CN113238459B - Optical device, exposure device, and article manufacturing method - Google Patents
Optical device, exposure device, and article manufacturing method Download PDFInfo
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- CN113238459B CN113238459B CN202110140250.5A CN202110140250A CN113238459B CN 113238459 B CN113238459 B CN 113238459B CN 202110140250 A CN202110140250 A CN 202110140250A CN 113238459 B CN113238459 B CN 113238459B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 134
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 230000008859 change Effects 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 abstract description 20
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 238000006731 degradation reaction Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 91
- 230000008569 process Effects 0.000 description 11
- 238000005286 illumination Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Lens Barrels (AREA)
Abstract
The invention provides an optical device, an exposure device and a method for manufacturing an article. In order to provide an optical device capable of reducing thermal influence due to exposure and suppressing degradation of imaging performance, an optical device according to the present invention includes: an optical element (5); a lens barrel (11) for accommodating the optical element (5); a travel direction setting means (16) for setting the travel direction of the gas (17) supplied from the gas supply means into the lens barrel (11); and a control unit (18) for controlling the travel direction setting mechanism (16) so as to change the travel direction of the gas (17).
Description
Technical Field
The invention relates to an optical device, an exposure device and a method for manufacturing an article.
Background
In the related art, it is known that in an optical device, an optical element provided in a lens barrel generates heat by light irradiation, and thus the refractive index of a gas in the lens barrel changes with temperature, resulting in a reduction in imaging performance.
For this purpose, the following measures are taken: by supplying a temperature-adjusting gas into the barrel of the optical device, the optical element and the gas around the optical element are cooled.
On the other hand, if the temperature adjustment gas is supplied at the time of exposure in the optical path space of the projection optical system provided in the barrel of the exposure apparatus, there is a possibility that: a fluctuation occurs around the projection optical system due to a difference in the flow velocity of the gas, or vibration occurs in an optical element constituting the projection optical system, resulting in a reduction in imaging performance.
Japanese patent application laid-open No. 2008-292761 discloses an exposure apparatus that does not supply a temperature-adjusting gas to a projection optical system in a lens barrel at the time of exposure and supplies the temperature-adjusting gas only at the time of non-exposure in order to suppress a decrease in imaging performance.
However, as in the exposure apparatus disclosed in japanese patent application laid-open No. 2008-292761, if the supply of the temperature-adjusting gas into the lens barrel is stopped at the time of exposure, the positive pressure in the lens barrel can no longer be ensured. Thus, there is a possibility that chemical contamination may occur in an optical element provided in the lens barrel due to gas entering from the outside.
Further, when the supply of the temperature-adjusting gas into the lens barrel is stopped at the time of exposure, the refractive index changes with the temperature or pressure fluctuation of the gas in the lens barrel as described above, and the imaging performance is lowered.
Disclosure of Invention
Accordingly, an object of the present invention is to provide an optical device capable of reducing thermal influence due to exposure and suppressing degradation of imaging performance.
An optical device according to the present invention is characterized by comprising: an optical element; a lens barrel accommodating an optical element; a travel direction setting mechanism that sets a travel direction of the gas supplied from the gas supply mechanism into the lens barrel; and a control unit that controls the travel direction setting mechanism so as to change the travel direction of the gas.
Drawings
Fig. 1A is a schematic cross-sectional view of an exposure apparatus including an optical device according to a first embodiment in a non-exposure state.
Fig. 1B is a schematic cross-sectional view of an exposure apparatus including an optical device according to the first embodiment at the time of exposure.
Fig. 2 is a flowchart showing control of switching of a shutter in the exposure apparatus including the optical device according to the first embodiment.
Fig. 3 is a schematic cross-sectional view of an exposure apparatus including an optical device according to a second embodiment at the time of exposure.
Fig. 4 is a schematic cross-sectional view of an exposure apparatus including an optical device according to a third embodiment at the time of exposure.
Fig. 5 is a schematic cross-sectional view of an exposure apparatus including an optical device according to a fourth embodiment at the time of exposure.
Fig. 6 is a schematic cross-sectional view of an exposure apparatus including an optical device according to a fifth embodiment at the time of exposure.
Detailed Description
The optical device according to the present embodiment will be described in detail below with reference to the drawings. The drawings shown below are drawn on a scale different from the actual scale so that the present embodiment can be easily understood.
In the following description, a direction perpendicular to the light sensing surface of the plate 4 is referred to as a Z direction, and two directions orthogonal to each other in the light sensing surface of the plate 4 are referred to as an X direction and a Y direction, respectively.
First embodiment
Fig. 1A and 1B are schematic cross-sectional views of an exposure apparatus 100 including an optical device according to a first embodiment in a non-exposure state and an exposure state, respectively.
The exposure apparatus 100 including an optical device according to the present embodiment includes an illumination system 1, a collimator lens 2, a projection optical system 5 (optical element), a lens barrel 11, a control unit 18, and a pressure sensor 19.
As shown in fig. 1A and 1B, the projection optical system 5 includes a reflecting mirror 7, a concave mirror 8, and a convex mirror 9.
As shown in fig. 1A and 1B, the lens barrel 11 is provided with an exhaust port 14, an air supply port 15, and a shutter 16 (a travel direction setting mechanism, a variable shutter).
The optical device according to the present embodiment is constituted by the projection optical system 5, the lens barrel 11, the shutter 16, the control unit 18, and the pressure sensor 19.
In the exposure apparatus 100, after passing through the mask 3 (original plate), the illumination light 12 (exposure light) from the illumination system 1 is irradiated to the plate 4 (substrate) via the projection optical system 5, whereby an image of the pattern drawn on the mask 3 is projected (transferred) onto the photoreceptor on the plate 4.
In the exposure apparatus 100, a mask stage, not shown, on which the mask 3 is placed and a board stage, not shown, on which the board 4 is placed are scanned in synchronization with each other in the Y direction.
In general, the lens barrel 11 and the components of the exposure apparatus 100 are provided in a temperature adjusting chamber, not shown, to ensure their performance.
The gas supply port 15 communicates with a gas supply mechanism (not shown), and a temperature-regulated gas 17 (hereinafter referred to as a temperature-regulated gas) is supplied from the gas supply mechanism into the lens barrel 11 through the gas supply port 15.
The traveling direction of the temperature-adjusting gas 17 supplied from the gas supply port 15 is set by the louver 16.
For example, when a mirror projection type exposure apparatus such as the exposure apparatus 100 is used and a liquid crystal panel is manufactured by photolithography, there are cases where it is necessary to improve the definition.
In this case, in order to increase the irradiation amount of the exposure light 12 to the photoreceptor on the board 4, it is conceivable to increase the illumination intensity of the illumination system 1 and reduce the scanning speed of a board table, not shown, on which the board 4 is mounted.
Here, when the energy per unit time irradiated to the photoconductor on the plate 4 is referred to as the exposure amount (wise), such exposure processing can be referred to as high wise exposure processing (high load exposure processing, high energy incidence processing).
When such high-DOSE exposure processing is performed, the temperature in the lens barrel 11 is higher than that in normal DOSE exposure processing.
This is because the energy of the exposure light 12 incident on the optical element included in the projection optical system 5 becomes large, and the optical element generates heat to a large extent, so that the gas around the optical element is heated.
Further, since the gas heated by the heat generation of the optical element moves upward in the Z direction, the temperature of the gas located upward in the Z direction in the barrel 11 is higher than that in the lower part.
As a result, since the refractive index of the gas above the Z direction, which is raised in temperature, changes, there is a possibility that the imaging performance may be lowered compared with the normal wise exposure processing when the exposure processing is performed in such a state.
In particular, the projection optical system 5 provided in the mirror image projection type exposure apparatus as in the present embodiment includes a concave mirror 8 and a convex mirror 9, and the concave mirror 8 and the convex mirror 9 have optical axes extending in directions intersecting a vertical direction (Z direction) parallel to the incident direction and the emission direction of the exposure light 12.
Therefore, the above-described temperature difference is generated between the surrounding gas in the vertical direction of the concave mirror 8 or the convex mirror 9, and the reduction in imaging performance according to the image height becomes remarkable.
In order to suppress the reduction of imaging performance by reducing the above-described temperature difference in the barrel of the exposure apparatus, measures have been taken to cool the optical element in the barrel by supplying a temperature-adjusting gas into the barrel.
On the other hand, if the temperature-adjusting gas is supplied to the optical path (optical path space) of the exposure light 12 in the lens barrel 11, there is a possibility that: a fluctuation in the flow velocity difference between the gases around the concave mirror 8 or the convex mirror 9 or a vibration occurs in the concave mirror 8 or the convex mirror 9, resulting in a decrease in imaging performance.
Therefore, there is also known a method of suppressing a decrease in imaging performance by temporarily stopping the supply of the temperature-adjusting gas at the time of exposure or at the time of calibration.
However, if the supply of the temperature-adjusting gas is temporarily stopped, the positive pressure in the barrel 11 cannot be maintained, and there is a possibility that chemical contamination may occur in the optical element in the barrel 11 due to the gas entering from the outside.
In addition, since the refractive index changes with temperature or pressure fluctuation of the gas in the lens barrel 11, the imaging performance becomes unstable.
In the exposure apparatus 100 provided with the optical device according to the present embodiment, the following control is performed to solve the above-described problems.
Fig. 2 is a flowchart showing the control of switching the shutter 16 in the exposure apparatus 100 provided with the optical device according to the present embodiment. The control unit 18 performs control described below.
First, it is determined whether or not an instruction for exposure processing has been issued in the exposure apparatus 100 (step S1). If an instruction for exposure processing is not issued, that is, if the exposure apparatus 100 is not in exposure (no in step S1), the shutter 16 is set to be oriented so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11 (step S2). In other words, in step S2, the traveling direction of the temperature-adjusting gas is set (changed) by the louver 16 so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11. Then, the process returns to step S1.
On the other hand, when an instruction for exposure processing is issued, that is, when the exposure apparatus 100 performs exposure processing (yes in step S1), the shutter 16 is set to be oriented so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11 (step S3). In other words, in step S3, the traveling direction of the temperature-adjusting gas is set (changed) by the louver 16 so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11. Then, exposure is started (step S4).
When the exposure is completed, that is, when the exposure apparatus 100 is not exposed (step S5), the shutter 16 is oriented so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11 (step S6), and the process returns to step S1.
As described above, in the exposure apparatus 100, the traveling direction of the temperature adjustment gas is set so that the temperature adjustment gas does not pass through the optical path of the projection optical system 5 during exposure, and the traveling direction of the temperature adjustment gas is set so that the temperature adjustment gas passes through the optical path of the projection optical system 5 during non-exposure.
In the control described above, it is preferable that the shutter 16 is set in the direction so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11 in step S3, and then the exposure is started in step S4 after the pressure in the lens barrel 11 stabilizes (is still fixed).
Accordingly, the exposure apparatus 100 provided with the optical device according to the present embodiment is provided with the pressure sensor 19 for monitoring the pressure in the lens barrel 11.
In the exposure apparatus 100 provided with the optical device according to the present embodiment, it is preferable that the direction of the shutter 16 in step S3 be switched (set) at a timing controlled so as to be performed particularly when the board 4 is replaced.
In addition, the direction of the shutter 16 may be switched when the exposure operation is made standby between batches when processing a plurality of batches of the plates 4.
In addition, it is preferable that when the alignment process is performed with respect to the plate 4, that is, when the alignment light passes through the optical path of the projection optical system 5, the switching of the orientation of the louver 16 is not performed.
In the exposure apparatus 100, the internal space of the lens barrel 11 is set to a weak positive pressure, specifically, to an atmospheric pressure+about 1Pa, in order to suppress air intake from the outside.
On the other hand, when the supply of the temperature-adjusting gas into the barrel 11 is stopped as in the conventional exposure apparatus, the pressure in the internal space of the barrel 11 changes to the atmospheric pressure.
Here, the refractive index of the gas in the barrel 11 when the temperature-adjusting gas is supplied into the barrel 11, that is, the refractive index of the gas at atmospheric pressure+about 1Pa is set to n 1. The refractive index of the gas in the barrel 11 when the supply of the temperature-adjusting gas into the barrel 11 is stopped, that is, the refractive index of the gas at atmospheric pressure is set to n 0.
At this time, the change Δn in refractive index of the gas accompanying the stop of the supply of the temperature-adjusting gas into the lens barrel 11 can be obtained from the following equation (1).
Δn＝n1－n0…(1)
Here, when the temperature-adjusting gas supplied into the lens barrel 11 is air, the refractive indices n 0 and n 1 can be calculated from the adelen equation shown in the following equation (2), respectively.
Here, the pressure P 1 in the barrel 11 when air is supplied into the barrel 11 is 101309Pa, and the pressure P 0 in the barrel 11 when air is stopped from being supplied into the barrel 11 is 101308Pa.
Further, assuming that the temperature T and the humidity H are kept constant at 23 degrees and 50%, respectively, the change Δn in refractive index can be obtained as 2.66×10 －9 according to the formula (2).
This change in refractive index has an influence on imaging performance. Specifically, the change in refractive index causes a shift in focus or distortion in proportion to the length of the optical path, and the shift causes a decrease in imaging performance such as an increase in line width of the pattern transferred from the mask 3 to the plate 4.
In addition, when the temperature adjustment gas is supplied to the optical path space in the lens barrel 11 at the time of exposure, there is a possibility that: sloshing occurs due to a difference in flow velocity between the gases around the optical element, or vibration occurs in the optical element, resulting in a decrease in overlay (superposition) accuracy.
In order to investigate such a decrease in superposition accuracy, the present inventors compared the case where air is supplied to the optical path space in the lens barrel 11 at the time of exposure with the case where air is not supplied.
Specifically, measurement reproducibility in a calibration mechanism using the calibration mirror 2, the mask 3, and the plate 4 was evaluated.
As a result, it was found that the measurement reproducibility in the calibration mechanism was reduced by 40% in the case of supplying air to the optical path space in the lens barrel 11 at the time of exposure, as compared with the case of not supplying air.
In this way, if measurement reproducibility in the calibration mechanism is reduced, variations in calibration and the like occur, and the overlay accuracy is reduced.
As described above, in the exposure apparatus 100 provided with the optical device according to the present embodiment, the shutter 16 is oriented so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11 when the exposure is not performed. On the other hand, at the time of exposure, the orientation of the shutter 16 is set so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11.
Thus, since the supply of the temperature-adjusting gas is not stopped, the pressure in the barrel 11 does not change at the time of exposure and at the time of non-exposure, that is, the refractive index of the gas in the barrel 11 does not change. Accordingly, in the exposure apparatus 100 including the optical device according to the present embodiment, a decrease in imaging performance associated with a change in refractive index can be suppressed.
Further, since the orientation of the shutter 16 is switched at the time of exposure so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11, the above-described degradation of the overlay accuracy can be suppressed.
In the optical device according to the present embodiment, as shown in fig. 1A and 1B, the exhaust port 14 and the air supply port 15 are provided at 4 positions and 1 position, respectively. However, the number of the exhaust ports 14 and the supply ports 15 is not limited thereto.
In the optical device according to the present embodiment, the gas supplied to the lens barrel 11 and the gas discharged from the lens barrel 11 are air, but the present invention is not limited thereto. For example, if the temperature in the lens barrel 11 can be adjusted without adversely affecting the projection optical system 5 in the lens barrel 11, other gases such as inert gases may be used.
Second embodiment
Fig. 3 is a schematic cross-sectional view of an exposure apparatus 200 including an optical device according to a second embodiment.
The optical device according to the present embodiment has the same configuration as the optical device according to the first embodiment except that the non-exposure-time supply port 20a and the exposure-time supply port 20b are provided instead of the louver 16, and therefore the same reference numerals are given to the same components, and the description thereof is omitted.
As shown in fig. 3, in the exposure apparatus 200 provided with the optical device according to the present embodiment, the temperature-adjusting gas is supplied from the exposure-time supply port 20b (gas supply port) into the lens barrel 11 during exposure so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11.
On the other hand, in the non-exposure, a temperature-adjusting gas is supplied from a non-exposure-time supply port 20a (gas supply port) into the lens barrel 11 so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11.
Accordingly, since the pressure in the barrel 11 does not change at the time of exposure and at the time of non-exposure, that is, the refractive index of the gas in the barrel 11 does not change, a decrease in imaging performance accompanying a change in refractive index can be suppressed.
In addition, since the temperature adjustment gas is supplied from the exposure-time supply port 20b into the lens barrel 11 at the time of exposure so that the temperature adjustment gas is supplied outside the optical path space of the lens barrel 11, a decrease in the overlay accuracy can be suppressed.
Third embodiment
Fig. 4 is a schematic cross-sectional view of an exposure apparatus 300 including an optical device according to a third embodiment.
The optical device according to the present embodiment has the same configuration as the optical device according to the first embodiment except for the newly added aerodynamic member (aero parts) 21, and therefore the same reference numerals are given to the same components, and the description thereof is omitted.
As shown in fig. 4, in the exposure apparatus 300 provided with the optical device according to the present embodiment, the shutter 16 is oriented so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11 at the time of exposure. The aerodynamic member 21 is provided so that the temperature-adjusting gas passing through the louver 16 is directed to the predetermined exhaust port 14 during exposure. In other words, in the exposure apparatus 300 including the optical device according to the present embodiment, the aerodynamic member 21 restricts the path of the temperature-controlled gas in the lens barrel 11.
This can further improve the directivity of the temperature-regulated gas to the predetermined exhaust port 14. In addition, the length of the aerodynamic member 21 in the X direction is substantially the same as the width of the internal space of the lens barrel 11 in the X direction.
In addition, as in the optical device according to the first embodiment, the shutter 16 is oriented in the non-exposure state so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11. On the other hand, the shutter 16 is oriented at the time of exposure so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11.
Accordingly, since the pressure in the barrel 11 does not change at the time of exposure and at the time of non-exposure, that is, the refractive index of the gas in the barrel 11 does not change, a decrease in imaging performance accompanying a change in refractive index can be suppressed.
Further, since the orientation of the shutter 16 is switched at the time of exposure so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11, the above-described degradation of the overlay accuracy can be suppressed.
Fourth embodiment
Fig. 5 is a schematic cross-sectional view of an exposure apparatus 400 including an optical device according to a fourth embodiment.
The optical device according to the present embodiment has the same configuration as the optical device according to the first embodiment except that the movable aerodynamic member 22 is provided instead of the louver 16, and therefore the same reference numerals are given to the same components, and the description thereof is omitted.
As shown in fig. 5, in the exposure apparatus 400 including the optical device according to the present embodiment, the movable aerodynamic member 22 is moved so that the center in the YZ cross section of the movable aerodynamic member 22 is disposed at the position P1 at the time of exposure. Thus, during exposure, the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11.
On the other hand, in the non-exposure, the movable aerodynamic member 22 is moved so that the center in the YZ cross section of the movable aerodynamic member 22 is arranged at the position P2. Thus, in the non-exposure, the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11.
The length of the movable aerodynamic member 22 in the X direction is substantially the same as the width of the internal space of the lens barrel 11 in the X direction.
Accordingly, since the pressure in the barrel 11 does not change at the time of exposure and at the time of non-exposure, that is, the refractive index of the gas in the barrel 11 does not change, a decrease in imaging performance accompanying a change in refractive index can be suppressed.
Further, since the movable aerodynamic member 22 is moved at the time of exposure so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11, a decrease in the overlay accuracy can be suppressed.
In the optical device according to the present embodiment, the movable aerodynamic member 22 is moved at the time of exposure and at the time of non-exposure, but the present invention is not limited thereto, and the size or shape of the movable aerodynamic member 22 may be changed.
Fifth embodiment
Fig. 6 is a schematic cross-sectional view of an exposure apparatus 500 including an optical device according to a fifth embodiment.
The optical device according to the present embodiment has the same configuration as that of the optical device according to the first embodiment except that the light amount detection sensor 24 is additionally provided, and therefore the same reference numerals are given to the same members, and the description thereof is omitted.
In the exposure apparatus 500 including the optical device according to the present embodiment, as shown in fig. 6, the light amount detection sensor 24 is provided on the optical path of the projection optical system 5 in the lens barrel 11. In this way, in particular in the calibration process for the plate 4, it is possible to detect whether calibration light has passed through the optical path of the projection optical system 5.
Preferably, as described above, the orientation of the louver 16 is not switched at the time of the alignment of the plates 4.
Thus, when calibration is not performed in the exposure apparatus 500, that is, when no calibration light passes on the optical path of the projection optical system 5 according to the detection result of the light amount detection sensor 24, the orientation of the louver 16 is set so that the temperature-adjusting gas is supplied into the optical path space of the lens barrel 11. On the other hand, at the time of non-exposure, specifically immediately before the start of exposure, the orientation of the shutter 16 is set so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11.
Accordingly, since the pressure in the barrel 11 does not change at the time of exposure and at the time of non-exposure, that is, the refractive index of the gas in the barrel 11 does not change, a decrease in imaging performance accompanying a change in refractive index can be suppressed.
In addition, at the time of exposure, since the shutter 16 is oriented so that the temperature-adjusting gas is supplied outside the optical path space of the lens barrel 11, the above-described lowering of the overlay accuracy can be suppressed.
The optical device according to the present embodiment is provided with the light amount detection sensor 24, but the present invention is not limited thereto, and a heat amount detection sensor may be provided.
According to the present invention, an optical device capable of reducing thermal influence due to exposure and suppressing degradation of imaging performance can be provided.
While the preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the concept.
[ Method for producing article ]
Next, a method for manufacturing an article using the exposure apparatus provided with the optical device according to any one of the first to fifth embodiments will be described.
The article is a semiconductor device, a display device, a color filter, an optical component, MEMS, or the like.
For example, a semiconductor device is manufactured by being subjected to a preceding process for producing a circuit pattern on a wafer and a subsequent process including a processing process for making a circuit chip produced in the preceding process finished as a product.
The previous working procedure comprises the following steps: an exposure step of exposing a wafer coated with a sensitizer using an exposure device provided with an optical device according to any one of the first to fifth embodiments; and a developing step of developing the exposed photosensitive agent.
The pattern of the developed sensitizer is used as a mask to perform an etching process, an ion implantation process, or the like, thereby forming a circuit pattern on the wafer.
These steps of exposure, development, etching, and the like are repeated to form a circuit pattern composed of a plurality of layers on the wafer.
In the subsequent step, the wafer on which the circuit pattern is formed is diced, and the mounting, packaging, and inspection steps of the chip are performed.
The display device is manufactured by being subjected to a process of forming a transparent electrode. The step of forming the transparent electrode includes: a step of coating a glass wafer on which a transparent conductive film is deposited with a photosensitive agent; and exposing the glass wafer coated with the sensitizer using the exposure device provided with the optical device according to any one of the first to fifth embodiments. The step of forming the transparent electrode includes a step of developing the exposed photosensitive agent.
According to the method for manufacturing an article according to the present embodiment, an article having a higher grade and a higher productivity than the conventional one can be manufactured.
Claims (11)
1. An exposure apparatus for projecting an image of a pattern of an original plate onto a substrate and exposing the substrate, comprising:
a projection optical system that projects an image of the pattern onto the substrate;
A lens barrel that houses the projection optical system;
a travel direction setting means for setting a travel direction of the gas supplied from the gas supply means into the lens barrel; and
A control unit that controls the travel direction setting mechanism so as to change the travel direction of the gas,
The control unit controls the travel direction setting mechanism so that the gas supplied into the lens barrel travels in a direction not passing through the optical path of the projection optical system when exposing, and controls the travel direction setting mechanism so that the gas supplied into the lens barrel travels in a direction passing through the optical path of the projection optical system when not exposing.
2. The exposure apparatus according to claim 1, wherein,
The travel direction setting means is a variable shutter provided in the lens barrel.
3. The exposure apparatus according to claim 1, wherein,
The travel direction setting means is provided in the barrel at a plurality of gas supply ports.
4. The exposure apparatus according to claim 1, wherein,
The lens barrel is provided with an aerodynamic member for restricting a path of gas in the lens barrel.
5. The exposure apparatus according to claim 1, wherein,
The travel direction setting mechanism is a movable aerodynamic member provided in the lens barrel.
6. The exposure apparatus according to claim 1, wherein,
The control unit controls the travel direction setting mechanism so as to change the travel direction when the exposure is not performed.
7. The exposure apparatus according to claim 6, wherein,
The control unit controls the traveling direction setting mechanism so as to change the traveling direction when the calibration light does not pass through the optical path of the projection optical system.
8. The exposure apparatus according to claim 6, wherein,
The control unit controls the travel direction setting mechanism so as to change the travel direction when the substrate is replaced.
9. The exposure apparatus according to claim 1, wherein,
The exposure device is provided with a light quantity detection sensor for detecting the light quantity on the light path of the projection optical system,
The control unit determines whether or not the calibration of the substrate is being performed based on the detection result of the light amount detection sensor.
10. The exposure apparatus according to claim 1, wherein,
The exposure device is provided with a pressure sensor for detecting the pressure in the lens barrel,
After the pressure is determined to be stable based on the detection result of the pressure sensor, exposure is performed.
11. A method for manufacturing an article, comprising:
a step of exposing the substrate with the exposure apparatus according to any one of claims 1 to 10;
for the above-mentioned after exposure a step of developing the substrate; and
And processing the developed substrate to obtain an article.
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| JP2020018861A JP7427461B2 (en) | 2020-02-06 | 2020-02-06 | Exposure equipment and article manufacturing method |
| JP2020-018861 | 2020-02-06 |
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| KR (1) | KR20210100528A (en) |
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| JP2016095412A (en) * | 2014-11-14 | 2016-05-26 | キヤノン株式会社 | Exposure equipment, and manufacturing method of article |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1092735A (en) * | 1996-09-13 | 1998-04-10 | Nikon Corp | Aligner |
| WO2003030229A1 (en) * | 2001-09-27 | 2003-04-10 | Nikon Corporation | Aligner and method for fabricating device |
| JP2003124092A (en) * | 2001-10-09 | 2003-04-25 | Canon Inc | Projection aligner and control method thereof, and device manufacturing method |
| TWI616932B (en) * | 2003-05-23 | 2018-03-01 | Nikon Corp | Exposure device and component manufacturing method |
| US7136142B2 (en) * | 2004-05-25 | 2006-11-14 | Asml Netherlands B.V. | Lithographic apparatus having a gas flushing device |
| JP2008292761A (en) | 2007-05-24 | 2008-12-04 | Canon Inc | Exposure apparatus and method for manufacturing device |
| JP5517847B2 (en) * | 2010-09-08 | 2014-06-11 | キヤノン株式会社 | Exposure apparatus and device manufacturing method using the same |
| JP2015079074A (en) | 2013-10-16 | 2015-04-23 | キヤノン株式会社 | Exposure equipment |
| JP6896404B2 (en) * | 2016-11-30 | 2021-06-30 | キヤノン株式会社 | Exposure equipment and manufacturing method of articles |
| JP7016661B2 (en) * | 2017-10-06 | 2022-02-07 | キヤノン株式会社 | Method of manufacturing exposure equipment and articles |
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| TW202429220A (en) | 2024-07-16 |
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