CN113394326A - Molding device for waterproof LED water inlet packaging adhesive - Google Patents
Molding device for waterproof LED water inlet packaging adhesive Download PDFInfo
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- CN113394326A CN113394326A CN202110727920.3A CN202110727920A CN113394326A CN 113394326 A CN113394326 A CN 113394326A CN 202110727920 A CN202110727920 A CN 202110727920A CN 113394326 A CN113394326 A CN 113394326A
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- negative pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
本发明公开了一种防水LED进水的封装胶的成模装置，其中，模具的容置凹槽的槽口尺寸大于待封装LED显示器的电路板的尺寸，容置凹槽的深度大于显示器高度，在进行压合封装时，容置凹槽内的封装胶可以对包括电路板在内的整个LED显示器的外侧进行封装。经本成模装置封装后的LED显示器，其电路板和LED完全被封装胶层包裹，电路板和封装胶层之间不再存在缝隙。避免了环境中的水汽从封装胶层和电路板之间的缝隙进入，对LED显示器产生损害。
The invention discloses a molding device for waterproof LED water-ingress encapsulation adhesive, wherein the size of the notch of the accommodating groove of the mold is larger than the size of the circuit board of the LED display to be packaged, and the depth of the accommodating groove is larger than the height of the display , during the press-fit packaging, the packaging glue in the accommodating groove can encapsulate the outer side of the entire LED display including the circuit board. For the LED display packaged by the molding device, the circuit board and the LED are completely wrapped by the packaging adhesive layer, and there is no gap between the circuit board and the packaging adhesive layer. It is avoided that the water vapor in the environment enters from the gap between the encapsulation adhesive layer and the circuit board and causes damage to the LED display.
Description
Technical Field
The invention relates to the technical field of display packaging, in particular to a molding device for waterproof LED (light-emitting diode) water inlet packaging adhesive.
Background
In the packaging process of the LED display, a glue filling packaging mode is adopted in the industry, namely mixed glue is directly filled and sealed on one surface of the circuit board, which is provided with the LED chip, so that the LED is packaged and protected. The prepared epoxy resin is poured into one surface of the circuit board, which is welded with the LED light-emitting chip, and then baking, curing and packaging are carried out. The method is simple and easy to realize, but the consistency of the product is difficult to ensure and the batch use is difficult.
In addition, in the prior art, an encapsulant layer is generally coated on only one side of the circuit board where the LED chip is mounted. However, during the use of the LED display, moisture in the environment may enter from the gap between the packaging adhesive layer and the circuit board, which may damage the LED display.
Disclosure of Invention
The invention aims to provide a molding device for packaging adhesive for preventing water from entering into an LED, which can improve the problems.
The embodiment of the invention is realized by the following steps:
the invention provides a molding device of waterproof LED water-inlet packaging adhesive, which comprises:
the device comprises an electric heating device, a mould carrying platform, a mould, a negative pressure adsorption device and an electric control telescopic rod;
the die carrying platform is placed on the electric heating device, and the die is placed on the die carrying platform;
the negative pressure adsorption device is used for adsorbing the LED display to be packaged, so that the LED display to be packaged is parallel to the die carrying platform;
the side, provided with the LED, of the LED display to be packaged faces the die and is away from the negative pressure adsorption device, and at least one electric control telescopic rod is fixed on one side, away from the LED display to be packaged, of the negative pressure adsorption device;
the surface of the die, which is far away from the die carrying platform, is provided with an accommodating groove; the shape of a notch of the accommodating groove is matched with that of a circuit board of the LED display, and the size of the notch is larger than that of the circuit board; the sum of the LED height and the circuit board height is the display height; the depth of the accommodating groove is larger than the height of the display.
During the use, adsorb through negative pressure adsorption equipment and live the LED display of waiting to encapsulate, place the encapsulation rubber cake in to the mould, will wait to encapsulate the LED display and press to the mould gradually through the motion of automatically controlled telescopic link, start the electric heater unit, heating temperature makes the encapsulation rubber cake melt between 140 ℃ to 150 ℃, after heating a period, after cooling a period again waits to encapsulate gluey resolidification, the automatically controlled telescopic link of secondary control pulls up the LED display that encapsulates, form the encapsulation layer promptly on the one side that LED was installed to the circuit board.
Wherein the packaging adhesive cake comprises 30-70% of organic silicon resin, 15-40% of fluorescent powder, 0.5-20% of electrodeless transparent powder and 0.5-5% of tackifier. The adhesion promoter is silane or siloxane oligomer containing alkoxy and hydrosilyl. The TG point (glass transition point) of the packaging rubber cake is 80-130 ℃, and the thermal expansion coefficient is 25-50 mu m/m.
The manufacturing steps of the packaging rubber cake are as follows: adding the raw materials of all the components into a pre-mixer for uniform mixing to form a silica gel mixture; extruding the silica gel mixture from a slit of an extrusion molding machine to form a silica gel mold; and drying the extruded silica gel film in a drying channel to obtain a packaging rubber cake, wherein the drying temperature is 150-160 ℃.
The invention can be understood that the invention discloses a molding device of waterproof LED water-inlet packaging adhesive, wherein the size of a notch of a containing groove of a mold is larger than the size of a circuit board of an LED display to be packaged, the depth of the containing groove is larger than the height of the display, and the packaging adhesive in the containing groove can package the outer side of the whole LED display including the circuit board when the pressing packaging is carried out. The circuit board and the LED of the LED display packaged by the molding device are completely wrapped by the packaging adhesive layer, and no gap exists between the circuit board and the packaging adhesive layer. The phenomenon that water vapor in the environment enters from a gap between the packaging adhesive layer and the circuit board to damage the LED display is avoided.
In an optional embodiment of the present invention, an area of a bottom surface of the accommodating groove is smaller than an area of a region surrounded by the notch; the notch and the edge of the bottom surface are connected by an inner wall.
It can be understood that, since the area of the bottom surface of the accommodating groove is smaller than that of the area enclosed by the notches, the inner wall between the notches and the bottom surface is connected by an inclined surface or an arc surface. The LED display after the molding device is packaged, the packaging adhesive layer of the LED display is matched with the inner wall of the containing groove to form a corresponding inclined plane or arc surface, water vapor in the environment can slide along the inclined plane or arc surface on the surface of the packaging adhesive layer with high probability and is not loaded on the display any more, and the dryness of the display can be better ensured.
In an alternative embodiment of the present invention, the inner wall includes at least one inclined surface, and an included angle formed between the inclined surface and a plane where the circuit board is located is less than 90 °.
In an alternative embodiment of the invention, the inner wall comprises at least one arc surface, which arc surface is convex in a direction away from the central position of the circuit board.
In an alternative embodiment of the present invention, the negative pressure adsorption device comprises a negative pressure pipeline, a negative pressure cavity and a porous material layer; the negative pressure pipeline is communicated with the air port on the first surface of the negative pressure cavity; a groove is formed in a second surface, opposite to the first surface, of the negative pressure cavity, a plurality of air holes are distributed in the groove, and the air holes penetrate through the groove and the negative pressure cavity; the porous material layer is fixed in the groove and covers the air holes.
It can be understood that the other end of the negative pressure pipeline is communicated with a negative pressure generating device such as an air pump, and negative pressure is formed in the whole negative pressure cavity of the negative pressure pipeline, so that each air hole has air flow, and the adsorbability is formed on the second surface. The provision of a porous layer of material on the second surface may make the adsorption force more uniform.
Wherein the porous material layer is composed of a substance containing a large number of through holes therein. The through holes can be classified into micro pores having a diameter of 2nm or less, meso pores having a diameter of 2nm to 50nm, and macro pores having a diameter of 50nm or more, depending on the size thereof. The porous material layer may be classified into organic ceramics, inorganic ceramics, metals, and mixed type porous materials according to its constituent components. The porous material layer may be in the form of powder, a coating film, or a block, and the powder may be in various forms such as a sphere, a hollow sphere, a fiber, or a tube, and the powder may be used as it is, but the powder may be used as a starting material in the form of a coating film or a block.
In an alternative embodiment of the invention, the size of the recess is smaller than the size of the second surface; the porous material layer conforms to the shape and size of the recess.
It will be appreciated that the layer of porous material conforms to the shape and size of the recess to facilitate embedding of the layer of porous material in the recess.
In an alternative embodiment of the present invention, the size of the recess is smaller than the size of the LED display to be packaged.
In an alternative embodiment of the invention, the size of the notch of the receiving groove is smaller than the size of the second surface; the size of the notch of the accommodating groove is larger than that of the groove.
Has the advantages that:
the invention discloses a molding device of waterproof LED water inflow packaging adhesive, wherein the size of a notch of a containing groove of a mold is larger than the size of a circuit board of an LED display to be packaged, the depth of the containing groove is larger than the height of the display, and the packaging adhesive in the containing groove can package the outer side of the whole LED display including the circuit board when press-fitting packaging is carried out. The circuit board and the LED of the LED display packaged by the molding device are completely wrapped by the packaging adhesive layer, and no gap exists between the circuit board and the packaging adhesive layer. The phenomenon that water vapor in the environment enters from a gap between the packaging adhesive layer and the circuit board to damage the LED display is avoided.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 to fig. 3 are schematic diagrams illustrating a using process of a molding device of a waterproof LED water-inlet packaging adhesive provided by the present invention;
FIG. 4 is a cross-sectional view of a mold provided by the present invention;
FIG. 5 is a cross-sectional view of an LED display mated with the mold shown in FIG. 4;
FIG. 6 is a cross-sectional view of another mold provided by the present invention;
fig. 7 is a cross-sectional view of an LED display mated with the mold shown in fig. 6.
Reference numerals:
the LED display device to be packaged 100, the LED110, the circuit board 120, the packaging adhesive layer 130, the electric heating device 10, the mold carrier 20, the mold 30, the negative pressure adsorption device 40, the negative pressure pipeline 41, the negative pressure cavity 42, the porous material layer 43, the air holes 44, the groove 45, the electric control telescopic rod 50, the packaging adhesive cake 60 and the accommodating groove 70.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 3, the present invention provides a molding apparatus for a waterproof LED water-inlet packaging adhesive, comprising: the electric heating device 10, the die carrying platform 20, the die 30, the negative pressure adsorption device 40 and the electric control telescopic rod 50.
The die carrying platform 20 is placed on the electric heating device 10, and the die 30 is placed on the die carrying platform 20; the negative pressure adsorption device 40 is used for adsorbing the LED display 100 to be packaged, so that the LED display 100 to be packaged is parallel to the mold carrier 20.
The side of the to-be-packaged LED display 100 provided with the LED110 faces the mold 30 and is away from the negative pressure adsorption device 40, and at least one electrically controlled telescopic rod 50 is fixed on one side of the negative pressure adsorption device 40 away from the to-be-packaged LED display 100.
The surface of the die 30 away from the die carrier 20 is provided with a receiving groove 70; the shape of the notch of the accommodating groove 70 is matched with the circuit board 120 of the LED display, and the size of the notch is larger than that of the circuit board 120; the sum of the height of the LEDs and the height of the circuit board 120 is the height of the display; the depth of the receiving recess 70 is greater than the height of the display.
When the LED display packaging machine is used, the LED display 100 to be packaged is adsorbed by the negative pressure adsorption device 40, the packaging rubber cake 60 is placed in the mold 30, and the LED display 100 to be packaged is gradually pressed to the mold 30 through the movement of the electric control telescopic rod 50, as shown in FIG. 1; starting the electric heating device 10, and heating the electric heating device to a temperature between 140 ℃ and 150 ℃ to melt the packaging adhesive cake 60, as shown in fig. 2; after heating for a period of time and cooling for a period of time, after the encapsulant is cured again, the electrical control telescopic rod 50 is controlled again to pull up the encapsulated LED display, and an encapsulation layer is formed on the surface of the circuit board 120 on which the LEDs are mounted, as shown in fig. 3.
It can be understood that the invention discloses a molding device for waterproof LED water-in packaging adhesive, wherein the size of the notch of the accommodating groove 70 of the mold 30 is larger than the size of the circuit board 120 of the LED display 100 to be packaged, the depth of the accommodating groove 70 is larger than the height of the display, and when the press-fit packaging is performed, the packaging adhesive in the accommodating groove 70 can package the outer side of the whole LED display including the circuit board 120. In the LED display encapsulated by the molding apparatus, the circuit board 120 and the LEDs are completely encapsulated by the encapsulating adhesive layer 130, and no gap exists between the circuit board 120 and the encapsulating adhesive layer 130. The moisture in the environment is prevented from entering from the gap between the packaging adhesive layer 130 and the circuit board 120, and the LED display is prevented from being damaged.
Wherein the packaging adhesive cake 60 comprises 30-70% of organic silicon resin, 15-40% of fluorescent powder, 0.5-20% of electrodeless transparent powder and 0.5-5% of tackifier. The adhesion promoter is silane or siloxane oligomer containing alkoxy and hydrosilyl. The TG point (glass transition point) of the packaging rubber cake 60 is 80-130 ℃, and the thermal expansion coefficient is 25-50 mu m/m.
The manufacturing steps of the packaging rubber cake 60 are as follows: adding the raw materials of all the components into a pre-mixer for uniform mixing to form a silica gel mixture; extruding the silica gel mixture from a slit of an extrusion molding machine to form a silica gel mold; and drying the extruded silica gel film in a drying channel to obtain a packaging rubber cake 60, wherein the drying temperature is 150-160 ℃.
In an alternative embodiment of the present invention, the area of the bottom surface of the receiving groove 70 is smaller than the area of the region surrounded by the notches; the notch and the edge of the bottom surface are connected by an inner wall.
It will be appreciated that since the bottom surface of the receiving recess 70 has a smaller area than the area enclosed by the notches, the inner wall between the notches and the bottom surface has a slope or a curved surface for connection. In the LED display encapsulated by the molding apparatus, the encapsulation adhesive layer 130 matches the inner wall of the receiving groove 70 to form a corresponding inclined surface (as shown in fig. 5) or curved surface (as shown in fig. 7), and the moisture in the environment slides down along the inclined surface or curved surface of the encapsulation adhesive layer 130 with a high probability, and is no longer loaded on the display, so that the dryness of the display can be better ensured.
In an alternative embodiment of the invention, as shown in fig. 4, the inner wall includes at least one inclined surface that forms an angle of less than 90 ° with the plane of the circuit board 120.
In an alternative embodiment of the invention, as shown in fig. 6, the inner wall comprises at least one curved surface that is convex in a direction away from the central position of the circuit board 120.
As shown in fig. 1, in an alternative embodiment of the present invention, the negative pressure adsorption device 40 includes a negative pressure conduit 41, a negative pressure chamber 42, and a porous material layer 43; the negative pressure conduit 41 communicates with an air port on a first surface of the negative pressure chamber 42; a groove 45 is formed in a second surface, opposite to the first surface, of the negative pressure cavity 42, a plurality of air holes 44 are distributed in the groove 45, and the air holes 44 penetrate through the groove 45 and the negative pressure cavity 42; the porous material layer 43 is fixed in the groove 45 and covers the air hole 44.
It can be understood that the other end of the negative pressure pipeline 41 is communicated with a negative pressure generating device such as an air pump, and a negative pressure is formed in the whole negative pressure cavity 42 through the negative pressure pipeline 41, so that each air hole 44 has an air flow, thereby forming the adsorbability on the second surface. The provision of a porous layer of material on the second surface may make the adsorption force more uniform.
The porous material layer 43 is made of a material having a large number of through holes therein. The through holes can be classified into micro pores 44 having a diameter of 2nm or less, middle pores 44 having a diameter of 2nm to 50nm, and macro pores 44 having a diameter of 50nm or more according to their sizes. The porous material layer 43 may be classified into organic ceramics, inorganic ceramics, metals, and mixed type porous materials according to its constituent components. The porous material layer 43 may be in the form of powder, a coating film, or a block, and the powder may be in various forms such as a sphere, a hollow sphere, a fiber, or a tube, and the powder may be used as it is, but it may be used as a starting material in the form of a coating film or a block.
In an alternative embodiment of the invention, the dimensions of the recess 45 are smaller than the dimensions of the second surface; the porous material layer 43 conforms to the shape and size of the recess 45.
It will be appreciated that the porous material layer 43 conforms to the shape and size of the recess 45 to facilitate embedding of the porous material layer 43 within the recess 45.
In an alternative embodiment of the invention, the size of the recess 45 is smaller than the size of the LED display 100 to be packaged.
In an alternative embodiment of the invention, the size of the notch of the receiving groove 70 is smaller than the size of the second surface; the size of the notch of the receiving groove 70 is larger than the size of the groove 45.
Has the advantages that:
the invention discloses a molding device for waterproof LED (light emitting diode) water inflow packaging glue, wherein the size of a notch of a containing groove 70 of a mold 30 is larger than the size of a circuit board 120 of an LED display 100 to be packaged, the depth of the containing groove 70 is larger than the height of the display, and the packaging glue in the containing groove 70 can package the outer side of the whole LED display including the circuit board 120 when pressing packaging is carried out. In the LED display encapsulated by the molding apparatus, the circuit board 120 and the LEDs are completely encapsulated by the encapsulating adhesive layer 130, and no gap exists between the circuit board 120 and the encapsulating adhesive layer 130. The moisture in the environment is prevented from entering from the gap between the packaging adhesive layer 130 and the circuit board 120, and the LED display is prevented from being damaged.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a molding device that encapsulation that waterproof LED intake was glued which characterized in that includes:
the device comprises an electric heating device, a mould carrying platform, a mould, a negative pressure adsorption device and an electric control telescopic rod;
the die carrying platform is placed on the electric heating device, and the die is placed on the die carrying platform;
the negative pressure adsorption device is used for adsorbing the LED display to be packaged, so that the LED display to be packaged is parallel to the die carrying platform;
the side, provided with the LED, of the LED display to be packaged faces the die and is away from the negative pressure adsorption device, and at least one electric control telescopic rod is fixed on one side, away from the LED display to be packaged, of the negative pressure adsorption device;
the surface of the die, which is far away from the die carrying platform, is provided with an accommodating groove; the shape of a notch of the accommodating groove is matched with that of a circuit board of the LED display, and the size of the notch is larger than that of the circuit board; the sum of the LED height and the circuit board height is the display height; the depth of the accommodating groove is larger than the height of the display.
2. The molding apparatus for encapsulating glue preventing water inflow of LED according to claim 1,
the area of the bottom surface of the accommodating groove is smaller than that of an area surrounded by the notches;
the notch and the edge of the bottom surface are connected by an inner wall.
3. The molding device of the waterproof LED water-inlet packaging adhesive according to claim 2,
the inner wall comprises at least one inclined plane, and an included angle formed by the inclined plane and the plane where the circuit board is located is smaller than 90 degrees.
4. The molding device of the waterproof LED water-inlet packaging adhesive according to claim 2,
the inner wall includes at least one arc surface, the arc surface is towards deviating from the direction of circuit board central point puts the protrusion.
5. The molding apparatus for encapsulating glue preventing water inflow of LED according to claim 1,
the negative pressure adsorption device comprises a negative pressure pipeline, a negative pressure cavity and a porous material layer;
the negative pressure pipeline is communicated with the air port on the first surface of the negative pressure cavity; a groove is formed in a second surface, opposite to the first surface, of the negative pressure cavity, a plurality of air holes are distributed in the groove, and the air holes penetrate through the groove and the negative pressure cavity;
the porous material layer is fixed in the groove and covers the air holes.
6. The molding device of the waterproof LED water-inlet packaging adhesive according to claim 5,
the size of the groove is smaller than that of the second surface;
the porous material layer conforms to the shape and size of the recess.
7. The molding apparatus for waterproof LED water-in packaging adhesive according to claim 6,
the size of the groove is smaller than that of the LED display to be packaged.
8. The molding apparatus for waterproof LED water-inlet packaging adhesive of claim 7,
the size of the notch of the accommodating groove is smaller than that of the second surface;
the size of the notch of the accommodating groove is larger than that of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110727920.3A CN113394326A (en) | 2021-06-29 | 2021-06-29 | Molding device for waterproof LED water inlet packaging adhesive |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110727920.3A CN113394326A (en) | 2021-06-29 | 2021-06-29 | Molding device for waterproof LED water inlet packaging adhesive |
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| CN113394326A true CN113394326A (en) | 2021-09-14 |
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| CN202110727920.3A Withdrawn CN113394326A (en) | 2021-06-29 | 2021-06-29 | Molding device for waterproof LED water inlet packaging adhesive |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1503339A (en) * | 2002-11-26 | 2004-06-09 | ������������ʽ���� | Resin encapsulation method and device, semiconductor device and manufacturing method thereof, and resin material |
| CN102347244A (en) * | 2010-07-29 | 2012-02-08 | 东和株式会社 | Resin sealing device and manufacturing method for resin sealing electronic component |
| TW201546913A (en) * | 2014-06-13 | 2015-12-16 | Dynacard Co Ltd | Manufacturing method for packaging module of fingerprint identification chip |
| CN105283294A (en) * | 2013-05-29 | 2016-01-27 | 山田尖端科技株式会社 | Resin molding device and resin molding method |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED packaging method and LED display device |
| CN207765078U (en) * | 2017-12-15 | 2018-08-24 | 深圳雷曼光电科技股份有限公司 | COB cell boards, LED display modules and LED display |
-
2021
- 2021-06-29 CN CN202110727920.3A patent/CN113394326A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1503339A (en) * | 2002-11-26 | 2004-06-09 | ������������ʽ���� | Resin encapsulation method and device, semiconductor device and manufacturing method thereof, and resin material |
| CN102347244A (en) * | 2010-07-29 | 2012-02-08 | 东和株式会社 | Resin sealing device and manufacturing method for resin sealing electronic component |
| CN105283294A (en) * | 2013-05-29 | 2016-01-27 | 山田尖端科技株式会社 | Resin molding device and resin molding method |
| TW201546913A (en) * | 2014-06-13 | 2015-12-16 | Dynacard Co Ltd | Manufacturing method for packaging module of fingerprint identification chip |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED packaging method and LED display device |
| CN207765078U (en) * | 2017-12-15 | 2018-08-24 | 深圳雷曼光电科技股份有限公司 | COB cell boards, LED display modules and LED display |
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Application publication date: 20210914 |