CN113333261B - A high frequency array transducer - Google Patents

Abstract

The invention provides an array transducer, which comprises an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a back lining layer which are sequentially arranged, wherein the first flexible circuit board assembly and the second flexible circuit board assembly respectively comprise at least one flexible circuit board; the first flexible circuit board assembly is arranged on the first electrode surface, a plurality of first electrode lead units are led out of the first flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same first electrode lead unit; the second flexible circuit board assembly is arranged on the second electrode surface, a plurality of second electrode lead units are led out of the second flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same second electrode lead unit.

Description

A high frequency array transducer

technical field

The invention relates to the technical field of ultrasonic transducers, in particular to a high-frequency array transducer.

Background technique

Ultrasound imaging technology is an important means of diagnosing diseases through medical imaging. It mainly transmits ultrasonic waves into the human body through the ultrasonic transducer, and performs linear, sectoral or other forms of scanning. When encountering the interface of two tissues with different acoustic impedances, the ultrasonic waves will be reflected back and received by the transducer. Processed, displayed on the screen, to form a tomographic image of the human body, called an ultrasonogram, for clinical diagnosis. Continuous multiple ultrasound images are displayed on the screen, and dynamic organ activity can be observed. Due to the difference in the depth of the interface between the organs and tissues in the body, the echoes are received in the past and after, so that the depth of the interface and the shape and size of the organs can be measured. High-frequency array ultrasound has important applications in high-resolution imaging diagnosis.

The array ultrasonic transducer mainly uses a flexible circuit board to draw out the array elements of the transducer. In order to prevent side lobes during ultrasonic imaging, the spacing of the array transducers is generally less than one wavelength. The higher the frequency, the smaller the spacing. , the smaller the array element. The wiring technology of high-frequency array transducers has long been the key and difficult technology in transducer fabrication. The commonly used wiring technology in array transducers is to use a flexible circuit board to draw out the array elements on the piezoelectric wafer. However, due to the limitation of the manufacturing process of the flexible circuit board, the size and spacing of the array elements that can be connected are limited.

Specifically, the prior art is affected by the flexible circuit board processing technology. The circuit width (Wf) on the flexible circuit board and the gap (Kf) between the circuits are generally greater than or equal to 50 microns, because the circuit width on the flexible circuit board is less than or equal to The width of the piezoelectric layer array element (We) and the circuit spacing (Pf) of the flexible circuit board are equal to the array element spacing (Pe), so that the array element width on the piezoelectric layer of the transducer must be greater than or equal to 50 microns. The pitch must be greater than or equal to 100 microns. In order to ensure the quality of ultrasonic imaging, the array element spacing of the high-frequency array transducer should be less than or equal to one-half of the ultrasonic wavelength in water, and the array element spacing is 100 microns. The highest phased array can only be produced at 7.5MHz, which cannot meet higher requirements. The fabrication of frequency array transducers requires, and in many ultrasound applications, higher frequency transducers to provide better diagnostic images.

Among them, Wf+Kf=Pf

We+Ke=Pe, where Ke is the element gap.

In order to prepare array transducers with higher frequencies, two methods of connecting conductive lines are mainly proposed in the prior art. However, the method of connecting the pins of the flexible circuit board to the array elements by hollowing out the pins is difficult to achieve in practical applications. , and the method of electrically connecting the corresponding electrodes in the motors arranged in the array to the corresponding electrical connectors based on the additive technology requires the use of a variety of precision equipment, which is difficult and costly to process.

To sum up, the wiring technology commonly used in array transducers is affected by the flexible board processing technology, and the highest frequency transducers that can be prepared cannot meet the needs of practical applications. Although there are proposals to prepare higher frequency arrays in the prior art The method of the transducer is still affected by other processes, and it is difficult to realize in the actual preparation process.

SUMMARY OF THE INVENTION

In view of this, in order to overcome the above-mentioned defects of the prior art, the present invention proposes an array transducer, which can fabricate a higher frequency array transducer without increasing the complexity and difficulty of the process.

The array transducer includes an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a backing layer arranged in sequence, the first flexible circuit board assembly and the The second flexible circuit board assemblies respectively include at least one flexible circuit board, the first electrode surface and the second electrode surface of the piezoelectric layer respectively have electrodes, and each side of the first electrode surface and the second electrode surface The electrodes on the surface are cut so that the piezoelectric layer forms a plurality of piezoelectric array elements;

The first flexible circuit board assembly is arranged on the first electrode surface, the first flexible circuit board assembly leads out a plurality of first electrode lead units, and at least a pair of adjacent piezoelectric array elements are connected to the same one. the first electrode lead unit;

The second flexible circuit board assembly is arranged on the second electrode surface, and the second flexible circuit board assembly leads out a plurality of second electrode lead units, and at least a pair of adjacent piezoelectric array elements are commonly connected to the same one the second electrode lead unit.

每两个相邻的所述压电阵元共同连接一个所述第一电极引线单元；所述第二电极引线单元的数量为

首端和尾端的所述压电阵元各连接一个所述第二电极引线单元，其余N-2个所述压电阵元中，每两个相邻的所述压电阵元共同连接一个所述第二电极引线单元；The piezoelectric layer includes N piezoelectric array elements, and when N is an even number, the number of the first electrode lead units is

Every two adjacent piezoelectric array elements are commonly connected to one of the first electrode lead units; the number of the second electrode lead units is

The piezoelectric array elements at the head end and the tail end are each connected to one of the second electrode lead units, and among the remaining N-2 piezoelectric array elements, each two adjacent piezoelectric array elements are connected to one in common. the second electrode lead unit;

首端或尾端的所述压电阵元连接一个所述第一电极引线单元，其余N-1个所述压电阵元中，每两个相邻的所述压电阵元共同连接一个所述第一电极引线单元；所述第二电极引线单元的数量为

首端或尾端的所述压电阵元连接一个所述第二电极引线单元，其余N-1个所述压电阵元中，每两个相邻的所述压电阵元共同连接一个所述第二电极引线单元。When N is an odd number, the number of the first electrode lead units is

The piezoelectric array elements at the head end or the tail end are connected to one of the first electrode lead units, and among the remaining N-1 piezoelectric array elements, every two adjacent piezoelectric array elements are commonly connected to one of the first electrode lead units. The first electrode lead unit; the number of the second electrode lead unit is

The piezoelectric array elements at the head end or the tail end are connected to one of the second electrode lead units, and among the remaining N-1 piezoelectric array elements, every two adjacent piezoelectric array elements are commonly connected to one of the second electrode lead units. the second electrode lead unit.

Specifically, the first electrode lead units may be distributed on the same side of the first electrode surface, and the second electrode lead units may be distributed on the same side of the second electrode surface; The first electrode lead units are alternately distributed on both sides of the first electrode surface, and the second electrode lead units are alternately distributed on both sides of the second electrode surface to expand the space between adjacent circuits on the flexible board the spacing scheme. Such a flexible board of the same specification can lead out the transducer array elements with smaller array element width and array element gap.

Both sides of the piezoelectric layer are provided with insulating layers, the first electrode surface of the piezoelectric layer extends to cover one surface of the insulating layer, and the second electrode surface of the piezoelectric layer extends to cover the insulating layer. On the other side surface, the electrodes of the first electrode surface and the second electrode surface of each array element are divided by an insulating layer.

The connection between the flexible circuit board assembly and the piezoelectric layer may be that the first flexible circuit board assembly and/or the second flexible circuit board assembly adhere to the insulating layer; and/or the first flexible circuit board assembly The circuit board assembly and/or the second flexible circuit board assembly adheres to the piezoelectric layer. When the matching layer and the backing layer are conductive layers, the first flexible circuit board assembly and/or the second flexible circuit board assembly may also be bonded to the matching layer; and/or, the The first flexible circuit board assembly and/or the second flexible circuit board assembly are bonded to the backing layer, and the applied signal is transmitted to the piezoelectric layer through the conductive layer to achieve electrical connection with the piezoelectric layer.

Preferably, the first flexible circuit board assembly and the second flexible circuit board assembly are electrical connectors, and the electrical connectors include integrated circuits, soft FPC boards and hard FPC boards. The acoustic lens includes a concave lens and a convex lens.

The number of layers of the transducer is not limited, the backing layer is one or more layers; and/or the piezoelectric layer is one or more layers; and/or the matching layer is a layer or layers; and/or, the acoustic lens is one or more layers.

The present invention also provides an ultrasonic system, including the above array transducer, electronic delay and switch, the array transducer includes a plurality of piezoelectric array elements, each of the piezoelectric array elements is connected to one of the electronic delays , the switch is connected between each electronic delay and the piezoelectric array element. Preferably, the electronic delays are of different lengths of time.

The present invention also improves an excitation method for the above-mentioned ultrasonic system. The excitation signal adjusts the excitation sequence and start time of the piezoelectric array elements through the electronic delays with different time lengths, and controls the excitation through the switch. The working and disconnecting states of the signal; the excitation signal drives the piezoelectric array element to work;

The "the excitation signal drives the piezoelectric array element to work" includes:

When the first electrode surfaces of two adjacent piezoelectric array elements are commonly connected to the same first electrode lead unit, and the second electrode surfaces are respectively connected to the two second electrode lead units, Applying excitation to the first electrode lead unit and one of the second electrode lead units, one of the piezoelectric array elements works, and applying excitation to the first electrode lead unit and the other of the second electrode lead units, Another said piezoelectric array element works;

When the first electrode surfaces of two adjacent piezoelectric array elements are respectively connected to two first electrode lead units, and the second electrode surfaces are commonly connected to the same second electrode lead unit, Apply excitation to one of the first electrode lead unit and the second electrode lead unit, one of the piezoelectric array elements works, and apply excitation to the other of the first electrode lead unit and the second electrode lead unit, The other said piezoelectric element works.

To sum up, the array transducer of the present invention, based on the existing transducer wiring technology, adopts the first flexible circuit board assembly and the second flexible circuit board assembly to be staggered on both sides of the piezoelectric layer respectively. The electrical interconnection between the piezoelectric layer and the external circuit is realized by the wiring method drawn from the piezoelectric array element. Applying the transducer wiring method of the present invention, the flexible circuit board of the same specification can lead out the transducer array elements with smaller array element width and array element gap, and can be prepared without increasing the complexity and difficulty of the process. frequency array transducer.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a schematic diagram of an array transducer of the present invention;

2 is a schematic structural diagram of an array transducer of the present invention;

3 is a schematic diagram of a connection method between a piezoelectric layer and a flexible circuit board assembly;

Fig. 4 is the circuit connection schematic diagram of the connection mode shown in Fig. 3;

5 is a schematic diagram of another connection method between the piezoelectric layer and the flexible circuit board assembly;

Fig. 6 is the circuit connection schematic diagram of the connection mode shown in Fig. 5;

FIG. 7 is a schematic diagram of excitation of an ultrasonic system applying the array transducer of the present invention.

Reference number:

1-backing layer; 2-piezoelectric layer; 21-first electrode surface; 22-second electrode surface; 23-piezoelectric array element; 24-array element gap; 3-insulating layer; 4-matching layer; 51 - first flexible circuit board assembly; 511 - first electrode lead unit; 52 - second flexible circuit board assembly; 521 - second electrode lead unit; 6 - acoustic lens; 71 - excitation signal; 72 - electronic delay; 73 - switch; 74 - target organization.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The invention provides an array transducer, which adopts a new wiring method to relieve the restriction of the flexible board processing technology on the preparation of the array transducer, and can prepare a higher frequency array transducer without increasing the complexity and difficulty of the process. .

Referring to FIG. 1 of the description, the array transducer structure of the present invention includes a backing layer 1, a piezoelectric layer 2, an insulating layer 3, a matching layer 4, a first flexible circuit board assembly 51, a second flexible circuit board assembly 52 and an acoustic The lens 6, wherein the acoustic lens 6, the matching layer 4, the first flexible circuit board assembly 51, the piezoelectric layer 2, the second flexible circuit board assembly 52 and the backing layer 1 are stacked in sequence. Specifically, the piezoelectric layer 2 is used to emit ultrasonic waves, and has a first electrode surface 21 arranged on one surface of the piezoelectric layer 2 and a second electrode surface 22 arranged on the other surface of the piezoelectric layer 2. The first electrode surface 21 and the second electrode surface 22 respectively have electrodes, and the electrodes on each side surface of the first electrode surface 21 and the second electrode surface 22 are cut so that the piezoelectric layer 2 forms a plurality of piezoelectric array elements 23, each piezoelectric array The elements 23 respectively have a first electrode located on the first electrode surface 21 and a second electrode located on the second electrode surface 22 , and an array element gap 24 is provided between the piezoelectric array elements 23 . In some embodiments, the array element gaps 24 are filled with an isolation substance. The matching layer 4 serves to match the acoustic impedance between the piezoelectric layer 2 and an external object. The backing layer 1 absorbs the ultrasonic waves emitted in the direction of the backing layer 1 . The acoustic lens 6 focuses the sound field and focuses the sound waves emitted by the piezoelectric layer 2, and can be a convex lens or a concave lens. The backing layer 1, the piezoelectric layer 2, the matching layer 4 and the acoustic lens 6 may all be one or more layers. Preferably, the piezoelectric layer 2 is arranged between the two insulating layers 3, and the electrodes of the piezoelectric layer 2 extend and cover the surface of the insulating layer 3 and share the same electrode with the insulating layer 3, so that the first electrode of each piezoelectric array element 23 The electrodes of the face 21 and the second electrode face 22 are divided.

The flexible circuit board assembly is an electrical connector used to realize the electrical interconnection between the piezoelectric layer 2 and the external circuit, including a plurality of electrode lead units, which can be integrated circuits, soft FPC boards, hard FPC boards, or can realize related electrical connections function of other objects. In the array transducer of the present invention, the piezoelectric array elements 23 are led out on the first electrode surface 21 and the second electrode surface 22 of the piezoelectric layer 2 alternately through the first flexible circuit board assembly 51 and the second flexible circuit board assembly 52, respectively. The first flexible circuit board assembly 51 and the second flexible circuit board assembly 52 respectively include at least one flexible circuit board. The first flexible circuit board assembly 51 is disposed on the first electrode surface 21 , the first flexible circuit board assembly 51 leads out a plurality of first electrode lead units 511 , and at least a pair of adjacent piezoelectric array elements 23 are commonly connected to one first electrode lead unit 511 . Electrode lead unit 511; the second flexible circuit board assembly 52 is arranged on the second electrode surface 22, the second flexible circuit board assembly 52 leads out a plurality of second electrode lead units 521, and at least a pair of adjacent piezoelectric array elements 23 are commonly connected A second electrode lead unit 521. Using the method of the present invention, the flexible circuit board assembly of the same specification can connect the piezoelectric array elements 23 with smaller spacing and width, thereby increasing the frequency of the transducers that can be prepared. The flexible circuit board assembly can be directly bonded to the surface of the piezoelectric layer 2; it can also be bonded to the surface of the insulating layer 3 that shares the electrode with the piezoelectric layer 2. Compared with the flexible circuit board assembly, the formed transducer is directly bonded. The performance of the transducer connected to the surface of the piezoelectric layer 2 is better. In some embodiments, the matching layer 4 and the backing layer 1 are conductive layers or contain conductive elements, and the flexible circuit board assembly can also be bonded on the matching layer 4 and/or the backing layer 1, and the applied signal passes through the conductive layer Transmission to the piezoelectric layer 2 achieves electrical connection with the piezoelectric layer 2 .

Example 1

This embodiment provides a specific connection structure between the flexible circuit board assembly and the piezoelectric layer 2 . Referring to FIG. 2 of the description, the piezoelectric layer 2 is disposed between the two insulating layers 3 , and each piezoelectric array element 23 has a first electrode located on the first electrode surface 21 and a second electrode located on the second electrode surface 22 respectively. Electrodes, the first electrode surface 21 on the piezoelectric layer 2 extends to cover one side surface of the insulating layer 3 , the second electrode surface 22 extends to cover the other side surface of the insulating layer 3 , and shares an electrode with the insulating layer 3 . In this embodiment, the flexible circuit board assembly includes a first flexible circuit board assembly 51 and a second flexible circuit board assembly 52 , and the flexible circuit board assembly is bonded on the insulating layer 3 .

It can be that the first flexible circuit board assembly 51 is bonded on the upper surface of the left insulating layer 3 to connect to the first electrode of the piezoelectric layer 2, and the second flexible circuit board assembly 52 is bonded on the lower surface of the right insulating layer 3. The second electrode of the piezoelectric layer 2 is connected. Alternatively, the first flexible circuit board assembly 51 is bonded on the upper surface of the right insulating layer 3 to connect to the first electrode of the piezoelectric layer 2 , and the second flexible circuit board assembly 52 is bonded on the lower surface of the left insulating layer 3 . The second electrode of the piezoelectric layer 2 is connected. Alternatively, the first flexible circuit board assembly 51 is bonded on the upper surface of the left insulating layer 3 to connect to the first electrode of the piezoelectric layer 2 , and the second flexible circuit board assembly 52 is bonded on the lower surface of the left insulating layer 3 . The second electrode of the piezoelectric layer 2 is connected. It can also be that the first flexible circuit board assembly 51 is bonded to the upper surface of the right insulating layer 3 to connect to the first electrode of the piezoelectric layer 2, and the second flexible circuit board assembly 52 is bonded to the lower surface of the right insulating layer 3. The second electrode of the piezoelectric layer 2 is connected thereon.

In this embodiment, the first flexible circuit board assembly 51 leads out a plurality of first electrode lead units 511 , the first flexible circuit board assembly 51 is bonded to the upper surface of the left insulating layer 3 , and the first electrode lead units 511 are connected to the piezoelectric The first electrodes of layer 2 are electrically connected; the second flexible circuit board assembly 52 leads out a plurality of second electrode lead units 521, the second flexible circuit board assembly 52 is bonded to the lower surface of the right insulating layer 3, and the second electrode lead units 521 It is electrically connected to the second electrode of the piezoelectric layer 2 .

每两个相邻的压电阵元23共同连接一个第一电极引线单元511；第二电极引线单元521的数量为

首端和尾端的压电阵元23各连接一个第二电极引线单元521，其余N-2个压电阵元23中，每两个相邻的压电阵元23共同连接一个第二电极引线单元521；There is a certain quantitative relationship between the piezoelectric array elements 23 of the piezoelectric layer 2 and the electrode lead units. Specifically, the piezoelectric layer 2 is set to include N piezoelectric array elements 23. When N is an even number, the first electrode lead The number of cells 511 is

Every two adjacent piezoelectric array elements 23 are commonly connected to a first electrode lead unit 511; the number of second electrode lead units 521 is

The piezoelectric array elements 23 at the head end and the tail end are each connected to a second electrode lead unit 521, and among the remaining N-2 piezoelectric array elements 23, every two adjacent piezoelectric array elements 23 are connected to a second electrode lead in common. unit 521;

首端或尾端的压电阵元23连接一个第一电极引线单元511，其余N-1个压电阵元23中，每两个相邻的压电阵元23共同连接一个第一电极引线单元511；第二电极引线单元521的数量为

首端或尾端的压电阵元23连接一个第二电极引线单元521，其余N-1个压电阵元23中，每两个相邻的压电阵元23共同连接一个第二电极引线单元521。When N is an odd number, the number of the first electrode lead units 511 is

The piezoelectric array element 23 at the head end or the tail end is connected to a first electrode lead unit 511, and among the remaining N-1 piezoelectric array elements 23, every two adjacent piezoelectric array elements 23 are jointly connected to a first electrode lead unit. 511; the number of the second electrode lead unit 521 is

The piezoelectric array element 23 at the head end or the tail end is connected to a second electrode lead unit 521, and among the remaining N-1 piezoelectric array elements 23, every two adjacent piezoelectric array elements 23 are connected to a second electrode lead unit. 521.

Example 2

This embodiment provides a circuit connection method of an array transducer applying the wiring method of the present invention. Referring to FIGS. 3-6 , the piezoelectric array elements 23 are staggered on the upper and lower sides of the piezoelectric layer 2 through the flexible circuit board assembly, and the electrode lead units are placed at intervals. Specifically, any two electrode lead units are not on the same straight line. By placing the first electrode lead unit 511 on the same side on the first electrode face 21 and the second electrode lead unit 521 on the same side on the second electrode face 22, the first electrode lead unit 511 and the second electrode lead unit 511 The units 521 are arranged on opposite sides to expand the spacing between adjacent electrode lead units on the flexible circuit board assembly; the first electrode lead units 511 can also be alternately arranged on both sides of the first electrode surface 21, and the second The electrode lead units 521 are alternately arranged on both sides of the second electrode surface 22 .

Specifically, referring to FIGS. 3 and 4 , for a specific example, the first electrode lead unit 511 is placed on the same side on the first electrode surface 21 , and the second electrode lead unit 521 is placed on the same side on the second electrode surface 22 . , the first electrode lead unit 511 and the second electrode lead unit 521 are arranged on opposite sides to expand the space between adjacent electrode lead units on the flexible circuit board assembly. As shown in the figure, the piezoelectric array elements 23 are numbered from left to right as PE1, PE2, PE3, PE4... The first electrode lead units 511 are numbered from left to right as UF1, UF2... The second electrode lead Units 521 are sequentially numbered DF1, DF2...wherein UF1 is connected to the first electrodes of PE1 and PE2, UF2 is connected to the first electrodes of PE3 and PE4; DF1 is connected to the second electrode of PE1, and DF2 is connected to the second electrodes of PE2 and PE3 Electrode connection; UF1, UF2 and DF1, DF2 are set on the opposite side. When UF1 and DF1 are excited, PE1 works; when UF1 and DF2 are excited, PE2 works; when UF2 and DF2 are excited, PE3 works... In this way, the width of the electrode lead unit satisfies less than twice the piezoelectric array element 23 The width of the element plus the array element gap 24 (2We+Ke), and the spacing of the electrode lead units is twice the spacing of the piezoelectric array element 23 (2Pe), the piezoelectric array element 23 of the transducer can be effectively led out. Such a flexible circuit board assembly of the same specification can lead out the piezoelectric array element 23 of a transducer with a smaller width of the piezoelectric array element 23 and a smaller array element gap 24 .

5 and 6, for a specific example, the first electrode lead units 511 are alternately arranged on both sides of the first electrode surface 21, and the second electrode lead units 521 are alternately arranged on both sides of the second electrode surface 22 to enlarge Scheme for spacing between adjacent electrode lead units on a flexible circuit board assembly. As shown in the figure, the piezoelectric array elements 23 are sequentially numbered as PE01, PE02, PE03, PE04 from left to right... The first electrode lead unit 511 is sequentially numbered as UF01, UF02, UF03, UF04... The second electrode lead The units 521 are sequentially numbered DF01, DF02, DF03, DF04...wherein UF01 is connected to the first electrodes of PE01 and PE02, UF02 is connected to the first electrodes of PE03 and PE04, UF03 is connected to the first electrodes of PE05 and PE06; DF01 is connected to the first electrodes of PE03 and PE04. The second electrode of PE01 is connected, DF02 is connected to the second electrodes of PE02 and PE03, DF03 is connected to the second electrodes of PE04 and PE05; DF03 and UF03 are arranged on opposite sides of DF02 and UF02. When DF01 and UF01 are excited, PE01 works; when UF01 and DF02 are excited, PE02 works; when DF02 and UF02 are excited, PE03 works; when UF02 and DF03 are excited, PE04 works... Relatively In the solution shown in FIG. 3 , the distance between adjacent electrode lead units on the flexible circuit board assembly can be further enlarged.

Example 3

Referring to FIG. 7 of the description, it is a schematic diagram of excitation of an ultrasonic system applying the array transducer of the present invention. Taking the array of 8 piezoelectric array elements 23 as an example in the figure, the excitation signal 71 adjusts the sequence and start time of excitation through electronic delays 72 with different time lengths, and controls the working and disconnecting states of the excitation signal 71 through the electronic switch 73, Next, the excitation signal 71 drives the piezoelectric array element 23 of the transducer to work: the piezoelectric array element 23 emits ultrasonic waves to form a focus at the target tissue 74; the ultrasonic echo reflected by the tissue is received by the piezoelectric array element 23 of the transducer, converted into After it is an electrical signal, it is processed to form an ultrasound image.

The excitation signal 71 driving the piezoelectric array element 23 of the transducer to work includes: when the first electrode surfaces 21 of two adjacent piezoelectric array elements 23 are connected to the same first electrode lead unit 511, the second electrode surface 22 When two second electrode lead units 521 are respectively connected, excitation is applied to the first electrode lead unit 511 and one second electrode lead unit 521, one piezoelectric array element 23 works, and the first electrode lead unit 511 and the other second electrode lead unit 521 are excited. The two-electrode lead unit 521 applies excitation, and the other piezoelectric array element 23 works;

When the first electrode surfaces 21 of two adjacent piezoelectric array elements 23 are respectively connected to two first electrode lead units 511, and the second electrode surfaces 22 are connected to the same second electrode lead unit 521, one first electrode When excitation is applied to the lead unit 511 and the second electrode lead unit 521, one piezoelectric array element 23 works, and excitation is applied to the other first electrode lead unit 511 and the second electrode lead unit 521, and the other piezoelectric array element 23 works.

To sum up, the present invention provides an array transducer, which is based on the existing transducer wiring technology and adopts the first flexible circuit board assembly and the second flexible circuit board assembly on two sides of the piezoelectric layer, respectively. The wiring method of the piezoelectric array elements is staggered on the side surface to realize the electrical interconnection between the piezoelectric layer and the external circuit, which is easy to realize, relieves the restriction of the flexible circuit board processing technology on the preparation of the array transducer, and can not increase the complexity of the process. and difficulty in fabricating higher frequency array transducers.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. In addition to the above embodiments, there can also be different modifications. The technical features of the above embodiments can be combined with each other. Within the scope of the present invention, any modifications, equivalent replacements, improvements, etc. made should be included within the protection scope of the present invention.

Claims (11)

1. an array transducer, is characterized in that, comprises acoustic lens, matching layer, first flexible circuit board assembly, piezoelectric layer, second flexible circuit board assembly and backing layer arranged in sequence, described first flexible circuit board assembly The circuit board assembly and the second flexible circuit board assembly respectively include at least one flexible circuit board, the first electrode surface and the second electrode surface of the piezoelectric layer respectively have electrodes, and the first electrode surface and the second electrode surface respectively have electrodes. The electrodes on each side surface of the two electrode surfaces are cut so that the piezoelectric layer forms a plurality of piezoelectric array elements; The first flexible circuit board assembly is arranged on the first electrode surface, the first flexible circuit board assembly leads out a plurality of first electrode lead units, and at least a pair of adjacent piezoelectric array elements are connected to the same one. the first electrode lead unit; The second flexible circuit board assembly is arranged on the second electrode surface, and the second flexible circuit board assembly leads out a plurality of second electrode lead units, and at least a pair of adjacent piezoelectric array elements are commonly connected to the same one the second electrode lead unit. 2 . The array transducer according to claim 1 , wherein the piezoelectric layer comprises N piezoelectric array elements, and when N is an even number, the number of the first electrode lead units is 2 .

Every two adjacent piezoelectric array elements are commonly connected to one of the first electrode lead units; the number of the second electrode lead units is

The piezoelectric array elements at the head end and the tail end are each connected to one of the second electrode lead units, and among the remaining N-2 piezoelectric array elements, each two adjacent piezoelectric array elements are connected to one in common. the second electrode lead unit; When N is an odd number, the number of the first electrode lead units is

The piezoelectric array elements at the head end or the tail end are connected to one of the first electrode lead units, and among the remaining N-1 piezoelectric array elements, every two adjacent piezoelectric array elements are commonly connected to one of the first electrode lead units. The first electrode lead unit; the number of the second electrode lead unit is

The piezoelectric array elements at the head end or the tail end are connected to one of the second electrode lead units, and among the remaining N-1 piezoelectric array elements, every two adjacent piezoelectric array elements are commonly connected to one of the second electrode lead units. the second electrode lead unit. 3 . The array transducer according to claim 1 , wherein the first electrode lead units are distributed on the same side of the first electrode surface, and the second electrode lead units are distributed on the first electrode surface. 4 . The same side of the two electrode surfaces; Alternatively, the first electrode lead units are alternately distributed on both sides of the first electrode surface, and the second electrode lead units are alternately distributed on both sides of the second electrode surface. 4 . The array transducer according to claim 1 , wherein insulating layers are provided on both sides of the piezoelectric layer, and the first electrode surface of the piezoelectric layer extends to cover one surface of the insulating layer. 5 . , the second electrode surface of the piezoelectric layer extends to cover the other side surface of the insulating layer. 5. The array transducer according to claim 4, wherein the first flexible circuit board assembly and/or the second flexible circuit board assembly are bonded to the insulating layer; And/or, the first flexible circuit board assembly and/or the second flexible circuit board assembly are bonded to the piezoelectric layer. 6. The array transducer according to claim 1 or 4, wherein the matching layer and the backing layer are conductive layers, the first flexible circuit board assembly and/or the second flexible The circuit board assembly bonds the matching layer; And/or, the first flexible circuit board assembly and/or the second flexible circuit board assembly adhere to the backing layer. 7 . The array transducer according to claim 1 , wherein the first flexible circuit board assembly and the second flexible circuit board assembly are electrical connectors, and the electrical connectors include integrated circuits, flexible FPC board and hard FPC board. 8. The array transducer of claim 1, wherein the acoustic lens comprises a concave lens and a convex lens. 9. The array transducer according to claim 1, wherein the backing layer is one or more layers; And/or, the piezoelectric layer is one or more layers; And/or, the matching layer is one or more layers; And/or, the acoustic lens is one or more layers. 10. An ultrasonic system, characterized by comprising the array transducer, electronic delay and switch according to any one of claims 1-9, the array transducer comprising a plurality of piezoelectric array elements, each of which The piezoelectric array element is connected to one of the electronic delays, and the switch is connected between each of the electronic delays and the piezoelectric array element. 11. An excitation method for an ultrasonic system according to claim 10, wherein the excitation signal adjusts the excitation sequence and start time of the piezoelectric array elements through the electronic delays with different time lengths, and passes the electronic delays with different time lengths. The switch controls the working and disconnecting states of the excitation signal; then the excitation signal drives the piezoelectric array element to work; The "the excitation signal drives the piezoelectric array element to work" includes: When the first electrode surfaces of two adjacent piezoelectric array elements are commonly connected to the same first electrode lead unit, and the second electrode surfaces are respectively connected to the two second electrode lead units, Applying excitation to the first electrode lead unit and one of the second electrode lead units, one of the piezoelectric array elements works, and applying excitation to the first electrode lead unit and the other of the second electrode lead units, Another said piezoelectric array element works; When the first electrode surfaces of two adjacent piezoelectric array elements are respectively connected to two first electrode lead units, and the second electrode surfaces are commonly connected to the same second electrode lead unit, Apply excitation to one of the first electrode lead unit and the second electrode lead unit, one of the piezoelectric array elements works, and apply excitation to the other of the first electrode lead unit and the second electrode lead unit, The other said piezoelectric element works.

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