CN113286435A - Method for plating copper in aluminum plate hole - Google Patents
Method for plating copper in aluminum plate hole Download PDFInfo
- Publication number
- CN113286435A CN113286435A CN202110573518.4A CN202110573518A CN113286435A CN 113286435 A CN113286435 A CN 113286435A CN 202110573518 A CN202110573518 A CN 202110573518A CN 113286435 A CN113286435 A CN 113286435A
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- CN
- China
- Prior art keywords
- hole
- aluminum plate
- copper
- diameter
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a method for plating copper in an aluminum plate hole, which comprises the following steps: s1, presetting the diameter of the finished product hole, and drilling the aluminum plate to form a through hole, wherein the diameter of the through hole is larger than that of the finished product hole; s2, embedding a copper block into the through hole, fully filling the copper block into the through hole, and then polishing the surface of the aluminum plate to be flat, wherein the surface of the copper block and the surface of the aluminum plate are positioned on the same horizontal plane; s3, laminating the aluminum plate and other substrates and then pressing; and S4, drilling the through hole embedded in the copper block, wherein the size of the drilled hole is the diameter of the finished hole. The invention solves the problem that the existing aluminum plate holes are not easy to be plated with copper, and uniform copper holes are formed in the aluminum plate holes; the aluminum plate has good heat dissipation effect, and the traditional copper substrate is replaced by the aluminum plate, so that the cost is reduced; the method is easy to operate and is beneficial to improving the production efficiency; the copper layer in the aluminum plate hole is uniform, the effect is good, the yield is improved by the method, and the quality of the PCB is ensured.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a method for plating copper in an aluminum plate hole.
Background
With the development of science and technology, electronic products are updated more and more frequently, the updating of the electronic products also indicates the updating of product structures, and the products need the advantages of low price and good performance to win the market due to more and more fierce market competition.
The copper substrate has good heat dissipation, can adopt the copper substrate in PCB board manufacturing process, but the cost of copper substrate is higher, in order to reduce cost, tries to use aluminium base board to replace the copper substrate in the trade, and aluminium base board in the manufacturing process of PCB board, has the problem that the pore wall does not go up copper after the drilling, and the copper facing effect is poor, influences the quality of PCB board.
Disclosure of Invention
The invention provides a method for plating copper in an aluminum plate hole, aiming at solving the problems that the existing aluminum plate hole is not easy to plate copper and has poor copper plating effect.
A method for plating copper in aluminum plate holes comprises the following steps:
s1, presetting the diameter of the finished product hole, and drilling the aluminum plate to form a through hole, wherein the diameter of the through hole is larger than that of the finished product hole;
s2, embedding a copper block into the through hole, fully filling the copper block into the through hole, and then polishing the surface of the aluminum plate to be flat, wherein the surface of the copper block and the surface of the aluminum plate are positioned on the same horizontal plane;
s3, laminating the aluminum plate and other substrates and then pressing;
and S4, drilling the through hole embedded in the copper block, wherein the size of the drilled hole is the diameter of the finished hole.
Optionally, the step S1 further includes: and presetting the thickness of the hole copper, wherein the diameter of the through hole is equal to the diameter of the finished hole plus the thickness of the hole copper 2. The method can form a uniform copper layer in the hole of the aluminum plate, is easy to operate, and is beneficial to reducing the cost and improving the yield of finished products.
Optionally, before step S1, the aluminum plate is drilled to form positioning holes.
Optionally, the step S3 specifically includes the following steps:
during lamination, on aluminium platesThe upper and lower surfaces of the copper foil layer are both provided with copper foil layers, a PP sheet is arranged between the copper foil layers and the aluminum plate, and the copper foil layers are arranged,ppStacking the sheets and the aluminum plate;
and laminating after the plates are stacked.
Optionally, the diameter of the through hole is larger than the diameter of the finished hole by more than 0.15 mm.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for plating copper in an aluminum plate hole, which solves the problem that the existing aluminum plate hole is not easy to plate copper, and uniform copper holes are formed in the aluminum plate hole; the aluminum plate has good heat dissipation effect, and the traditional copper substrate is replaced by the aluminum plate, so that the cost is reduced; the method is easy to operate and is beneficial to improving the production efficiency; the copper layer in the aluminum plate hole is uniform, the effect is good, the yield is improved by the method, and the quality of the PCB is ensured.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below.
A method for plating copper in aluminum plate holes comprises the following steps:
s0, the aluminum plate is drilled to form positioning holes, which in some embodiments are located at four corners of the aluminum plate.
And S1, presetting the diameter of the finished product hole and the thickness of the hole copper, and drilling the aluminum plate to form a through hole, wherein the diameter of the through hole is larger than that of the finished product hole. Specifically, the diameter of the through hole is equal to the diameter of the finished hole + the thickness of copper in the hole 2. In some embodiments, the diameter of the through-hole is greater than the diameter of the finished hole by more than 0.15 mm. It will be appreciated that the number of through holes may be set according to actual requirements.
S2, embedding a copper block into the through hole, fully filling the copper block into the through hole, and then polishing the surface of the aluminum plate to be flat, wherein the surface of the copper block and the surface of the aluminum plate are positioned on the same horizontal plane; the copper block can be embedded by mechanical force, and seamless connection of the through block and the through hole is realized.
S3, laminating the aluminum plate and other substrates and then pressing;
in some embodiments, the aluminum plates are stacked on top of each otherCopper foil layers are arranged on both sides, PP sheets are arranged between the copper foil layers and the aluminum plates, and the copper foil layers are arranged,ppAnd laminating the sheets and the aluminum plate, and laminating after laminating.
And S4, drilling the through hole embedded in the copper block, wherein the size of the drilled hole is the diameter of the finished hole. And drilling holes corresponding to the copper blocks, wherein the hole diameter of the drilled holes is smaller than that of the copper blocks, and the hole wall of the aluminum plate is provided with a copper hole layer.
The invention provides a method for plating copper in an aluminum plate hole, which solves the problem that the existing aluminum plate hole is not easy to plate copper, and a uniform copper layer is formed in the aluminum plate hole; the aluminum plate has good heat dissipation effect, and the traditional copper substrate is replaced by the aluminum plate, so that the cost is reduced; the method is easy to operate and is beneficial to improving the production efficiency; the copper layer in the aluminum plate hole is uniform, the effect is good, the yield is improved by the method, and the quality of the PCB is ensured.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (5)
1. A method for plating copper in aluminum plate holes is characterized by comprising the following steps: the method comprises the following steps:
s1, presetting the diameter of the finished product hole, and drilling the aluminum plate to form a through hole, wherein the diameter of the through hole is larger than that of the finished product hole;
s2, embedding a copper block into the through hole, fully filling the copper block into the through hole, and then polishing the surface of the aluminum plate to be flat, wherein the surface of the copper block and the surface of the aluminum plate are positioned on the same horizontal plane;
s3, laminating the aluminum plate and other substrates and then pressing;
and S4, drilling the through hole embedded in the copper block, wherein the size of the drilled hole is the diameter of the finished hole.
2. The method of claim 1 for plating copper in aluminum holes, comprising the steps of: the step S1 further includes: and presetting the thickness of the hole copper, wherein the diameter of the through hole is equal to the diameter of the finished hole plus the thickness of the hole copper 2.
3. The method of claim 1 for plating copper in aluminum holes, comprising the steps of: before the step S1, drilling holes in the aluminum plate to form positioning holes.
4. The method of claim 1 for plating copper in aluminum holes, comprising the steps of: the step S3 specifically includes the following steps:
during plate stacking, copper foil layers are placed on the upper surface and the lower surface of an aluminum plate, PP sheets are arranged between the copper foil layers and the aluminum plate, and the copper foil layers, the PP sheets and the aluminum plate are stacked;
and laminating after the plates are stacked.
5. The method of claim 1 for plating copper in aluminum holes, comprising the steps of: the diameter of the through hole is larger than that of the finished product hole by more than 0.15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110573518.4A CN113286435A (en) | 2021-05-25 | 2021-05-25 | Method for plating copper in aluminum plate hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110573518.4A CN113286435A (en) | 2021-05-25 | 2021-05-25 | Method for plating copper in aluminum plate hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113286435A true CN113286435A (en) | 2021-08-20 |
Family
ID=77281767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110573518.4A Pending CN113286435A (en) | 2021-05-25 | 2021-05-25 | Method for plating copper in aluminum plate hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113286435A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01244854A (en) * | 1970-01-20 | 1989-09-29 | Matsushita Electric Works Ltd | Manufacture of electric laminate |
| CN1627489A (en) * | 2003-12-10 | 2005-06-15 | 玄基光电半导体股份有限公司 | Semiconductor chip carrier substrate and manufacturing method thereof |
| CN102711367A (en) * | 2012-05-14 | 2012-10-03 | 景旺电子（深圳）有限公司 | Heat-conducting aluminum base plate and manufacturing method of heat-conducting aluminum base plate |
| CN103025085A (en) * | 2012-12-10 | 2013-04-03 | 四川海英电子科技有限公司 | Copper deposition method for double-faced aluminum substrate |
| CN104427747A (en) * | 2013-08-30 | 2015-03-18 | 深南电路有限公司 | Circuit board with copper buried in inner layer and processing method of circuit board |
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN108040416A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | A kind of production method of double-face aluminium substrate |
| US20180160547A1 (en) * | 2016-12-02 | 2018-06-07 | Fujitsu Limited | Method of manufacturing substrate and substrate |
| CN211150801U (en) * | 2019-11-29 | 2020-07-31 | 广东电网有限责任公司 | Low-voltage wire copper-aluminum transition connecting device |
-
2021
- 2021-05-25 CN CN202110573518.4A patent/CN113286435A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01244854A (en) * | 1970-01-20 | 1989-09-29 | Matsushita Electric Works Ltd | Manufacture of electric laminate |
| CN1627489A (en) * | 2003-12-10 | 2005-06-15 | 玄基光电半导体股份有限公司 | Semiconductor chip carrier substrate and manufacturing method thereof |
| CN102711367A (en) * | 2012-05-14 | 2012-10-03 | 景旺电子（深圳）有限公司 | Heat-conducting aluminum base plate and manufacturing method of heat-conducting aluminum base plate |
| CN103025085A (en) * | 2012-12-10 | 2013-04-03 | 四川海英电子科技有限公司 | Copper deposition method for double-faced aluminum substrate |
| CN104427747A (en) * | 2013-08-30 | 2015-03-18 | 深南电路有限公司 | Circuit board with copper buried in inner layer and processing method of circuit board |
| US20180160547A1 (en) * | 2016-12-02 | 2018-06-07 | Fujitsu Limited | Method of manufacturing substrate and substrate |
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN108040416A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | A kind of production method of double-face aluminium substrate |
| CN211150801U (en) * | 2019-11-29 | 2020-07-31 | 广东电网有限责任公司 | Low-voltage wire copper-aluminum transition connecting device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210820 |
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| RJ01 | Rejection of invention patent application after publication |