CN113394116A - Method for improving semiconductor metal packaging product excess detection qualification rate - Google Patents
Method for improving semiconductor metal packaging product excess detection qualification rate Download PDFInfo
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- CN113394116A CN113394116A CN202110679768.6A CN202110679768A CN113394116A CN 113394116 A CN113394116 A CN 113394116A CN 202110679768 A CN202110679768 A CN 202110679768A CN 113394116 A CN113394116 A CN 113394116A
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- 239000002184 metal Substances 0.000 title claims abstract description 74
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 74
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 title claims abstract description 16
- 238000012797 qualification Methods 0.000 title claims abstract description 14
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 239000004945 silicone rubber Substances 0.000 claims abstract description 17
- 238000005538 encapsulation Methods 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 8
- 230000018044 dehydration Effects 0.000 claims description 6
- 238000006297 dehydration reaction Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 6
- 239000007789 gas Substances 0.000 abstract description 5
- 231100000331 toxic Toxicity 0.000 abstract description 5
- 230000002588 toxic effect Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229960000935 dehydrated alcohol Drugs 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
本申请提供了一种提高半导体金属封装产品多余物检测合格率的方法，包括如下步骤：将有机硅橡胶涂覆到金属封装管帽上；将金属封装管帽依次在80±5℃、120±5℃、150±5℃、180±5℃、220±5℃的温度下进行烘烤；将烘烤完成后的金属封装管帽放置于一恒温环境，并进行密封。通过本申请方案的实施，经过多阶段的高温对有机硅橡胶烘烤过后，使有机硅橡胶中的有毒、有害气体排出，同时保持有机硅橡胶具有一定的粘连度，可以有效粘附封装腔体内微小的多余物，从而提高金属金属封装产品多余物检测的合格率，且本申请的操作方法操作简单，有效性强，可广泛运用于空封器件的封装过程中。
The present application provides a method for improving the qualification rate of detection of excess substances in semiconductor metal encapsulation products, comprising the following steps: coating silicone rubber on the metal encapsulation cap; Bake at temperatures of 5°C, 150±5°C, 180±5°C, and 220±5°C; place the metal package cap after baking in a constant temperature environment and seal it. Through the implementation of the solution of the present application, after the silicone rubber is baked at a multi-stage high temperature, the toxic and harmful gases in the silicone rubber are discharged, and at the same time, the silicone rubber has a certain degree of adhesion, which can effectively adhere to the packaging cavity. Therefore, the qualified rate of the detection of metal-metal encapsulated products can be improved, and the operation method of the present application is simple in operation and strong in effectiveness, and can be widely used in the encapsulation process of air-encapsulated devices.
Description
Technical Field
The application relates to the technical field of semiconductor device packaging, in particular to a method for improving the excess detection qualified rate of a semiconductor metal packaging product.
Background
Semiconductor devices are electronic components that have electrical conductivity between a good electrical conductor and an insulator, and that perform specific functions by utilizing the special electrical characteristics of semiconductor materials, and are used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is a metal material such as silicon, germanium, or gallium arsenide, and is used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like.
When packaging metal products, the generation of excess inside the metal products is a key factor influencing the yield and reliability of the air-sealed device products, and when packaging the metal products at present, organic glue materials are generally adopted in the pipe caps of the metal packaging structures, so that movable excess inside the metal packaging products is changed into immovable excess. However, toxic and harmful gases (such as water vapor, chlorine gas and the like) of the air-sealed component are released in the later period to influence the reliability of the water vapor content and the carbon dioxide content in the air-sealed component, so that the qualification rate of detecting the excess substances in the metal-sealed product is reduced.
Disclosure of Invention
The embodiment of the application provides a method for improving the qualification rate of detecting the excess of a semiconductor metal packaging product, and at least can solve the problem of low qualification rate of detecting the excess in the metal packaging product in the related technology.
The embodiment of the application provides a method for improving the detection qualification rate of semiconductor metal packaging product excess, which comprises the following steps:
coating organic silicon rubber on the metal packaging pipe cap;
baking the metal packaging pipe cap at the temperature of 80 +/-5 ℃, 120 +/-5 ℃, 150 +/-5 ℃, 180 +/-5 ℃ and 220 +/-5 ℃ in sequence;
and placing the baked metal packaging pipe cap in a constant temperature environment, and sealing.
Further, the baking the metal packaging pipe cap at the temperature of 80 plus or minus 5 ℃, 120 plus or minus 5 ℃, 150 plus or minus 5 ℃, 180 plus or minus 5 ℃ and 220 plus or minus 5 ℃ in sequence specifically comprises:
s1, baking the metal packaging pipe cap for 18-40h at the temperature of 80 +/-5 ℃;
s2, baking the metal packaging pipe cap for 18-40h at the temperature of 120 +/-5 ℃;
s3, baking the metal packaging pipe cap for 24-40h at the temperature of 150 +/-5 ℃;
s4, baking the metal packaging pipe cap for 24-40h at the temperature of 180 +/-5 ℃;
s5, baking the metal packaging pipe cap for 12-40h at the temperature of 220 +/-5 ℃.
Further, the constant temperature environment is an oven at 180 +/-5 ℃.
Further, the organic silicon rubber comprises any one of KJR5033 and KJR 1204-1.
Further, before the step of coating the silicone rubber on the metal encapsulation pipe cap, the method further comprises the following steps:
and baking the metal packaging tube cap at the temperature of 150-170 ℃ for 4-8 h.
Further, before the step of baking the metal packaging tube cap at the temperature of 150-:
and carrying out ultrasonic cleaning, alcohol dehydration and drying on the metal packaging pipe cap.
Further, the ultrasonic cleaning comprises:
and putting the metal packaging pipe cap into deionized water, and carrying out ultrasonic cleaning on the metal packaging pipe cap, wherein the density of the deionized water is more than or equal to 10M omega cm.
Further, the drying includes:
and baking the metal packaging pipe cap subjected to alcohol dehydration at the temperature of 150 +/-5 ℃.
Further, before the step of coating the silicone rubber on the metal encapsulation pipe cap, the method further comprises the following steps:
and dehumidifying the interior of the glue coating table, and putting the dried metal packaging pipe cap into the glue coating table, wherein the humidity inside the glue coating table is less than 30% of the ambient humidity.
Therefore, the method for improving the detection qualification rate of the semiconductor metal packaging product excess provided by the scheme of the application comprises the following steps: coating organic silicon rubber on the metal packaging pipe cap; baking the metal packaging pipe cap at the temperature of 80 +/-5 ℃, 120 +/-5 ℃, 150 +/-5 ℃, 180 +/-5 ℃ and 220 +/-5 ℃ in sequence; and placing the baked metal packaging pipe cap in a constant temperature environment, and sealing. Through the implementation of the scheme, after the organic silicon rubber is baked at multi-stage high temperature, toxic and harmful gases in the organic silicon rubber are exhausted, meanwhile, the organic silicon rubber has certain adhesion degree, and tiny excess in the packaging cavity can be effectively adhered, so that the qualification rate of excess detection of metal packaging products is improved.
Drawings
FIG. 1 is a schematic view of a basic flow chart of the method for improving the yield of the semiconductor metal package product excess detection according to the present application;
FIG. 2 is a schematic view of a refining process of coating silicone rubber in the method for improving the qualification rate of the semiconductor metal packaging product by detecting the excess
FIG. 3 is a schematic diagram of a silicone rubber coated cap in the method for increasing the yield of excess detection of semiconductor metal-encapsulated products according to the present application;
fig. 4 is a curve diagram illustrating a stage of temperature rise baking in the method for increasing the yield of the semiconductor metal package product excess detection.
Detailed Description
In order to make the objects, features and advantages of the present invention more apparent and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, an embodiment of the present application provides a method for increasing a yield of a semiconductor metal package product in excess detection, which includes the following steps:
and step 10, coating the organic silicon rubber on the metal packaging pipe cap.
In this embodiment, the semiconductor is packaged in a metal package structure, the metal package structure includes a cap, that is, the semiconductor is placed in the cap, the organic glue material is coated on the cap to change the movable excess inside the metal package product into the immobile excess, the organic silica gel is an organic silicon compound, and is mainly classified into three categories, which are: silicon rubber, silicon resin and silicon oil, and the outstanding performances are as follows: 1. temperature resistance 2, weather resistance 3, electrical insulation 4, physiological inertia 5, low surface tension and low surface energy. Since silicone has these excellent properties, its application range is very wide, and silicone rubber is used in the examples of the present application.
As shown in fig. 2, which is a schematic view of a detailed flow of a step of coating a silicone rubber on a metal-encapsulated tube cap provided in this embodiment, in an optional implementation manner of this embodiment, the step of specifically detailing the coating includes:
specifically, firstly wearing a mask and a spun yarn glove, putting a pipe cap into a 2000ml beaker, wherein the height of the pile of the pipe cap cannot exceed the scale of 1600ml of the beaker; and (3) turning on an air draft power switch in the air draft cabinet, switching on a water source, turning on a heating switch of the water heater, and cleaning the plastic basin and the perforated basket.
102, ultrasonic cleaning;
specifically, the beaker provided with the pipe cap is flushed with deionized water, so that the height of the water is about 2 times of the highest position of the pipe cap, then the beaker is placed on an ultrasonic table for ultrasonic cleaning, and the beaker is taken out after 5 minutes; pouring the pipe caps arranged in the beaker into a leaking net basket, putting the basket into a plastic basin, and flushing hot deionized water into the plastic basin, wherein the water temperature is 65 +/-10 ℃, and the highest 2 times of the pipe caps are filled with water; and then shaking the perforated basket for 10 times in the front-back, left-right, clockwise and anticlockwise directions for 5 minutes, and then taking out the perforated basket to pour water in the plastic basin. Washing the plastic basin once by using deionized water, putting the screen basket provided with the pipe caps into the plastic basin, washing cold deionized water into the plastic basin, wherein the water temperature is 15-20 ℃, the water is more than twice of the highest part of the pipe caps, then shaking the screen basket in the front-back, left-right, clockwise and anticlockwise directions for 10 times for 5 minutes, washing the plastic basin 1 time by using the deionized water, putting the screen basket provided with the pipe caps into the plastic basin, and circulating for 3 times. Wherein the density of the deionized water is greater than or equal to 10M omega cm.
specifically, the method comprises the steps of taking out the strainer basket, pouring water out of the plastic basin, wiping the plastic basin, putting the strainer basket into the plastic basin, adding alcohol for dehydration, enabling the height of the alcohol to exceed that of a pipe cap, shaking the strainer basket in the front-back, left-right, clockwise and anticlockwise directions for 10 times respectively, taking out the strainer basket, pouring the alcohol out of the plastic basin, and dehydrating the alcohol again, wherein the purity of the alcohol is greater than or equal to 99%.
104, baking the tube caps after the alcohol dehydration;
specifically, the dehydrated alcohol is dripped to be dry, the screen basket does not drip the alcohol, the pipe cap is poured into a beaker, the beaker is placed in an oven at the temperature of 150 +/-5 ℃ to bake the pipe cap so as to remove the alcohol on the pipe cap, the dried pipe cap is placed into a drying tower, and the cover of the drying tower is covered.
105, pre-baking;
placing the baked pipe cap into an oven at the temperature of 150-170 ℃ for baking for 4-8h again;
and 106, gluing.
Specifically, a nitrogen switch of a glue spreading table is opened, so that the humidity in the glue spreading table is less than 30% of the humidity of the conventional environment, the previously dried pipe cap is placed in the glue spreading table, a door of the glue spreading table is closed, the organosilicon rubber with the type KJR-5033 or KJR1204-1 is coated on the surface of the pipe cap, and the pipe cap coated with the organosilicon rubber is placed in an oven for baking.
Specifically, the organosilicon rubber of the type KJR-5033 or KJR1204-1 is selected in the embodiment of the application to reduce the content of water vapor, carbon dioxide and other toxic and harmful gases in the organosilicon rubber, and simultaneously, the selected organosilicon rubber can keep certain adhesion capability after being subjected to multi-stage high-temperature baking, so that tiny excess in the packaging cavity can be effectively adhered, and the qualification rate of excess detection of the metal packaging product is improved.
Specifically, referring to fig. 3, fig. 3 is a schematic view illustrating that silicone rubber is coated on a cap, and a special soft brush is required to be used in the process of coating the silicone rubber on the cap, so that the uniformity of the silicone rubber during the coating process can be ensured, and the soft brush can be prevented from falling into the cap.
And 20, baking the metal packaging pipe cap at the temperatures of 80 +/-5 ℃, 120 +/-5 ℃, 150 +/-5 ℃, 180 +/-5 ℃ and 220 +/-5 ℃ in sequence.
In this embodiment, referring to fig. 4, fig. 4 is a schematic diagram of a step heating curve in the embodiment of the present application, a metal-packaged cap is baked in a step heating manner to discharge toxic gases in silicone rubber in advance, in which the metal-packaged cap is baked at 80 ± 5 ℃ for 18-40h in the first step, the metal-packaged cap is baked at 120 ± 5 ℃ for 18-40h in the second step, the metal-packaged cap is baked at 150 ± 5 ℃ for 24-40h in the third step, the metal-packaged cap is baked at 180 ± 5 ℃ for 24-40h in the fourth step, and the metal-packaged cap is baked at 220 ± 5 ℃ for 12-40h in the fifth step.
And step 30, placing the baked metal packaging pipe cap in a constant temperature environment, and sealing.
In this embodiment, the metal encapsulation cap after the baking is finished needs to be stored in an environment with special control over temperature and humidity, and the device is sealed in an effective time, so that the organic silicon rubber on the cap is prevented from adsorbing water vapor in the air again and influencing the water vapor content of the device.
The method for improving the detection qualification rate of the semiconductor metal packaging product excess provided by the scheme of the application comprises the following steps: coating organic silicon rubber on the metal packaging pipe cap; baking the metal packaging pipe cap at the temperature of 80 +/-5 ℃, 120 +/-5 ℃, 150 +/-5 ℃, 180 +/-5 ℃ and 220 +/-5 ℃ in sequence; and placing the baked metal packaging pipe cap in a constant temperature environment, and sealing. Through the implementation of the scheme, after the organic silicon rubber is baked at multi-stage high temperature, toxic and harmful gases in the organic silicon rubber are exhausted, meanwhile, the organic silicon rubber has certain adhesion degree, and tiny excess in the packaging cavity can be effectively adhered, so that the qualification rate of excess detection of metal packaging products is improved.
It should be noted that, in the summary of the present invention, each embodiment is described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
It is further noted that, in the present disclosure, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined in this disclosure may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A method for improving the detection qualification rate of the excess of semiconductor metal packaging products is characterized by comprising the following steps:
coating organic silicon rubber on the metal packaging pipe cap;
baking the metal packaging pipe cap at the temperature of 80 +/-5 ℃, 120 +/-5 ℃, 150 +/-5 ℃, 180 +/-5 ℃ and 220 +/-5 ℃ in sequence;
and placing the baked metal packaging pipe cap in a constant temperature environment, and sealing.
2. The method of claim 1, wherein the baking the metal encapsulation cap at the temperatures of 80 ± 5 ℃, 120 ± 5 ℃, 150 ± 5 ℃, 180 ± 5 ℃ and 220 ± 5 ℃ in sequence comprises:
s1, baking the metal packaging pipe cap for 18-40h at the temperature of 80 +/-5 ℃;
s2, baking the metal packaging pipe cap for 18-40h at the temperature of 120 +/-5 ℃;
s3, baking the metal packaging pipe cap for 24-40h at the temperature of 150 +/-5 ℃;
s4, baking the metal packaging pipe cap for 24-40h at the temperature of 180 +/-5 ℃;
s5, baking the metal packaging pipe cap for 12-40h at the temperature of 220 +/-5 ℃.
3. The method of claim 1, wherein the isothermal environment is an oven at 180 ± 5 ℃.
4. The method of claim 1, wherein the silicone rubber comprises any one of model numbers KJR5033 and KJR 1204-1.
5. The method of claim 1, wherein prior to applying the silicone rubber to the metal encapsulation cap, further comprising:
and baking the metal packaging tube cap at the temperature of 150-170 ℃ for 4-8 h.
6. The method as claimed in claim 5, wherein before the baking the metal encapsulation cap at the temperature of 150 ℃ and 170 ℃ for 4-8h, the method further comprises:
and carrying out ultrasonic cleaning, alcohol dehydration and drying on the metal packaging pipe cap.
7. The method of claim 6, wherein the ultrasonic cleaning comprises:
and putting the metal packaging pipe cap into deionized water, and carrying out ultrasonic cleaning on the metal packaging pipe cap, wherein the density of the deionized water is more than or equal to 10M omega cm.
8. The method of claim 6, wherein the drying comprises:
and baking the metal packaging pipe cap subjected to alcohol dehydration at the temperature of 150 +/-5 ℃.
9. The method of claim 5, wherein prior to applying the silicone rubber to the metal encapsulation cap, further comprises:
and dehumidifying the interior of the glue coating table, and putting the dried metal packaging pipe cap into the glue coating table, wherein the humidity inside the glue coating table is less than 30% of the ambient humidity.
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2021
- 2021-06-18 CN CN202110679768.6A patent/CN113394116A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428258A (en) * | 2015-12-16 | 2016-03-23 | 济南市半导体元件实验所 | Packaging process for controlling movable redundant materials in semiconductor cavity |
| CN105448747A (en) * | 2016-01-26 | 2016-03-30 | 中国振华集团云科电子有限公司 | Cavity filling method of organic silicone rubber |
| CN110289220A (en) * | 2019-07-07 | 2019-09-27 | 陕西航空电气有限责任公司 | A kind of 250 DEG C of junction temperature of silicon carbide diode chip insulation guard method |
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Application publication date: 20210914 |