CN113301784B - Heat sink device - Google Patents

Abstract

The embodiment of the present application provides a heat dissipation device. The heat dissipation device includes: a housing, an air duct is provided in the housing, the air duct has a first air inlet and a first air outlet, a clamping part is provided on the housing, and the electronic equipment is suitable for being detachably mounted on the clamping part. When the electronic device is installed on the clamping part, the first air outlet faces the electronic device; the first heat conduction member is installed on the housing, and when the electronic device is installed on the clamping part, the first heat conduction The component is adjacent to the electronic equipment; the first heat dissipation fan is installed on the casing, and the first heat dissipation fan is located at the first air inlet, and the heat dissipation fan is used to accelerate the airflow in the air duct; the second heat dissipation fan is used for the second heat dissipation The fan is installed on the side of the first heat conduction element away from the electronic equipment, and the second heat dissipation fan is used to dissipate heat for the first heat conduction element.

Description

heat sink

technical field

The present application relates to the technical field of electronic equipment, in particular to a heat dissipation device.

Background technique

With the advancement of science and technology, the functions of electronic equipment are becoming more and more complete. Through electronic equipment, radio frequency can be viewed, images can be taken, etc. However, in the process of using the electronic equipment, the electronic equipment will generate heat, if the heat generated by the electronic equipment is not dissipated in time, the electronic equipment may be shut down and affect the use of the user. Usually, the heat generated by the electronic equipment is dissipated by installing the heat dissipation device on the electronic equipment, but in the related art, the heat dissipation efficiency of the heat dissipation device for the electronic equipment is low.

application content

An embodiment of the present application provides a heat dissipation device to solve the problem of low heat dissipation efficiency of the heat dissipation device for electronic equipment in the related art.

In order to solve the above-mentioned technical problems, the application is implemented as follows:

An embodiment of the present application provides a heat dissipation device, including:

A housing, the housing is provided with an air duct, the air duct has a first air inlet and a first air outlet, the housing is provided with a clamping part, and the electronic device is suitable for being detachably mounted on the housing. In the clamping part, when the electronic device is installed in the clamping part, the first air outlet faces the electronic device;

A first heat conduction member, the first heat conduction member is installed on the housing, and when the electronic device is installed on the clamping portion, the first heat conduction member is adjacent to the electronic device;

A first heat dissipation fan, the first heat dissipation fan is installed on the housing, and the first heat dissipation fan is located at the first air inlet, and the heat dissipation fan is used to accelerate the airflow in the air duct;

A second heat dissipation fan, the second heat dissipation fan is installed on a side of the first heat conduction element away from the electronic device, and the second heat dissipation fan is used for dissipating heat from the first heat conduction element.

In the embodiment of the present application, by providing an air duct in the housing, a first heat dissipation fan is provided on the housing, and the first heat dissipation fan is located at the first air inlet of the air duct and the second air outlet faces the electronic equipment, so that the electronic equipment generates After the heat is transferred to the housing, the heat can be dissipated from the second air outlet as soon as possible through the first cooling fan. By arranging the first heat conduction member and the second heat dissipation fan on the housing, after the heat generated by the electronic device is transferred into the housing, the heat can be transferred to the second heat dissipation fan through the first heat conduction member, so that the heat can pass through The second cooling fan dissipates. That is, after the heat generated by the electronic device is transferred to the casing, the heat can be dissipated as soon as possible through two paths, so that the heat dissipation efficiency for the heat dissipation of the electronic device is improved. In addition, the first air outlet faces the electronic device, so that the airflow from the first air outlet can cool down the surface of the electronic device, further improving the heat dissipation efficiency for the electronic device. That is, in the embodiment of the present application, after the heat of the electronic device is transferred to the casing, the heat can be dissipated as soon as possible through two paths. In addition, the surface of the electronic device can also be dissipated to improve the heat dissipation efficiency of the electronic device. .

Description of drawings

FIG. 1 shows a schematic diagram of a heat dissipation device provided in an embodiment of the present application;

FIG. 2 shows a schematic diagram of a second heat dissipation fan provided in an embodiment of the present application installed on a radiator;

Fig. 3 shows a schematic diagram of a protective case provided by an embodiment of the present application;

Fig. 4 shows a schematic diagram of a first heat conduction member provided in an embodiment of the present application installed on a radiator;

Fig. 5 shows a top view of a heat conduction block provided by an embodiment of the present application;

FIG. 6 shows a top view of a thermal pad provided by an embodiment of the present application.

Reference signs:

10: shell; 20: first heat conduction member; 30: first cooling fan; 40: second cooling fan; 50: control circuit; 60: radiator; 70: protective shell; 11: air duct; 12: clamping 13: heat conduction block; 14: heat conduction pad; 61: heat dissipation substrate; 62: heat dissipation column; 71: second air inlet; 72: second air outlet; 111: first air duct; 112: first air duct; 100: Electronic equipment.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

It should be understood that reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present application. Thus, appearances of "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to FIG. 1 , it shows a schematic diagram of a heat dissipation device provided by an embodiment of the present application. Referring to FIG. 2 , it shows a schematic diagram of a second heat dissipation fan provided by an embodiment of the present application installed on a radiator. Referring to FIG. 3 , It shows a schematic diagram of a protective case provided by the embodiment of the present application. Referring to FIG. 4 , it shows a schematic diagram of a first heat conduction member provided by the embodiment of the present application installed on a radiator. Referring to FIG. 5 , it shows the The top view of a heat conduction block provided by the embodiment of the application, referring to FIG. 6 , shows the top view of a heat conduction pad provided by the embodiment of the application. As shown in FIGS. 1 to 6 , the heat dissipation device includes: a housing 10, The housing 10 is provided with an air duct 11, the air duct 11 has a first air inlet and a first air outlet, the housing 10 is provided with a clamping portion 12, and the electronic device 100 is suitable for being detachably mounted on the clamping portion 12, When the electronic device 100 is installed on the holding portion 12 , the first air outlet faces the electronic device 100 .

The first heat conduction member 20 is mounted on the casing 10 , and is adjacent to the electronic device 100 when the electronic device 100 is installed on the holding portion 12 . The first cooling fan 30 , the first cooling fan 30 is installed on the casing 10 , and the first cooling fan 30 is located at the first air inlet, and the cooling fan is used to accelerate the airflow in the air duct 11 . The second heat dissipation fan 40 , the second heat dissipation fan 40 is installed on the side of the first heat conduction member 20 away from the electronic device 100 , and the second heat dissipation fan 40 is used for dissipating heat from the first heat conduction member 20 .

In the embodiment of the present application, since the first heat conduction member 20 is installed on the casing 10, when the electronic device 100 is installed on the clamping portion 12, the first heat conduction member 20 is adjacent to the electronic device 100, therefore, the electronic device 100 produces After the heat is transferred into the housing 10 , the heat can be transferred to the first heat conducting member 20 . Since the second heat dissipation fan 40 is installed on the side of the first heat conduction member 20 away from the electronic device 100, after the heat generated by the electronic device 100 is transferred to the first heat conduction member 20, the second heat dissipation fan 40 can operate as the first heat conduction member 20. The component 20 dissipates heat, so that the heat transferred to the first heat conducting component 20 can be dissipated as soon as possible. Since the housing 10 is provided with an air duct 11 and the housing 10 is provided with a clamping portion 12, when the electronic device 100 is mounted on the clamping portion 12, the first air outlet faces the electronic device 100, and the first cooling fan 30 Installed on the casing 10, and the first cooling fan 30 is located at the first air inlet, therefore, after the heat generated by the electronic device 100 is transferred to the casing 10, the first cooling fan 30 can run and transfer to the air duct 11 The wind force can accelerate the air flow in the air duct 11, so that the air flow velocity in the air duct 11 is accelerated, and the air flow in the air duct 11 can take the heat in the housing 10 out from the second air outlet 72, so that the housing 10 Dissipate the heat as quickly as possible. In addition, since the second air outlet 72 faces the electronic device 100 , after the airflow in the air duct 11 flows out from the second air outlet 72 , the airflow can also flow to the surface of the electronic device 100 , so that the airflow of the electronic device 100 can be Surface heat dissipation.

That is, in the embodiment of the present application, by setting the air duct 11 in the housing 10, the first cooling fan 30 is arranged on the housing 10, and the first cooling fan 30 is located at the first air inlet of the air duct 11 and the second The air outlet 72 faces the electronic device 100 , so that after the heat generated by the electronic device 100 is transferred into the casing 10 , the heat can be dissipated from the second air outlet 72 as soon as possible by the first cooling fan 30 . By arranging the first heat conduction member 20 and the second heat dissipation fan 40 on the housing 10, after the heat generated by the electronic device 100 is transferred into the housing 10, the heat can be transferred to the second heat dissipation fan through the first heat conduction member 20 40, so that the heat can be dissipated by the second cooling fan 40. That is, after the heat generated by the electronic device 100 is transferred to the housing 10 , the heat can be dissipated as soon as possible through two paths, so that the heat dissipation efficiency of the electronic device 100 is improved. In addition, the first air outlet faces the electronic device 100 , so that the airflow from the first air outlet can cool down the surface of the electronic device 100 , further improving the heat dissipation efficiency of the electronic device 100 . That is, in the embodiment of the present application, after the heat of the electronic device 100 is transferred to the housing 10, the heat can be dissipated as soon as possible through two paths. In addition, the surface of the electronic device 100 can also be dissipated, so that the electronic device 100 can dissipate heat. The heat dissipation efficiency is improved.

It should be noted that, in the embodiment of the present application, the first heat dissipation fan 30 may be a centrifugal fan, and the second heat dissipation fan 40 may be an axial flow fan. Of course, the first heat dissipation fan 30 and the second heat dissipation fan 40 may also be other types of fans, which is not limited in this embodiment of the present application.

In addition, in the embodiment of the present application, when the electronic device 100 is installed on the clamping part 12, the direction of the first air outlet can be parallel to the surface of the electronic device 100, and at this time, the airflow flowing from the first air outlet can be Flow along the surface of the electronic device 100 to the greatest extent, so that the heat dissipation effect for the surface heat dissipation of the electronic device 100 is better. Of course, the orientation of the first air outlet may also form a certain angle with the surface of the electronic device 100, that is, the orientation of the first air outlet is not parallel to the surface of the electronic device 100, which is not limited in this embodiment of the present application. .

In addition, in the embodiment of the present application, as shown in FIG. 1 and FIG. 4 , the first heat conduction member 20 may be a semiconductor refrigerator, the first heat conduction member 20 includes a cold end and a hot end, the cold end is adjacent to the electronic device 100, and the heat dissipation device It may also include: a control circuit 50 , the control circuit 50 is electrically connected to the first heat conduction member 20 , and the control circuit 50 controls the first heat conduction member 20 to be powered on and off.

Since the first heat conduction element 20 is a semiconductor refrigerator, and the first heat conduction element 20 includes a cold end and a hot end, and the cold end is adjacent to the electronic device 100, when the heat generated by the electronic device 100 is transferred to the casing 10, the cold end The heat in the casing 10 can be quickly absorbed and transferred to the hot end. That is, the first heat conduction member 20 can play a role of heat conduction, and transfer heat quickly. Since the control circuit 50 is electrically connected to the first heat conduction member 20, the control circuit 50 can control the first heat conduction member 20 to be powered on or off. When the first heat conduction member 20 is powered on, the cold end of the first heat conduction member 20 starts to absorb heat. , transferring heat to the hot end. When the first heat conduction element 20 is powered off, the cold end of the first heat conduction element 20 stops absorbing heat and stops transferring heat to the hot end. That is to say, by setting the control circuit 50 , it is convenient to control the first heat conducting member 20 to conduct heat transfer.

It should be noted that, in the embodiment of the present application, in order to facilitate setting of the control circuit 50, the control circuit 50 can be integrated on a printed circuit board (Printed Circuit Board, PCB). Of course, the control circuit 50 can also be integrated on a flexible On a flexible printed circuit (FPC), which is not limited in this embodiment of the present application.

In addition, in some embodiments, as shown in FIG. 1 , the heat dissipation device may further include a radiator 60 . The radiator 60 is installed on the side of the first heat conducting member 20 away from the electronic device 100 , and the second cooling fan 40 is installed on the radiator 60 .

Because the heat sink 60 is installed on the side of the first heat conduction member 20 away from the electronic device 100, and the second heat dissipation fan 40 is installed on the heat sink 60, therefore, the first heat conduction member 20 can transfer the heat in the housing 10 to the heat sink. The radiator 60 can quickly dissipate heat, and the second cooling fan 40 can generate airflow to dissipate the heat dissipated by the radiator 60 . That is, by setting the heat sink 60, when the first heat conduction member 20 transfers the heat in the casing 10, that is, the heat generated by the electronic device 100, the heat sink 60 can quickly dissipate the heat transferred by the first heat conduction member 20, and then the second The heat dissipation fan 40 can dissipate heat, further improving the heat dissipation efficiency for the heat dissipation of the electronic device 100 .

In addition, in the embodiment of the present application, as shown in FIG. 2 , the heat sink 60 may include a heat dissipation substrate 61 and a heat dissipation column 62. The heat dissipation substrate 61 has a first surface and a second surface opposite to each other. The first surface of the first heat conducting member 20 and the second surface of the heat dissipation substrate 61 . The second heat conduction member transmits heat to the heat dissipation substrate 61, and then the heat is transmitted to the heat dissipation column 62 through the heat dissipation substrate 61. The heat dissipation column 62 dissipates heat, and the second heat dissipation fan 40 generates airflow, which can quickly take away heat through the airflow, realizing the purpose of electronic equipment 100's heat dissipation.

In addition, in the embodiment of the present application, the number of cooling columns 62 can be multiple, the second cooling fan 40 can be arranged on the second surface, the plurality of cooling columns 62 can be arranged on the second surface, and the plurality of cooling columns 62 Surrounding the second fan, at this time, the heat dissipated by the plurality of heat dissipation columns 62 can be quickly taken away by the airflow generated by the second heat dissipation fan 40 to achieve the effect of rapid heat dissipation.

In addition, in the embodiment of the present application, when the first heat conducting member 20 includes a cold end and a hot end, at this time, the hot end may be connected to the heat dissipation substrate 61 .

In addition, in some embodiments, as shown in FIG. 1 , the air duct 11 may include a first air duct 111 , the first air duct 111 extends along the extension direction of the housing 10 , and the first air outlet is located on one side of the housing 10 .

When the air duct 11 includes the first air duct 111, and the first air duct 111 extends along the extension direction of the casing 10, at this time, when the first cooling fan 30 is running, the airflow generated by the first cooling fan 30 can be as large as possible. The flow along the extension direction of the housing 10 makes the distance of the airflow flowing in the housing 10 longer, so that as much heat as possible in the housing 10 is taken away by the airflow with the flow of the airflow, so that for the electronic After the heat generated by the device 100 is transferred to the casing 10, the heat can be dissipated as much as possible. That is, by arranging the first air duct 111 along the extending direction of the housing 10 , the heat dissipation efficiency in the housing 10 can be made higher.

In addition, in some embodiments, the air duct 11 may further include a second air duct 112 , the second air duct 112 passes through the housing 10 and faces the electronic device 100 , and the first cooling fan 30 is located between the first air duct 111 and the second air duct 112 . Between Road 112.

When the air duct 11 includes the second air duct 112, the second air duct 112 passes through the housing 10 and faces the electronic device 100, and the first cooling fan 30 is located between the first air duct 111 and the second air duct 112, at this time, When the heat generated by the electronic device 100 is transferred to the casing 10, the airflow generated by the first cooling fan 30 can flow through the first air channel 111 and the second air channel 112, so that the first air channel 111 and the second air channel 112 All the airflow takes away the heat in the casing 10, so that the heat dissipation efficiency for the heat dissipation in the casing 10 is further improved. That is, by setting the second air channel 112, the heat dissipation efficiency can be further improved.

In addition, in some embodiments, as shown in FIG. 1 , a heat conduction block 13 may be disposed in the casing 10 . The heat conduction block 13 is located between the first air inlet and the first air outlet, and at least one air channel is arranged in the heat conduction block 13 , and the air channel communicates with the air channel 11 . The first heat conduction element 20 is connected to the heat conduction block 13 .

Since the housing 10 is provided with a heat conduction block 13, the first heat conduction member 20 is connected to the heat conduction block 13, therefore, the heat of the electronic device 100 can be transferred to the heat conduction block 13, and the heat generated by the electronic device 100 is transferred to the second thermal conduction block 13 through the heat conduction block 13. A heat conduction element 20 , and then the first heat conduction element 20 transmits heat to the second cooling fan 40 . That is, by providing the heat conduction block 13 , the heat generated by the electronic device 100 can be facilitated to be transferred to the first heat conduction member 20 . Since the heat conduction block 13 is located between the first air inlet and the first air outlet, at least one air passage is arranged in the heat conduction block 13, and the air passage communicates with the air passage 11, so the heat in the electronic device 100 is transferred to the casing 10 When the first heat dissipation fan 30 transmits airflow to the first air duct 111 through the first air inlet, the air duct in the heat conduction block 13 communicates with the air duct 11, so that the air flow can flow through the heat conduction block 13, thereby accelerating the heat conduction block 13 heat transfer. That is to say, by providing the heat conduction block 13 in the casing 10 and at least one air duct is arranged in the heat conduction block 13, the heat conduction block 13 can not only facilitate the heat transfer of the electronic device 100 to the first heat conduction member 20, but also the heat conduction block 13 It will not affect the effect of the first cooling fan 30 dissipating the heat generated by the electronic device 100 through the air duct 11 .

It should be noted that, in the embodiment of the present application, the material of the heat conduction block 13 can be copper alloy, of course, it can also be other materials that facilitate heat conduction, which is not limited in this embodiment of the present application. In addition, the number of air passages may be set according to actual needs, for example, there may be two air passages, and the specific number of air passages is not limited in this embodiment of the present application.

In addition, in some embodiments, as shown in FIG. 1 , a flexible heat conduction pad 14 may be provided on the side of the housing 10 away from the first heat conduction member 20 . When the electronic device 100 is installed on the clamping portion 12 , the electronic device 100 stops against the flexible thermal pad 14 .

Since the housing 10 is provided with a flexible heat conduction pad 14 on the side away from the first heat conduction member 20, when the electronic device 100 is mounted on the clamping portion 12, the electronic device 100 stops against the flexible heat conduction pad 14, thus At this time, the flexible thermal pad 14 can adapt to the shape of the electronic device 100, so that the surface of the electronic device 100 installed in the clamping part 12 is in contact with the flexible thermal pad 14 as much as possible, so that when the electronic device 100 generates heat, the heat can be as much as possible. As much heat as possible is transferred to the flexible heat conduction pad 14 , and the heat is transferred to the housing 10 through the flexible heat conduction pad 14 . That is to say, by setting the flexible heat conduction pad 14 , the heat generated by the electronic device 100 can be transferred to the housing 10 as much as possible, so that the heat can be dissipated through the first heat conducting member 20 and other heat dissipation components of the housing 10 .

It should be noted that, in the embodiment of the present application, the flexible heat conduction pad 14 may be a silicone pad, of course, it may also be a flexible member made of other heat conduction materials, which is not limited in this embodiment of the present application.

In addition, in the embodiment of the present application, when the housing 10 is provided with the heat conduction block 13, at this time, the flexible heat conduction pad 14 can be connected with the heat conduction block 13, and the flexible heat conduction pad 14 can transfer heat to the heat conduction block 13, thereby passing The heat conduction block 13 transmits heat to the first heat conduction member 20 .

In addition, in some embodiments, at least one channel may be provided in the flexible thermal pad 14 , and the channel is used to deform the flexible thermal pad 14 .

When at least one channel is provided in the flexible thermal pad 14, at this time, it is equivalent to the flexible thermal pad 14 being similar to a grid structure. When the electronic device 100 stops against the flexible thermal pad 14, due to the existence of the channel, the flexible thermal pad 14 It is easy to deform and adapt to the surface of the electronic device 100 , so that the heat of the electronic device 100 can be transferred to the flexible thermal pad 14 over a larger area, and then transferred to the casing 10 through the flexible thermal pad 14 .

In addition, in some embodiments, as shown in FIG. 3 , the heat dissipation device may further include a protective shell 70 . The protective case 70 is connected with the housing 10 , and the protective case 70 and the housing 10 form an accommodating space, and the first heat conducting member 20 and the second cooling fan 40 are located in the accommodating space. The protective case 70 is provided with a second air inlet 71 and a second air outlet 72, the first air inlet and the second air outlet 72 are both facing the second cooling fan 40, the second air inlet 71 is used to make the outer space of the protective case 70 The air enters into the protective case 70 so that the second cooling fan 40 forms an airflow to dissipate heat for the first heat conducting member 20 .

Since the protective case 70 and the housing 10 form an accommodation space, the first heat conduction member 20 and the second heat dissipation fan 40 are located in the accommodation space, therefore, the protection case 70 can protect the first heat conduction member 20 and the second heat dissipation fan 40. Function, to avoid the first heat conduction member 20 and the second heat dissipation fan 40 being damaged due to collision. Since the protective case 70 is provided with a second air inlet 71 and a second air outlet 72, and the second air inlet 71 and the second air outlet 72 are all facing the second cooling fan 40, therefore, the air in the outer space of the protective case 70 can flow along the second air outlet. The second air inlet 71 enters the protective shell 70. When the second cooling fan 40 is running, the second cooling fan 40 can make the air in the protective shell 70 form an airflow and flow out from the second air outlet 72, so that the first heat conducting member 20 can transfer The heat can be taken away by the airflow generated by the second heat dissipation fan 40, so that the second heat dissipation fan 40 can have the effect of heat dissipation.

In the embodiment of the present application, by setting the air duct 11 in the housing 10, the first cooling fan 30 is provided on the housing 10, and the first cooling fan 30 is located at the first air inlet and the second air outlet 72 of the air duct 11 toward For the electronic device 100 , after the heat generated by the electronic device 100 is transferred to the casing 10 , the heat can be transferred and dissipated from the second air outlet 72 as soon as possible through the first cooling fan 30 . By arranging the first heat conduction member 20 and the second heat dissipation fan 40 on the housing 10, after the heat generated by the electronic device 100 is transferred into the housing 10, the heat can be transferred to the second heat dissipation fan through the first heat conduction member 20 40, so that the heat can be dissipated by the second cooling fan 40. That is, after the heat generated by the electronic device 100 is transferred to the housing 10 , the heat can be dissipated as soon as possible through two paths, so that the heat dissipation efficiency of the electronic device 100 is improved. In addition, the first air outlet faces the electronic device 100 , so that the airflow from the first air outlet can cool down the surface of the electronic device 100 , further improving the heat dissipation efficiency of the electronic device 100 . That is, in the embodiment of the present application, after the heat of the electronic device 100 is transferred to the housing 10, the heat can be dissipated as soon as possible through two paths. In addition, the surface of the electronic device 100 can also be dissipated, so that the electronic device 100 can dissipate heat. The heat dissipation efficiency is improved.

It should be noted that, in the embodiment of the present application, electronic devices include but are not limited to mobile phones, tablet computers, notebook computers, palmtop computers, vehicle-mounted terminals, wearable devices, and pedometers.

It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. For the same and similar parts in each embodiment, refer to each other, that is, Can.

While alternatives to the embodiments of the present application have been described, additional changes and modifications to these embodiments may be made by those skilled in the art once the basic inventive concept is appreciated. Therefore, the appended claims are intended to be interpreted to include alternative embodiments and all changes and modifications that fall within the scope of the embodiments of the application.

Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any relationship between these entities. This actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that an article or terminal equipment comprising a series of elements includes not only those elements but also other elements not expressly listed , or also include elements inherent in such articles or terminal equipment. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the article or terminal device comprising the element.

The technical solution provided by this application has been introduced in detail above, and specific examples have been used in this paper to illustrate the principles and implementation methods of this application. At the same time, for those skilled in the art, based on the principles and implementation methods of this application, There will be changes in specific implementation methods and application ranges. In summary, the contents of this specification should not be construed as limiting the application.

Claims (7)

1. A cooling device for electronic equipment, characterized in that it comprises: A housing, the housing is provided with an air duct, the air duct has a first air inlet and a first air outlet, the housing is provided with a clamping part, and the electronic device is suitable for being detachably mounted on the housing. In the clamping part, when the electronic device is installed in the clamping part, the first air outlet faces the electronic device; A first heat conduction member, the first heat conduction member is installed on the housing, and when the electronic device is installed on the clamping portion, the first heat conduction member is adjacent to the electronic device; A first heat dissipation fan, the first heat dissipation fan is installed on the housing, and the first heat dissipation fan is located at the first air inlet, and the heat dissipation fan is used to accelerate the airflow in the air duct; A second heat dissipation fan, the second heat dissipation fan is installed on the side of the first heat conduction member away from the electronic device, and the second heat dissipation fan is used to dissipate heat for the first heat conduction member; The air duct includes a first air duct and a second air duct, the first air duct extends along the extension direction of the housing, the first air outlet is located on one side of the housing; the second air duct Through the housing and facing the electronic equipment, the first cooling fan is located between the first air duct and the second air duct. 2. The heat dissipation device according to claim 1, wherein the first heat conduction member is a semiconductor refrigerator, the first heat conduction member includes a cold end and a hot end, and the cold end is adjacent to the electronic device, The cooling device also includes: A control circuit, the control circuit is electrically connected to the first heat conduction element, and the control circuit controls the first heat conduction element to be powered on and off. 3. The heat dissipation device according to claim 1, wherein the heat dissipation device further comprises a radiator; The heat sink is mounted on a side of the first heat conducting member away from the electronic device, and the second cooling fan is mounted on the heat sink. 4. The heat dissipation device according to claim 1, wherein a heat conduction block is arranged in the housing; The heat conduction block is located between the first air inlet and the first air outlet, and at least one air channel is arranged in the heat conduction block, and the air channel communicates with the air channel; The first heat conduction element is connected with the heat conduction block. 5. The heat dissipation device according to claim 1, wherein a flexible heat conduction pad is further provided on the side of the housing away from the first heat conduction member; When the electronic device is installed on the clamping portion, the electronic device stops against the flexible thermal pad. 6 . The heat dissipation device according to claim 5 , wherein at least one channel is provided in the flexible thermal pad, and the channel is used to deform the flexible thermal pad. 7. The heat dissipation device according to claim 1, further comprising a protective case; The protective shell is connected to the housing, and the protective shell and the housing form an accommodation space, and the first heat conduction member and the second cooling fan are located in the accommodation space; The protective shell is provided with a second air inlet and a second air outlet, the second air inlet and the second air outlet are both facing the second cooling fan, and the second air inlet is used to make the The air in the outer space of the protective case enters the protective case, so that the second cooling fan forms an airflow to dissipate heat for the first heat conducting member.

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