CN113364955A - Infrared module - Google Patents
Infrared module Download PDFInfo
- Publication number
- CN113364955A CN113364955A CN202110627108.3A CN202110627108A CN113364955A CN 113364955 A CN113364955 A CN 113364955A CN 202110627108 A CN202110627108 A CN 202110627108A CN 113364955 A CN113364955 A CN 113364955A
- Authority
- CN
- China
- Prior art keywords
- photosensitive chip
- lens
- infrared module
- glue
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims abstract description 53
- 239000000428 dust Substances 0.000 claims abstract description 49
- 239000011859 microparticle Substances 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000003384 imaging method Methods 0.000 abstract description 7
- 238000001931 thermography Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The invention discloses an infrared module, which comprises a lens seat and a photosensitive chip, wherein the lens seat and the photosensitive chip are fixed on a mainboard, a lens is arranged on the lens seat, the photosensitive chip is positioned in a space formed by the lens seat and the mainboard in an enclosing manner, so that the chip is isolated from the outside, in order to improve the dustproof effect, dust catching glue for adhering micro particles is arranged around the photosensitive chip, the dust catching glue is also positioned in the space formed by the lens seat and the mainboard in an enclosing manner, the periphery of the photosensitive chip is surrounded by the dust catching glue, foreign matters such as dust and the like around the photosensitive chip are effectively adsorbed by the dust catching glue for a long time, the photosensitive area is ensured not to be interfered by the foreign matters, and the better dustproof effect is realized, so that the imaging quality is ensured.
Description
Technical Field
The invention relates to the technical field of infrared thermal imaging, in particular to an infrared module.
Background
In recent years, the infrared thermal imaging technology is rapidly developed, the infrared thermal imaging module is widely applied to scenes such as security monitoring, automatic driving, internet of things, smart homes, electric power detection, industrial temperature measurement and medical treatment, and the infrared thermal imaging system plays an important role no matter in the military or commercial field.
Along with the continuous expansion of the application field of the infrared thermal imaging technology, the size of the module is continuously reduced, compared with the existing metal tube shell and ceramic tube shell packaging technology, the wafer level packaging technology has higher integration level, the detector is small in size, the tube shell is not needed, a small lens is directly adopted, the process flow is simple, the cost is low, and the infrared thermal imaging device is more suitable for mass production and low-cost production.
The infrared thermal imaging module relies on the photosensitive chip to acquire infrared signals, and through a series of signal processing output imaging, the photosensitive chip size is little, and tiny impurities such as dust disturb imaging greatly, and in the prior art, the LCC tube package or pixel level package are adopted usually, and the present traditional packaging mode all reaches better dustproof effect.
For those skilled in the art, how to better implement the dustproof packaging is a technical problem to be solved at present.
Disclosure of Invention
The invention provides an infrared module, which adsorbs foreign matters entering from the outside by arranging dust catching glue around a photosensitive chip, avoids interference of a photosensitive area and improves the imaging quality, and the specific scheme is as follows:
an infrared module comprises a lens base and a photosensitive chip, wherein the lens base and the photosensitive chip are fixed on a main board, a lens is mounted on the lens base, and the photosensitive chip is located in a space formed by the lens base and the main board in an enclosing mode;
the periphery of the photosensitive chip is provided with dust catching glue for adhering microparticles in a surrounding mode.
Optionally, a lead is arranged between the photosensitive chip and the main board, and the lead is completely wrapped by the dust catching glue.
Optionally, the thickness of the dust catching glue is greater than that of the photosensitive chip, and the dust catching glue covers the edge of the photosensitive chip.
Optionally, the photosensitive chip is pasted on the main board through a patch glue.
Optionally, a dust adhesive is disposed at a connection gap between the lens base and the lens.
Optionally, a rubber blocking block protrudes inwards from the lens base, and the rubber blocking block is used for containing the falling dust-binding rubber and the falling debris particles.
Optionally, the lens base and the lens are connected through threads.
Optionally, the mirror base and the main plate are fixed by gluing.
Optionally, the display device further comprises an auxiliary board, components are arranged on the auxiliary board, and the auxiliary board is connected with the main board through a flexible flat cable signal.
Optionally, a socket for connecting with the outside is provided on the sub-plate.
The invention provides an infrared module, which comprises a lens seat and a photosensitive chip, wherein the lens seat and the photosensitive chip are fixed on a mainboard, a lens is arranged on the lens seat, the photosensitive chip is positioned in a space formed by the lens seat and the mainboard in an enclosing manner, so that the chip is isolated from the outside, in order to improve the dustproof effect, dust catching glue for adhering micro particles is arranged around the photosensitive chip, the dust catching glue is also positioned in the space formed by the lens seat and the mainboard in an enclosing manner, the periphery of the photosensitive chip is surrounded by the dust catching glue, foreign matters such as dust and the like around the photosensitive chip are effectively adsorbed by the dust catching glue for a long time, the photosensitive area is ensured not to be interfered by the foreign matters, and the better dustproof effect is realized, so that the imaging quality is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an infrared module according to the present invention;
FIG. 2 is a schematic diagram of three stages of assembly of related components on a motherboard;
FIG. 3 is a schematic view of the relevant components of the microscope stand at two stages of assembly;
fig. 4 is a schematic structural diagram of an infrared module according to a second embodiment of the invention.
The figure includes:
a main board 1, a lens base 2, a rubber block 21, a photosensitive chip 3, a dust catching glue 4, a lens 5, a dust sticking glue 51, a lead 6, a secondary board 7, a socket 71, a flexible flat cable 8,
Detailed Description
The invention provides an infrared module, which adsorbs foreign matters entering from the outside by arranging dust catching glue around a photosensitive chip, avoids interference of a photosensitive area and improves the imaging quality.
In order to make those skilled in the art better understand the technical solution of the present invention, the infrared module of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The present invention provides an infrared module, fig. 1 is a schematic cross-sectional structure diagram of the infrared module provided by the present invention; the dust-catching lens comprises a mainboard 1, a lens base 2, a photosensitive chip 3, dust-catching glue 4, a lens 5 and other structures, wherein the lens base 2 and the photosensitive chip 3 are fixedly arranged on the mainboard 1, the lens 5 is arranged on the lens base 2, and the lens 5 is used for transmitting light; the microscope base 2 provided with the lens 5 is fixed on the mainboard 1 to form a closed space, the photosensitive chip 3 is positioned in the space formed by the microscope base 2 and the mainboard 1 in an enclosing manner, light transmitted by the lens 5 enters the photosensitive chip 3, and the photosensitive chip 3 generates an electric signal.
Since the module is formed by combining the lens holder 2, the lens 5, the main board 1, and the like, the lens holder 2, the lens 5, and the main board 1 are exposed to the outside, and there are gaps at the joints between the components, and fine foreign matters such as dust may enter from the gaps, and the attachment to the photosensitive chip 3 may affect the quality of the image. In order to avoid the interference of foreign matters, the dust catching glue 4 for adhering micro-particles is arranged around the photosensitive chip 3, the dust catching glue 4 is glue with small stress after curing and certain viscosity on the surface, the foreign matters around the photosensitive chip 3 are effectively adsorbed for a long time, and the photosensitive area is prevented from being polluted by the external foreign matters; the glue curing method adopted by the dust catching glue 4 is not limited, and can be thermosetting, UV curing, UV thermosetting and the like.
According to the invention, the dust catching glue 4 is arranged in the space formed by the lens base 2 and the main board 1, the periphery of the photosensitive chip 3 is surrounded by the dust catching glue 4, foreign matters entering from the outside firstly reach the range of the dust catching glue 4 and are adsorbed by the dust catching glue 4, the surface of the dust catching glue 4 has viscosity for a long time, the foreign matters are continuously adsorbed, the photosensitive area is ensured not to be interfered by the foreign matters, a better dustproof effect is realized, and the imaging quality is ensured.
On the basis of the scheme, the lead 6 is arranged between the photosensitive chip 3 and the mainboard 1, the lead 6 can transmit signals between the photosensitive chip 3 and the mainboard 1, the diameter of the lead 6 is very thin, generally less than 25 micrometers, and the lead 6 is easily damaged by external force, the lead 6 is completely wrapped by the dust catching glue 4, and the dust catching glue 4 plays a role in protection on one hand and plays an insulating role on the other hand for the lead 6.
As shown in fig. 1, the thickness of the dust catching glue 4 is larger than that of the photosensitive chip 3, and the dust catching glue 4 covers the edge of the photosensitive chip 3; the dust catching glue 4 is in contact with the peripheral side face of the photosensitive chip 3, and covers a part of the outer edge of the upper surface of the photosensitive chip 3 to completely wrap the connection point of the lead 6.
Specifically, the photosensitive chip 3 is adhered to the main board 1 by the patch glue; fig. 2 is a schematic diagram of three stages of assembling related components on the motherboard 1; during assembly, firstly, the photosensitive chip 3 is pasted on the main board 1 through the patch glue, the leads 6 are respectively connected with the main board 1 and the photosensitive chip 3, and finally, the upper surface of the main board 1 is coated with the dust catching glue 4, and the dust catching glue 4 surrounds the periphery of the photosensitive chip 3; and the dust catching glue 4 is contacted with the inner wall of the mirror base 2, the seam between the mirror base 2 and the main board 1 is plugged by the dust catching glue 4, and the dustproof effect can also be improved.
On the basis of any one of the above technical schemes and the mutual combination thereof, the joint gap between the lens base 2 and the lens 5 is provided with the dust adhesive 51, and the dust adhesive 51 blocks the gap between the lens base 2 and the lens 5 to prevent foreign matters from entering from the joint gap between the two.
Furthermore, the lens holder 2 of the present invention is provided with a rubber stopper 21 protruding inwards, and the rubber stopper 21 is used for containing falling dust-sticking rubber 51 and debris particles, which are usually generated by friction when the lens 5 and the lens holder 2 are mounted. Keep off gluey piece 21 protrusion setting on the inner wall of mirror seat 2, keep off gluey piece 21 and be located the below of camera lens 5, just to the connecting gap between camera lens 5 and the mirror seat 2, produce the extrusion to sticky dirt glue 51 when installation camera lens 5, partial sticky dirt glue 51 can be extruded and drop, falls to keep off gluey piece 21, avoids causing the pollution to sensitization chip 3.
The upper surface of the glue blocking block 21 can be provided with a groove structure, or an inclined slope is arranged towards the outer side, so that the amount of the bearing glue solution is increased.
Preferably, the lens holder 2 and the lens 5 are connected through a screw thread, an external screw thread is arranged on the periphery of the lens 5, an internal screw thread is arranged on the inner wall of the lens holder 2, and the lens 5 is screwed on the lens holder 2 through a screw thread structure.
Fig. 3 is a schematic view of two stages of assembly of the relevant components on the lens holder 2; firstly, coating dust adhesive 51 on the internal thread of the lens base 2, then screwing the lens 5 in the screw way, and dropping the extruded dust adhesive 51 on the rubber stopper 21.
Due to the fact that the thread machining has certain tolerance, the situation that the thread is too loose or too tight can occur in the installation and locking process, the lens is easy to shake after the lens is locked and attached due to the too loose thread, particles generated by thread friction are easy to generate due to the too tight thread, and the problem can be effectively solved through the dust adhesive 51; for the situation that the thread is too loose, the dust-binding glue 51 has certain viscosity after being pre-cured, so that the lens can be prevented from shaking; for the case of too tight thread, the dust-sticking glue 51 can effectively adhere particles generated by thread friction, and the particles generated by thread friction can fall onto the glue-blocking block 21 along with the dust-sticking glue 51, so as to prevent the particles from falling onto the surface of the photosensitive chip 3.
Specifically, the mirror base 2 and the main board 1 are fixed by gluing, and glue between the bottom edge of the mirror base 2 and the main board 1 can also play a role in blocking foreign matters from entering.
Referring to fig. 2 and 3, the main board 1 is provided with a photosensitive chip 3, a dust catching glue 4, a lead 6 and other structures, the mirror cover 2 is provided with a lens 5, and the mirror cover 2 and the main board 1 are bonded to each other.
Further, as shown in fig. 4, a schematic structural diagram of a second embodiment of the infrared module of the present invention is shown; the infrared module further comprises an auxiliary board 7, the auxiliary board 7 is independent of the main board 1, components are arranged on the auxiliary board 7, and the components on the auxiliary board 7 can be originally integrated on the back or the front of the main board, so that the number of components arranged on the main board 1 is reduced, and the size of the main board is reduced. The auxiliary board 7 is in signal connection with the main board 1 through a flexible flat cable 8, and the flexible flat cable 8 is in signal transmission between the auxiliary board 7 and the main board 1.
The sub-board 7 is provided with a socket 71 for connection to the outside, and signal connection is made to the outside through the socket 71 on the sub-board 7.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An infrared module is characterized by comprising a mirror base (2) and a photosensitive chip (3) which are fixed on a main board (1), wherein a lens (5) is installed on the mirror base (2), and the photosensitive chip (3) is positioned in a space formed by the mirror base (2) and the main board (1) in an enclosing manner;
and dust catching glue (4) for adhering micro-particles is arranged around the periphery of the photosensitive chip (3).
2. Infrared module according to claim 1, characterized in that a lead (6) is provided between the photosensitive chip (3) and the motherboard (1), the lead (6) being completely encapsulated by the capture glue (4).
3. The infrared module according to claim 2, characterized in that the thickness of the capture paste (4) is greater than the thickness of the photosensitive chip (3), the capture paste (4) covering the edges of the photosensitive chip (3).
4. Infrared module according to claim 1, characterized in that the photosensitive chip (3) is glued on the motherboard (1) by means of a patch glue.
5. The infrared module as set forth in any of claims 1 to 4, characterized in that a dust-binding glue (51) is provided at the connecting gap between the lens holder (2) and the lens (5).
6. The infrared module as set forth in claim 5, characterized in that a rubber stopper (21) is provided on the mirror base (2) in an inwardly protruding manner, the rubber stopper (21) being adapted to receive the falling dust-binding glue (51) and the debris particles.
7. The infrared module according to claim 5, characterized in that the lens holder (2) and the lens (5) are connected by a screw thread.
8. Infrared module according to claim 5, characterised in that the mirror base (2) and the main board (1) are fixed by gluing.
9. The infrared module as set forth in claim 5, characterized in that it further comprises a sub-board (7), components are disposed on the sub-board (7), and the sub-board (7) is in signal connection with the main board (1) through a flexible flat cable (8).
10. Infrared module according to claim 9, characterized in that said sub-plate (7) is provided with a socket (71) for connection to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110627108.3A CN113364955A (en) | 2021-06-04 | 2021-06-04 | Infrared module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110627108.3A CN113364955A (en) | 2021-06-04 | 2021-06-04 | Infrared module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113364955A true CN113364955A (en) | 2021-09-07 |
Family
ID=77532506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110627108.3A Pending CN113364955A (en) | 2021-06-04 | 2021-06-04 | Infrared module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113364955A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114189615A (en) * | 2021-12-07 | 2022-03-15 | 信利光电股份有限公司 | A camera module for reducing moving stains and a method for reducing moving stains on a camera module |
| TWI836659B (en) * | 2022-10-07 | 2024-03-21 | 一品光學工業股份有限公司 | Thermal sensing module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873992A (en) * | 2005-06-03 | 2006-12-06 | 鸿富锦精密工业（深圳）有限公司 | Package of image sensor, and packaging procedure |
| CN101179655A (en) * | 2006-11-08 | 2008-05-14 | 智元科技股份有限公司 | Image sensing element and manufacturing method thereof |
| CN201765370U (en) * | 2010-08-31 | 2011-03-16 | 宁波舜宇光电信息有限公司 | Image pickup module of mobile phone |
| US20160021282A1 (en) * | 2014-07-16 | 2016-01-21 | Larview Technologies Corp. | Image capturing module having a built-in dustproof structure |
| CN207301586U (en) * | 2017-10-09 | 2018-05-01 | 深圳市煜辰光学有限公司 | Dust-proof camera lens module equipped with double optical filtering switch |
| CN208353440U (en) * | 2018-05-03 | 2019-01-08 | 3M中国有限公司 | Camera module with dedusting structure |
-
2021
- 2021-06-04 CN CN202110627108.3A patent/CN113364955A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1873992A (en) * | 2005-06-03 | 2006-12-06 | 鸿富锦精密工业（深圳）有限公司 | Package of image sensor, and packaging procedure |
| CN101179655A (en) * | 2006-11-08 | 2008-05-14 | 智元科技股份有限公司 | Image sensing element and manufacturing method thereof |
| CN201765370U (en) * | 2010-08-31 | 2011-03-16 | 宁波舜宇光电信息有限公司 | Image pickup module of mobile phone |
| US20160021282A1 (en) * | 2014-07-16 | 2016-01-21 | Larview Technologies Corp. | Image capturing module having a built-in dustproof structure |
| CN207301586U (en) * | 2017-10-09 | 2018-05-01 | 深圳市煜辰光学有限公司 | Dust-proof camera lens module equipped with double optical filtering switch |
| CN208353440U (en) * | 2018-05-03 | 2019-01-08 | 3M中国有限公司 | Camera module with dedusting structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114189615A (en) * | 2021-12-07 | 2022-03-15 | 信利光电股份有限公司 | A camera module for reducing moving stains and a method for reducing moving stains on a camera module |
| TWI836659B (en) * | 2022-10-07 | 2024-03-21 | 一品光學工業股份有限公司 | Thermal sensing module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100843300B1 (en) | Camera module and its manufacturing method | |
| TWI682210B (en) | Lens module and method for assembling the same | |
| CN204721435U (en) | Security protection camera module | |
| KR20030091549A (en) | Image sensor module and method thereof | |
| US20040239794A1 (en) | Compact camera module | |
| CN105573020A (en) | Camera module with dust catching structure | |
| CN102262275B (en) | Imaging module and method for assembling the same | |
| CN113364955A (en) | Infrared module | |
| US8836855B2 (en) | Thin image capturing apparatus | |
| KR20070105723A (en) | Camera module package | |
| CN111103668A (en) | lens module | |
| JP2002252797A (en) | Solid-state imaging device | |
| CN112615987A (en) | Camera module and electronic equipment | |
| KR20100070604A (en) | Camera module and method for manufacturing the same | |
| KR20100009339A (en) | Camera module for mobile device | |
| JP2024144668A (en) | Camera Module | |
| JP5821394B2 (en) | Imaging device | |
| CN114488458A (en) | Optical lens, camera module and electronic equipment | |
| CN101872054A (en) | Lens module and its applied camera module | |
| US9111826B2 (en) | Image pickup device, image pickup module, and camera | |
| KR20100041951A (en) | Camera module for mobile device | |
| KR102396492B1 (en) | Thin camera packaging apparatus | |
| JPS59122087A (en) | Solid-state image pickup device | |
| KR20090055978A (en) | Camera module to prevent foreign objects from entering | |
| KR101050851B1 (en) | Image sensor module and camera module having same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210907 |
|
| RJ01 | Rejection of invention patent application after publication |