Disclosure of Invention
The embodiment of the application aims to provide a display module and electronic equipment, which can solve the problems that a flexible circuit board is difficult to bend at a large angle in the process of connecting an antenna in the prior art, and poor contact occurs easily in a bonding area after bending due to overlarge stress.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a display module, which includes:
a substrate including a display area and an edge area located at a periphery of the display area;
the display layer is arranged in the display area of the substrate;
at least one antenna comprising an antenna pattern disposed in an edge region of the substrate;
the circuit board is arranged on one side of the substrate, which is far away from the antenna pattern, a via hole penetrating through the substrate is further formed in the edge area of the substrate, and the circuit board is electrically connected with the antenna pattern through the via hole.
Optionally, the antenna pattern is manufactured by using a metal mesh manufacturing process.
Optionally, a metal layer is disposed on an inner wall of the via hole, and the circuit board is electrically connected to the antenna pattern through the metal layer.
Optionally, the through hole is filled with a conductive material pillar, and the circuit board is electrically connected to the antenna pattern through the conductive material pillar.
Optionally, the antenna further includes a ground line pattern, the ground line pattern is disposed on a side of the substrate facing away from the antenna pattern, and orthographic projections of the ground line pattern and the antenna pattern on the substrate are at least partially overlapped.
Optionally, the antenna pattern includes an antenna electrode and an antenna electrode outgoing line connected to the antenna electrode, and an orthogonal projection of the antenna electrode outgoing line on the substrate at least partially covers the via hole.
Optionally, the display layer includes a plurality of display devices, each display device includes at least one metal layer, and the antenna pattern and the metal layer of the display device are disposed in the same layer and in the same material.
Optionally, the antenna pattern is made of a transparent conductive material.
Optionally, the circuit board is connected to the antenna pattern through an anisotropic conductive film.
In a second aspect, an embodiment of the present application provides an electronic device, which includes the display module according to the first aspect.
In the embodiment of the application, the via holes are formed in the substrate, and the antenna patterns and the circuit board which are respectively positioned on two sides of the substrate can be connected through the via holes, so that the flexible circuit board does not need to be bent from the side edge of the substrate to realize connection, and the problems that the flexible circuit board is difficult to bend when a feeder is arranged on the flexible circuit board and a bonding area is easy to have poor contact due to overlarge stress are solved.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The display module and the electronic device provided by the embodiment of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an on-screen antenna in the prior art. As shown in fig. 1, the design scheme of the conventional in-screen antenna is to provide an antenna 12 at the edge of a substrate 11, when the antenna 12 is connected to a feeder, one end of a flexible circuit board 13 is bonded to the antenna 12, and the other end of the flexible circuit board 13 is bent from the side edge of the substrate 11 to the back surface of the substrate 11 to be bonded to a radio frequency module. Since the frequency of the antenna in the screen is very high, for example, in the 60GHz band, the feeder loss of the antenna 12 is required to be very low, and therefore, materials with low dielectric loss, such as modified polyimide, industrialized liquid crystal polymer, fluorine and the like, need to be used, and since the hardness of the materials is relatively high and the antenna feeder has a certain requirement for the thickness of the medium, the flexible circuit board 13 cannot be bent at a large angle in the process of connecting the antenna 12, and the bonding area is prone to poor contact due to excessive stress after bending.
Therefore, referring to fig. 2 to 4, fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present disclosure, fig. 3 is a schematic top view of the display module according to the embodiment of the present disclosure, and fig. 4 is a schematic bottom view of the display module according to the embodiment of the present disclosure. As shown in fig. 2 to 4, the display module provided in the embodiment of the present application includes a substrate 21, a display layer 29, at least one antenna, and a circuit board; the substrate 21 comprises a display area and an edge area located at the periphery of the display area, wherein the display area and the edge area are both located on the same side surface of the substrate 21; the display layer 29 is disposed in the display area of the substrate 21, the display layer 29 is used for implementing a display function of the display module, the antenna includes an antenna pattern 22, the antenna pattern 22 is disposed in an edge area of the substrate 21, the circuit board 23 is disposed on a side of the substrate 21 away from the antenna pattern 22, the circuit board 23 is provided with a radio frequency module, and the radio frequency module needs to be connected with the antenna to implement signal transceiving, so that a via hole 24 penetrating through the thickness direction of the substrate 21 is further formed in the edge area of the substrate 21, and the circuit board 23 is electrically connected with the antenna pattern 22 through the via hole 24.
Therefore, in the embodiment of the present application, the via hole 24 is formed in the substrate 21, and the via hole 24 provides a connection channel between the circuit board 23 and the antenna pattern 22, so that a structure that the circuit board and the antenna pattern are connected by bending through the flexible circuit board via the side edge of the substrate 21 can be omitted, the size of the frame is reduced, the feeder line with a certain thickness and a high hardness does not need to be bent, the bonding between the circuit board 23 and the antenna pattern 22 is hardly affected by stress, the bonding is stable, and the long-term stability of the antenna signal can be ensured.
In this embodiment, the number of the antenna patterns 22 in the display module is at least one, and since the carrier frequency is higher and higher, the loss of the antenna signal is higher and higher, and the loss needs to be reduced by using an array antenna, in order to improve the performance of the antenna, the antenna in the display module may include a plurality of antenna patterns 22, the plurality of antenna patterns 22 are disposed in an edge region of the substrate 21, and the plurality of antenna patterns 22 together form an array antenna, i.e., a Multiple Input Multiple Output (MIMO) antenna.
In some embodiments of the present application, the substrate 21 may be rectangular, and the at least one antenna may be disposed on a short side of the substrate 21 in addition to a long side of the substrate 21.
In some embodiments of the present application, the antenna pattern 22 is manufactured by a metal mesh manufacturing process, in other words, the antenna pattern 22 is in a metal mesh shape, so as to reduce an area occupied by the antenna, and the antenna pattern 22 hardly affects normal display of the display module. The width and the gap of the metal grid can be adjusted according to requirements, the width of a general metal wire is 0.1-30 micrometers, the gap is 30-50 micrometers, specifically, after a photosensitive material is coated on a film material, the photosensitive material is locally pressed into a circuit shape by using a nano-sized die, the photosensitive material is cured after ultraviolet exposure, then a nano conductive material is coated or printed in a groove of the photosensitive material to form a circuit, and the circuit with the required shape is formed on the substrate 21 through curing in a high-temperature sintering mode and the like.
As shown in fig. 2, in some embodiments of the present application, a metal layer 25 is disposed on an inner wall of the via hole 22, and the circuit board 23 is electrically connected to the antenna pattern 22 through the metal layer 25. Alternatively, the circuit board 23 may be electrically connected to the metal layer 25 through the connecting member 26, and the metal layer 25 may be electrically connected to the antenna pattern 22. The metal layer 25 is only disposed on the inner wall of the via hole 22, so that the amount of metal used can be reduced, and the weight of the whole antenna structure can be reduced.
Referring to fig. 5, fig. 5 is a schematic structural diagram of another display module according to an embodiment of the present disclosure. As shown in fig. 5, in other embodiments of the present application, the via hole 24 formed in the edge region of the substrate 21 is filled with a conductive material pillar 27, and the circuit board 23 is electrically connected to the antenna pattern 22 through the conductive material pillar 27. Alternatively, the circuit board 23 may be electrically connected to the conductive material pillar 27 through the connecting member 26, and the metal conductive material layer 27 may be electrically connected to the antenna pattern 22.
In some embodiments of the present application, the antenna further includes a ground line pattern 223, the ground line pattern 223 is disposed on a side of the substrate 21 away from the antenna pattern 22, and an orthographic projection of the ground line pattern 223 and the antenna pattern 22 on the substrate 21 at least partially overlaps, so that the ground line pattern 223 reflects a signal wave to improve the receiving performance of the antenna.
In other embodiments of the present application, the antenna pattern 22 includes an antenna electrode 221 and an antenna electrode lead-out line 222 connected to the antenna electrode 221, and an orthographic projection of the antenna electrode lead-out line 222 on the substrate at least partially covers the via hole 24, that is, the antenna electrode lead-out line 222 covers the via hole 24, so that the antenna electrode lead-out line 222 is conveniently connected to the circuit board 23 through the via hole 24. By dividing the antenna pattern 22 into the antenna electrode 221 and the antenna electrode lead-out line 222, the shape consistency of the antenna electrode 221 can be ensured, and matching and setting of indexes such as antenna impedance and the like are facilitated.
In the embodiment of the present application, the display layer 29 includes a plurality of display devices, the display devices include at least one metal layer, and the antenna pattern 22 and the metal layer of the display device are disposed in the same material in the same layer; illustratively, the display device includes an anode layer, and the antenna pattern 22 may be made of the same material as the anode layer of the display device, so as to save process steps and facilitate manufacturing.
In some alternative embodiments, the antenna pattern 22 is made of a transparent conductive material, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and the antenna pattern 22 made of a transparent conductive material may further reduce the influence of the antenna on the display module under the display condition.
In some embodiments of the present application, the connecting member 26 may be an anisotropic conductive film, that is, the circuit board 23 is connected to the metal layer 25 or the conductive material pillar 27 through the anisotropic conductive film, and the metal layer 25 or the conductive material pillar 27 is further connected to the antenna pattern 22. The anisotropic conductive film has the functions of unidirectional (vertical conduction and parallel non-conduction) conduction and gluing fixation, and has good insulation effect and stable gluing. Of course, the circuit board 23 may also be bonded to the substrate 21 by thermocompression bonding to be connected and fixed with the metal layer 25 or the conductive material pillar 27, so as to achieve electrical conduction.
Referring to fig. 6, fig. 6 is a diagram illustrating one of the conducting manners according to an embodiment of the present disclosure. As shown in fig. 6, in some embodiments of the present application, a via hole 24 may be formed on a film on which an antenna pattern 22 is already formed by laser or mechanical drilling at a position where an antenna electrode lead 222 is located, and a continuous metal layer 25 may be formed on a hole wall of the via hole 24 by means of hole metallization, so as to electrically connect the antenna patterns on both sides of the substrate 21 and the circuit board.
Referring to fig. 7, fig. 7 shows a second conduction mode provided in the present embodiment. As shown in fig. 7, in other embodiments of the present application, a via hole 24 may be formed in a position where the antenna electrode lead line 222 is formed on a film material on which the antenna pattern 22 is already formed by laser or mechanical drilling, a conductive material may be filled into the via hole 24 by printing or the like, and the filled conductive material may be cured by high temperature baking or exposure to form a conductive material pillar 27, so as to electrically connect the antenna pattern on both sides of the substrate 21 and the circuit board.
Referring to fig. 8, fig. 8 shows a third conducting manner provided in the present embodiment. As shown in fig. 8, in some embodiments of the present application, a photosensitive film 28 may be formed on a substrate 21, the photosensitive film 28 that does not need a via position is exposed and cured, an unexposed area is removed by a developing solution, the exposed area remains on the surface of the substrate 21 because the exposed area does not react with the developing solution, an etching solution is used to etch away the exposed portion of the substrate 21, thereby forming a via hole 24, a mold-releasing process is used to remove the cured photosensitive film, and a Metal Mesh (Metal Mesh) process is used to fill the via hole 24 with a conductive material and form an antenna pattern 22, thereby electrically connecting the antenna patterns on both sides of the substrate 21 to a circuit board.
In the embodiment of the application, the via holes are formed in the substrate, and the antenna patterns and the circuit board which are respectively positioned on two sides of the substrate can be connected through the via holes, so that the flexible circuit board does not need to be bent from the side edge of the substrate to realize connection, and the problems that the flexible circuit board is difficult to bend when a feeder is arranged on the flexible circuit board and a bonding area is easy to have poor contact due to overlarge stress are solved.
An embodiment of another aspect of the present application further provides an electronic device, where the electronic device includes the display module described in the above embodiment. Because the display module in the above embodiment has the above beneficial effects, the electronic device in the embodiment of the present application also has the above beneficial effects, and is not repeated herein for avoiding repetition.
The electronic device in the embodiment of the present application may be a mobile electronic device, and may also be a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a Personal Computer (PC), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.