CN113271728A - Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window - Google Patents
Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window Download PDFInfo
- Publication number
- CN113271728A CN113271728A CN202110539786.4A CN202110539786A CN113271728A CN 113271728 A CN113271728 A CN 113271728A CN 202110539786 A CN202110539786 A CN 202110539786A CN 113271728 A CN113271728 A CN 113271728A
- Authority
- CN
- China
- Prior art keywords
- plate
- air guide
- production
- guide plate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 claims abstract description 99
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 238000007650 screen-printing Methods 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 12
- 238000011161 development Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 26
- 230000007547 defect Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000006087 Brown hydroboration reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an air guide plate and a method for improving bad ink hole plugging of VIA holes of a circuit board window, wherein the air guide plate comprises a flat plate with a flat surface, a plurality of grooves are formed in the upper surface of the flat plate at intervals along the length direction or the width direction of the flat plate, the cross sections of the grooves are in a trapezoid shape with a large upper part and a small lower part, adjacent grooves are separated through an inverted V-shaped supporting part, at least one air guide hole penetrates through the bottom of each groove, and the peripheral plate edges of the upper surface of the flat plate are flat. The invention utilizes the trapezoidal groove and the inverted V-shaped supporting part in the air guide plate to avoid the superposition of the holes on the production plate, and ensures that the production plate can not block the holes during solder mask screen printing, thereby avoiding the problem of poor hole plugging.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to an air guide plate and a method for improving poor ink hole plugging of a windowing VIA hole of a circuit board.
Background
With the development of electronic information technology, electronic products tend to be portable and more precise, and the requirements of windowing VIA holes to block holes are more and more common due to wiring design and welding requirements.
The existing VIA windowing hole plugging mode generally adopts a resin hole plugging mode or a solder resist ink hole plugging mode at present, and the solder resist ink hole plugging mode comprises a normal solder resist ink hole plugging process flow and a solder resist ink hole plugging ink point process flow; wherein, the resin hole plugging process is as follows: the method comprises the steps of a front process → copper plate deposition electric → resin plug hole → abrasive belt grinding plate → outer layer pattern → solder mask (including solder mask plug hole process) → a rear process → packaging and shipping; the normal solder resist ink hole plugging process flow is as follows: the method comprises the following steps of a front process → copper plate deposition electric → an outer layer pattern → solder mask (simultaneously performing a solder mask plug hole and a surface solder mask process) → a rear process → packaging and shipping; solder resist ink hole plugging ink dot process flow: pre-process → solder resist plug hole → pre-baking → alignment exposure → development → high temperature curing → sanding plate → normal solder resist → character → post-process → packaging shipment.
In the above, the resin hole plugging process has a large application limitation due to long process flow, high production cost, low production efficiency and high equipment investment, and is mainly applied to high value-added circuit board products; and adopt and hinder welding ink consent mode, need use air guide plate and production board cooperation to carry out the consent, receive the structural constraint of current air guide plate, the inevitable meeting of some holes of circuit board can coincide with the air guide plate in the printing ink consent process, consequently appears the phenomenon that the hole can not the evacuation, leads to some holes to appear not full grade poor quality problem of consent.
In addition, the windowing VIA hole is produced by adopting a normal hole plugging mode of solder resist ink, so that the quality defect of PAD on ink bleeding oil caused by influence of various factors of the ink cannot be avoided, the efficiency of surface treatment processing and manual inspection repair of the post-procedure is influenced, and the problem of customer complaint caused by welding abnormity in the part pasting process due to leakage can be avoided; for the design of windowing VIA hole plugging, the normal hole plugging mode of solder resist ink can only sacrifice cost and change into a resin hole plugging process due to the irresolvable process limitation, and the problem of long process flow and high production cost of the resin hole plugging is unacceptable for many customers; adopt and hinder welding ink consent process flow processing among the above-mentioned, although can reduce the proportion of bleeding, can not avoid the bleeding problem completely, the consent hinders with the surface and welds separately twice preparation moreover, has increased once and has hindered the processing flow, has increased the production flow who hinders and welds, and the influence hinders and welds process output, has reduced production efficiency, increases the running cost of enterprise, does not reach lean production purpose.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the air guide plate, the air guide plate can avoid the superposition of holes on the production plate by utilizing the trapezoidal grooves and the inverted V-shaped supporting parts, and ensure that the production plate can not block the holes during solder mask and screen printing, thereby avoiding the problem of poor hole plugging.
In order to solve the technical problem, the invention provides an air guide plate which comprises a flat plate with a flat surface, wherein a plurality of grooves are formed in the upper surface of the flat plate at intervals along the length direction or the width direction of the flat plate, the cross sections of the grooves are trapezoidal, the upper parts of the grooves are larger than the lower parts of the grooves, the adjacent grooves are separated through an inverted V-shaped supporting part, at least one air guide hole penetrates through the bottom of each groove, and the peripheral plate edges of the upper surface of the flat plate are flat.
Furthermore, the plate edge of the flat plate is provided with a positioning hole.
Furthermore, the plate edge of the flat plate is provided with a positioning slot hole.
Further, the length and width of the flat plate are the same as those of a production plate to be subjected to resistance welding treatment, and the width of the plane is the same as that of the plate edge of the production plate.
Further, the flat plate is an epoxy resin plate.
The invention also provides a method for improving poor ink plugging of VIA holes of a circuit board, which adopts the air guide plate to produce, wherein the plate edge of the production plate corresponds to the plate edge of the air guide plate, and the graphic area of the production plate corresponds to the groove area on the air guide plate, and the method comprises the following steps:
s1, aligning and fixing the air guide plate and the production plate, enabling the upper surface of the production plate to be located at the outer side, enabling the surface with the groove in the air guide plate to be located at the inner side, and placing the air guide plate and the production plate in a vacuum hole plugging machine or a screen printing machine;
s2, silk-screen printing ink on the upper surface of the production plate, and vacuumizing through the air guide holes of the air guide plate in the silk-screen printing process, so that the holes of the production plate are filled with the ink;
s3, after the production board is turned over, the production board and the air guide plate are aligned and fixed, the lower surface of the production board is located on the outer side, and the production board and the air guide plate are placed in a vacuum hole plugging machine or a screen printing machine;
s4, printing ink on the lower surface of the production plate in a silk-screen manner, and vacuumizing through air holes of the air guide plate in the silk-screen manner;
s5, pre-baking the production board in a three-stage low-temperature baking mode; wherein the baking temperature in the first stage is not more than 45 ℃, the baking temperature in the second stage is 50 ℃, and the baking temperature in the third stage is 60-75 ℃;
s6, forming a solder mask pattern on the production board after the procedures of exposure and development in sequence;
and S7, baking the production plate to solidify the ink.
Further, in step S5, the first stage is baking at 45 deg.C for 20min, the second stage is baking at 50 deg.C for 30min, and the third stage is baking at 75 deg.C for 30 min.
Further, the type of the ink is SK 3101.
Further, in step S7, the production board is baked at 155 ℃ for 60 min.
Furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg, and the multilayer board sequentially passes through the working procedures of drilling, copper deposition, full-board electroplating and outer circuit manufacturing.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the air guide plate can avoid the superposition of the holes on the production plate by utilizing the trapezoidal grooves and the inverted V-shaped supporting parts, and the inverted V-shaped supporting parts enable the contact between the pattern area in the middle of the production plate and the air guide plate to be line contact, so that the phenomenon of hole blockage of the production plate during solder-resisting screen printing is avoided, and the problem of poor hole plugging caused by insufficient hole plugging is avoided; in addition, utilize the supporting part to support the production board, avoid when the evacuation because of the too big quality problems such as board bending and fracture that lead to of fretwork between production board and the air guide plate to appear.
The invention also provides a method for plugging holes by using the air guide plate, which can avoid the problem of poor plugging holes caused by the fact that the plugging holes are not full by the effect of the air guide plate and the mode of respectively carrying out vacuum screen printing on the front surface and the back surface of the production plate to plug the holes, and then simultaneously carrying out ink plugging holes and surface solder mask screen printing by adopting a one-time screen printing mode, thereby reducing the solder mask plugging hole flow in the existing ink dot process, improving the solder mask production efficiency, increasing the solder mask production capacity, reducing the efficiency loss of the solder mask caused by the increase of the ink dot process, increasing the operation quality problems of wiping and the like caused by the increase of the operation flow and achieving the purpose of lean production; in addition adopt the mode that three-stage low temperature toasted and heat up in proper order when prebaking, and through the temperature when controlling every stage and toasting, make downthehole printing ink and surface printing ink all be baked dry and realize preliminary solidification, and can avoid downthehole printing ink to bake not dry and surface printing ink to dry excessive problem, thereby solve when the later stage develops because of downthehole printing ink not dry totally and overflow to flow to PAD on lead to PAD's quality defect on the printing ink, the quality defect that PAD on the oil that appears exploding when directly adopting higher temperature single-stage prebaking in the current still can be avoided.
Drawings
FIG. 1 is a schematic view of an air guide plate in an embodiment;
FIG. 2 is a cross-sectional view of an air guide plate in the embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and explained with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1-2, the air guide plate of the present embodiment includes a flat plate 1 having a flat surface and a square shape, a plurality of grooves 2 are formed on the upper surface of the flat plate 1 at intervals along the length or width direction thereof, the cross-section of each groove 2 is a trapezoid having a large top and a small bottom, so that the adjacent grooves 2 are separated by an inverted V-shaped support portion 3, at least one air guide hole 4 is formed through the bottom of each groove 2, the single groove can be vacuumized by the air guide hole, the peripheral plate edges of the upper surface of the flat plate 1 are flat surfaces 11, and the inner grooves of the air guide plate form a sealing structure after the air guide plate and a production plate are aligned and fixed by the flat structure, thereby realizing the vacuumization operation of the air guide hole; in the above, the air guide plate can avoid the holes on the production plate from being overlapped with the trapezoidal grooves and the inverted-V-shaped supporting parts, and the inverted-V-shaped supporting parts enable the contact between the pattern area in the middle of the production plate and the air guide plate to be line contact, so that the production plate is ensured not to have the phenomenon of hole blockage during solder-resisting screen printing, and the problem of poor hole blockage caused by insufficient hole blockage is avoided; in addition, utilize the supporting part to support the production board, avoid when the evacuation because of the too big quality problems such as board bending and fracture that lead to of fretwork between production board and the air guide plate to appear.
Specifically, the plate edge of the flat plate 1 is provided with a positioning hole 5 and a universal positioning slot hole 6, and the positioning hole or the universal positioning slot hole is aligned and fixed with the production plate.
Specifically, the length and width of the flat plate 1 are the same as those of a production plate to be subjected to solder resist treatment, and the width of the plane 11 is the same as that of the plate edge (i.e., non-graphic area) of the production plate, so that the graphic area in the middle of the production plate is ensured to be overlapped with the groove area on the gas guide plate, and thus, the problem of hole plugging is solved by realizing line contact between the graphic area and the groove area.
In this embodiment, the flat plate 1 is an epoxy resin plate.
In an embodiment, two air holes are disposed in each groove, and the two air holes are disposed at two ends of the groove, so as to ensure better vacuum-pumping treatment of the whole groove.
Example 2
The method for manufacturing a circuit board shown in this embodiment includes a method for improving poor ink plugging of VIA holes of a circuit board, where the method includes performing ink plugging production by using the air guide plate described in embodiment 1, where a plate edge of a production plate corresponds to a plate edge of the air guide plate, and a pattern area of the production plate corresponds to a groove area on the air guide plate, and the specific process includes:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the outer layer copper foil is 0.5 oz.
(2) Inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film on the core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing inner layer circuit exposure on the core plate by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming an inner layer circuit pattern on the core plate through development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: and (3) brown oxidation speed is realized according to the thickness of the bottom copper, and the outer copper foil, the prepreg, the inner core plate, the prepreg and the outer copper foil are sequentially laminated and then are pressed by selecting proper lamination conditions according to the characteristics of the plate to form the production plate.
(4) And outer layer drilling, namely drilling holes in the production board by using a mechanical drilling mode according to the drilling data, wherein the drilled holes comprise plug holes to be filled with resin.
(5) And depositing a layer of thin copper on the hole wall in a chemical reaction mode to metalize the hole on the production board, and testing the hole with 10 grades in a backlight mode, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) And electroplating the whole plate: according to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of the copper deposition.
(7) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; and (3) outer layer pattern electroplating, then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min by using a current density of 1.8ASD, the tin plating is carried out for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then sequentially stripping, etching and stripping the tin, etching an outer layer circuit and an outer layer AOI on the production plate, then checking the defects of the outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, carrying out defective scrapping treatment, and discharging the product without defects to the next process.
(8) Resistance welding pretreatment: and removing oxides, oil stains and impurities on the board surface and the wall of the through hole, and roughening the surface of the circuit copper layer.
(9) Solder resist and silk screen printing of characters: printing TOP surface solder resist ink by adopting a white screen, and adding a UL mark to TOP surface characters; specifically, a protective layer for preventing bridging between circuits during welding, providing a permanent electrical environment and resisting chemical corrosion is coated on the circuits and the base materials which do not need welding, and the protective layer has the function of beautifying the appearance, and the method specifically comprises the following steps:
a. after the air guide plate and the production plate are aligned and fixed, the upper surface of the production plate is positioned at the outer side, the surface with the groove in the air guide plate is positioned at the inner side, and the air guide plate and the production plate are fixedly arranged in a vacuum hole plugging machine or a screen printing machine;
b. then, printing ink is printed on the upper surface of the production plate in a silk-screen manner, and vacuumizing treatment is carried out through the air guide holes of the air guide plate in the silk-screen process, so that the printing ink is filled in the holes of the production plate and flows out from the hole opening at the lower end;
c. after the production plate is turned over, the production plate and the air guide plate are aligned and fixed, so that the lower surface of the production plate is positioned at the outer side, and then the production plate and the air guide plate are placed in a vacuum hole plugging machine or a screen printing machine;
d. then, printing ink is printed on the lower surface of the production plate in a silk-screen mode, and vacuumizing treatment is carried out through air guide holes of the air guide plate in the silk-screen printing process, so that the upper and lower orifices of the holes are filled with the printing ink;
e. pre-baking the production plate by adopting a three-stage low-temperature baking mode; wherein the first stage is baking at 45 deg.C for 20min, the second stage is baking at 50 deg.C for 30min, and the third stage is baking at 75 deg.C for 30 min;
f. carrying out counterpoint exposure treatment on the upper surface and the lower surface of the production board by adopting a negative film with a solder mask pattern, further solidifying the board surface ink and the hole plugging ink at the solder mask pattern, and then forming the solder mask pattern on the production board through a developing process;
g. the production plate is baked at 155 ℃ for 60min for post-curing treatment, so that the ink is completely cured.
In the above, the ink is the special ink with the type SK3101, and can be better matched with the pre-baking parameters to achieve the technical effect of the invention.
(10) And electrical test: the electric conduction performance of the production board is tested, and the board use test method comprises the following steps: and (5) flying probe testing.
(11) And surface treatment: according to the prior art and according to the design requirement, nickel and gold with certain required thickness are uniformly deposited on the copper surface of a solder mask windowing position (a welding pad) through a chemical principle.
(12) And forming: according to the prior art, the shape is milled according to the design requirement, and the tolerance of the shape is +/-0.05mm, so that the circuit board is manufactured.
(13) FQC: and (4) inspecting the appearance of the circuit board according to the customer acceptance standard and the I's inspection standard, and timely repairing the circuit board if a defect exists so as to ensure that excellent quality control is provided for the customer.
(14) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(15) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides an air guide plate, its characterized in that, includes the dull and stereotyped of surfacing, be equipped with a plurality of recess along its length or width direction interval on the dull and stereotyped upper surface, the cross-section of recess is trapezoidal big-end-up, makes the supporting part through the font of falling V separate between the adjacent recess, the bottom of recess is run through and is equipped with at least one air guide hole, the flange limit all around of dull and stereotyped upper surface is the plane.
2. The air guide plate of claim 1, wherein the plate edges of the flat plate are provided with positioning holes.
3. The air guide plate of claim 1, wherein the plate edges of the flat plate are provided with positioning slots.
4. The air guide plate according to claim 1, wherein the length and width dimensions of the flat plate are the same as those of a production plate to be solder-resist-treated, and the width of the flat surface is the same as the plate edge width of the production plate.
5. The air guide plate according to any one of claims 1 to 4, wherein the flat plate is an epoxy resin plate.
6. A method for improving VIA hole ink plugging failure in circuit board windowing, wherein the air guide plate of any one of claims 1-5 is used for production, wherein the plate edge of the production plate corresponds to the plate edge of the air guide plate, and the pattern area of the production plate corresponds to the groove area on the air guide plate, and the method comprises the following steps:
s1, aligning and fixing the air guide plate and the production plate, enabling the upper surface of the production plate to be located at the outer side, enabling the surface with the groove in the air guide plate to be located at the inner side, and placing the air guide plate and the production plate in a vacuum hole plugging machine or a screen printing machine;
s2, silk-screen printing ink on the upper surface of the production plate, and vacuumizing through the air guide holes of the air guide plate in the silk-screen printing process, so that the holes of the production plate are filled with the ink;
s3, after the production board is turned over, the production board and the air guide plate are aligned and fixed, the lower surface of the production board is located on the outer side, and the production board and the air guide plate are placed in a vacuum hole plugging machine or a screen printing machine;
s4, printing ink on the lower surface of the production plate in a silk-screen manner, and vacuumizing through air holes of the air guide plate in the silk-screen manner;
s5, pre-baking the production board in a three-stage low-temperature baking mode; wherein the baking temperature in the first stage is not more than 45 ℃, the baking temperature in the second stage is 50 ℃, and the baking temperature in the third stage is 60-75 ℃;
s6, forming a solder mask pattern on the production board after the procedures of exposure and development in sequence;
and S7, baking the production plate to solidify the ink.
7. The method of claim 6, wherein in step S5, the first stage is baking at 45 ℃ for 20min, the second stage is baking at 50 ℃ for 30min, and the third stage is baking at 75 ℃ for 30 min.
8. The method of improving VIA hole imperfection of circuit board windowing VIA ink as claimed in claim 6, wherein said ink is type SK 3101.
9. The method for improving poor VIA-filling of windowing VIA hole ink of a circuit board as claimed in claim 6, wherein in step S7, the production board is baked at 155 ℃ for 60 min.
10. The method for improving VIA hole ink plugging failure of circuit board as claimed in claim 6, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil together by a prepreg, and the multi-layer board is subjected to drilling, copper deposition, full-board electroplating and outer circuit manufacturing processes in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110539786.4A CN113271728A (en) | 2021-05-18 | 2021-05-18 | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110539786.4A CN113271728A (en) | 2021-05-18 | 2021-05-18 | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113271728A true CN113271728A (en) | 2021-08-17 |
Family
ID=77231455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110539786.4A Withdrawn CN113271728A (en) | 2021-05-18 | 2021-05-18 | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113271728A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114938566A (en) * | 2022-06-14 | 2022-08-23 | 高创(苏州)电子有限公司 | Circuit board and display device having the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519668A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Circuit board jig and ink hole-plugging method |
| CN208353724U (en) * | 2018-06-29 | 2019-01-08 | 广州兴森快捷电路科技有限公司 | Consent aeroscopic plate |
| CN209546022U (en) * | 2018-10-30 | 2019-10-25 | 深圳市景旺电子股份有限公司 | Air guide backing plate for printed circuit board consent |
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
| CN212486882U (en) * | 2020-05-14 | 2021-02-05 | 领跃电子科技（珠海）有限公司 | Novel line plughole printed base plate |
-
2021
- 2021-05-18 CN CN202110539786.4A patent/CN113271728A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519668A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Circuit board jig and ink hole-plugging method |
| CN208353724U (en) * | 2018-06-29 | 2019-01-08 | 广州兴森快捷电路科技有限公司 | Consent aeroscopic plate |
| CN209546022U (en) * | 2018-10-30 | 2019-10-25 | 深圳市景旺电子股份有限公司 | Air guide backing plate for printed circuit board consent |
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
| CN212486882U (en) * | 2020-05-14 | 2021-02-05 | 领跃电子科技（珠海）有限公司 | Novel line plughole printed base plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114938566A (en) * | 2022-06-14 | 2022-08-23 | 高创(苏州)电子有限公司 | Circuit board and display device having the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108323037B (en) | PCB processing technology of double-sided step position electro-gold | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN111867271A (en) | Method for manufacturing variegated ink solder mask of thick copper plate | |
| CN111182743B (en) | Manufacturing method of ceramic-based circuit board | |
| CN110708859A (en) | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block | |
| CN112423476A (en) | Method for improving poor hole plugging of PCB resin | |
| CN111867266A (en) | Circuit design method for preventing short circuit of isolated circuit of PCB | |
| CN112770549B (en) | Covered aluminum foil and method for improving lamination glue overflow of embedded copper block PCB | |
| CN113873762B (en) | PCB with surface treatments of nickel-gold deposition and oxidation resistance and manufacturing method thereof | |
| CN111836485A (en) | Manufacturing process of twice stepped plate | |
| CN111669905B (en) | Core plate, manufacturing method thereof and method for preventing bending plate of laminated plate from warping | |
| CN110267443A (en) | A kind of production method of the positive wiring board with ladder route | |
| CN112752435B (en) | Method for improving pad removal of blind holes of multi-order circuit board and multi-order circuit board | |
| CN110602890A (en) | Manufacturing method of negative film circuit board with step circuit | |
| CN110913601B (en) | Method for manufacturing solder mask translation film | |
| CN114615830B (en) | Method for improving lamination glue overflow of copper-embedded circuit board | |
| CN112235961A (en) | Manufacturing method for improving tin coating on gold surface of blue rubber plate | |
| CN110785013A (en) | Manufacturing method for improving foaming and explosion of circuit board | |
| CN113271728A (en) | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window | |
| CN211240272U (en) | Bendable substrate | |
| CN109831874A (en) | A method of solving the upper PAD of the quick-fried oil of welding resistance | |
| CN112165769A (en) | Method for improving processing efficiency of small PCS (process control System) board | |
| CN112757380A (en) | Method for improving drilling efficiency of high-density micro holes of circuit board | |
| CN116456630A (en) | Manufacturing method of high-heat-dissipation printed circuit board | |
| CN110809372B (en) | Manufacturing method for improving solder resist white oil dropping |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210817 |