CN113376764B - Optical transceiver module device - Google Patents
Optical transceiver module device Download PDFInfo
- Publication number
- CN113376764B CN113376764B CN202110505679.XA CN202110505679A CN113376764B CN 113376764 B CN113376764 B CN 113376764B CN 202110505679 A CN202110505679 A CN 202110505679A CN 113376764 B CN113376764 B CN 113376764B
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- Prior art keywords
- base
- optical
- transceiver module
- optical transceiver
- optical fiber
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- 230000003287 optical effect Effects 0.000 title claims abstract description 82
- 239000013307 optical fiber Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims description 22
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 7
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication and provides an optical transceiver module device which comprises a base and an optical fiber connector, wherein an optical fiber mounting groove for accommodating the optical fiber connector is formed in the base, a V-shaped boss is formed on one side, close to an electric port, of the optical fiber connector, a V-shaped groove is formed on one side, close to the electric port, of the optical fiber mounting groove, the optical fiber mounting groove and the V-shaped groove are arranged in a step mode, and the V-shaped boss is embedded in the V-shaped groove. According to the optical transceiver module device, the optical fiber mounting groove for placing the optical fiber connector is arranged in the middle of the base, the separation bulge is arranged in the middle of the optical fiber mounting groove, namely, the V-shaped groove and the V-shaped groove form a step structure, so that the V-shaped boss matched with the optical fiber connector can ensure that the internal EMI leakage gap is very small, and the EMI leakage is reduced.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an optical transceiver module device.
Background
According to the specification of the QSFP-DD multi-source protocol of the optical transceiver module, the optical communication module has the characteristic of hot plug, namely, the module can be connected or disconnected with equipment under the condition of not cutting off a power supply. The optical communication module is often required to be plugged and unplugged during use, and therefore, the module is usually required to be provided with an unlocking device, so that the module can be smoothly pulled out of an installation cage of the equipment. When the QSFP-DD optical module is inserted into the installation cage of the equipment, the structural steps on two sides of the optical module are mutually contacted with the locking plates of the cage to lock the optical module, so that the module is fixed in the cage to work, when the module needs to be pulled out outwards, the locking plates of the spring on the cage are jacked up by the unlocking parts of the pull rings of the optical module, so that the unlocking of the optical module is realized, and the module can be pulled out outwards at the moment, and finally, the hot plug function of the optical module is realized. It is therefore structurally necessary to design an unlocking device to achieve this function.
The QSFP-DD optical module adopts 8-channel full duplex receiving and transmitting, and the transmission data rate of each channel is up to 50Gbps. As the transmission rate of optical modules increases, optical transceiver modules with high transmission rates are particularly prone to generating excessive EMI (electromagnetic radiation). An effective solution to the EMI is to provide electromagnetic shielding on the product housing structure. Electromagnetic shielding is to utilize a shielding body to attenuate electromagnetic waves, so that interference or injury caused by the electromagnetic waves is reduced. For electromagnetic shielding of conductor materials, the effect is best by using the integral metal shell, but in practical application, gaps are inevitably formed between the module base and the outer cover and between the optical device interface and the base due to the problems of assembly requirement and processing precision, so that the electromagnetic shielding effect of the integral optical module shell is greatly reduced. Therefore, in order to improve the electromagnetic shielding efficiency of the optical module housing structure, it is required to eliminate or reduce the holes and gaps from the inside to the outside of the module as much as possible.
The total power consumption of the QSFP-DD packaged high-speed optical transceiver module can exceed 15W at most, so that the heat dissipation capacity problem is also required to be particularly considered in the structure of the optical module shell.
Disclosure of Invention
The present invention is directed to an optical transceiver module device, which at least solves some of the drawbacks of the prior art.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides an optical transceiver module device, includes base, fiber connector and lid in upper cover on the base, the inside settling of having of base fiber connector's optic fibre mounting groove, the upper cover has V-arrangement boss, one side that the optic fibre mounting groove is close to the electricity mouth has the V-arrangement groove, the optic fibre mounting groove with the V-arrangement groove is the step and arranges, the V-arrangement boss inlays and locates in the V-arrangement groove.
Further, the optical device connector comprises an optical device connector, the base is further provided with an optical device connector mounting groove for the optical device connector to be arranged, and the optical device connector mounting groove is arranged on one side, far away from the V-shaped groove, of the optical fiber mounting groove.
Further, the base and the upper cover enclose a cavity for mounting a PCBA board and an optical transceiver.
Further, a filler material is included for reducing or eliminating gaps between the optical device interface and the base and between the upper cover and the base.
Further, the filling material is an elastic conductive adhesive tape, and the elastic conductive adhesive tape is filled in a gap between the optical device interface and the base and a gap between the upper cover and the base.
Further, the base is provided with a plurality of heat dissipation teeth on the surface facing away from the upper cover.
Further, the heat dissipation teeth are covered with a sheet metal outer cover.
Further, an unlocking mechanism for removing the device from the cage is included.
Further, release mechanism includes the pull ring, can respectively in two gliding sheet metal parts of both sides of base and every the tail end of sheet metal part all is equipped with can block into the cage or the first spacing arch that deviate from in the cage, two sheet metal parts all install on the pull ring.
Further, the unlocking mechanism further comprises a spring capable of automatically resetting, and the two sheet metal parts are respectively provided with a clamping hook capable of receiving the elastic force of the spring.
Compared with the prior art, the invention has the beneficial effects that: an optical transceiver module device is characterized in that an optical fiber mounting groove for placing an optical fiber connector is arranged in the middle of the inner part of a base, a separation bulge is arranged in the middle of the optical fiber mounting groove, namely, a V-shaped groove and the optical fiber mounting groove form a step structure, so that a V-shaped boss of an upper cover is matched, the situation that an internal EMI leakage gap is very small can be ensured, and the EMI leakage is reduced.
Drawings
Fig. 1 is an exploded view of an optical transceiver module device according to an embodiment of the present invention;
fig. 2 is a perspective view of a first view angle of an optical transceiver module device according to an embodiment of the present invention;
fig. 3 is a second perspective view of an optical transceiver module device according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a state of an optical transceiver module device according to an embodiment of the present invention when the optical transceiver module device is in operation (i.e. after the optical transceiver module device is covered with a cage);
fig. 5 is a schematic diagram illustrating an internal assembly state of an optical transceiver module device according to an embodiment of the present invention;
fig. 6 is a perspective view of a first view of a base of an optical transceiver module device according to an embodiment of the present invention;
fig. 7 is a second perspective view of a base of an optical transceiver module device according to an embodiment of the present invention;
fig. 8 is a perspective view of a first view of an upper cover of an optical transceiver module device according to an embodiment of the present invention;
fig. 9 is a second perspective view of an upper cover of an optical transceiver module device according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a pull ring of an optical transceiver module device according to an embodiment of the present invention;
in the reference numerals: 1-1, a base; 1.1, screw holes; 1.2, a first limit groove; 1.3, a pull ring placing groove; 1.4, a spring mounting groove; 1.5, an optical device interface mounting groove; 1.6, an optical fiber mounting groove; 1.7, a boss; 1.8, V-grooves; 1.9, a second limiting protrusion; 1.10, radiating teeth; 2. PCBA board; 3. an upper cover; 3.1, a second limit groove; 3.2, grooves; 3.3, V-shaped bosses; 3.4, conducting adhesive tape; 3.5, screw mounting holes; 3.6, a label groove; 4. a screw; 5. an optical fiber connector; 6. a spring; 7. an optical device interface; 8. a pull ring; 8.1, a first limiting protrusion; 8.2, a third limit protrusion; 8.3, a pull ring handle; 8.4, a clamping hook; 8.5, a sliding arm; 9. sheet metal outer cover.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 10, an optical transceiver module device is provided in an embodiment of the present invention, which includes a base 1, an optical fiber connector 5, and an upper cover 3 covering the base 1, wherein an optical fiber mounting groove 1.6 for accommodating the optical fiber connector 5 is provided in the base 1, the upper cover 3 has a V-shaped boss 3.3, a V-shaped groove 1.8 is provided on a side of the optical fiber mounting groove 1.6 close to an electrical port, the optical fiber mounting groove 1.6 and the V-shaped groove 1.8 are arranged in a step, and the V-shaped boss 3.3 is embedded in the V-shaped groove 1.8. In this embodiment, referring to fig. 6, an optical fiber mounting groove 1.6 for placing an optical fiber connector 5 is provided in the middle of the base 1, and a separation protrusion is provided in the middle of the optical fiber mounting groove 1.6, that is, a V-shaped groove 1.8 and the V-shaped groove form a step structure, so that the V-shaped boss 3.3 of the upper cover 3 is matched, and the small internal EMI leakage gap can be ensured, thereby achieving the purpose of reducing EMI leakage. Preferably, the device further comprises an optical device interface 7, the base 1 further comprises an optical device interface mounting groove 1.5 for the optical device interface 7 to be arranged, and the optical device interface mounting groove 1.5 is arranged on one side of the optical fiber mounting groove 1.6 away from the V-shaped groove 1.8. Wherein, the front end of base 1 is equipped with the optical device interface 7 that is connected with optic fibre, and the back shield of base 1 is equipped with the electric mouth that is linked together with PCBA board 2. The base 1 is internally provided with an installation position of the optical device interface 7. Preferably, the base 1 has four screw holes 1.1 for mounting screws 4, and screw mounting holes 3.5 for cooperation therewith. Preferably, the V-shaped groove 1.8 is provided with a boss 1.7 for fixing the V-shaped boss 3.3, and specifically, the V-shaped boss 3.3 is provided with a groove 3.2 for clamping the boss 1.7.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 10, the device further includes an upper cover 3 covering the base 1, where the base 1 and the upper cover 3 enclose a cavity for mounting the PCBA board 2 and the optical transceiver device. In this embodiment, after the upper cover 3 is covered, the PCBA board 2 and the optical transceiver device can be mounted in the gap between the upper cover and the base 1. Preferably, the upper cover 3 is detachably connected with the base 1.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 to 10, the present apparatus further includes a filling material for reducing or eliminating a gap between the optical device interface 7 and the base 1 and a gap between the upper cover 3 and the base 1. Preferably, the filling material is an elastic conductive adhesive tape 3.4, and the elastic conductive adhesive tape 3.4 is filled in a gap between the optical device interface 7 and the base 1 and a gap between the upper cover 3 and the base 1. In this embodiment, referring to fig. 8, when the optical transceiver module device is inserted into the equipment shielding cage for operation, the front end of the optical module is exposed outside the equipment shielding cage, so that when there is a gap between the optical device interface 7 and the base 1 and a gap between the upper cover 3 and the base 1, EMI inside the module will leak out, and the special shielding structure design inside the base 1 is adopted, and the gap is filled with an elastic conductive material, so that the gap can be reduced or completely eliminated, thereby achieving the purpose of reducing EMI without leakage. The filler material is preferably an elastic conductive adhesive strip 3.4.
As an optimized solution of the embodiment of the present invention, referring to fig. 1 to 10, a surface of the base 1 facing away from the upper cover 3 has a plurality of heat dissipating teeth 1.10. The heat dissipation teeth 1.10 are covered with a sheet metal outer cover 9. In this embodiment, referring to fig. 2, 4 and 7, the plurality of heat dissipation teeth 1.10 have a plurality of heat dissipation channels, so that heat dissipation can be facilitated, and the heat dissipation requirement of the high-power optical transceiver module can be satisfied. Preferably, the heat dissipation teeth 1.10 are provided with second limit protrusions 1.9, so that the installation of the sheet metal outer cover 9 can be facilitated.
As an optimized solution of the embodiment of the present invention, referring to fig. 1 to 10, the device further includes an unlocking mechanism for releasing the device from the cage. The unlocking mechanism comprises a pull ring 8, two sheet metal parts capable of sliding on two sides of the base 1 respectively, and a first limiting protrusion 8.1 capable of being clamped into a cage or being separated from the cage is arranged at the tail end of each sheet metal part, and the two sheet metal parts are mounted on the pull ring 8. The unlocking mechanism further comprises a spring 6 capable of automatically resetting, and the two sheet metal parts are respectively provided with a clamping hook 8.4 capable of receiving the elastic force of the spring 6. In this embodiment, but base 1 both sides slidable mounting has the pull ring 8 that realizes the unblock function, and pull ring 8 rear end unblock part is stainless steel sheet metal component, and the front end handle is the comfortable flexible plastic part of feeling, and pull ring 8 can realize automatic re-setting under the spring 6 effect of both sides. The pull ring 8 is formed by integrally forming a soft rubber handle and a metal plate unlocking plate by adopting an encapsulation injection molding process, and the soft rubber handle can be made into different colors according to different product requirements. Two clamping hooks 8.4 receiving the elastic force of the springs 6 are arranged in the middle areas of the two sides of the metal plate, and automatic reset under the action of the springs 6 can be realized. The tail ends of the two sides are respectively provided with a first protruding structure, so that the function of unlocking the module from the equipment is realized. Preferably, a first limit groove 1.2 for limiting the displacement range of the pull ring 8 is arranged on each side of the base 1. Preferably, the outer surface of the upper cover 3 has a label groove 3.6 to which a label is attached. The pull ring placing grooves 1.3 of the pull ring 8 are arranged on two sides of the upper cover 3, and the second limiting grooves 3.1 for limiting the displacement range of the pull ring 8 are respectively arranged on two sides of the front end. Preferably, the pull ring 8 has a third limit projection 8.2 which can be coupled with the upper cover 3 in a mating manner. The tab 8 may be subdivided into a tab handle 8.3 and a sliding arm 8.5, which sliding arm 8.5 is then the sheet metal part. The front ends of the two sides of the base 1 are provided with two spring mounting grooves 1.4 for mounting springs 6.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. An optical transceiver module device, includes base, fiber connector and lid in upper cover on the base, its characterized in that: the optical fiber connector is characterized in that an optical fiber mounting groove for accommodating the optical fiber connector is formed in the base, a V-shaped boss is arranged on the upper cover, a V-shaped groove is formed in one side, close to the electric port, of the optical fiber mounting groove, the optical fiber mounting groove and the V-shaped groove are arranged in a step mode, the V-shaped boss is embedded in the V-shaped groove, and a boss for fixing the V-shaped boss is arranged on the V-shaped groove.
2. An optical transceiver module as claimed in claim 1, wherein: the optical device comprises a base, and is characterized by further comprising an optical device interface, wherein the base is further provided with an optical device interface mounting groove for arranging the optical device interface, and the optical device interface mounting groove is arranged on one side, far away from the V-shaped groove, of the optical fiber mounting groove.
3. An optical transceiver module arrangement as claimed in claim 2, wherein: the base and the upper cover enclose a cavity for mounting the PCBA board and the optical transceiver.
4. An optical transceiver module as claimed in claim 3, wherein: and a filler material for reducing or eliminating gaps between the optical device interface and the base and between the upper cover and the base.
5. An optical transceiver module as claimed in claim 4, wherein: the filling material is an elastic conductive adhesive tape, and the elastic conductive adhesive tape is filled in a gap between the optical device interface and the base and a gap between the upper cover and the base.
6. An optical transceiver module as claimed in claim 3, wherein: the base is away from the face of upper cover has a plurality of heat dissipation tooth.
7. An optical transceiver module as claimed in claim 6, wherein: and the heat dissipation teeth are covered with a sheet metal outer cover.
8. An optical transceiver module as claimed in claim 1, wherein: an unlocking mechanism for removing the device from the cage is also included.
9. An optical transceiver module as claimed in claim 8, wherein: the unlocking mechanism comprises a pull ring, two sheet metal parts capable of sliding on two sides of the base respectively, and a first limiting protrusion capable of being clamped into the cage or being separated from the cage is arranged at the tail end of each sheet metal part, and the two sheet metal parts are mounted on the pull ring.
10. An optical transceiver module as claimed in claim 9, wherein: the unlocking mechanism further comprises a spring capable of automatically resetting, and the two sheet metal parts are respectively provided with a clamping hook capable of receiving the elastic force of the spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110505679.XA CN113376764B (en) | 2021-05-10 | 2021-05-10 | Optical transceiver module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110505679.XA CN113376764B (en) | 2021-05-10 | 2021-05-10 | Optical transceiver module device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113376764A CN113376764A (en) | 2021-09-10 |
| CN113376764B true CN113376764B (en) | 2023-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110505679.XA Active CN113376764B (en) | 2021-05-10 | 2021-05-10 | Optical transceiver module device |
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| Country | Link |
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| CN (1) | CN113376764B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114675381A (en) * | 2022-03-17 | 2022-06-28 | 武汉华工正源光子技术有限公司 | Base assembly, housing and optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738689A (en) * | 2008-11-21 | 2010-06-16 | 星电株式会社 | Optical module |
| CN102914830A (en) * | 2012-10-19 | 2013-02-06 | 深圳市泰科微光学有限公司 | Double-step structure with V-shaped grooves of optical fiber connector |
| CN103713363A (en) * | 2014-01-03 | 2014-04-09 | 长芯盛（武汉）科技有限公司 | Connecting assembly of USB 3.0 type optical fiber connector |
| CN108710182A (en) * | 2018-08-08 | 2018-10-26 | 高意通讯（深圳）有限公司 | A kind of method and sealing structure for the sealing of optical device low temperature glass |
| CN112114405A (en) * | 2020-09-04 | 2020-12-22 | 武汉联特科技有限公司 | An optical transceiver integrated module shell structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6819858B2 (en) * | 2000-10-26 | 2004-11-16 | Shipley Company, L.L.C. | Fiber array with V-groove chip and mount |
| US7917037B2 (en) * | 2004-01-05 | 2011-03-29 | Finisar Corporation | Internal EMI shield for an optoelectronic module |
| EP1761813B1 (en) * | 2004-06-30 | 2014-06-25 | Hoya Corporation Usa | Fiber-coupled optical device |
| US7543994B2 (en) * | 2006-10-19 | 2009-06-09 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Multi-optical fiber connector module for use with a transceiver module and method for coupling optical signals between the transceiver module and multiple optical fibers |
-
2021
- 2021-05-10 CN CN202110505679.XA patent/CN113376764B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738689A (en) * | 2008-11-21 | 2010-06-16 | 星电株式会社 | Optical module |
| CN102914830A (en) * | 2012-10-19 | 2013-02-06 | 深圳市泰科微光学有限公司 | Double-step structure with V-shaped grooves of optical fiber connector |
| CN103713363A (en) * | 2014-01-03 | 2014-04-09 | 长芯盛（武汉）科技有限公司 | Connecting assembly of USB 3.0 type optical fiber connector |
| CN108710182A (en) * | 2018-08-08 | 2018-10-26 | 高意通讯（深圳）有限公司 | A kind of method and sealing structure for the sealing of optical device low temperature glass |
| CN112114405A (en) * | 2020-09-04 | 2020-12-22 | 武汉联特科技有限公司 | An optical transceiver integrated module shell structure |
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| CN113376764A (en) | 2021-09-10 |
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