CN113192679B - Coaxial line and electronic equipment - Google Patents

Abstract

The application discloses coaxial line and electronic equipment belongs to the electronic equipment field. The coaxial line sequentially comprises a wire, a first insulating layer, a heat conducting wire, a heat conducting pipe and a second insulating layer from inside to outside, wherein the wire is wrapped by the first insulating layer, the heat conducting wire is arranged on the inner wall of the heat conducting pipe, a gap is formed between the heat conducting wire and the first insulating layer, and the outer peripheral side of the middle part of the heat conducting pipe is wrapped by the second insulating layer.

Description

Coaxial line and electronic equipment

Technical Field

The application belongs to the field of electronic equipment, and particularly relates to a coaxial line and electronic equipment.

Background

With the continuous innovation and progress of electronic equipment, the internal structure of the electronic equipment is gradually improved, the electronic equipment usually comprises a main board and an auxiliary board, with the development of 5G, the frequency range of an antenna is increased, and in order to meet the requirement of transmission of antenna signals between the main board and the auxiliary board, a coaxial line needs to be arranged between the main board and the auxiliary board.

However, because the restriction of electronic equipment volume, the inside radiating effect of electronic equipment is relatively poor, when a plurality of applications move simultaneously, when long-time conversation or recreation, mainboard and subplate can give off a large amount of heats, the heat is gathered and can't be derived on mainboard and subplate, lead to the regional temperature of mainboard and subplate to rise fast, because be provided with a large amount of electron devices on mainboard and the subplate, mainboard and subplate high temperature can lead to electronic equipment's functioning speed river all, make electronic equipment take place the circumstances such as the card pause easily, seriously influence user's experience.

Disclosure of Invention

The embodiment of the application aims to provide a coaxial line and electronic equipment, and the problem that the temperature of a main board and an auxiliary board in the electronic equipment is higher, and the user experience is influenced can be solved.

In a first aspect, an embodiment of the present application provides a coaxial line, coaxial line from interior to exterior includes wire, first insulating layer, heat-conducting wire, heat pipe and second insulating layer in proper order, first insulating layer parcel the wire, the heat-conducting wire set up in on the inner wall of heat pipe, the heat-conducting wire with be provided with the clearance between the first insulating layer, the second insulating layer parcel in the periphery side at the middle part of heat pipe.

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device has an inner cavity, a main board and an auxiliary board are disposed in the inner cavity, and the main board and the auxiliary board are connected to each other through a plurality of coaxial lines.

In this application embodiment, can make the coaxial line possess quick heat conduction's effect through heat conduction silk and heat pipe, the coaxial line can be quick derive the heat on the electron device who connects, when the coaxial line sets up in electronic equipment, can realize for mainboard and the quick radiating effect of subplate.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device in an embodiment of the present application;

FIG. 2 isbase:Sub>A cross-sectional view of area A-A of FIG. 1;

FIG. 3 is a cross-sectional view of area A of FIG. 2;

FIG. 4 is a schematic structural diagram of a coaxial line in the embodiment of the present application;

FIG. 5 is a partial exploded view of an electronic device in an embodiment of the present application;

fig. 6 is a partial sectional view of an electronic apparatus in an embodiment of the present application.

Reference numerals

1. A coaxial line; 11. a wire; 12. a first insulating layer; 13. heat conducting wires; 14. a heat conducting pipe; 15. a second insulating layer; 2. an electronic device; 21. a main board; 22. a sub-board; 3. a heat conducting snap ring; 31. a housing; 311. buckling; 312. looping; 313. a heat conducting plate; 32. a spring plate; 33. a support; 331. a splint; 4. a heat-conducting plug; 5. a thermally conductive layer.

Detailed Description

The technical solutions in the embodiments of the present application will be described below clearly with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The coaxial cable and the electronic device provided by the embodiment of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

In a first aspect, as shown in fig. 4, the coaxial cable 1 includes, in order from inside to outside, a conductor 11, a first insulating layer 12, a heat conducting wire 13, a heat conducting pipe 14, and a second insulating layer 15, where the first insulating layer 12 wraps the conductor 11, the heat conducting wire 13 is disposed on an inner wall of the heat conducting pipe 14, a gap is disposed between the heat conducting wire 13 and the first insulating layer 12, and the second insulating layer 15 wraps an outer peripheral side of a middle portion of the heat conducting pipe 14. Coaxial line 1 is in the use, and both ends all are connected with electron device, and the last heat that gives off of electron device passes through on the heat pipe 14, and inside heat pipe 14 can pass to coaxial line 1 with the heat through heat-conducting wire 13, the last heat of electron device was absorbed by coaxial line 1, can make electron device's temperature disperse rapidly, reduces electron device's temperature. When the axis 1 is applied to the inside of a mobile phone, the main board 21 and the auxiliary board 22 are connected to two ends of the coaxial line 1, and the electronic devices on the main board 21 and the auxiliary board 22 generate a large amount of heat during operation, the heat is transferred to the main board 21 and the auxiliary board 22, and the local temperature of the main board 21 and the auxiliary board 22 rises accordingly. If the coaxial line 1 in the electronic device 2 is the coaxial line 1 in the prior art, the heat of the main board 21 and the sub-board 22 cannot be dissipated, the heat accumulated continuously makes the local area of the electronic device 2 rapidly heat up, even the user can be scalded, meanwhile, because the temperature of the main board 21 and the sub-board 22 rises, the electronic devices on the main board 21 and the sub-board 22 are affected, the performance is reduced, the running speed of the electronic device 2 is reduced, and even the situation of blocking and the like occurs, so that the use of the user is seriously affected. However, if the main board 21 and the sub-board 22 are connected by the coaxial line 1 in this embodiment, when the main board 21 and the sub-board 22 generate heat, the coaxial line 1 can rapidly disperse heat on the main board 21 and the sub-board 22, thereby effectively reducing temperatures on the main board 21 and the sub-board 22 and improving user experience.

Specifically, the conductive wire 11 is a wire rod capable of interconnecting signals of the main board 21 and the sub-board 22, and is made of a material such as an annealed copper wire or a copper-clad aluminum wire. The first insulating layer 12 and the second insulating layer 15 are protective layers for the lead wires 11 and the heat transfer pipes 14, and may be made of an insulating material such as rubber. The heat pipe 14 can not only conduct heat from the main plate 21 and the sub-plate 22, but also conduct low level heat, and has shielding effect, and usually selects copper pipe and other materials with good electric and heat conducting properties. The heat conducting wire 13 is used to conduct heat from the heat conducting pipe 14 to the gap between the heat conducting wire 13 and the first insulating layer 12, and usually, a material with good heat conducting property and low cost such as a copper wire is selected. The heat conducting wires 13 are small in size and distributed on the inner wall of the heat conducting pipe 14 in a capillary mode, and therefore heat dissipation efficiency can be effectively improved.

Specifically, in practical application, the two ends of the wire 11 are connected to the main plate 21 and the sub-plate 22, respectively, the ends of the heat pipe 14 are subjected to necking treatment so that the wire 11 and the first insulating layer 12 pass through the center of the heat pipe 14, and the peripheral side of the first insulating layer 12 located between the two ends of the heat pipe 14 is not in contact with the heat pipe 14. The heat conducting wires 13 are arranged on the inner wall of the heat conducting pipe 14 around the first insulating layer 12, and the heat conducting wires 13 can more uniformly transfer heat to the gap between the first insulating layer 12 and the heat conducting pipe 14, so that the cooling efficiency is improved. Meanwhile, according to different use conditions, the gap between the first insulating layer 12 and the heat conducting pipe 14 can be properly adjusted, one side of the first insulating layer 12 can be attached to the heat conducting pipe 14, the corresponding heat conducting wires 13 are arranged on the inner wall of the heat conducting pipe 14, and the heat conducting wires 13 are arranged to be avoided from the first insulating layer.

Optionally, there are two sets of the heat conducting wires 13, and the two sets of the heat conducting wires 13 are symmetrically disposed on the inner wall of the heat conducting pipe 14. Two sets of heat conduction wires 13 can be faster with the heat dispersion on the heat pipe 14, reach coaxial line 1 inside for coaxial line 1 is to the thermal conduction of mainboard 21 and subplate 22, can make the more even the dispersing to coaxial line 1 inside of heat pipe 14's heat simultaneously.

Optionally, a vacuum state is formed between the heat conducting pipe 14 and the first insulating layer 12. When heat is conducted to the heat pipe 14, the heat is rapidly dispersed between the heat pipe 14 and the first insulating layer 12 through the heat conducting wires 13, and since the space between the heat pipe 14 and the first insulating layer 12 is in a vacuum state, a condensation effect can be formed, and condensate is formed between the heat pipe 14 and the first insulating layer 12 so as to take away a large amount of heat on the heat pipe 14. With the continuous heating of the main board 21 and the sub-board 22, the heat is conducted to the heat pipe 14 and is dispersed to the vacuum area via the heat conducting wires 13 to form a condensation effect, so that the heat pipe 14 is always kept at a lower temperature, and the heat on the sub-board 22 can be effectively transferred to the heat pipe 14.

In a second aspect, as shown in fig. 1 to 6, the electronic device 2 has an inner cavity, a main board 21 and a sub board 22 are disposed in the inner cavity, and the main board 21 and the sub board 22 are connected by a plurality of coaxial lines 1 as described above. The coaxial line 1 can communicate between mainboard 21 and the subplate 22, realizes the signal transmission between mainboard 21 and the subplate 22, is provided with multiple electron device on mainboard 21 and the subplate 22, and at electronic equipment 2 operation in-process, if electron device's such as CPU or camera module calorific capacity is great, sets up two coaxial lines 1 near CPU and camera module respectively. Peripheral mainboard 21 or subplate 22 temperature risees when CPU and the module operation of making a video recording generate heat, coaxial line 1 can conduct the temperature on mainboard 21 and the subplate 22 to coaxial line 1 on, the temperature of mainboard 21 or subplate 22 reduces, corresponding CPU and the temperature of the module of making a video recording also can obtain effectual control, so CPU and the module of making a video recording can keep the best state operation, it is more smooth when user uses electronic equipment 2, and the temperature is maintained at normal range, give the best use experience of user.

Optionally, both ends of coaxial line 1 all are provided with heat conduction snap ring 3, heat conduction snap ring 3 with coaxial line 1 electricity is connected, heat conduction snap ring 3 with mainboard 21 and all be provided with heat conduction plug 4 between the subplate 22, heat conduction plug 4 with heat conduction snap ring 3 is connected, mainboard 21 with subplate 22 passes through heat conduction plug 4 with heat conduction snap ring 3 realize with coaxial line 1 realizes signal connection. Can strengthen the joint strength between coaxial line 1 and mainboard 21 and the subplate 22 through heat conduction snap ring 3 and ground connection plug, can also improve heat-conduction efficiency simultaneously, make the heat on mainboard 21 and the subplate 22 can be as fast as possible conduct to coaxial line 1 on to realize the signal connection between mainboard 21, subplate 22 and the coaxial line 1 through heat conduction snap ring 3 and heat conduction plug 4. The efficiency of the coaxial line 1 for heat conduction on the main board 21 and the sub board 22 is further improved, and meanwhile, the stability of signal transmission between the main board 21 and the sub board 22 is ensured.

Wherein, heat conduction plug 4 is wrapped up by the casing to changing the casing and carrying out ground connection, avoiding heat conduction plug 4 to influence the signal transmission between mainboard and the subplate.

Optionally, heat conduction snap ring 3 includes shell 31, shell fragment 32 and support 33, support 33 set up in the shell 31, shell 31 has first uncovered and the second is uncovered, the intercommunication has been seted up on support 33 first uncovered with the uncovered installation department of second, shell fragment 32 set up in the installation department, coaxial line 1 is inserted by first uncovered department in the shell 31 with shell fragment 32 signal connection, mainboard 21 or subplate 22 passes through the second is uncovered with shell fragment 32 signal connection, shell 31 includes buckle 311, latch 312 and heat-conducting plate 313, buckle 311 is fixed in the both ends periphery side of heat pipe 14, heat-conducting plug 4 by the uncovered insertion of second in the installation department, the inside wall of shell 31 to support 33 direction protrusion forms latch 312, latch 312 with the inside wall centre gripping of shell 31 is fixed heat-conducting plug 4, heat-conducting plate 313 paste in mainboard 21 or subplate 22 sets up. The heat conducting plug 4 is in signal connection with the main board 21 or the auxiliary board 22, the heat conducting plug 4 is in signal connection with the elastic sheet 32, and the coaxial line 1 is inserted into the shell 31 through the first opening, so that the signal connection between the coaxial line 1 and the elastic sheet 32 is realized, namely, the signal connection between the coaxial line 1 and the main board 21 or the auxiliary board 22 is realized, and finally, the effect of signal transmission between the main board 21 and the auxiliary board 22 through the coaxial line 1 is realized. The elastic sheet 32 has certain elasticity, so that the electronic device 2 is prevented from shaking or colliding or being in a city, and the grounding plug damages the elastic sheet 32, which results in failure of signal transmission. The heat-conducting plug 4 is fixed in the shell 31 through the ring-shaped buckle 312, and meanwhile, the coaxial line 1 is fixed through the ring-shaped buckle 312, so that the phenomenon that the coaxial line 1 or the heat-conducting plug 4 drops to cause signal disconnection in the use process of the electronic device 2 is avoided. The heat conducting plate 313 is in contact with the heat conducting plug 4, the heat conducting plug 4 conducts heat on the main plate 21 or the auxiliary plate 22 to the heat conducting plate 313 quickly, the heat conducting plate 313 transfers the heat to the buckle 311, and finally the heat is transferred to the heat conducting pipe 14, and quick heat dissipation of the main plate 21 and the auxiliary plate 22 is achieved.

Optionally, the wires 11 at the two ends of the coaxial wire 1 at least partially protrude from the end portion of the first insulating layer 12, and the wires 11 at the two ends of the coaxial wire 1 are welded and fixed to the elastic pieces 32. The lead 11 and the spring plate 32 are fixed by welding, so that the stability of signal transmission between the main board 21 and the auxiliary board 22 can be further enhanced.

Optionally, both ends of the heat pipe 14 gradually contract, the bracket 33 is provided with a clamping plate 331 toward the coaxial line 1 side, the end of the heat pipe 14 is inserted between the buckle 311 and the clamping plate 331, an adhesive is filled between the buckle 311 and the clamping plate 331, and the adhesive wraps the end of the heat pipe 14. Can realize sealed processing to coaxial line 1 through the viscose, can guarantee to be in vacuum state between first insulating layer 12 and the heat pipe 14 through sealed processing, guarantee that coaxial line 1 has good condensation cooling's effect. Meanwhile, in the shaking or collision process of the electronic device 2, the adhesive between the buckle 311 and the clamping plate 331 can play a good role in buffering, so that the disconnection of welding points between the lead 11 and the elastic sheet 32 is avoided, and the stability of signal transmission between the main board 21 and the auxiliary board 22 is ensured.

Optionally, heat conduction plug 4 includes bottom plate, first cylinder and second cylinder, the bottom plate with heat-conducting plate 313 fixed connection, first cylinder inserts in the installation department, first cylinder with shell fragment 32 connects, the second cylinder is the annular, the latch closure 312 with the inside wall cooperation of shell 31 will second cylinder joint is fixed. The base plate is used for receiving signals and heat on the main plate 21 or the sub-plate 22 and transferring the heat to the heat conducting snap ring 3. The first column and the elastic sheet 32 realize signal connection, and are used for transmitting signals on the main board 21 or the auxiliary board 22 to the lead 11. The second cylinder is used for fixing the heat conduction clamping ring 3 and the heat conduction plug 4, so that the heat conduction clamping ring 3 and the heat conduction plug 4 are prevented from falling off, and the heat conduction efficiency and the stability of signal transmission are ensured.

Optionally, a heat conduction layer 5 is arranged between the bottom plate and the heat conduction clamping ring 3. The heat conduction layer 5 can be made of materials such as heat conduction carbon fibers, copper foils or heat dissipation graphite flakes, and by arranging the heat conduction layer 5, the heat conduction on the heat conduction plug 4 can be further accelerated to the heat conduction snap ring 3, namely, the heat loss rate on the main board 21 and the auxiliary board 22 is further accelerated.

The operation of mounting the coaxial line 1 into the electronic device 2 is as follows: the two ends of the coaxial line 1 are cut to expose the heat conduction pipe 14 at the end of the coaxial line 1 outside the second insulation layer 15, and the two ends of the coaxial line 1 are cut again to expose the conducting wire 11 outside the first insulation layer 12. The two ends of the processed coaxial line 1 are respectively welded and fixed on the corresponding elastic pieces 32, the space between the heat conduction pipe 14 and the first insulating layer 12 is vacuumized, and after a vacuum state is formed between the heat conduction pipe 14 and the first insulating layer 12, the outer side wall of the heat conduction pipe 14, the buckle 311 and the clamping plate 331 are adhered and fixed through viscose glue. While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. An electronic device is characterized in that the electronic device is provided with an inner cavity, a main board and an auxiliary board are arranged in the inner cavity, and the main board and the auxiliary board are connected through a plurality of coaxial lines;

the coaxial line sequentially comprises a conducting wire, a first insulating layer and a heat conducting pipe from inside to outside, wherein the conducting wire is wrapped by the first insulating layer, and a gap is formed between the heat conducting pipe and the first insulating layer;

still be provided with the heat conduction snap ring on the coaxial line, the heat conduction snap ring with the mainboard and all be provided with the heat conduction plug between the subplate, the heat conduction plug with the heat conduction snap ring is connected, the heat conduction snap ring includes the shell, the shell includes buckle and heat-conducting plate, the buckle is fixed in the both ends periphery side of heat pipe, the heat-conducting plate with the contact of heat conduction plug.

2. The electronic device of claim 1, wherein the heat-conducting snap ring is disposed at both ends of the coaxial line, the heat-conducting snap ring is electrically connected to the coaxial line, and the main board and the auxiliary board are in signal connection with the coaxial line through the heat-conducting plug and the heat-conducting snap ring.

3. The electronic device of claim 1, wherein the heat-conducting snap ring comprises an elastic sheet and a support, the support is arranged in the housing, the housing has a first opening and a second opening, the support is provided with an installation part for communicating the first opening with the second opening, the elastic sheet is arranged in the installation part, the coaxial line is inserted into the housing from the first opening and is in signal connection with the elastic sheet, the main board or the auxiliary board is in signal connection with the elastic sheet through the second opening, the housing comprises a buckle, the heat-conducting plug is inserted into the installation part from the second opening, the inner side wall of the housing protrudes towards the support to form the buckle, the buckle and the inner side wall of the housing are clamped and fixed, and the heat-conducting plate is attached to the main board or the auxiliary board.

4. The electronic device of claim 3, wherein the wires at the two ends of the coaxial line at least partially protrude from the end of the first insulating layer, and the wires at the two ends of the coaxial line are welded and fixed to the elastic pieces.

5. The electronic device of claim 3, wherein two ends of the heat conducting pipe are gradually contracted, the bracket is provided with a clamping plate towards one side of the coaxial line, the end part of the heat conducting pipe is inserted between the buckle and the clamping plate, viscose is filled between the buckle and the clamping plate, and the viscose wraps the end part of the heat conducting pipe.

6. The electronic device of claim 3, wherein the heat-conducting plug comprises a bottom plate, a first cylinder and a second cylinder, the bottom plate is fixedly connected with the heat-conducting plate, the first cylinder is inserted into the mounting portion, the first cylinder is connected with the elastic sheet, the second cylinder is annular, and the ring buckle is matched with the inner side wall of the shell to fix the second cylinder in a clamped mode.

7. An electronic device in accordance with claim 6, wherein a thermally conductive layer is disposed between said base plate and said thermally conductive snap ring.

Images