CN113275692B - Soldering iron management system and method - Google Patents

Abstract

The present disclosure provides a soldering iron management system and method. The soldering iron management system comprises a target object, a soldering iron, a first temperature sensor and a processing unit. The soldering iron has an end portion, wherein the end portion is heated and brought into contact with the object. The first temperature sensor is configured to sense the temperature of the end portion. The processing unit is connected with the first temperature sensor to receive the temperature of the end part, wherein the processing unit obtains temperature change information according to the change of the temperature of the end part in the process of contacting the end part with the target object, and then the soldering iron is replaced when the temperature change information meets the preset condition.

Description

Soldering iron management system and method

technical field

The present disclosure relates to a soldering iron management system and method, in particular to a soldering iron management system and method capable of judging when to replace a soldering iron.

Background technique

The soldering system uses the tip of the soldering iron in a high-temperature heating state to melt the solder metal with a lower melting point, and uses the melted solder to weld the component pins and circuit contacts. Due to the accumulated long-term heating state and repeated welding reactions, the soldering iron tip of the soldering system will be oxidized, which will lead to poor heat conduction of the soldering iron tip and affect the quality of the soldering process.

Generally speaking, the life evaluation of soldering iron tips is based on the statistics of empirical data, such as replacing the soldering iron tip after a certain number of products are produced. However, the quality of the soldering iron tip itself may be poor. Even if the same specification of the soldering iron tip is used for the same process, the wear and tear of the soldering iron tip is not the same. Therefore, the soldering iron tip may be disabled before replacement, resulting in lower product quality, and the soldering iron tip may still have normal functions when it is replaced, thus causing waste of resources.

Therefore, how to develop a soldering iron management system and method that can improve the above-mentioned prior art is an urgent need at present.

Contents of the invention

The purpose of the present disclosure is to provide a soldering iron management system and method. Through the temperature change information during the contact process between the soldering iron and the target object, the thermal conductivity of the soldering iron can be obtained in real time. Replace the soldering iron when necessary. In this way, stable product quality can be maintained, and waste caused by premature replacement of soldering irons can be avoided.

To achieve the above purpose, the present disclosure provides a soldering iron management system. The soldering iron management system includes a target object, a soldering iron, a first temperature sensor and a processing unit. A soldering iron has a tip that is heated and brought into contact with a target. The first temperature sensor is configured to sense the temperature of the end. The processing unit is connected to the first temperature sensor to receive the temperature of the end, wherein the processing unit obtains temperature change information according to the change of the temperature of the end when the end is in contact with the target object, and then the temperature Replace the soldering iron when the change information meets the preset conditions.

To achieve the above purpose, the present disclosure further provides a soldering iron management method. The soldering iron management method includes steps: (S1) continuously sensing the temperature of the tip of the soldering iron; (S2) heating the tip and making the tip contact with the target; (S3) contacting the target at the tip according to the temperature of the tip Obtain temperature change information from changes generated during the contact process; and (S4) judge whether the temperature change information satisfies a preset condition, and if the judgment result is yes, replace the soldering iron.

Description of drawings

FIG. 1 is a schematic structural diagram of a soldering iron management system according to a preferred embodiment of the present disclosure.

FIG. 2 is a waveform diagram illustrating temperature changes of a soldering iron and an object, wherein the soldering iron is in an ideal state.

FIG. 3A is a waveform diagram illustrating the temperature change of the tip of the soldering iron in the current state and the ideal state.

FIG. 3B is a waveform diagram illustrating temperature changes of the target object in the current state and the ideal state.

Figure 4 is a waveform diagram illustrating the temperature change of the tip of the soldering iron when it is in an ideal state, when it needs to be maintained, and when it needs to be replaced

FIG. 5 is a schematic structural diagram of a soldering iron management system according to another preferred embodiment of the present disclosure.

FIG. 6 is a step diagram of a method for managing a soldering iron according to a preferred embodiment of the present disclosure.

Explanation of reference signs:

1: Soldering iron management system

11: Target

12: Soldering iron

121: end

13: The first temperature sensor

14: Processing unit

15: Temperature controller

16: Second temperature sensor

T0: preset temperature

t1r: reference cooling time

T1r: reference cooling amplitude

t2r: reference temperature recovery time

t3r: reference heating time

t1: actual cooling time

T1: actual cooling amplitude

t2: Actual temperature recovery time

t3: actual heating time

Δt1: first difference

Δt2: second difference

ΔT1: the third difference

Δt3: the fourth difference

detailed description

Some typical embodiments embodying the features and advantages of the present disclosure will be described in detail in the description in the following paragraphs. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the descriptions and illustrations therein are illustrative in nature and not restrictive. This disclosure.

FIG. 1 is a schematic structural diagram of a soldering iron management system according to a preferred embodiment of the present disclosure. As shown in FIG. 1 , the soldering iron management system 1 includes an object 11 , a soldering iron 12 , a first temperature sensor 13 and a processing unit 14 . The target object 11 is a material with better thermal conductivity, such as but not limited to metal. The soldering iron 12 has an end 121 which is heated and contacts the target 11 . The first temperature sensor 13 is configured to sense the temperature of the end portion 121 . The processing unit 14 is connected to the first temperature sensor 13 to receive the temperature of the end portion 121 . The processing unit 14 obtains temperature change information according to the temperature change of the end portion 121 when the end portion 121 is in contact with the target object 11 , and then replaces the soldering iron 12 when the temperature change information meets a preset condition. In some embodiments, the soldering iron management system 1 further includes a temperature controller 15 connected to the soldering iron 12 and configured to control the temperature of the end 121 of the soldering iron 12 .

FIG. 2 is a waveform diagram illustrating temperature changes of a soldering iron and an object, wherein the soldering iron is in an ideal state. In FIG. 2 , the temperature of the end portion 121 is indicated by a solid line, and the temperature of the target 11 is indicated by a dotted line. As shown in FIG. 2 , when the soldering iron 12 heats the object 11 for welding, firstly, the end portion 121 is heated to a preset temperature T0 . Next, the end portion 121 is brought into contact with the target object 11 , due to heat conduction, the temperature of the end portion 121 decreases gradually, and the temperature of the target object 11 gradually increases. Then, after the temperature of the target object 11 is raised to be the same as the temperature of the end portion 121 , the temperature of the end portion 121 and the target object 11 rise together. Finally, the temperature of the end portion 121 and the target object 11 is increased to the preset temperature T0 and maintained at the preset temperature T0. Wherein, the duration of the temperature drop of the end portion 121 is the temperature drop time, and the drop range of the temperature of the end portion 121 is the temperature drop amplitude. In addition, when the temperature of the end portion 121 drops from the preset temperature T0 and finally rises back to the preset temperature T0, the time spent is the warm-up time. The aforementioned cooling time, cooling amplitude and warming time can reflect the heat conduction performance of the end portion 121 of the soldering iron 12 .

When the soldering iron 12 is in an ideal state (that is, the soldering iron 12 has normal functions and is not worn out), the reference cooling time t1r, reference cooling amplitude T1r and reference heating time t2r of the end portion 121 are shown in FIG. 2 . It should be noted that FIG. 2 only illustrates the temperature variation when the soldering iron 12 is in an ideal state. When the thermal conductivity of the end 121 of the soldering iron 12 decreases due to use loss, the temperature waveforms of the end 121 and the target object 11 will produce Change.

After the soldering iron 12 has undergone multiple heating states and repeated welding, it is inevitable that the end 121 of the soldering iron 12 will cause a decrease in thermal conductivity due to oxidation. Increase. Using the first temperature sensor 13 of the soldering iron management system 1 , the temperature change information during the contact process between the soldering iron 12 and the target object 11 can be obtained, so as to know the actual heat conduction performance of the soldering iron 12 . By comparing the actual heat conduction performance of the soldering iron 12 with the heat conduction performance of the soldering iron 12 in an ideal state, the decline rate of the heat conduction performance of the soldering iron 12 can be deduced. 12 for replacement. In this way, stable product quality can be maintained, and waste caused by premature replacement of the soldering iron 12 can be avoided.

According to whether the temperature change information satisfies the preset condition, it can be known whether the thermal conductivity of the soldering iron 12 has dropped to a certain level and cannot be used. Specifically, the temperature change information may, for example but not limited to, include parameter values such as the actual cooling time t1, the actual cooling amplitude T1, and the actual warming time t2 of the soldering iron 12, and the parameter values of various temperature change information and their corresponding reference parameter values There is a difference, and the preset condition is the relationship between the difference and the corresponding preset value.

3A is a waveform diagram illustrating the temperature change of the end portion of the soldering iron in the current state and the ideal state, wherein the solid line represents the temperature change of the end portion 121 in the ideal state, and the dotted line represents the temperature change of the end portion 121 in the current state. temperature change. The parameter values of various temperature change information and their corresponding preset conditions will be illustrated below with reference to FIG. 3A .

The temperature change information may include the actual cooling time t1 of the end portion 121 of the soldering iron 12 , and the actual cooling time t1 of the end portion 121 differs from the reference cooling time t1r by a first difference Δt1 . Correspondingly, the preset condition includes that the first difference Δt1 is greater than the first preset value, and if the obtained first difference Δt1 satisfies the preset condition, the soldering iron 12 is replaced. In some embodiments, the first preset value may be set as a specific value or a specific percentage of the reference cooling time t1r, but not limited thereto.

The temperature change information may include the actual temperature recovery time t2 of the end portion 121 of the soldering iron 12 , and the actual temperature recovery time t2 of the end portion 121 differs from the reference temperature recovery time t2r by a second difference Δt2 . Correspondingly, the preset condition includes that the second difference Δt2 is greater than the second preset value, and if the obtained second difference Δt2 satisfies the preset condition, the soldering iron 12 is replaced. In some embodiments, the second preset value can be set as a specific value or a specific percentage of the reference warming time t2r, but not limited thereto.

The temperature change information may include the actual cooling amplitude T1 of the end portion 121 of the soldering iron 12 , and the actual cooling amplitude T1 of the end portion 121 is different from the reference cooling amplitude T1r by a third difference ΔT1 . Correspondingly, the preset condition includes that the third difference ΔT1 is greater than the third preset value, and if the obtained third difference ΔT1 satisfies the preset condition, the soldering iron 12 is replaced. In some embodiments, the third preset value can be set as a specific value or a specific percentage of the reference temperature reduction amplitude T1r, but not limited thereto.

Among the parameter values such as the actual cooling time t1 , the actual cooling amplitude T1 , and the actual heating time t2 of the temperature change information, the user can select any one or more parameter values to judge the actual heat conduction performance of the soldering iron 12 .

Please refer to Figure 1 again. In some embodiments, the soldering iron management system 1 further includes a second temperature sensor 16 . The second temperature sensor 16 is connected to the processing unit 14 , and the second temperature sensor 16 is configured to sense the temperature of the target object 11 and further provide the temperature of the target object 11 to the processing unit 14 . According to the change of the temperature of the target object 11 when the end portion 121 is in contact with the target object 11 , the processing unit 14 can obtain the heating time of the target object 11 . The heat conduction performance of the soldering iron 12 is estimated by comparing the heating time of the target object 11 with its reference value, thereby enhancing the accuracy of the heat conduction performance of the soldering iron 12 . Specifically, from the time the target 11 comes into contact with the end 121 of the soldering iron 12 until the temperature of the target 11 rises to the preset temperature T0, the length of time spent is the heating time of the target 11, which is also equivalent to that of the soldering iron. 12 reheating time. When the soldering iron 12 is in an ideal state, the reference heating time t3r of the target object 11 is as shown in FIG. 2 .

3B is a waveform diagram illustrating the temperature change of the target object in the current state and the ideal state, wherein the temperature change of the target object 11 in the ideal state is represented by a solid line, and the temperature change of the target object 11 in the current state is represented by a dotted line . The actual heating time t3 of the target object 11 is different from the reference heating time t3r by a fourth difference Δt3. If the fourth difference Δt3 is greater than the fourth preset value, the soldering iron 12 is replaced. In some embodiments, the fourth preset value can be set as a specific value or a specific percentage of the reference heating time t3r, but not limited thereto.

In addition, during the use of the soldering iron 12 , the thermal conductivity of the soldering iron 12 may decrease due to damage, but some damages can be repaired through maintenance work without replacing the soldering iron 12 , thereby reducing costs. Furthermore, timely maintenance of the soldering iron 12 can also increase the service life of the soldering iron 12 . The following is an example to illustrate how to judge the maintenance timing of the soldering iron 12. FIG. 4 is a waveform diagram illustrating the temperature changes of the end portion of the soldering iron in an ideal state, when maintenance is required, and when replacement is required, wherein the temperature curve of the end portion 121 in an ideal state is represented by a solid line, and the points are represented by dots. The chain line represents the temperature curve of the end 121 of the soldering iron 12 when maintenance is required, and the dotted line represents the temperature curve of the soldering iron 12 when it needs to be replaced. The user can set the temperature curve of the soldering iron 12 when it needs to be replaced as the first reference temperature curve (ie the dotted line in FIG. 4 ), and the user can set the temperature curve of the end portion 121 when it needs to be maintained as The second reference temperature curve (that is, the dotted line in FIG. 4 ). When the end portion 121 is in contact with the target object 11 , the temperature change information obtained by the processing unit 14 also includes the actual temperature curve of the end portion 121 . If the actual temperature curve is consistent with the second reference temperature curve (a certain error can be tolerated), the maintenance operation is performed on the end 121 of the soldering iron 12 .

According to various possible damages of the soldering iron 12 , different second reference temperature curves can be set, and the corresponding maintenance operations are also different. For example, if the end 121 of the soldering iron 12 is stained with residual tin, the maintenance operation can be to remove tin and clean the soldering iron 12 by blowing air, and if the end 121 is slightly oxidized, the maintenance operation can be to use a wire cleaner (eg copper brush) to remove oxides from the surface. Of course, in some embodiments, the user can set a variety of different second reference temperature curves to correspond to different damage situations, and the actual temperature curve of the end portion 121 conforms to any second reference temperature curve. corresponding maintenance work.

In some embodiments, in order to set a reference temperature curve conforming to a specific damage situation, soldering irons 12 with the same damage situation can be collected, and the temperature curves at the end 121 can be counted, and then obtained by curve fitting (curvefitting). The identification curve of the damage situation, and use the identification curve as the reference temperature curve corresponding to the damage situation. However, the setting method of the reference temperature curve is not limited thereto.

In some embodiments, when judging whether the actual temperature curve of the end portion 121 is consistent with the reference temperature curve, besides comparing the waveform diagram, the judgment can also be made by using multiple parameter values in the temperature change information. For example, the reference temperature curve set by the user includes parameter values such as the cooling time, cooling amplitude, and warming time of the end portion 121. Correspondingly, the temperature change information includes the actual cooling time of the end portion 121 in the current state. t1, the actual cooling amplitude T1 and the actual temperature recovery time t2 and other parameter values, if these parameter values are consistent, it can be inferred that the actual temperature curve of the end 121 is consistent with the reference temperature curve. Of course, the more parameter values used in the judgment process, the more accurate the judgment result will be.

In some embodiments, as shown in FIG. 1 , the first temperature sensor 13 and the second temperature sensor 16 are contact temperature sensors, which may, for example, not be limited to utilize thermocouples for temperature sensing. In other embodiments, as shown in FIG. 5 , the first temperature sensor 13 and the second temperature sensor 16 are non-contact temperature sensors, which can be, for example but not limited to, infrared thermal imagers.

FIG. 6 is a step diagram of a soldering iron management method in a preferred embodiment of the present disclosure, wherein the soldering iron management method is applicable to the soldering iron management system 1 of FIG. 1 . After the soldering iron 12 performs multiple soldering processes, the soldering iron management method can be used to determine whether the soldering iron 12 needs to be replaced. As shown in FIG. 6 , the soldering iron management method includes steps S1 , S2 , S3 and S4 .

In step S1, the temperature of the end portion 121 of the soldering iron 12 is continuously sensed. In step S2 , the end portion 121 is heated, and the end portion 121 is brought into contact with the target object 11 . In step S3 , temperature change information is obtained according to the change of the temperature of the end portion 121 when the end portion 121 is in contact with the target object 11 . In some embodiments, the temperature change information includes the actual temperature curve of the end portion 121 . In step S4, it is judged whether the temperature change information satisfies the preset condition or whether the actual temperature curve is consistent with the first reference temperature curve, and if the judgment result is yes, the soldering iron 12 is replaced. If the judgment result of step S4 is negative, it means that the wear of the soldering iron 12 is not enough to affect the process, so the soldering iron 12 will continue to be used in the soldering process, and the soldering iron 12 will not be replaced.

In some embodiments, the temperature change information in step S3 includes the actual cooling time t1 of the end portion 121 , and the actual cooling time t1 is different from the reference cooling time t1r by a first difference Δt1 . Correspondingly, in step S4, the preset condition includes that the first difference Δt1 is greater than the first preset value. In some embodiments, the temperature change information in step S3 includes the actual warm-up time t2 of the end portion 121, the actual warm-up time t2 is different from the reference warm-up time t2r by a second difference Δt2, and in step S4, the preset condition It includes that the second difference Δt2 is greater than the second preset value. In some embodiments, the temperature change information in step S3 includes the actual temperature reduction amplitude T1 of the end portion 121, and the actual temperature reduction amplitude T1 is different from the reference temperature reduction amplitude T1r by a third difference ΔT1. In step S4, the preset condition It includes that the third difference ΔT1 is greater than the third preset value.

In some embodiments, the soldering iron management method further includes step S5 after step S3: determining whether the temperature change information satisfies a preset condition or determining whether the actual temperature curve matches the second reference temperature curve. If the judgment result of step S5 is yes, maintenance operation is performed on the soldering iron 12, and the soldering iron 12 is continued to be used in the soldering process after the maintenance. If the judgment result of step S5 is no, then step S4 is executed to judge whether the soldering iron 12 needs to be replaced. The preset conditions in step S5 can refer to the preset conditions in step S4 to set specific conditions, and adjust according to various possible damage situations, and will not be repeated here. In other embodiments, the sequence of step S5 can also be performed after step S4, that is, step S4 is performed first to determine whether the soldering iron needs to be replaced, and if it is determined that the soldering iron does not need to be replaced, then step S5 is performed to determine whether the soldering iron needs to be maintained Operation.

In some embodiments, the soldering iron management method further includes a step before step S2: continuously sensing the temperature of the target object 11 . The step S3 of the soldering iron management method further includes: obtaining the actual temperature rise time t3 of the target 11 according to the change of the temperature of the target 11 when the end portion 121 is in contact with the target 11 . The actual temperature rise time t3 is different from the reference temperature rise time t3r by a fourth difference Δt3. The soldering iron management method further includes a step after step S3: judging whether the fourth difference Δt3 is greater than a fourth preset value, and if the judging result is yes, replacing the soldering iron 12 .

To sum up, the present disclosure provides a soldering iron management system and method. Through the temperature change information during the contact process between the soldering iron and the target object, the thermal conductivity of the soldering iron can be obtained in real time. Therefore, it can be accurately determined when the thermal conductivity of the soldering iron is lower than Replace the soldering iron at preset levels. In this way, stable product quality can be maintained, and waste caused by premature replacement of soldering irons can be avoided. Moreover, the soldering iron management system and method of the present disclosure can sense the temperature of the target object, and estimate the heat conduction performance of the soldering iron by comparing the temperature rise time of the target object with a reference value, thereby enhancing the accuracy of the heat conduction performance of the soldering iron. What's more, the soldering iron management system and method of the present disclosure can timely maintain the soldering iron when a specific damage occurs, thereby increasing the service life of the soldering iron.

It should be noted that the above-mentioned preferred embodiments are only proposed to illustrate the present disclosure, and the present disclosure is not limited to the described embodiments, and the scope of the present disclosure is determined by the claims. Moreover, the present disclosure can be modified in various ways by those skilled in the art without departing from what is intended to be protected by the claims.

Claims (13)

1. A soldering iron management system, comprising: a target; a soldering iron having an end, wherein the end is heated and in contact with the target; a first temperature sensor configured to sense the temperature of the end; and a processing unit connected to the first temperature sensor to receive the temperature of the end, wherein the processing unit generates the A temperature change information is obtained, the temperature change information includes an actual temperature curve of the end, and the soldering iron is replaced when the actual temperature curve of the end is consistent with a first reference temperature curve. 2. The soldering iron management system according to claim 1, wherein the temperature change information includes an actual cooling time of the end portion, the actual cooling time differs from a reference cooling time by a first difference, and the temperature change information satisfies The soldering iron is replaced under a preset condition, and the preset condition includes that the first difference is greater than a first preset value. 3. The soldering iron management system as claimed in claim 1, wherein the temperature change information includes an actual warm-up time of the end portion, the actual warm-up time differs from a reference warm-up time by a second difference, at the temperature The soldering iron is replaced when the change information satisfies a preset condition, and the preset condition includes that the second difference is greater than a second preset value. 4. The soldering iron management system as claimed in claim 1, wherein the temperature change information includes an actual cooling amplitude of the end portion, the actual cooling amplitude is different from a reference cooling amplitude by a third difference, at the temperature The soldering iron is replaced when the change information satisfies a preset condition, and the preset condition includes that the third difference is greater than a third preset value. 5. The soldering iron management system as claimed in claim 1, wherein when the actual temperature curve of the end part matches a second reference temperature curve, a maintenance operation is performed on the soldering iron. 6. The soldering iron management system as claimed in claim 1, further comprising a second temperature sensor, wherein the second temperature sensor is connected to the processing unit, and the second temperature sensor is structured to sense and providing the temperature of the object to the processing unit, wherein the processing unit obtains an actual temperature rise time of the object according to the change of the temperature of the object during the contact of the end portion with the object, the processing unit The actual heating time differs from a reference heating time by a fourth difference, and the soldering iron is replaced when the fourth difference is greater than a fourth preset value. 7. A soldering iron management method, comprising: Step S1 continuously senses the temperature of one end of a soldering iron; Step S2 heating the end and bringing the end into contact with an object; Step S3 obtains a temperature change information according to the change of the temperature of the end when the end is in contact with the object, wherein the temperature change information in the step S3 includes an actual temperature curve of the end , in the step S4, it is judged whether the actual temperature curve is consistent with a first reference temperature curve, if the judgment result is yes, then the soldering iron is replaced. 8. The soldering iron management method as claimed in claim 7, wherein the temperature change information in the step S3 includes an actual cooling time of the end portion, and the actual cooling time differs from a reference cooling time by a first difference, step S4 judges whether the temperature change information satisfies a preset condition, and if the judged result is yes, replace the soldering iron. In the step S4, the preset condition includes that the first difference is greater than a first preset value. 9. The soldering iron management method as claimed in claim 7, wherein the temperature change information in the step S3 includes an actual temperature recovery time of the end portion, and the actual temperature recovery time differs from a reference temperature recovery time by a second difference value, step S4 judges whether the temperature change information satisfies a preset condition, if the judgment result is yes, then replace the soldering iron, in the step S4, the preset condition includes that the second difference is greater than a second preset value . 10. The soldering iron management method as claimed in claim 7, wherein the temperature change information in the step S3 includes an actual cooling amplitude of the end portion, the actual cooling amplitude differs from a reference cooling amplitude by a third difference value, step S4 judges whether the temperature change information satisfies a preset condition, if the judgment result is yes, replace the soldering iron, in the step S4, the preset condition includes that the third difference is greater than a third preset value . 11. The soldering iron management method as claimed in claim 7, wherein the temperature change information in the step S3 includes the actual temperature curve of the end, step S4 judges whether the temperature change information satisfies a preset condition, if the judgment result If yes, replace the soldering iron. Before step S4 is performed, a step S5 is further included: judging whether the actual temperature curve is consistent with a second reference temperature curve, and if the judging result is yes, performing a maintenance operation on the soldering iron. 12. The soldering iron management method as claimed in claim 7, wherein the temperature change information in the step S3 includes the actual temperature curve of the end, and step S4 judges whether the temperature change information satisfies a preset condition, if the judgment result If yes, then replace the soldering iron, and if it is judged in step S4 that the temperature change information does not meet the preset condition, then execute a step S5: judge whether the actual temperature curve is consistent with a second reference temperature curve, if the judgment result is yes , perform a maintenance operation on the soldering iron. 13. The soldering iron management method as claimed in claim 7, further comprising the step before the step S2: continuously sensing the temperature of the target; wherein the step S3 further comprises connecting the end with the target according to the temperature of the target The changes generated during the phase contact process obtain an actual heating time of the target object; the actual heating time differs from a reference heating time by a fourth difference; and the soldering iron management method further includes steps after the step S3: It is judged whether the fourth difference is greater than a fourth preset value, and if the judgment result is yes, the soldering iron is replaced.

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