47 to move along the moving chute 45, whether the probe card 47 is dirty or not is observed, if the probe card 47 is dirty, the probe card 47 is required to be cleaned by cleaning paper with the same model, if the probe card 47 is deformed and bent, the probe card 47 is required to be replaced, the controller is used for controlling the electric telescopic rod 41 to shrink to drive the sealing plate 42 to move downwards so as to form a closed working environment, then the wafer to be tested is placed on the chuck 3 through the transmission module, the moving platform 2 is used for driving the chuck 3 to move upwards so that a welding pad area on the wafer contacts with the needle tip of the probe card 47, and whether the power-on detection chip can work normally, the moving platform 2 drives the chuck 3 to horizontally move to adjust the position of the wafer, so that the probe card 47 contacts with the bonding pad areas at different positions to complete the testing process; the invention provides a method for testing the probe card 47, which comprises the steps of setting a sealing module, detecting, wiping and replacing the probe card 47 before detecting the wafer, preventing dirt in the air from adhering to the tip of the probe card 47 or the bonding pad area of the wafer, damaging the middle insulating layer of the chip, improving the reliability of testing the integrated circuit testing equipment, inserting a dust-proof block 7 on the elastic dust-proof cloth 6 into a dust-proof groove 8 of a rotating rod 54 after the wafer is put into a chuck 3, enabling the elastic dust-proof cloth 6 to stretch to cover a transmission hole 51, further ensuring the cleaning of the internal environment, overturning the rotating rod 54 to a horizontal state when the chuck 3 is required to be taken out, enabling the dust-proof block 7 to be separated from the dust-proof groove 8 under the elastic action of the elastic dust-proof cloth 6, preventing the dirt on the wafer from affecting the contact between the probe card 47 and the chip, improving the safety of the testing equipment of the integrated circuit, and removing the probe card by setting a fixing hole 9 and the probe card 10, removing the probe card 10 from the fixing hole 47, and manually pressing the probe card 47 to one end of the probe card 46 when the probe card is required to be removed from the fixing hole 10, and the probe card is required to be removed from the probe card 46, and the probe card is required to be removed from the probe card 10, and the probe card is required to be removed from the probe card is removed from the probe card 46, and the probe card is required to be replaced, and the probe card is replaced by the probe card is required to be replaced by the probe card and the probe card is replaced by the probe card and the probe card. The probe card 47 pushes the fixed block 10 to move towards the driving block 44, and when the probe card 47 moves to the position of the fixed hole 9 corresponding to the fixed block 10, the fixed block 10 enters the fixed hole 9; the probe head 47 is replaced conveniently, the fixing block 10 slides along the inverted T-shaped sliding groove on the probe head 46, so that the fixing block 10 cannot be separated from the probe head 46, the probe card 47 cannot move along the through hole due to the stress of the probe tip after the fixing block 10 is inserted into the fixing hole 9, the contact stability between the probe tip of the probe head 47 and a chip of a wafer is ensured, the use convenience of the integrated circuit test equipment is improved, because the magnifying glass 13 is arranged, after the electric telescopic rod 41 is extended, the probe head is moved to a position corresponding to the probe card 47 by moving the checking column 12, the magnifying glass 13 is used for observing whether the probe tip of the probe card 47 is dirty or not, whether the probe tip of the probe card 47 is deformed or not is observed, the contact effect between the probe card 47 and the chip is prevented from being influenced by dirty on the probe card 47, the stability of the test process of the integrated circuit test equipment is further ensured, the laser sensor 14 senses the position of the probe card 47 before the test is performed, the laser sensor 14 transmits a detection signal to a controller, the controller senses the position of the probe tip of the probe card 47 through the laser sensor 14 when the probe head is not in a plane, the two probe pads are not in a program is not started, the two program is prevented from being started when the probe head is in a plane, the poor contact of the needle tip of the other probe card 47 prevents the contact surface between the probe card 47 and the chip from being out of plane, thereby affecting the contact effect between the probe card 47 and the chip and further guaranteeing the safety of the integrated circuit in the testing process of the integrated circuit testing equipment.
The front, rear, left, right, up and down are based on the viewing angle of the person, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.
In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of the present invention.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
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| CN112462104A (en) * | 2020-11-28 | 2021-03-09 | 法特迪精密科技（苏州）有限公司 | Test probe cleaning method and friction scraping, adhesive adsorption and probe fixing method |
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| CN207301270U (en) * | 2017-10-19 | 2018-05-01 | 许亚阳 | A kind of IC chip Batch testing apparatus |
| CN112462104A (en) * | 2020-11-28 | 2021-03-09 | 法特迪精密科技（苏州）有限公司 | Test probe cleaning method and friction scraping, adhesive adsorption and probe fixing method |
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