CN113194622A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN113194622A CN113194622A CN202110464014.9A CN202110464014A CN113194622A CN 113194622 A CN113194622 A CN 113194622A CN 202110464014 A CN202110464014 A CN 202110464014A CN 113194622 A CN113194622 A CN 113194622A
- Authority
- CN
- China
- Prior art keywords
- conductive
- conductive resin
- resin
- circuit board
- pattern layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a non-conductive resin substrate, a conductive resin pattern layer attached to the non-conductive resin substrate and a metal conductive layer attached to the conductive resin pattern layer, wherein the conductive resin pattern layer is formed by directly forming conductive resin according to a circuit design pattern through a forming process, the manufacturing method is not influenced by a substrate structure, and the circuit board can be used for manufacturing a three-dimensional circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a circuit board which has excellent electrical performance and is suitable for three-dimensional products and a manufacturing method thereof.
Background
With the development trend of miniaturization and multi-functionalization of electronic equipment, the requirement on high-frequency and high-speed performance of the copper-clad circuit board is higher and higher, and the copper-clad circuit board is required to realize compact installation effect, so that the circuit board is required to be not a planar circuit board but a three-dimensional circuit board. In the industry, a three-dimensional molded interconnect device (3D-MID) refers to a device that integrates mechanical and electronic functions into an organic whole by directly arranging electronic circuits on the surface of a molded part having a mechanical function as a substrate and connecting discrete electronic components in a three-dimensional space.
The Laser Direct Structuring (LDS) technology developed by the company LPKF in Germany has developed very rapidly in recent years, the core process is that metal chelate and other additives which can be activated and reduced by laser to form metal atoms are added, mixing the mixture into plastic materials such as PA (polyamide), PC (polycarbonate), PPS (polyphenylene sulfide) and the like by a modification method, then performing injection molding on a circuit substrate of an electronic product, then the prepared substrate surface is processed by adopting a laser etching method, the metal chelate at the position scanned by the laser beam is decomposed into elemental metal, forming the required antenna circuit pattern, depositing metal copper on the etched surface by a chemical plating method to obtain the required circuit, the method for preparing the circuit is not limited by the structure of the product, and the laser beam can be directly written according to the electronic file.
Firstly, the laser etching substrate surface is utilized to manufacture the antenna circuit, the production efficiency is lower, and meanwhile, the rough surface with unevenness is formed after the substrate surface is etched, so that the efficiency of the manufactured antenna on signal receiving and transmission is reduced, and the performance cannot meet the ideal requirement; secondly, as the material is added with laser absorbing substances such as metal chelate, carbon powder and the like, the dielectric constant, dielectric loss and other electrical properties of the material are reduced, so that the shielding of electronic signals is caused, and the transmission efficiency of the antenna is reduced. In addition, the current LDS laser equipment and LDS modified plastic raw materials are high in price, and the production cost of the three-dimensional circuit board is increased.
Liquid Crystal Polymers (LCP) are novel polymers having excellent properties, and are classified into thermotropic LCP, which is a wholly aromatic condensation Polymer having relatively rigid and linear Polymer chains, and lyotropic LCP, etc. according to the conditions for forming Liquid crystals, and these polymers are aligned to form a Liquid Crystal phase when they are melted. Liquid crystalline polymers constitute a family of thermoplastics with a unique set of properties, among which the most well known applications are wholly aromatic polyesters, which perform very well in harsh environments, show high thermal resistance, high chemical resistance, low water absorption and extremely high dimensional stability, and dielectric properties remain relatively stable over a wide frequency range and temperature range, thus being the most desirable high frequency high speed communication base material in the industry today. However, in the communications industry, the liquid crystal polyester film is mainly manufactured in the industry at present, and can only be used for producing Flexible Printed Circuit (FPC) and can not be used for producing rigid Printed Circuit (PCB).
Disclosure of Invention
Based on the technical problems that the existing three-dimensional circuit board is high in manufacturing cost, low in production efficiency and poor in performance, the invention aims to develop a circuit board and a manufacturing method thereof, the circuit board can be used for manufacturing the three-dimensional circuit board, is high in production efficiency and low in manufacturing cost, can be produced in large batch and has excellent electrical performance.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the invention provides a circuit board, which comprises a non-conductive resin substrate, a conductive resin pattern layer attached on the non-conductive resin substrate and a metal conductive layer attached on the conductive resin pattern layer; the conductive resin pattern layer is formed by directly forming conductive resin according to a circuit design pattern through a forming process.
Specifically, the conductive resin is a conductive filler filling modified resin material, and comprises a matrix resin and a conductive filler dispersed in the matrix resin.
The conductive resin pattern layer is provided with the conductive filler, and the properties of the conductive filler and the metal conductive layer are similar, so that the metal conductive layer is formed by electroplating or chemical plating deposition, and the metal conductive layer and the conductive resin pattern layer have strong bonding force, so that the metal conductive layer is selectively and firmly attached to the conductive resin pattern layer. In addition, because the material properties of the matrix resin in the conductive resin pattern layer are similar to those of the non-conductive resin substrate, the conductive resin pattern layer can be well combined with the non-conductive resin substrate, and further is closely connected with the non-conductive resin substrate and the metal conductive layer on two sides.
Specifically, the conductive filler comprises one or more of the following materials:
carbon materials: carbon black, graphite, glassy carbon, carbon fiber, carbon beads, carbon nanotubes;
metals and metal oxides: gold, silver, copper, nickel, aluminum and alloys thereof, ITO, lithium-manganese composite oxide, vanadium pentoxide, tin oxide, potassium titanate;
conductive ceramics: tungsten carbide, titanium carbide and composites thereof, titanium borate, titanium nitride;
conductive polymers: polyacetylene, polypyrene, polyaniline, polyphenylene, polyacene.
Specifically, the mass percentage of the conductive filler in the conductive resin is 10-90%; the particle size of the conductive filler is preferably less than 20 μm, more preferably 10nm to 10 μm.
Specifically, for the conductive resin, the conductive filler is preferably uniformly dispersed in the matrix resin using a twin-screw or multi-screw extruder.
Specifically, in order to uniformly disperse the conductive filler in the matrix resin, the conductive resin further comprises a coupling agent, preferably a silane coupling agent, and the mass percentage of the coupling agent in the conductive resin is 0.1-2%.
Further, the conductive resin is a conductive filler filled modified liquid crystal polymer resin, and the matrix resin in the conductive resin pattern layer is a liquid crystal polymer, preferably a thermotropic liquid crystal polymer resin.
Specifically, the dielectric loss of the non-conductive resin substrate is preferably less than 0.005, and the material thereof may be selected from low dielectric loss polymer materials such as polyphenylene sulfide (PPS), polyphenylene oxide (PPO), polytetrafluoroethylene, liquid crystal polymer resin, and the like.
Further, the non-conductive resin substrate is preferably a thermotropic liquid crystal polymer resin.
Further, the thermotropic liquid crystal polymer resin in the conductive resin pattern layer and the non-conductive resin substrate is selected from one or more of wholly aromatic polyester, wholly aromatic polyamide and wholly aromatic polyether ketone.
Preferably, the material of the matrix resin in the conductive resin and the resin in the non-conductive resin substrate are the same material, and the thermotropic liquid crystal polymer resin in the conductive resin pattern layer and the non-conductive resin substrate are wholly aromatic polyester.
Further, the thermotropic liquid crystalline polymer resin is a thermotropic liquid crystalline polymer resin produced from an aromatic dibasic acid (e.g., terephthalic acid, naphthalenedicarboxylic acid), an aromatic dihydric phenol (e.g., hydroquinone, biphenol) and an aromatic hydroxycarboxylic acid such as p-hydroxybenzoic acid (HBA).
More preferably, the wholly aromatic polyester may be obtained by condensation polymerization of an aromatic dibasic acid and an aromatic dihydric phenol each having a benzene ring structure, or may be obtained by self condensation polymerization of an aromatic hydroxycarboxylic acid having a bifunctional structure including both a carboxyl group and a hydroxyl group, or may be obtained by condensation polymerization of an aromatic dibasic acid, an aromatic dihydric phenol, and an aromatic hydroxycarboxylic acid.
More preferably, the aromatic dibasic acid is selected from terephthalic acid (T), isophthalic acid, naphthalenedicarboxylic acid, etc., the aromatic dihydric phenol is selected from hydroquinone, biphenol, etc., and the aromatic hydroxycarboxylic acid is selected from p-hydroxybenzoic acid (HBA), 6-hydroxy-2-naphthoic acid (HNA), etc.
The invention also provides a manufacturing method of the three-dimensional circuit board, which is characterized in that conductive resin is directly attached to a non-conductive resin substrate according to a circuit design pattern through a molding process such as an injection molding process, a 3D printing process or a mould pressing process to form a patterned three-dimensional conductive resin pattern layer, and then a metal conductive layer is attached to the conductive resin pattern layer to form the circuit board.
Wherein the melting point of the conductive resin is 10-200 ℃ lower than that of the non-conductive resin substrate; in order to improve the adhesion of the conductive resin pattern layer on the non-conductive resin substrate and simultaneously avoid the conductive resin pattern layer from damaging the surface of the non-conductive resin substrate in the forming process, the melting temperature of the conductive resin pattern layer in the forming process is 200-300 ℃.
Specifically, the thickness of the conductive resin pattern layer is 0.2-500 mu m, and the resistivity of the conductive resin pattern layer is less than 109Ω · m, preferably less than 107Ω · m, more preferably less than 105Ω·m。
Further, the non-conductive resin substrate is preferably liquid crystal polymer resin, and the liquid crystal polymer is used for producing the hard printed wiring board by manufacturing the non-conductive resin substrate by adopting an injection molding process.
Specifically, the metal conductive layer is selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, compounds thereof.
Specifically, the metal conductive layer is attached to the surface of the conductive polymer by electroplating, chemical vapor deposition, magnetron sputtering and the like.
The invention has the following beneficial effects:
(1) the circuit board can be used for manufacturing a three-dimensional circuit board, and compared with the existing three-dimensional circuit board which adopts an LDS technology, the circuit board has the advantages of high production efficiency, low manufacturing cost, capability of mass production, environment-friendly manufacturing method and no pollution to the environment;
(2) the manufactured circuit board has excellent electrical properties such as signal receiving and transmitting efficiency, dielectric constant, dielectric loss and the like, and the dielectric properties and the like can be adjusted according to requirements.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a circuit board according to the present invention;
fig. 2 is a schematic cross-sectional structure diagram of the circuit board of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the embodiment described in this embodiment is merely a general case of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step other than that described in the claims, are within the scope of protection of the present invention.
As shown in fig. 1, the method for manufacturing a circuit board of the present invention specifically includes the following steps:
step 1, directly attaching conductive resin on a non-conductive resin substrate 1 according to a circuit design pattern through a forming process to form a conductive resin pattern layer 2 with a micro conductive path, wherein the conductive resin pattern layer 2 is convenient for forming a metal conductive layer 3 in a subsequent mode of electroplating or electrochemistry and the like.
Specifically, in step 1, the conductive resin pattern layer 2 is formed by directly performing a molding process such as an injection molding process, a 3D printing process, or a mold pressing process on the conductive resin, so that the conductive resin pattern layer 2 is not affected by the structure of the circuit board and can be used for producing a three-dimensional circuit board.
Specifically, the non-conductive resin substrate 1 is formed by injection molding, the non-conductive resin substrate 1 is preferably liquid crystal polymer resin, and the invention applies the liquid crystal polymer to the production of hard circuit boards by injection molding.
Specifically, the conductive resin is a conductive filler filling modified resin material, and comprises a matrix resin and a conductive filler dispersed in the matrix resin.
Further, the conductive resin is preferably a conductive filler-filled modified liquid crystal polymer resin, and the matrix resin in the conductive resin pattern layer is preferably a liquid crystal polymer resin.
Specifically, in the step 1, the non-conductive resin substrate 1 and the conductive resin pattern layer 2 may be manufactured and formed by a two-shot injection molding method together, wherein the formation of the non-conductive resin substrate 1 is completed by the first-shot injection molding, at this time, a circuit groove is left on the surface of the non-conductive resin substrate 1, then, the formation of the conductive resin pattern layer 2 is completed by the second-shot injection molding, and the conductive resin pattern layer 2 is filled in the circuit groove of the non-conductive resin substrate 1, so that the manufacture of the non-conductive resin substrate 1 and the conductive resin pattern layer 2 is completed by the two-shot injection molding method. However, due to the limitation of material flowability, the two-shot injection molding method is mainly used for the circuit form with relatively large circuit size. For a wiring board of a fine circuit pattern, it is preferable that the conductive resin pattern layer 2 is manufactured by a 3D printing process or a molding process.
And 2, attaching a metal conductive layer 3 on the conductive resin pattern layer 2 by adopting methods such as electroplating, chemical vapor deposition, magnetron sputtering and the like, thereby obtaining the three-dimensional circuit board shown in fig. 2.
Specifically, in the circuit board obtained by the invention, the bonding force between the metal conductive layer 3 and the conductive resin pattern layer 2 is generally 5-10N.
Specifically, the thickness of the conductive resin pattern layer 2 is 0.2 to 500 μm, and as shown in fig. 2, the conductive resin pattern layer 2 preferably protrudes from the surface of the non-conductive resin substrate 1, so that when the metal conductive layer 3 is formed by deposition, the metal conductive layer 3 can be attached to the top surface and the side surface of the conductive resin pattern layer 2 at the same time, which is equivalent to widening the line width of the metal conductive layer 3 and reducing the line resistance during signal transmission.
The manufacturing method of the circuit board of the invention, directly attach the conductive resin to the non-conductive resin substrate 1 according to the circuit design pattern through the forming process, form the three-dimensional conductive resin pattern layer 2 with little conductive path, then attach the metal conducting layer 3 on the conductive resin pattern layer 2, form the circuit board; the method is not influenced by the structure of the substrate, can be used for producing the three-dimensional circuit board, has high production efficiency and low manufacturing cost, can be produced in large batch, and has excellent electrical performance of the manufactured circuit board.
In the conductive resin pattern layer 2 and the non-conductive resin substrate 1, the liquid crystal polymer resin is a thermotropic liquid crystal polymer resin selected from wholly aromatic polyester, wholly aromatic polyamide, wholly aromatic polyether ketone, and the like, and preferably a wholly aromatic polyester-based liquid crystal polymer.
The thermotropic liquid crystal polymer resin is preferably a thermotropic liquid crystal polymer formed by polycondensation of aromatic dibasic acid (such as terephthalic acid and naphthalenedicarboxylic acid), aromatic dihydric phenol (such as hydroquinone and biphenol) and aromatic hydroxycarboxylic acid (such as p-hydroxybenzoic acid (HBA)).
The conductive filler in the conductive resin includes, but is not limited to, the following listed materials:
carbon materials: carbon black, graphite, glassy carbon, carbon fiber, carbon beads, carbon nanotubes;
metals and metal oxides: gold, silver, copper, nickel, aluminum and alloys thereof, ITO (indium-tin oxide), lithium-manganese composite oxide, vanadium pentoxide, tin oxide, and potassium titanate;
conductive ceramics: tungsten carbide, titanium carbide and its composites, titanium borate, titanium nitride.
Wherein the metal conductive layer 3 is selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, compounds thereof.
Wherein the conductive filler accounts for 10 to 90 percent of the conductive resin by mass; the particle size of the conductive filler is preferably less than 20 μm, more preferably 10nm to 10 μm.
Wherein the conductive filler is uniformly dispersed in the matrix resin preferably using a twin-screw or multi-screw extruder.
In order to uniformly disperse the conductive filler in the matrix resin, the conductive resin further comprises a coupling agent, the coupling agent is preferably a silane coupling agent, and the mass percentage of the coupling agent in the conductive resin is 0.1-2%.
The non-conductive resin substrate 1 can be a substrate with a dielectric constant less than 4, preferably a substrate with a dielectric constant less than 3.5, and the dielectric loss is less than 0.005, and the prepared circuit board can be applied to the high-speed high-frequency communication industry.
The non-conductive resin substrate 1 can also be a substrate with the dielectric constant larger than 4, the dielectric loss is less than 0.005, and the prepared circuit board can be used for reducing the circuit size, saving the circuit space, reducing the antenna area and reducing the material cost and the assembly cost.
The following examples are intended to illustrate the practice of the present application and to fully evaluate the results of the practice. Unless otherwise indicated, the raw materials and reagents used in the following examples are all commercially available products or can be prepared by known methods.
Example 1: preparation three-dimensional circuit board
(1) Making modified conductive liquid crystalline polymer resins
The conductive liquid crystal polymer resin of the embodiment comprises the following components in percentage by mass: 30% of liquid crystal resin (LCPA 3000 resin produced by Delong-Zhongtai engineering plastic science and technology limited in Jiangmen city, the melting point is 300 ℃, the dielectric constant (DK) is 2.8, the dielectric loss (DF) is 0.0016), 69% of mixed conductive filler and 1% of silane coupling agent; wherein the mixed conductive filler is 5% of conductive carbon black, 30% of carbon nano tube and 34% of carbon fiber powder.
The preparation process specifically comprises the following steps: adding the mixed conductive filler into a high-speed mixer, raising the temperature of the mixed conductive filler by 100 ℃, adding a silane coupling agent for pretreating the mixed conductive filler, wherein the reaction time is 1h, and taking out for later use; adding A3000 LCP resin into a double-screw extruder through a main feeder, simultaneously adding the pretreated mixed conductive filler into a side feeder, controlling the temperature to be 310 ℃, performing melt extrusion, and granulating to obtain the modified conductive liquid crystal polymer resin.
(2) Providing a non-conductive resin substrate made of LCP (LCP L1000 resin produced by Limited technology of Delong-Zhongtai engineering plastics in Jiangmen, the melting point of which is 330 ℃, DK 2.9 and DF 0.0017); attaching the obtained modified conductive liquid crystal polymer resin on a non-conductive resin substrate by a mould pressing method according to the circuit design pattern of the circuit board to obtain a conductive resin pattern layer with the thickness of about 100 mu m;
(3) and (3) attaching a metal conductive layer on the conductive resin pattern layer by adopting an electroplating method to obtain the three-dimensional circuit board.
The plating metal conductive layer of the three-dimensional circuit board obtained in example 1 was subjected to a plating adhesion test, and the peel strength from the surface of the plating coating conductive resin pattern layer was 8N.
Example 2: preparation circuit board
Compared with the embodiment 1, the modified conductive liquid crystal polymer resin has the liquid crystal resin and the conductive filler accounting for 70 percent and 29 percent respectively by mass, wherein the conductive filler is the carbon nano tube. Other technical features are the same as those of embodiment 1, and are not described herein again.
The plating metal conductive layer of the wiring board obtained in example 2 was subjected to a plating adhesion test, and the peel strength from the surface of the plating coating layer conductive resin pattern layer was 9N.
Example 3: preparation circuit board
Compared with the embodiment 1, the modified conductive liquid crystal polymer resin has the liquid crystal resin and the conductive filler respectively accounting for 50 percent and 49 percent by mass, wherein the conductive filler is conductive carbon black. Other technical features are the same as those of embodiment 1, and are not described herein again.
The plated metal conductive layer of the wiring board obtained in example 3 was subjected to a plating adhesion test, and the peel strength from the surface of the plated layer conductive resin pattern layer was 7N.
Comparative example: preparation circuit board
In comparison with example 1, the metal conductive layer was directly formed by electroplating on the non-conductive resin substrate without providing the conductive resin pattern layer.
And (3) carrying out an electroplating bonding force test on the plated metal conductive layer of the circuit board obtained in the comparative example, wherein the peel strength of the plated metal conductive layer and the surface of the non-conductive resin substrate of the electroplated plated layer is 2N.
From the above results, the manufacturing method of the present invention can ensure good bonding between the metal conductive layer and the substrate while achieving the three-dimensional circuit board effect.
The manufacturing method of the circuit board is not influenced by the structure of the substrate, can be used for producing the three-dimensional circuit board, has high production efficiency and low manufacturing cost, can be produced in large batch, is environment-friendly, does not pollute the environment, has excellent electrical properties such as signal receiving and transmitting efficiency, dielectric constant, dielectric loss and the like, and can be adjusted according to requirements; the circuit board of the invention, the non-conductive resin substrate is formed by injection molding, and the liquid crystal polymer can be applied to the production of hard circuit boards.
While the present invention has been described in detail with reference to the above embodiments, the above embodiments are only for the purpose of facilitating understanding of the present invention by those skilled in the art, and do not limit the scope of the present invention. Therefore, any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A circuit board is characterized by comprising a non-conductive resin substrate, a conductive resin pattern layer attached on the non-conductive resin substrate and a metal conductive layer attached on the conductive resin pattern layer;
the conductive resin pattern layer is formed by directly forming conductive resin according to a circuit design pattern through a forming process, and the conductive resin is a conductive filler filling modified resin material and comprises matrix resin and conductive fillers dispersed in the matrix resin.
2. The circuit board according to claim 1, wherein the conductive filler accounts for 10-90% of the conductive resin by mass; the particle size of the conductive filler is less than 20 mu m;
the conductive filler in the conductive resin is selected from one or more of the following materials:
carbon materials: carbon black, graphite, glassy carbon, carbon fiber, carbon beads, carbon nanotubes;
metals and metal oxides: gold, silver, copper, nickel, aluminum and alloys thereof, ITO, lithium-manganese composite oxide, vanadium pentoxide, tin oxide, potassium titanate;
conductive ceramics: tungsten carbide, titanium carbide and composites thereof, titanium borate, titanium nitride;
conductive polymers: polyacetylene, polypyrene, polyaniline, polyphenylene, polyacene.
3. The wiring board according to claim 1, wherein the conductive resin further comprises a coupling agent, and the coupling agent accounts for 0.1-2% of the conductive resin by mass.
4. The wiring board of claim 1, wherein the dielectric loss of the non-conductive resin substrate is less than 0.005, the raw material of the non-conductive resin substrate comprises thermotropic liquid crystal polymer resin, and the thermotropic liquid crystal polymer resin in the non-conductive resin substrate is selected from one or more of wholly aromatic polyester, wholly aromatic polyamide and wholly aromatic polyether ketone.
5. The wiring board according to claim 1 or 4, wherein the matrix resin in the conductive resin is a thermotropic liquid crystal polymer resin, and the thermotropic liquid crystal polymer resin in the conductive resin is selected from one or more of wholly aromatic polyester, wholly aromatic polyamide and wholly aromatic polyether ketone.
6. The wiring board according to any one of claims 1 to 5, wherein the thickness of the conductive resin pattern layer is 0.2 to 500 μm; the resistivity of the conductive resin pattern layer is less than 109Ω·m。
7. The method for manufacturing a circuit board according to any one of claims 1 to 6, wherein the conductive resin is directly attached to the non-conductive resin substrate by a molding process according to a circuit design pattern to form a patterned conductive resin pattern layer, and then the metal conductive layer is attached to the conductive resin pattern layer to form the circuit board.
8. The manufacturing method of the circuit board according to claim 7, wherein the forming process of the conductive resin pattern layer is an injection molding process, a 3D printing process or a mold pressing process; the melting point of the conductive resin is 10-200 ℃ lower than that of the non-conductive resin substrate.
9. The method of manufacturing a wiring board according to claim 7, wherein the non-conductive resin substrate is formed by injection molding.
10. The method for manufacturing a circuit board according to claim 7, wherein the metal conductive layer is attached to the surface of the conductive polymer by electroplating, chemical vapor deposition or magnetron sputtering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110464014.9A CN113194622A (en) | 2021-04-27 | 2021-04-27 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110464014.9A CN113194622A (en) | 2021-04-27 | 2021-04-27 | Circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113194622A true CN113194622A (en) | 2021-07-30 |
Family
ID=76979968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110464014.9A Pending CN113194622A (en) | 2021-04-27 | 2021-04-27 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113194622A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939078A (en) * | 2021-11-11 | 2022-01-14 | 广州国显科技有限公司 | Flexible circuit board, display panel, display device and manufacturing method thereof |
| DE102023105398A1 (en) * | 2023-03-06 | 2024-09-12 | Diehl Aviation Laupheim Gmbh | Additively manufactured MID electronic component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148712A (en) * | 1995-11-21 | 1997-06-06 | Tokai Rubber Ind Ltd | Three-dimensional molded circuit body and manufacture thereof |
| CN101232774A (en) * | 2007-01-24 | 2008-07-30 | 南京汉德森科技股份有限公司 | High heat conductivity ceramic base printed circuit board and method for making the same |
| CN101394710A (en) * | 2008-10-10 | 2009-03-25 | 华中科技大学 | A method for manufacturing and repairing conductive lines of three-dimensional molded interconnection devices |
| CN110158132A (en) * | 2018-02-13 | 2019-08-23 | 华瑞墨石丹阳有限公司 | A kind of electro-plating method of insulating materials |
| CN110430674A (en) * | 2019-07-10 | 2019-11-08 | 广东工业大学 | A kind of preparation method of electroplating deposition circuit board |
-
2021
- 2021-04-27 CN CN202110464014.9A patent/CN113194622A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148712A (en) * | 1995-11-21 | 1997-06-06 | Tokai Rubber Ind Ltd | Three-dimensional molded circuit body and manufacture thereof |
| CN101232774A (en) * | 2007-01-24 | 2008-07-30 | 南京汉德森科技股份有限公司 | High heat conductivity ceramic base printed circuit board and method for making the same |
| CN101394710A (en) * | 2008-10-10 | 2009-03-25 | 华中科技大学 | A method for manufacturing and repairing conductive lines of three-dimensional molded interconnection devices |
| CN110158132A (en) * | 2018-02-13 | 2019-08-23 | 华瑞墨石丹阳有限公司 | A kind of electro-plating method of insulating materials |
| CN110430674A (en) * | 2019-07-10 | 2019-11-08 | 广东工业大学 | A kind of preparation method of electroplating deposition circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 黄伯云 等: "工程塑料", 中国铁道出版社, pages: 300 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939078A (en) * | 2021-11-11 | 2022-01-14 | 广州国显科技有限公司 | Flexible circuit board, display panel, display device and manufacturing method thereof |
| DE102023105398A1 (en) * | 2023-03-06 | 2024-09-12 | Diehl Aviation Laupheim Gmbh | Additively manufactured MID electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2405222C2 (en) | Dispersion for depositing metallic layer | |
| CN104228186B (en) | A kind of high heat conduction high-performance aluminum matrix copper-clad laminate and preparation method thereof | |
| CA1312160C (en) | Resin composition for printed circuit board | |
| KR102104753B1 (en) | A polymer composition for a laser direct structuring having low-dielectric properties in a high frequency region. | |
| KR101148225B1 (en) | Method for producing laminate | |
| US5652042A (en) | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | |
| KR100664718B1 (en) | Method of forming conductive composition, conductive film and conductive film | |
| KR102338614B1 (en) | Aromatic polyester-containing curable resin composition, cured product, electric and electronic component, and circuit board | |
| CN113194622A (en) | Circuit board and manufacturing method thereof | |
| CN115700014A (en) | Circuit structure | |
| CN109735060A (en) | A kind of thermoplastic composite and preparation method thereof for laser direct structuring technique | |
| CN111587272A (en) | Polyphenylene sulfide resin composition, method for producing the same, and injection molded article produced using the same | |
| CN110117374A (en) | The manufacturing method of liquid crystal polymer film and the flexible copper foil substrate with liquid crystal polymer film | |
| JP2016062955A (en) | Film for electronic circuit board and electronic circuit board | |
| JPH01185380A (en) | Anisotropically conductive adhesive | |
| CN101760147A (en) | Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof | |
| CN111961352A (en) | Laser direct-forming low-warpage LDS composite high polymer material and preparation method thereof | |
| CN110511533A (en) | Polyether ether ketone/tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer/chopped quartz fiber material, preparation method and application | |
| KR101327921B1 (en) | Conductive paste and method for manufacturing the same | |
| CN113179592A (en) | Circuit board and manufacturing method thereof | |
| CN111497097B (en) | Polytetrafluoroethylene wave-transmitting material capable of being directly metallized on surface, preparation method and application | |
| Kim et al. | Polyphenylene sulfide/liquid crystal polymer blend system for laser direct structuring and electroless plating applications | |
| CN114096337B (en) | Zinc ammonium molybdate hydrate for electronic material, resin composition for electronic material, prepreg, resin sheet, laminated sheet, metal foil-clad laminated sheet, and printed wiring board | |
| CN113314251A (en) | High-temperature sintered silver paste special for RFID (radio frequency identification) of ceramic substrate and manufacturing method thereof | |
| KR100832803B1 (en) | Low dielectric constant low loss thermosetting composite resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210730 |