CN113347819A - Heat conduction assembly, display module and electronic equipment - Google Patents
Heat conduction assembly, display module and electronic equipment Download PDFInfo
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- CN113347819A CN113347819A CN202110276338.XA CN202110276338A CN113347819A CN 113347819 A CN113347819 A CN 113347819A CN 202110276338 A CN202110276338 A CN 202110276338A CN 113347819 A CN113347819 A CN 113347819A
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- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
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- 230000017525 heat dissipation Effects 0.000 abstract description 20
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请公开了一种导热组件、显示模组及电子设备，该导热组件包括：相对设置的第一导热单元和第二导热单元，以及设置在所述第一导热单元和所述第二导热单元间的至少一个半导体对；所述第一导热单元包括第一导热贴片和第一导热电极，所述第二导热单元包括第二导热贴片和第二导热电极；所述半导体对通过所述第一导热电极与所述第一导热贴片连接，所述半导体对通过所述第二导热电极与所述第二导热贴片连接；所述第二导热贴片在第一方向的尺寸小于或等于所述第一导热贴片在所述第一方向的尺寸，其中，所述第一方向为所述第二导热贴片的厚度方向。通过本申请提供了一种散热效率高的导热组件、显示模组及电子设备。
The present application discloses a heat conduction assembly, a display module and an electronic device. The heat conduction assembly includes: a first heat conduction unit and a second heat conduction unit arranged opposite to each other, and a heat conduction unit arranged on the first heat conduction unit and the second heat conduction unit at least one semiconductor pair between the two; the first heat conduction unit includes a first heat conduction patch and a first heat conduction electrode, and the second heat conduction unit includes a second heat conduction patch and a second heat conduction electrode; the semiconductor pair passes through the The first thermally conductive electrode is connected to the first thermally conductive patch, and the semiconductor pair is connected to the second thermally conductive patch through the second thermally conductive electrode; the size of the second thermally conductive patch in the first direction is smaller than or is equal to the dimension of the first thermally conductive patch in the first direction, wherein the first direction is the thickness direction of the second thermally conductive patch. The present application provides a thermally conductive component, a display module and an electronic device with high heat dissipation efficiency.
Description
Technical Field
The application relates to the technical field of heat dissipation, especially, relate to a heat-conducting component, display module assembly and electronic equipment.
Background
With the development of electronic technology, the integration level of components of electronic equipment and modules is higher and higher, and one of the significant problems brought by the improvement of the integration level is serious heat generation.
The protective housing of electronic equipment or module is prepared for adopting the material that the heat conductivity is strong to current commonly used heat dissipation scheme. However, the heat dissipation effect of this solution is not good, and a solution capable of significantly improving the heat dissipation effect is urgently needed.
Disclosure of Invention
In view of the above, the present application is proposed to provide a heat conducting assembly, a display module and an electronic device that overcome or at least partially solve the above problems.
In a first aspect, a thermally conductive assembly is provided, comprising:
the heat conduction structure comprises a first heat conduction unit, a second heat conduction unit and at least one semiconductor pair, wherein the first heat conduction unit and the second heat conduction unit are oppositely arranged, and the at least one semiconductor pair is arranged between the first heat conduction unit and the second heat conduction unit;
the first heat conducting unit comprises a first heat conducting patch and a first heat conducting electrode, and the second heat conducting unit comprises a second heat conducting patch and a second heat conducting electrode;
the semiconductor pair is connected with the first heat conduction patch through the first heat conduction electrode, and the semiconductor pair is connected with the second heat conduction patch through the second heat conduction electrode;
the size of the second heat conducting patch in the first direction is smaller than or equal to the size of the first heat conducting patch in the first direction, wherein the first direction is the thickness direction of the second heat conducting patch.
Optionally, the semiconductor pair includes: the P-type semiconductor and the N-type semiconductor are connected in series through the first heat conduction electrode and the second heat conduction electrode and are connected end to end through the first heat conduction electrode and the second heat conduction electrode.
Optionally, a size of the first heat conducting patch in a second direction is smaller than a size of the second heat conducting patch in the second direction, where the second direction is a thickness direction of the first heat conducting patch.
Optionally, the heat conducting assembly further comprises: the size of the power supply unit in a third direction is smaller than that of the second heat-conducting patch in the third direction, the power supply unit provides a power supply interface for the semiconductor pair, and the third direction is the direction in which the longer side of a connection area of the power supply unit and the second heat-conducting patch is located.
Optionally, the material of the first heat conducting patch and the second heat conducting patch is any one or a combination of more than one of the following materials: polyamide resins, polyamideimide resins, polyimide resins, and epoxy resins.
Optionally, the first heat conducting patch and the second heat conducting patch are both sheet structures.
In a second aspect, a display module is provided, which includes the heat conducting assembly of the first aspect.
Optionally, the display module further includes: the heat conducting assembly is connected with the metal back plate through the first heat conducting patch and is connected with the circuit board through the second heat conducting patch; and the power supply unit of the heat conduction assembly is in contact with the circuit board to realize electric connection.
Optionally, the display module further includes: the heat conducting assembly is at least partially overlapped with the projection of the display panel on the plane where the metal back plate is located.
In a third aspect, an electronic device is provided, which includes the display module of the second aspect.
The technical scheme provided in the embodiment of the application at least has the following technical effects or advantages:
the embodiment of the application provides a heat conduction assembly, display module assembly and electronic equipment, set up at least one semiconductor between first heat conduction unit and second heat conduction unit to it is connected with first heat conduction paster to set up the semiconductor, be connected with second heat conduction paster through first heat conduction electrode, the thermocouple structure has been formed, the ingenious Peltier effect that utilizes the thermocouple, thereby can absorb the heat of treating the cooling region through a heat conduction paster, give off the heat through another heat conduction paster, and then can realize more efficient heat conduction, and the radiating efficiency is improved. And, still set up the size that second heat conduction paster is less than or equal to first heat conduction paster in the size of the first direction that its thickness corresponds, increased the suitability of heat conduction subassembly with the display module assembly.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a first front view of a thermally conductive assembly according to an embodiment of the present disclosure;
FIG. 2 is a side view of the thermally conductive assembly of FIG. 1 in an embodiment of the present application;
FIG. 3 is a second front view of the heat conducting assembly in the embodiment of the present application;
FIG. 4 is a diagram illustrating a structure of a display module according to an embodiment of the present disclosure;
fig. 5 is a structural diagram of an electronic device in an embodiment of the present application.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Referring to fig. 1 and 2, fig. 1 is a first front view of a heat-conducting assembly 100 according to an embodiment of the present invention, and fig. 2 is a side view of the heat-conducting assembly 100 shown in fig. 1, the heat-conducting assembly including:
the heat conduction device comprises a first heat conduction unit 1, a second heat conduction unit 2 and at least one semiconductor pair 3, wherein the first heat conduction unit 1 and the second heat conduction unit 2 are oppositely arranged, and the semiconductor pair is arranged between the first heat conduction unit 1 and the second heat conduction unit 2;
the first heat conducting unit 1 comprises a first heat conducting patch 11 and a first heat conducting electrode 12, and the second heat conducting unit 2 comprises a second heat conducting patch 21 and a second heat conducting electrode 22;
the semiconductor pair 3 is connected with the first heat conducting patch 11 through the first heat conducting electrode 12, and the semiconductor pair 3 is connected with the second heat conducting patch 21 through the second heat conducting electrode 22;
the size of the second heat conducting patch 21 in the first direction 101 is smaller than or equal to the size of the first heat conducting patch 11 in the first direction 101, wherein the first direction 101 is the thickness direction of the second heat conducting patch 21.
It should be noted that the heat conducting assembly may be mounted in a display product, a mobile device product, a notebook product, or a car screen product, and the like, which is not limited herein.
The first heat conducting unit 1, the second heat conducting unit 2 and the semiconductor pair 3 in the heat conducting assembly form a thermocouple, and based on the Peltier effect, when current passes through a loop formed by conductors of different types, in addition to irreversible Joule heat generation, heat absorption and heat release phenomena can occur at joints of different conductors along with different current directions. Therefore, when the semiconductor pair 3 is turned on, a heat generating portion and a cooling portion are formed in different types of conductors or semiconductor connection regions of the semiconductor pair 3 by the peltier effect. This application connects refrigeration portion and the portion of generating heat respectively through setting up the heat conduction unit, can be to the regional heat absorption of high temperature, dispel the heat in the low temperature region, improve the radiating efficiency.
The following further describes the specific structure of the heat conducting assembly:
as shown in fig. 1, the semiconductor pair 3 may include: a P-type semiconductor and an N-type semiconductor, which are connected in series by the first and second thermally conductive electrodes 12 and 22, and are connected end-to-end by the first and second thermally conductive electrodes 12 and 22. Specifically, the heat generating portion is a connection region where current flows from the P-type semiconductor to the N-type semiconductor connected in series when the pair of semiconductors 3 is on, and the first heat conductive electrode 12 is used as the heat generating portion in fig. 1. When the cooling portion is a connection region where the semiconductor pair 3 is turned on, a current flows from the N-type semiconductor to the P-type semiconductor connected in series, and the second heat conductive electrode 22 is used as the cooling portion in fig. 1. Specifically, the N-type semiconductor and the P-type semiconductor are alternately connected in series to form the thermocouple, so that the cost can be obviously reduced due to the fact that the thermocouple is more consistent with a mature semiconductor manufacturing process, heat absorption of a connection area of the N-type semiconductor and the P-type semiconductor is more stable and controllable, and heat absorption and conduction efficiency of the thermocouple can be more stable and higher.
Wherein, the size of the N type semiconductor and the P type semiconductor that the semiconductor included to 3 can be set up according to the shape and the size of waiting to dispel the heat the product, to the heat-conducting component who is applied to small-size product, can set up the N type semiconductor and the P type semiconductor of millimeter level size and satisfy the miniaturization demand. For example, each pair of N-type and P-type semiconductors may be sized to be less than 10mm on a side, and the correspondingly formed thermal conductive assembly may have an outer dimension of less than 40mm on a side.
The number of the N-type semiconductors and the number of the P-type semiconductors in the semiconductor pair 3 can be customized according to specific cooling requirements, so that the problem that the number of the N-type semiconductors and the P-type semiconductors is too large to cause power consumption waste or the number of the N-type semiconductors and the P-type semiconductors is too small to cause insufficient heat dissipation effect is avoided. Specifically, the target logarithm of the N-type semiconductor and the P-type semiconductor in the semiconductor pair 3 can be determined according to the ratio of the number of degrees to be cooled to the number of degrees per unit of temperature to be cooled, wherein the number of degrees per unit of temperature to be cooled represents the number of degrees per unit of temperature to be cooled of the N-type semiconductor and the P-type semiconductor. The acquisition mode of the degree to be cooled may be a numerical value input by a worker according to an empirical value, or a numerical value obtained by thermally simulating a product to be cooled, and is not limited herein. The unit cooling degree can be obtained by empirical values or experimental values. According to the research of the inventor, the unit cooling degree can be set to be 1.2-1.4 ℃/pair, preferably, the unit cooling degree is set to be 1.3 ℃/pair, and the pair of the N-type semiconductor and the P-type semiconductor meeting the cooling requirement can be more accurately determined. For example, if the product to be cooled needs to be cooled by 20 ℃, 20 ÷ 1.3 ≈ 15.4, the semiconductor pair 3 including 15 groups or 16 pairs of N-type semiconductor and P-type semiconductor can basically meet the cooling and heat dissipation requirements.
Preferably, both the N-type semiconductor and the P-type semiconductor used to form the semiconductor pair 3 may be provided as thermoelectric semiconductor materials, for example, bismuth-tellurium-based thermoelectric semiconductor materials, to improve heat absorption and conduction efficiency.
Of course, in the implementation process, the material of the semiconductor pair 3 forming the thermocouple is not limited to the above material, and for example, the semiconductor pair formed by connecting nickel chromium and nickel silicon or made of graphite can be used, which is not limited and is not listed.
As shown in fig. 1 and 2, the first heat conducting unit 1 and the second heat conducting unit 2 are oppositely disposed at both sides of the semiconductor pair 3, respectively. The first heat conducting unit 1 includes a first heat conducting patch 11 and a first heat conducting electrode 12, the first heat conducting electrode 12 is connected between the N-type semiconductor and the P-type semiconductor of the semiconductor pair 3, and specifically, when the semiconductor pair 3 is powered on, current is conducted from the P-type semiconductor to the electrode of the N-type semiconductor, so as to achieve the heat dissipation function. The second heat conducting unit 2 includes a second heat conducting patch 21 and a second heat conducting electrode 22, the second heat conducting electrode 22 is connected between the N-type semiconductor and the P-type semiconductor of the semiconductor pair 3, and specifically, when the semiconductor pair 3 is powered on, current is conducted from the N-type semiconductor to the electrode of the P-type semiconductor, so as to realize the heat absorption and refrigeration functions.
The first and second heat-conducting electrodes 12 and 22 may be made of a metal conductor or a compound conductor material, and the shape thereof may be a strip, a block, or a film, which is not limited herein.
The first heat conductive patch 11 is connected to the first heat conductive electrode 12 to conduct heat on the first heat conductive electrode 12 to a low temperature region or a region with high heat conductivity for heat dissipation. The second heat conductive patch 21 is connected to the second heat conductive electrode 22 to absorb and cool heat in the high temperature region through the second heat conductive electrode 22.
As shown in fig. 1 and 2, the dimension of the second heat conductive patch 21 in the first direction 101 is smaller than or equal to the dimension of the first heat conductive patch 11 in the first direction 101, wherein the first direction 101 is the thickness direction of the second heat conductive patch 21, i.e., the vertical direction in fig. 1 and 2. The size of the heat dissipation area can be increased by setting the size of the first heat conducting patch 11 in the first direction 101 to be larger, and the heat dissipation efficiency is further improved.
Further, the size of first heat-conducting patch 11 in second direction 102 may also be set smaller than the size of second heat-conducting patch 21 in second direction 102, where second direction 102 is the thickness direction of first heat-conducting patch 11, i.e., the horizontal direction in fig. 2. The size of the heat absorbing region can be increased by setting the size of the second heat conductive patch 21 in the second direction 102 to be larger, and the heat transfer efficiency is further improved.
Moreover, the size of the first heat conducting patch 11 in the first direction 101 is large, and the size of the second heat conducting patch 21 in the second direction 102 is large, so that the conventional arrangement of the backboard and the circuit board in the display module needing cooling can be better applicable, and the heat conducting efficiency is ensured on the basis of not additionally increasing the size of the display module.
The first heat conducting patch 11 and the second heat conducting patch 21 are heat conducting materials. In an alternative embodiment, the first heat conducting patch 11 and the second heat conducting patch 21 may be both insulators, so as to avoid introducing electrical interference to the product to be cooled while cooling. For example, the first heat conduction patch 11 and the second heat conduction patch 21 may be made of: and insulating materials having good heat resistance, such as polyamide resin, polyamide-imide resin, polyimide resin, and epoxy resin.
The shapes of the first heat conducting patch 11 and the second heat conducting patch 21 can be customized according to the shape and size of a product to be cooled, so that the layout requirements in different products can be met. It is better, can set up first heat conduction paster 11 and second heat conduction paster 21 and be the lamellar structure to increase and wait to dispel the heat the area of contact of product when guaranteeing less volume, thereby improve heat absorption and radiating efficiency.
In an alternative embodiment, as shown in fig. 1 and 2, the power supply scheme for the semiconductor pair 3 in the heat conducting assembly may be that a power supply unit 4 is disposed on the heat conducting assembly, the power supply unit 4 is electrically connected to the semiconductor pair 3 to provide a power supply interface for the semiconductor pair 3, and when the power supply unit 4 is inserted into an external power interface, conduction of the semiconductor pair 3 is achieved; a power supply may also be disposed on the heat conducting assembly to connect with the semiconductor pair 3, and when the power supply is turned on, the semiconductor pair 3 is conducted, which is not limited herein.
Specifically, the power supply unit 4 may be provided on the first heat conductive patch 11 side or on the second heat conductive patch 21 side. It is more excellent, set up power supply unit 4 in second heat conduction paster 21 to the adaptation second heat conduction paster 21 is as the condition of refrigeration heat absorption end, thereby can be convenient through the power of the radiating circuit board of needs to supply power to 3 semiconductor, need not additionally set up the power again.
As shown in fig. 1, the size of the power supply unit 4 in the third direction 103 may be smaller than the size of the second heat conductive patch 21 in the third direction 103, wherein the third direction 103 is a direction in which a longer side of a connection area of the power supply unit 4 and the second heat conductive patch 21 is located, i.e., a horizontal direction in fig. 1. By setting the size of the power supply unit 4 in this direction to be small, the space occupied by the heat conductive member can be reduced.
In an alternative embodiment, in addition to the N-type semiconductor and the P-type semiconductor being arranged in a spaced manner and alternately connected in series by the electrodes as shown in fig. 1, the N-type semiconductor and the P-type semiconductor may be arranged in direct contact and connected in series as shown in fig. 3, the formed PN junction region is used as a heat generating portion and a cooling portion, and the heat generating portion and the cooling portion are respectively connected to the first heat conductive electrode 12 and the second heat conductive electrode 22. The first heat conducting patch 11 and the first heat conducting electrode 12 are integrated into a whole, and the protruding portion is the first heat conducting electrode 12 to conduct heat on the first heat conducting electrode 12 to a low-temperature region or a region with high heat conductivity for heat dissipation. The second heat conducting patch 21 and the second heat conducting electrode 22 are integrated into a whole, and the protruding portion is the second heat conducting electrode 22, so that the heat in the high-temperature area is absorbed and cooled by the second heat conducting electrode 22.
Further, for verifying the radiating effect of the heat conducting component provided by the application, data actually measured by the effect are also provided. The specific test process is that the heat conduction assembly is adopted to carry out heat dissipation test on the object needing to be cooled. According to the test, the initial temperature of the object to be cooled is 27.8 ℃, and after the heat conduction assembly comprising 10 pairs of P-type semiconductors and N-type semiconductors carries out heat dissipation for 2 hours, the temperature of the object to be cooled is reduced to 14.8 ℃ and tends to be stable, and is reduced by 13 ℃ altogether. It is thus clear that the heat-conducting component radiating effect that this application provided is showing.
Based on the same inventive concept, an embodiment of the present application further provides a display module, as shown in fig. 4, which is a structural diagram of the display module 400 in the embodiment of the present application, including: the thermally conductive assembly 100 is provided as previously described.
The display module 400 may further include: the heat conducting assembly 100 is connected with the metal back plate 401 through the first heat conducting patch 11, and is connected with the circuit board 402 through the second heat conducting patch 21. The power supply unit 4 of the heat conductive assembly 100 is in contact with the circuit board 401 to achieve electrical connection.
It should be noted that the display module 400 may be installed in an electronic device such as a television, a notebook, a mobile phone, or a vehicle-mounted touch screen, and is not limited herein.
Considering that the circuit board 402 often has a region with serious heat generation because more components are often integrated on the circuit board 402, the second thermal patch 21 of the thermal conductive assembly 100 is connected to and mounted on the circuit board 402 to absorb the heat generated by the circuit board 402. The metal back plate 401 does not generate heat and the metal back plate 401 has a strong heat dissipation characteristic, so the first heat conducting patches 11 of the heat conducting assembly 100 are connected and mounted on the metal back plate 401, so that the absorbed and converted heat is partially dissipated to the air through the first heat conducting patches 11, and partially is conducted to the metal back plate 401 for heat dissipation.
Further, the first heat conducting patch 11 may be attached to the metal back plate 401 through a heat dissipation tape, and the heat dissipation tape may play a role of fixing the heat conducting assembly 100 on one hand, and may accelerate heat conduction of a part of heat to the metal back plate 401 for dissipation on the other hand. Further, as shown in fig. 4, the second heat conductive patch 21 may be mounted to the circuit board 402 through the power supply unit 4, so that the circuit board 402 supplies power to the semiconductor pair 3 of the heat conductive assembly 100 through the power supply unit 4.
The display module 400 may further include: the projection of the display panel, the heat conducting assembly 100 and the display panel on the plane of the metal back plate 401 is at least partially overlapped, so as to improve the heat dissipation efficiency.
Of course, in the display module 400, the installation position of the heat conducting assembly 100 is not limited to the above-mentioned scheme, and the heat conducting assembly 100 may be installed in another serious heat generating region determined by thermal simulation, which is not limited herein. Moreover, the number of the heat conducting assemblies 100 in the display module 400 may be one or more, and is specifically set according to the heat dissipation requirement of the display module 400, which is not limited herein. Since the heat conducting element 100 of the display module 400 provided in the present embodiment has been described in detail above, it is not repeated here, as long as the display module including the heat conducting element 100 is within the scope of the present application.
Based on the same inventive concept, an embodiment of the present application further provides an electronic device, as shown in fig. 5, which is a structural diagram of an electronic device 500 in the embodiment of the present application, and includes: the display module 400 provided by the embodiment of the present application.
Since the display module 400 of the electronic device 500 of the present embodiment has been described in detail above, it is not repeated here, as long as the electronic device including the display module 400 is within the scope of the present application.
The technical scheme provided in the embodiment of the application at least has the following technical effects or advantages:
the embodiment of the application provides a heat conduction assembly, display module assembly and electronic equipment, set up at least one semiconductor between first heat conduction unit and second heat conduction unit to it is connected with first heat conduction paster to set up the semiconductor, be connected with second heat conduction paster through first heat conduction electrode, the thermocouple structure has been formed, the ingenious Peltier effect that utilizes the thermocouple, thereby can absorb the heat of treating the cooling region through a heat conduction paster, give off the heat through another heat conduction paster, and then can realize more efficient heat conduction, and the radiating efficiency is improved. And, still set up the size that second heat conduction paster is less than or equal to first heat conduction paster in the size of the first direction that its thickness corresponds, increased the suitability of heat conduction subassembly with the display module assembly.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the application, various features of the application are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be interpreted as reflecting an intention that: this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this application.
Those skilled in the art will appreciate that the modules in the apparatus of an embodiment may be adaptively changed and disposed in one or more apparatuses other than the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Moreover, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the following claims, any of the claimed embodiments may be used in any combination.
It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110276338.XA CN113347819A (en) | 2021-03-15 | 2021-03-15 | Heat conduction assembly, display module and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115274762A (en) * | 2022-08-11 | 2022-11-01 | 赫曼半导体技术(深圳)有限公司 | Display substrate, display module and display device |
| CN115513363A (en) * | 2022-10-09 | 2022-12-23 | 上海天马微电子有限公司 | Display module and display device |
| CN119255580A (en) * | 2024-12-06 | 2025-01-03 | 杭州云动智能汽车技术有限公司 | Communication module heat dissipation device and heat dissipation method, electronic equipment and storage medium |
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| CN215872078U (en) * | 2021-03-15 | 2022-02-18 | 京东方科技集团股份有限公司 | A thermally conductive component, display module and electronic equipment |
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| KR20160005588A (en) * | 2014-07-07 | 2016-01-15 | 삼성전기주식회사 | temperature sensor |
| CN206076197U (en) * | 2016-09-29 | 2017-04-05 | 昆山工研院新型平板显示技术中心有限公司 | Vacuum chamber attemperating unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115274762A (en) * | 2022-08-11 | 2022-11-01 | 赫曼半导体技术(深圳)有限公司 | Display substrate, display module and display device |
| CN115513363A (en) * | 2022-10-09 | 2022-12-23 | 上海天马微电子有限公司 | Display module and display device |
| CN119255580A (en) * | 2024-12-06 | 2025-01-03 | 杭州云动智能汽车技术有限公司 | Communication module heat dissipation device and heat dissipation method, electronic equipment and storage medium |
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